CN114420616A - Groove type cleaning device - Google Patents
Groove type cleaning device Download PDFInfo
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- CN114420616A CN114420616A CN202210308464.3A CN202210308464A CN114420616A CN 114420616 A CN114420616 A CN 114420616A CN 202210308464 A CN202210308464 A CN 202210308464A CN 114420616 A CN114420616 A CN 114420616A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a trough type cleaning device, which comprises a feeding unit, a cleaning unit and a discharging unit, wherein the feeding unit comprises: the first conveying structure comprises a first conveying part, a first bearing area and at least one first cache area, wherein the first conveying part is used for conveying the wafer box bearing the wafers on the feeding table to the first bearing area, or the first cache area, or conveying the cached wafer box to the first bearing area; the second transmission structure comprises a second transmission part and is used for transmitting the wafer in the wafer box in the first bearing area to the cleaning unit; the unloading unit includes: the third conveying structure comprises a third conveying part and is used for conveying the cleaned wafer into an empty wafer box placed in a second bearing area of the fourth conveying structure; and the fourth transmission structure comprises a fourth transmission part, a second bearing area and at least one second buffer area, wherein the fourth transmission part is used for transmitting the empty wafer boxes to the second bearing area, or the second buffer area for buffering, or transmitting the buffered wafer boxes to the second bearing area.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to a groove type cleaning device.
Background
In the field of semiconductor silicon wafers, the application of a groove type cleaning machine is very wide, mainly aiming at removing organic matters, particles and metal pollution on the surface of a silicon wafer to obtain the silicon wafer with a high clean surface, and groove type wet cleaning equipment still activates the field of production and manufacturing of integrated circuits with the surface of 30nm or more at present due to higher production capacity and more stable process capacity.
In the traditional groove type wet cleaning equipment, one process groove is filled with one chemical liquid, and the whole cleaning equipment consists of a plurality of process grooves. In the cleaning process, the whole silicon wafer is soaked in a tank filled with chemical liquid medicine, the chemical liquid medicine is replaced regularly to ensure the cleanness of a treatment tank, so that the quality of a product is ensured, and some chemical liquid medicines need to be replaced frequently.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a tank cleaning apparatus, which solves the problem that the wafer cleaning cannot be continuously carried on and off.
In order to achieve the purpose, the embodiment of the invention adopts the technical scheme that: the utility model provides a slot type belt cleaning device, includes material loading unit, cleaning unit and unloading unit, the material loading unit includes: a first conveying structure and a second conveying structure;
the first transmission structure comprises a first transmission part, a first bearing area and at least one first cache area, wherein the first transmission part is used for transmitting a wafer box bearing wafers on the feeding table to the first bearing area, or transmitting the wafer box bearing the wafers to the corresponding first cache area for caching, or transmitting the wafer box bearing the wafers cached in the first cache area to the first bearing area;
the second transmission structure comprises a second transmission part used for transmitting the wafer placed in the wafer box of the first bearing area to the cleaning unit;
the blanking unit comprises a third conveying structure and a fourth conveying structure;
the third conveying structure comprises a third conveying part for conveying the cleaned wafer into an empty wafer box placed in a second bearing area of the fourth conveying structure;
the fourth conveying structure comprises a fourth conveying part, a second bearing area and at least one second buffer area, wherein the fourth conveying part is used for conveying empty wafer boxes to the second bearing area, or conveying the empty wafer boxes to the corresponding second buffer area for buffering, or conveying the empty wafer boxes buffered in the second buffer area to the second bearing area.
Optionally, the first conveying unit includes:
a first box structure, a first inlet communicated with the feeding table is arranged on a first side wall of the first box structure, a first outlet communicated with the second conveying part is arranged on a second side wall of the first box structure, the first bearing area is arranged at the first outlet, the second side wall is adjacent to or opposite to the first side wall, and at least one first buffer area is arranged on at least one side wall of the first box structure;
a first transfer arm;
and the first control component is used for controlling the first conveying arm to move so as to realize the conveying of the wafer box.
Optionally, the first cache region includes a bearing plate disposed on a side wall of the first box structure, and the bearing plate is disposed horizontally.
Optionally, at least one first buffer area is disposed on at least one side of the first bearing area along the vertical direction.
Optionally, the first control part includes a first guide rod disposed in the first box structure, the first guide rod extends in a vertical direction, and the first transfer arm is movably disposed on the first guide rod.
Optionally, at least one first buffer area is disposed on at least one side of the first carrying area along a first direction, and the first direction is perpendicular to the vertical direction and parallel to the second sidewall.
Optionally, the first control unit includes:
the first guide rod extends in the vertical direction and is arranged between the top wall and the bottom wall of the first box body structure, and the first conveying arm is movably arranged on the first guide rod;
the first guide rail is arranged on the top wall and/or the bottom wall of the first box body structure, the first guide rail comprises at least one first sub-guide rail in a plane parallel to the horizontal direction, and the first guide rod is movably arranged on the at least one first sub-guide rail.
Optionally, the fourth transmitting part includes:
a second box structure, a second inlet communicated with the cleaning unit is formed in a third side wall of the second box structure, a second outlet communicated with a blanking table is formed in a fourth side wall of the second box structure, the second bearing area is arranged at the second inlet, the fourth side wall is adjacent to or opposite to the third side wall, and at least one second cache area is arranged on at least one side wall of the second box structure;
a second transfer arm;
and the second control component is used for controlling the second transmission arm to move so as to realize the transmission of the wafer box.
Optionally, the second cache region includes a bearing plate disposed on a side wall of the second box structure, and the bearing plate is disposed horizontally.
Optionally, at least one second buffer area is disposed on at least one side of the second bearing area along the vertical direction.
Optionally, the second control part includes a second guide rod disposed in the second box structure, the second guide rod extends in the vertical direction, and the second transfer arm is movably disposed on the second guide rod.
Optionally, at least one second buffer area is disposed on at least one side of the second carrying area along a second direction, and the second direction is perpendicular to the vertical direction and is parallel to the fourth sidewall.
Optionally, the second control unit includes:
the second guide rod extends in the vertical direction and is arranged between the top wall and the bottom wall of the second box body structure, and the second conveying arm is movably arranged on the second guide rod;
the second guide rail is arranged on the top wall and/or the bottom wall of the second box body structure, the second guide rail comprises at least one second sub-guide rail in a plane parallel to the horizontal direction, and the second guide rod is movably arranged on the at least one second sub-guide rail.
The invention has the beneficial effects that: the first conveying structure and the second conveying structure are matched to realize the uploading continuity of the wafers to be cleaned, the third conveying structure and the fourth conveying structure are matched to realize the unloading continuity of the cleaned wafers, and the cleaning efficiency is improved.
Drawings
FIG. 1 is a schematic view showing a tank type washing apparatus according to the related art;
FIG. 2 is a schematic structural view of a trough cleaning apparatus according to an embodiment of the present invention;
FIG. 3 is a diagram illustrating a distribution of a first cache region according to an embodiment of the invention.
1, a feeding unit; 2, a cleaning unit; 3, a blanking unit; 4, an uploading area; 5 an unloading area; 101 a first wafer cassette; 102 a first transfer arm; 103 a first top wall; 104 a first cache region; 105 a first automatic door; 106 a third transfer arm; 107 wafer handling arms; 108 a fourth transfer arm; 109 a second automatic door; 110 a second cache area; 111 a second top wall; 112 a second transfer arm; 113 a second wafer cassette; 120 a first side wall; 121 a second side wall; 123 a third side wall; 124 a fourth side wall; 125 a feeding table; 126 a blanking table; 130 a first bearer region; 140 a second bearing region; 210 a first guide bar; 211 a first sub-track; 212 second guide bar.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, only for the purpose of facilitating description of the present invention and simplifying description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Referring to fig. 1, a trench cleaner Bench cleaner in the related art includes a loading unit 1, a cleaning unit 2, and a unloading unit 3, which are all used for etching and cleaning after loading a wafer and sequentially flowing through each process trench in the wafer loading order, but face the following 2 problems:
1. the operation personnel do not have timely continuous uploading pending wafer in uploading district 4, will cause the inside cell body of equipment idle, and the productivity is extravagant, and the chemicals in the cell body need to be changed new according to fixed time, no matter have or not production promptly, also can be changed after the certain time, causes high input low output.
2. When the operator does not place an empty wafer box in the unloading area 5 in time to unload the processed wafer, the wafer being processed in the equipment cannot reach the next process tank on time, so that the cleaning is overtime, the product needs to be reworked integrally, the capacity of the equipment is wasted, the product can be subjected to degradation treatment, and particularly, the wafer immersed in the chemical etching tank is overtime, so that the risk of scrapping is caused.
With reference to fig. 2 and 3, in order to solve the above problem, the present embodiment provides a trough type cleaning device, including a feeding unit, a cleaning unit, and a discharging unit, where the feeding unit includes: a first conveying structure and a second conveying structure;
the first transfer structure includes a first transfer portion, a first loading area 130 (a is shown in position), and at least one first buffer area 104, the first transfer portion is used for transferring a wafer cassette (a first wafer cassette 101) on the loading platform 125 to the first loading area 130, or transferring a wafer cassette to the corresponding first buffer area 104 for buffering, or transferring a wafer cassette buffered in the first buffer area 104 to the first loading area 130;
the second transfer structure includes a second transfer part for transferring the wafer placed in the wafer cassette of the first loading area 130 to the cleaning unit;
the blanking unit comprises a third conveying structure and a fourth conveying structure;
the third conveying structure comprises a third conveying part for conveying the cleaned wafer into an empty wafer box placed in the second bearing area 140 of the fourth conveying structure;
the fourth transfer structure includes a fourth transfer portion for transferring an empty wafer cassette (a second wafer cassette 113) to the second loading zone 140, or transferring an empty wafer cassette to the corresponding second buffer zone 110, or transferring an empty wafer cassette buffered in the second buffer zone 110 to the second loading zone 140, a second loading zone 140 (a position indicated by B), and at least one second buffer zone 110.
The first conveying structure and the second conveying structure are matched to realize the uploading continuity of the wafers to be cleaned, the third conveying structure and the fourth conveying structure are matched to realize the unloading continuity of the cleaned wafers, the continuous input and output of the wafers are ensured, and the efficiency is improved.
When the wafer cassette is operated, the wafer cassette carrying wafers is placed on the loading platform 125, the first transfer part transfers the wafer cassette carrying wafers to the first carrying area 130, the second transfer part takes away the wafers and transfers the wafers to the cleaning unit for cleaning, in the process that the wafers in the wafer cassette on the first carrying area 130 are not completely taken out, the wafer cassette carrying the wafers uploaded on the loading platform 125 is transferred to the first cache area 104 by the first transfer part for temporary storage, after all the wafers in the wafer cassette on the first carrying area 130 are taken out, the first transfer part takes out the empty wafer cassette to the loading platform 125, and then the wafer cassette carrying the wafers temporarily stored in the first cache area 104 is transferred to the first carrying area 130, so as to reduce the interval time.
It should be noted that the first loading area 130 may store two wafer cassettes at the same time, so that the first transfer unit may first transfer the wafer cassette temporarily stored in the first buffer area 104 and carrying the wafer to the first loading area 130, and then take out the empty wafer cassette, thereby further realizing the continuous loading.
It should be noted that the first transfer unit may be a single transfer unit, i.e. only one action is performed at a time, for example, after an empty pod is taken and transferred to the loading platform 125, the pod temporarily stored in the first buffer area 104 for carrying wafers is transferred to the first loading area 130. For example, the first transfer unit may also complete a plurality of operations at one time, for example, the first transfer unit may include a first sub-transfer unit and a second sub-transfer unit, and the second sub-transfer unit transfers the wafer cassette temporarily stored in the first buffer area 104 to the first loading area 130 while the first sub-transfer unit transfers the wafer cassette above the first loading area 130 to the loading table 125, so as to further save time, achieve continuous loading of wafers, and improve efficiency.
In this embodiment, the first transfer unit includes:
a first box structure, a first inlet communicated with the feeding table 125 is formed on a first side wall 120 of the first box structure, a first outlet communicated with the second conveying part is formed on a second side wall 121 of the first box structure, the first bearing area 130 is arranged at the first outlet, the second side wall 121 is adjacent to or opposite to the first side wall 120, and at least one first buffer area 104 is arranged on at least one side wall of the first box structure;
a first transfer arm 102;
a first control component for controlling the first transfer arm 102 to move to realize the transfer of the wafer cassette.
In this embodiment, the first conveying part and the second conveying part are divided into two spaces, the first conveying part and the second conveying part are separated by a baffle, the first carrying region 130 is located at a communication position of the first conveying part and the second conveying part, an automatic door (a first automatic door 105) is arranged at the communication position, and when a wafer cassette carrying wafers is placed in the first carrying region 130, the automatic door is automatically opened to ensure a clean environment in the cleaning unit.
In a specific embodiment of this embodiment, the second sidewall 121 (i.e., the partition between the first conveying portion and the second conveying portion) is disposed opposite to the first sidewall 120, so that the moving path of the first conveying arm 102 is simplified, but not limited thereto.
Illustratively, the first buffer area 104 includes a loading board disposed on a sidewall of the first box structure, and the loading board is disposed horizontally.
Illustratively, at least one first buffer area 104 is disposed on at least one side of the first loading area 130 along a vertical direction (refer to a Y direction in fig. 3).
Illustratively, the first control component includes a first guide rod 210 disposed in the first box structure, the first guide rod 210 extends in a vertical direction, and the first transfer arm 102 is movably disposed on the first guide rod 210.
The first transfer arm 102 can rotate around the first guide rod 210 and can reciprocate along the extending direction of the first guide rod 210, and the first transfer arm 102 takes the wafer cassette carrying the wafer on the loading platform 125 under the control of the first control component and then rotates to back to the loading platform 125 to transfer the wafer cassette carrying the wafer to the first carrying region 130, or moves up or down along the first guide rod 210 to transfer the wafer cassette carrying the wafer to the corresponding first buffer region 104.
It should be noted that the first transfer arm 102 includes a first telescopic arm and a first clamping jaw located at one end of the first telescopic arm, and the first telescopic arm is configured to facilitate rotation of the first transfer arm 102 and transfer a wafer cassette between the loading platform 125 and the first loading area 130 (or the first buffer area 104).
For example, a guide rail extending in a direction from the first side wall 120 to the second side wall 121 may be further disposed in the first box structure, the first guide rod 210 may be movably disposed on the guide rail to facilitate transportation of a wafer cassette, the guide rail may be disposed on at least one inner wall of a top wall and a bottom wall of the first box structure, for example, the top wall and the bottom wall are both provided with guide rails, an orthographic projection of the guide rail on the top wall on the bottom wall coincides with the guide rail on the bottom wall, and two opposite ends of the first guide rod 210 are respectively movably disposed on the corresponding guide rails.
Illustratively, at least one first buffer area 104 is disposed on at least one side of the first loading area 130 along a first direction (refer to the X direction in fig. 3), the first direction is perpendicular to the vertical direction and is parallel to the second sidewall 121 (i.e. parallel to the plane of the second sidewall, the first buffer area 104 is disposed on the second sidewall 121).
Illustratively, the first control component includes:
a first guide bar 210 extending in a vertical direction between the top wall and the bottom wall of the first box structure, wherein the first transfer arm 102 is movably disposed on the first guide bar 210;
the first guide rail is arranged on the top wall and/or the bottom wall of the first box structure, the first guide rail comprises at least one first sub-guide rail 211 in a plane parallel to the horizontal direction, and the first guide rod 210 is movably arranged on at least one first sub-guide rail 211.
When the first transfer arm 102 rotates around the first guide rod 210 and is sufficient to transfer the wafer cassette, which is located on the loading platform 125 and is used for carrying the wafer, to the first carrying area 130, the first guide rail does not need to be arranged in the direction from the first side wall 120 to the second side wall 121, and when the wafer cassette carrying the wafer needs to be transferred to the corresponding first buffer area 104, the first guide rod 210 needs to move along the corresponding first sub-guide rail 211 to drive the first transfer arm 102 to move, and at least one of the first sub-guide rails 211 is arranged along the horizontal direction and is parallel to the second side wall 121.
It should be noted that the first transfer arm 102 may be a telescopic structure, for example, the first transfer arm 102 includes a first telescopic arm and a first clamping jaw at one end of the first telescopic arm, and in this case, the first guide rail may be omitted.
Illustratively, at least one first buffer area 104 is disposed on at least one side of the first bearer area 130 along the vertical direction, and at least one first buffer area 104 is disposed on at least one side of the first bearer area 130 along the first direction.
Illustratively, the first buffer areas 104 are arranged in an array around the first carrier area 130, the first buffer areas 104 are arranged in an array on the second sidewall 121, and a plurality of the first buffer areas 104 are located around the first carrier area 130, so as to move the wafer cassette temporarily stored in the first buffer areas 104 to the first carrier area 130.
At this time, in order to facilitate the transportation of the first transporting arm 102, at least two first sub-guide rails 211 are disposed on the bottom wall of the first box structure, wherein one of the first sub-guide rails 211 extends from the first side wall 120 to the second side wall 121, and one of the first sub-guide rails 211 is parallel to the second side wall 121.
Illustratively, the second transfer part includes a third transfer arm 106, the third transfer arm 106 includes a plurality of connecting rods hinged end to end, and a free end of each connecting rod is provided with a clamping member (refer to the structure of a mechanical arm in the conventional art, and will not be described herein again).
Illustratively, the fourth transfer part includes:
a second box structure, a third sidewall 123 of the second box structure is provided with a second inlet communicated with the cleaning unit, a fourth sidewall 124 of the second box structure is provided with a second outlet communicated with a blanking table 126, the second bearing area 140 is disposed at the second inlet, the fourth sidewall 124 is adjacent to or opposite to the third sidewall 123, and at least one second buffer area 110 is disposed on at least one sidewall of the second box structure;
a second transfer arm 112;
a second control part for controlling the second transfer arm 112 to move to realize the transfer of the wafer cassette.
In this embodiment, the third conveying part and the fourth conveying part are divided into two spaces, the third conveying part and the fourth conveying part are separated by a baffle, the second carrying area 140 is located at a communication position of the third conveying part and the fourth conveying part, an automatic door (a second automatic door 109) is arranged at the communication position, and when an empty wafer cassette is placed in the second carrying area 140, the automatic door is automatically opened to ensure a clean environment in the cleaning unit.
An empty wafer cassette (a second wafer cassette 113) is placed on the unloading platform 126, the second transfer arm 112 transfers the empty wafer cassette to the second loading area 140, so that the third transfer part transfers the wafer to the empty wafer cassette, at this time, the empty wafer cassette loaded on the unloading platform 126 is transferred to the second buffer area 110 by the second transfer arm 112, after the wafer cassette located on the second loading area 140 is fully loaded, the second transfer arm 112 takes the fully loaded wafer cassette away and returns to the unloading platform 126, and then the second transfer arm 112 transfers the empty wafer cassette temporarily stored on the second buffer area 110 to the second loading area 140 to continue loading the wafer, thereby ensuring the continuity of unloading the wafer.
It should be noted that the second transfer arm 112 may include a third sub-transfer arm and a fourth sub-transfer arm, and the third sub-transfer arm takes away a full wafer cassette while the fourth sub-transfer arm transfers an empty wafer cassette temporarily stored in the second buffer area 110 to the second loading area 140 to continue loading wafers, so as to more effectively ensure the continuity of unloading the wafers after the cleaning.
In a specific embodiment of this embodiment, the fourth side wall 124 (i.e., the partition between the third transmitting portion and the fourth transmitting portion) is disposed opposite to the third side wall 123, so that the moving path of the second transmitting arm 112 is simplified, but not limited thereto.
Illustratively, the second buffer area 110 includes a loading board disposed on a sidewall of the second box structure, and the loading board is disposed horizontally.
Illustratively, at least one second buffer area 110 is disposed on at least one side of the second loading area 140 along the vertical direction.
Illustratively, the second control component includes a second guide rod 212 disposed in the second box structure, the second guide rod 212 is disposed to extend in a vertical direction, and the second transfer arm 112 is movably disposed on the second guide rod 212.
The second transfer arm 112 can rotate around the second guide rod 212 and can reciprocate along the extending direction of the second guide rod 212, and the second transfer arm 112 takes away the empty wafer cassette on the blanking table 126 under the control of the second control component and then rotates to back to the blanking table 126 to transfer the empty wafer cassette to the second carrying area 140, or moves up or down along the second guide rod 212 to transfer the empty wafer cassette to the corresponding second buffer area 110.
It should be noted that the second transfer arm 112 includes a second telescopic arm and a clamping jaw located at one end of the second telescopic arm, and the second telescopic arm is configured to facilitate rotation of the second transfer arm 112 and transfer a wafer cassette between the blanking table 126 and the second loading area 140 (or the second buffer area 110).
For example, a guide rail extending in a direction from the third side wall 123 to the fourth side wall 124 may be further disposed in the second box structure, the second guide rod 212 may be movably disposed on the guide rail to facilitate transportation of the wafer cassette, the guide rail may be disposed on at least one inner wall of a top wall and a bottom wall of the second box structure, for example, a guide rail is disposed on each of the top wall and the bottom wall, an orthographic projection of the guide rail on the top wall on the bottom wall coincides with the guide rail on the bottom wall, and two opposite ends of the second guide rod 212 are respectively movably disposed on the corresponding guide rails.
Illustratively, at least one second buffer area 110 is disposed on at least one side of the second carrying area 140 along a second direction, the second direction is perpendicular to the vertical direction and is parallel to the fourth sidewall 124 (i.e. parallel to the plane of the fourth sidewall 124, the second buffer area 110 is disposed on the fourth sidewall 124).
Illustratively, the second control component includes:
a second guide rod 212 extending in a vertical direction between the top wall and the bottom wall of the second box structure, the second transfer arm 112 being movably disposed on the second guide rod 212;
and a second guide rail disposed on the top wall and/or the bottom wall of the second box structure, wherein the second guide rail includes at least one second sub-guide rail in a plane parallel to the horizontal direction, and the second guide rod 212 is movably disposed on the at least one second sub-guide rail.
When the second transfer arm 112 rotates around the second guide rod 212 and is sufficient to transfer the empty wafer cassette located on the blanking table 126 to the second loading area 140, the second guide rail is not required to be arranged in the direction from the third side wall 123 to the fourth side wall 124, and when the empty wafer cassette needs to be transferred to the corresponding second buffer area 110, the second guide rod 212 needs to move along the corresponding second sub-guide rail to drive the second transfer arm 112 to move, and at least one of the second sub-guide rails is arranged in the horizontal direction and is parallel to the fourth side wall 124.
It should be noted that the second transfer arm 112 may be a telescopic structure, for example, if the second transfer arm 112 includes a second telescopic arm and a second clamping jaw at one end of the second telescopic arm, in this case, the second guide rail may be omitted.
Illustratively, at least one second buffer area 110 is disposed on at least one side of the second bearing area 140 along the vertical direction, and at least one second buffer area 110 is disposed on at least one side of the second bearing area 140 along the horizontal direction.
Illustratively, the second buffer areas 110 are arranged in an array around the second carrier area 140, that is, the second buffer areas 110 are arranged on the fourth sidewall 124 in an array, and a plurality of the second buffer areas 110 are located around the second carrier area 140, so as to move the empty wafer cassette temporarily stored in the second buffer area 110 to the second carrier area 140.
In order to facilitate the transportation of the second transporting arm 112, at least two second sub-rails are disposed on the bottom wall of the second box structure, wherein the second sub-rails are disposed to intersect with each other, one of the second sub-rails extends from the third side wall 123 to the fourth side wall 124, and the other second sub-rail is parallel to the fourth side wall 124.
In this embodiment, a filter is disposed on the first top wall 103 of the first conveying part to ensure a clean environment of the first conveying part.
In this embodiment, a filter is disposed on the second top wall 111 of the fourth transfer part to ensure a clean environment of the fourth transfer part.
Illustratively, the third transfer part includes a fourth transfer arm 108, and the fourth transfer arm 108 includes a connecting rod hinged end to end, and a clamping member disposed at a free end of the connecting rod (refer to the structure of a robot arm in the conventional art, and will not be described herein again).
In this embodiment, the cleaning unit includes a plurality of cleaning tanks, and each cleaning tank contains different cleaning solutions to clean the wafer.
A wafer handling arm 107 is disposed within the cleaning unit and is movable between the plurality of cleaning tanks.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (13)
1. The utility model provides a slot type belt cleaning device, includes material loading unit, cleaning unit and unloading unit, its characterized in that, the material loading unit includes: a first conveying structure and a second conveying structure;
the first transmission structure comprises a first transmission part, a first bearing area and at least one first cache area, wherein the first transmission part is used for transmitting a wafer box bearing wafers on the feeding table to the first bearing area, or transmitting the wafer box bearing the wafers to the corresponding first cache area for caching, or transmitting the wafer box bearing the wafers cached in the first cache area to the first bearing area;
the second transmission structure comprises a second transmission part used for transmitting the wafer placed in the wafer box of the first bearing area to the cleaning unit;
the blanking unit comprises a third conveying structure and a fourth conveying structure;
the third conveying structure comprises a third conveying part for conveying the cleaned wafer into an empty wafer box placed in a second bearing area of the fourth conveying structure;
the fourth conveying structure comprises a fourth conveying part, a second bearing area and at least one second buffer area, wherein the fourth conveying part is used for conveying empty wafer boxes to the second bearing area, or conveying the empty wafer boxes to the corresponding second buffer area for buffering, or conveying the empty wafer boxes buffered in the second buffer area to the second bearing area.
2. The trough cleaning apparatus according to claim 1, wherein the first conveyor section comprises:
a first box structure, a first inlet communicated with the feeding table is arranged on a first side wall of the first box structure, a first outlet communicated with the second conveying part is arranged on a second side wall of the first box structure, the first bearing area is arranged at the first outlet, the second side wall is adjacent to or opposite to the first side wall, and at least one first buffer area is arranged on at least one side wall of the first box structure;
a first transfer arm;
and the first control component is used for controlling the first conveying arm to move so as to realize the conveying of the wafer box.
3. The trough cleaning apparatus of claim 2, wherein the first buffer area comprises a carrier plate disposed on a sidewall of the first tank structure, the carrier plate being horizontally disposed.
4. The trough cleaning apparatus according to claim 2, wherein at least one first buffer zone is provided on at least one side of the first carrier zone in the vertical direction.
5. The trough cleaning apparatus according to claim 4, wherein the first control member comprises a first guide bar disposed within the first tank structure, the first guide bar extending in a vertical direction, the first transfer arm movably disposed on the first guide bar.
6. The trough cleaning apparatus according to claim 2 or 4, wherein at least one first buffer zone is disposed on at least one side of the first loading zone along a first direction, the first direction being perpendicular to the vertical direction and parallel to the second sidewall.
7. The trough cleaning apparatus according to claim 6, wherein the first control member comprises:
the first guide rod extends in the vertical direction and is arranged between the top wall and the bottom wall of the first box body structure, and the first conveying arm is movably arranged on the first guide rod;
the first guide rail is arranged on the top wall and/or the bottom wall of the first box body structure, the first guide rail comprises at least one first sub-guide rail in a plane parallel to the horizontal direction, and the first guide rod is movably arranged on the at least one first sub-guide rail.
8. The trough cleaning apparatus according to claim 1, wherein the fourth conveyor comprises:
a second box structure, a second inlet communicated with the cleaning unit is formed in a third side wall of the second box structure, a second outlet communicated with a blanking table is formed in a fourth side wall of the second box structure, the second bearing area is arranged at the second inlet, the fourth side wall is adjacent to or opposite to the third side wall, and at least one second cache area is arranged on at least one side wall of the second box structure;
a second transfer arm;
and the second control component is used for controlling the second transmission arm to move so as to realize the transmission of the wafer box.
9. The trough cleaning apparatus of claim 8, wherein the second buffer area comprises a carrier plate disposed on a sidewall of the second tank structure, the carrier plate being horizontally disposed.
10. The trough cleaning apparatus according to claim 8, wherein at least one second buffer zone is provided on at least one side of the second carrying area in the vertical direction.
11. The trough cleaning apparatus according to claim 10, wherein the second control member comprises a second guide bar disposed within the second tank structure, the second guide bar extending in a vertical direction, the second transfer arm movably disposed on the second guide bar.
12. The trough cleaning apparatus according to claim 8 or 10, wherein at least one second buffer zone is disposed on at least one side of the second loading zone along a second direction, the second direction being perpendicular to the vertical direction and parallel to the fourth sidewall.
13. The trough cleaning apparatus according to claim 12, wherein the second control member comprises:
the second guide rod extends in the vertical direction and is arranged between the top wall and the bottom wall of the second box body structure, and the second conveying arm is movably arranged on the second guide rod;
the second guide rail is arranged on the top wall and/or the bottom wall of the second box body structure, the second guide rail comprises at least one second sub-guide rail in a plane parallel to the horizontal direction, and the second guide rod is movably arranged on the at least one second sub-guide rail.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210308464.3A CN114420616A (en) | 2022-03-28 | 2022-03-28 | Groove type cleaning device |
| TW111134444A TWI855378B (en) | 2022-03-28 | 2022-09-13 | Tank cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210308464.3A CN114420616A (en) | 2022-03-28 | 2022-03-28 | Groove type cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114420616A true CN114420616A (en) | 2022-04-29 |
Family
ID=81264219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210308464.3A Pending CN114420616A (en) | 2022-03-28 | 2022-03-28 | Groove type cleaning device |
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| Country | Link |
|---|---|
| CN (1) | CN114420616A (en) |
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Also Published As
| Publication number | Publication date |
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| TW202303819A (en) | 2023-01-16 |
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