CN114420758B - 具有高阈值电压的SiC MOSFET及制造方法 - Google Patents
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- CN114420758B CN114420758B CN202111492929.7A CN202111492929A CN114420758B CN 114420758 B CN114420758 B CN 114420758B CN 202111492929 A CN202111492929 A CN 202111492929A CN 114420758 B CN114420758 B CN 114420758B
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
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- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
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- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
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CN114678277B (zh) * | 2022-05-27 | 2022-08-16 | 深圳平创半导体有限公司 | 中心注入p+屏蔽区的分裂栅平面mosfet及其制造方法 |
CN116364758B (zh) * | 2023-03-30 | 2023-11-14 | 苏州龙驰半导体科技有限公司 | SiC MOS器件 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102110711A (zh) * | 2009-12-28 | 2011-06-29 | 格科微电子(上海)有限公司 | 减少寄生电容的mos晶体管及其制造方法 |
CN102142375A (zh) * | 2010-12-29 | 2011-08-03 | 上海贝岭股份有限公司 | 一种平面型场控功率器件的制造方法 |
CN102738238A (zh) * | 2011-04-15 | 2012-10-17 | 快捷韩国半导体有限公司 | 功率半导体器件及其制作方法 |
JP2013149837A (ja) * | 2012-01-20 | 2013-08-01 | Mitsubishi Electric Corp | 炭化珪素半導体装置およびその製造方法 |
CN104241348A (zh) * | 2014-08-28 | 2014-12-24 | 西安电子科技大学 | 一种低导通电阻的SiC IGBT及其制备方法 |
JP2017055003A (ja) * | 2015-09-11 | 2017-03-16 | 株式会社東芝 | 半導体装置及びその製造方法 |
CN106920846A (zh) * | 2017-02-21 | 2017-07-04 | 深圳深爱半导体股份有限公司 | 功率晶体管及其制造方法 |
CN109119483A (zh) * | 2018-11-05 | 2019-01-01 | 深圳市鹏朗贸易有限责任公司 | 一种晶体管及其制作方法 |
CN109273529A (zh) * | 2017-07-18 | 2019-01-25 | 比亚迪股份有限公司 | Mos型功率器件及其制备方法 |
CN109616523A (zh) * | 2018-11-27 | 2019-04-12 | 中国科学院微电子研究所 | 一种4H-SiC MOSFET功率器件及其制造方法 |
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2021
- 2021-12-08 CN CN202111492929.7A patent/CN114420758B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102110711A (zh) * | 2009-12-28 | 2011-06-29 | 格科微电子(上海)有限公司 | 减少寄生电容的mos晶体管及其制造方法 |
CN102142375A (zh) * | 2010-12-29 | 2011-08-03 | 上海贝岭股份有限公司 | 一种平面型场控功率器件的制造方法 |
CN102738238A (zh) * | 2011-04-15 | 2012-10-17 | 快捷韩国半导体有限公司 | 功率半导体器件及其制作方法 |
JP2013149837A (ja) * | 2012-01-20 | 2013-08-01 | Mitsubishi Electric Corp | 炭化珪素半導体装置およびその製造方法 |
CN104241348A (zh) * | 2014-08-28 | 2014-12-24 | 西安电子科技大学 | 一种低导通电阻的SiC IGBT及其制备方法 |
JP2017055003A (ja) * | 2015-09-11 | 2017-03-16 | 株式会社東芝 | 半導体装置及びその製造方法 |
CN106920846A (zh) * | 2017-02-21 | 2017-07-04 | 深圳深爱半导体股份有限公司 | 功率晶体管及其制造方法 |
CN109273529A (zh) * | 2017-07-18 | 2019-01-25 | 比亚迪股份有限公司 | Mos型功率器件及其制备方法 |
CN109119483A (zh) * | 2018-11-05 | 2019-01-01 | 深圳市鹏朗贸易有限责任公司 | 一种晶体管及其制作方法 |
CN109616523A (zh) * | 2018-11-27 | 2019-04-12 | 中国科学院微电子研究所 | 一种4H-SiC MOSFET功率器件及其制造方法 |
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Effective date of registration: 20231214 Address after: 210000, 2nd Floor, Building 1, No. 7 Zhongke Road, Moling Street, Nanjing City, Jiangsu Province (Jiangning Development Zone) Patentee after: Nanjing Zhixin Semiconductor Co.,Ltd. Address before: 710048 Shaanxi province Xi'an Beilin District Jinhua Road No. 5 Patentee before: XI'AN University OF TECHNOLOGY |
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Correction item: Patentee|Address Correct: Xi'an University of technology|710048 Shaanxi province Xi'an Beilin District Jinhua Road No. 5 False: Nanjing Zhixin Semiconductor Co.,Ltd.|210000, 2nd Floor, Building 1, No. 7 Zhongke Road, Moling Street, Nanjing City, Jiangsu Province (Jiangning Development Zone) Number: 52-02 Volume: 39 |
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Effective date of registration: 20240118 Address after: 210000, 2nd Floor, Building 1, No. 7 Zhongke Road, Moling Street, Nanjing City, Jiangsu Province (Jiangning Development Zone) Patentee after: SUNNYCHIP SEMICONDUCTOR CO. Address before: 710048 Shaanxi province Xi'an Beilin District Jinhua Road No. 5 Patentee before: XI'AN University OF TECHNOLOGY |