TWI855378B - Tank cleaning device - Google Patents

Abstract

The present invention relates to a tank cleaning device, comprising a loading unit, a cleaning unit and an unloading unit. The loading unit comprises: a first conveying structure, comprising a first conveying part, a first carrying area and at least one first buffer area, the first conveying part is used to convey a wafer box carrying wafers on a loading table to the first carrying area, or the first buffer area, or to convey the buffered wafer box to the first carrying area; a second conveying structure, comprising a second conveying part, used to convey the wafer box placed in the first carrying area to the first carrying area; The wafers in the wafer box are transferred to the cleaning unit; the unloading unit includes: a third transfer structure, including a third transfer part, used to transfer the wafers after cleaning to the empty wafer box placed in the second carrying area of the fourth transfer structure; a fourth transfer structure, including a fourth transfer part, a second carrying area and at least one second buffer area, the fourth transfer part is used to transfer the empty wafer box to the second carrying area, or buffer in the second buffer area, or transfer the buffered wafer box to the second carrying area.

Description

Tank cleaning device

The present invention belongs to the field of wafer cleaning technology, and in particular to a tank cleaning device.

In the field of semiconductor silicon wafers, tank cleaning machines are widely used, mainly to remove organic matter, particles, and metal contamination on the surface of silicon wafers to obtain silicon wafers with high surface cleanliness. Due to its high production capacity and stable technical capabilities, tank wet cleaning equipment is still active in the field of integrated circuit production and manufacturing of 30nm and above.

In traditional tank-type wet cleaning equipment, one reaction tank is filled with one chemical solution, and the entire cleaning equipment is composed of multiple reaction tanks. During the cleaning process, the entire silicon wafer is immersed in a tank filled with chemical liquid. The chemical liquid is replaced regularly to ensure the cleanliness of the processing tank, thereby ensuring the quality of the product. Some chemical liquids need to be replaced frequently. The current production sequence of the tank cleaning equipment is that the silicon wafer enters the tank body and circulates in sequence according to the settings until the final cleaning and drying are completed, and then enters the clean empty wafer box (Front Opening Unified Pod, FOUP) for unloading. Therefore, continuous loading and unloading is an important factor in improving the production efficiency of the cleaning machine. However, in actual production, due to the limitations of the loading and unloading ports, only 2 FOUPs can be placed at a time, but the equipment itself has a large circulation volume. Due to human factors, the equipment is often in a state of inability to load and unload continuously.

In order to solve the above technical problems, the present invention provides a tank cleaning device to solve the problem that wafer cleaning cannot be continuously loaded and unloaded.

In order to achieve the above-mentioned purpose, the technical solution adopted by the embodiment of the present invention is: a tank cleaning device, including a loading unit, a cleaning unit and an unloading unit, the loading unit includes: a first conveying structure and a second conveying structure; the first conveying structure includes a first conveying part, a first carrying area and at least one first buffer area, the first conveying part is used to convey the wafer box carrying the wafer on the loading table to the first carrying area, or to convey the wafer box carrying the wafer to the corresponding first buffer area for buffering, or to convey the wafer box carrying the wafer buffered in the first buffer area to the first carrying area; the second conveying structure includes a second conveying part, used to convey the wafer box carrying the wafer on the loading table to the first carrying area, The wafers placed in the wafer box in the first carrying area are transferred to the cleaning unit; the unloading unit includes a third transfer structure and a fourth transfer structure; the third transfer structure includes a third transfer part, which is used to transfer the wafers after cleaning to the empty wafer box placed in the second carrying area of the fourth transfer structure; the fourth transfer structure includes a fourth transfer part, a second carrying area and at least one second buffer area, and the fourth transfer part is used to transfer the empty wafer box to the second carrying area, or transfer the empty wafer box to the corresponding second buffer area for buffering, or transfer the empty wafer box buffered in the second buffer area to the second carrying area.

Optionally, the first conveying part includes: a first box structure, a first entrance connected to the loading platform is opened on the first side wall of the first box structure, a first exit connected to the second conveying part is opened on the second side wall of the first box structure, the first carrying area is arranged at the first exit, the second side wall is arranged adjacent to or opposite to the first side wall, and at least one first buffer area is arranged on at least one side wall of the first box structure; a first conveying arm; a first control component, used to control the movement of the first conveying arm to realize the conveyance of the wafer box.

Optionally, the first buffer area includes a supporting plate disposed on a side wall of the first box structure, and the supporting plate is disposed horizontally.

Optionally, at least one first buffer area is provided on at least one side of the first loading area in the vertical direction.

Optionally, the first control component includes a first guide rod disposed in the first box structure, the first guide rod is extended in a vertical direction, and the first transmission arm is movably disposed on the first guide rod.

Optionally, at least one first buffer area is provided on at least one side of the first carrying area along a first direction, and the first direction is perpendicular to the vertical direction and parallel to the second side wall.

Optionally, the first control component includes: a first guide rod extending in the vertical direction and arranged between the top wall and the bottom wall of the first box structure, and the first transmission arm is movably arranged on the first guide rod; a first guide rail is arranged on the top wall and/or the bottom wall of the first box structure, and the first guide rail includes at least one first sub-guide rail in a plane parallel to the horizontal direction, and the first guide rod is movably arranged on at least one of the first sub-guide rails.

Optionally, the fourth conveying part includes: a second box structure, a second entrance connected to the cleaning unit is provided on the third side wall of the second box structure, a second exit connected to the unloading platform is provided on the fourth side wall of the second box structure, the second carrying area is arranged at the second entrance, the fourth side wall is arranged adjacent to or opposite to the third side wall, and at least one second buffer area is arranged on at least one side wall of the second box structure; a second conveying arm; a second control component, used to control the movement of the second conveying arm to realize the conveyance of the wafer box.

Optionally, the second buffer area includes a supporting plate disposed on a side wall of the second box structure, and the supporting plate is disposed horizontally.

Optionally, at least one second buffer area is provided on at least one side of the second carrying area in the vertical direction.

Optionally, the second control component includes a second guide rod disposed in the second box structure, the second guide rod is extended in a vertical direction, and the second transmission arm is movably disposed on the second guide rod.

Optionally, at least one second buffer area is provided on at least one side of the second carrying area along the second direction, and the second direction is perpendicular to the vertical direction and parallel to the fourth side wall.

Optionally, the second control component includes: a second guide rod extending in the vertical direction and arranged between the top wall and the bottom wall of the second box structure, and the second transmission arm is movably arranged on the second guide rod; a second guide rail is arranged on the top wall and/or the bottom wall of the second box structure, and the second guide rail includes at least one second sub-guide rail in a plane parallel to the horizontal direction, and the second guide rod is movably arranged on at least one of the second sub-guide rails.

The beneficial effect of the present invention is that the first transmission structure and the second transmission structure cooperate to realize the continuous uploading of the wafers to be cleaned, and the third transmission structure and the fourth transmission structure cooperate to realize the continuous unloading of the wafers after cleaning, thereby improving the cleaning efficiency.

1: Loading unit

2: Cleaning unit

3: Unloading unit

4: Upload area

5: Unloading area

101: First wafer box

102: First transmission arm

103: First top wall

104: First cache area

105: First automatic door

106: The third transmission arm

107: Wafer handling arm

108: Fourth transmission arm

109: Second automatic door

110: Second cache area

111: Second top wall

112: Second transmission arm

113: Second wafer box

120: First side wall

121: Second side wall

123: Third side wall

124: Fourth side wall

125: Loading table

126: Unloading table

130: First loading area

140: Second loading area

210: First guide rod

211: First sub-track

212: Second guide rod

FIG1 is a schematic diagram showing the structure of a tank-type cleaning device in the related art; FIG2 is a schematic diagram showing the structure of a tank-type cleaning device in an embodiment of the present invention; FIG3 is a schematic diagram showing the distribution of the first buffer area in an embodiment of the present invention.

In order to help you understand the technical features, content and advantages of the present invention and the effects it can achieve, the present invention is described in detail as follows with accompanying drawings and appendices in the form of embodiments. The drawings used are only for illustration and auxiliary instructions, and may not be the true proportions and precise configurations after the implementation of the present invention. Therefore, the proportions and configurations of the attached drawings should not be interpreted to limit the scope of application of the present invention in actual implementation.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the attached drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For those with ordinary knowledge in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to the specific circumstances.

Referring to FIG. 1 , the tank cleaning machine in the related art includes a loading unit 1, a cleaning unit 2 and an unloading unit 3. After the wafers are loaded, they flow through each reaction tank in sequence for etching and cleaning in the order in which the wafers are put in. However, there are two problems: 1. If the operator fails to load the wafers to be processed in the loading area 4 in a timely and continuous manner, the tank inside the equipment will be idle, resulting in a waste of production capacity. The chemicals in the tank need to be replaced with new ones at a fixed time, that is, they are not Regardless of whether it is in production or not, it will be replaced after a certain period of time, resulting in high input and low output; 2. When the operator does not place an empty wafer box in the unloading area 5 in time to unload the processed wafers, the wafers being processed inside the equipment will not be able to reach the next reaction tank on time, causing the cleaning timeout. The product needs to be reworked as a whole, wasting the equipment's capacity. The product will also face degradation, especially the wafers that have been soaked in the chemical etching tank for a long time, which has the risk of being scrapped.

Referring to FIG. 2 and FIG. 3, in view of the above problems, the present embodiment provides a tank cleaning device, including a loading unit, a cleaning unit and an unloading unit, wherein the loading unit includes: a first conveying structure and a second conveying structure; the first conveying structure includes a first conveying part, a first carrying area 130 (position indicated by A) and at least one first buffer area 104, the first conveying part is used to convey the wafer box (first wafer box 101) carrying the wafer on the loading platform 125 to the first carrying area 130, or convey the wafer box carrying the wafer to the corresponding first buffer area 104 for buffering, or convey the wafer box carrying the wafer buffered in the first buffer area 104 to the first carrying area 130; the second conveying structure includes a second conveying part, which is used to convey the wafer box carrying the wafer on the loading platform 125 to the first carrying area 130. The wafers placed in the wafer box of the first loading area 130 are transferred to the cleaning unit; the unloading unit includes a third transfer structure and a fourth transfer structure; the third transfer structure includes a third transfer part, which is used to transfer the wafers after cleaning to the empty wafer box placed in the second loading area 140 of the fourth transfer structure; the fourth transfer structure includes a fourth transfer part, a second loading area 140 (position indicated by B) and at least one second buffer area 110, and the fourth transfer part is used to transfer the empty wafer box (second wafer box 113) to the second loading area 140, or transfer the empty wafer box to the corresponding second buffer area 110 for buffering, or transfer the empty wafer box buffered in the second buffer area 110 to the second loading area 140.

The first transmission structure and the second transmission structure cooperate to realize the continuous uploading of the wafers to be cleaned, and the third transmission structure and the fourth transmission structure cooperate to realize the continuous unloading of the wafers after cleaning, thereby ensuring the continuous input and output of the wafers and improving efficiency.

During operation, a wafer box carrying wafers is placed on the loading platform 125, the first conveying unit conveys the wafer box carrying wafers to the first loading area 130, and the second conveying unit takes away the wafers and conveys them to the cleaning unit for cleaning. When the wafers in the wafer box on the first loading area 130 are not completely taken out, the wafer box carrying wafers loaded on the loading platform 125 is conveyed by the first conveying unit to the first buffer area 104 for temporary storage. After all the wafers in the wafer box on the first loading area 130 are taken out, the first conveying unit takes out the empty wafer box to the loading platform 125, and then conveys the wafer box carrying wafers temporarily stored in the first buffer area 104 to the first loading area 130 to reduce the interval time.

It should be noted that the first loading area 130 can store two wafer boxes at the same time, so that the first transfer unit can first transfer the wafer box carrying wafers temporarily stored in the first buffer area 104 to the first loading area 130, and then take away the empty wafer box, so that the continuous loading can be further realized.

It should be noted that the first conveying unit can be a single conveying unit, that is, it can only perform one action at a time. For example, after the empty wafer box is taken away and conveyed to the loading platform 125, the wafer box carrying the wafer temporarily stored in the first buffer area 104 is conveyed to the first loading area 130. Exemplarily, the first conveying unit can also complete multiple actions at a time. For example, the first conveying unit can include a first sub-conveying unit and a second sub-conveying unit. While the first sub-conveying unit conveys the empty wafer box on the first loading area 130 to the loading platform 125, the second sub-conveying unit conveys the wafer box carrying the wafer temporarily stored in the first buffer area 104 to the first loading area 130, so as to further save time, realize continuous loading of wafers, and improve efficiency.

In this embodiment, the first conveying part includes: a first box structure, a first entrance connected to a loading platform 125 is provided on a first side wall 120 of the first box structure, a first exit connected to the second conveying part is provided on a second side wall 121 of the first box structure, the first carrying area 130 is arranged at the first exit, the second side wall 121 is arranged adjacent to or opposite to the first side wall 120, at least one first buffer area 104 is arranged on at least one side wall of the first box structure; a first conveying arm 102; a first control component, used to control the movement of the first conveying arm 102 to realize the conveyance of the wafer box.

In this embodiment, the first conveying part and the second conveying part are divided into two spaces, the first conveying part and the second conveying part are separated by a baffle, the first carrying area 130 is located at the connection between the first conveying part and the second conveying part, and an automatic door (first automatic door 105) is provided at the connection. When a wafer box carrying wafers is placed in the first carrying area 130, the automatic door automatically opens to ensure a clean environment in the cleaning unit.

In a specific implementation of this embodiment, the second side wall 121 (i.e., the partition between the first conveying part and the second conveying part) is arranged opposite to the first side wall 120, so that the moving route of the first conveying arm 102 is simplified, but it is not limited to this.

Exemplarily, the first buffer area 104 includes a supporting plate disposed on a side wall of the first box structure, and the supporting plate is disposed horizontally.

Exemplarily, along the vertical direction (refer to the Y direction in FIG. 3 ), at least one first buffer area 104 is disposed on at least one side of the first loading area 130.

Exemplarily, the first control component includes a first guide rod 210 disposed in the first box structure, the first guide rod 210 is extended in a vertical direction, and the first transmission arm 102 is movably disposed on the first guide rod 210.

The first transfer arm 102 can rotate around the first guide rod 210 and can reciprocate along the extension direction of the first guide rod 210. Under the control of the first control component, the first transfer arm 102 takes the wafer box carrying the wafer on the loading platform 125, and then rotates to face away from the loading platform 125 to transfer the wafer box carrying the wafer to the first loading area 130, or moves up or down along the first guide rod 210 to transfer the wafer box carrying the wafer to the corresponding first buffer area 104.

It should be noted that the first transfer arm 102 includes a first telescopic arm and a first clamp located at one end of the first telescopic arm. The arrangement of the first telescopic arm facilitates the rotation of the first transfer arm 102 and facilitates the transfer of the wafer box between the loading platform 125 and the first loading area 130 (or the first buffer area 104).

For example, a guide rail extending from the first side wall 120 to the second side wall 121 may be provided in the first box structure, and the first guide rod 210 may be movably provided on the guide rail, which is convenient for conveying the wafer box. The guide rail may be provided on at least one inner wall of the top wall and the bottom wall of the first box structure, for example, guide rails may be provided on both the top wall and the bottom wall, and the orthographic projection of the guide rail on the top wall on the bottom wall coincides with the guide rail on the bottom wall, and the opposite ends of the first guide rod 210 may be movably provided on the corresponding guide rails.

Exemplarily, along the first direction (refer to the X direction in FIG. 3 ), at least one first buffer area 104 is disposed on at least one side of the first loading area 130, and the first direction is perpendicular to the vertical direction and parallel to the second sidewall 121 (i.e., parallel to the plane where the second sidewall is located, and the first buffer area 104 is disposed on the second sidewall 121).

Exemplarily, the first control component includes: a first guide rod 210 extending in the vertical direction and arranged between the top wall and the bottom wall of the first box structure, and the first transmission arm 102 is movably arranged on the first guide rod 210; a first guide rail, arranged on the top wall and/or the bottom wall of the first box structure, and the first guide rail includes at least one first sub-guide rail 211 in a plane parallel to the horizontal direction, and the first guide rod 210 is movably arranged on at least one of the first sub-guide rails 211.

When the first transfer arm 102 rotates around the first guide rod 210 and is sufficient to transfer the wafer box carrying the wafer located on the loading platform 125 to the first loading area 130, the first guide rail does not need to be set in the direction from the first side wall 120 to the second side wall 121. When the wafer box carrying the wafer needs to be transferred to the corresponding first buffer area 104, the first guide rod 210 needs to move along the corresponding first sub-guide rail 211 to drive the first transfer arm 102 to move. At this time, at least one of the first sub-guide rails 211 is set in the horizontal direction and parallel to the second side wall 121.

It should be noted that the first transmission arm 102 may be a telescopic structure. For example, the first transmission arm 102 includes a first telescopic arm and a first clamp located at one end of the first telescopic arm. In this case, the first guide rail may be omitted.

Exemplarily, along the vertical direction, at least one first buffer area 104 is disposed on at least one side of the first loading area 130, and along the first direction, at least one first buffer area 104 is disposed on at least one side of the first loading area 130.

For example, the first buffer areas 104 are arranged in an array around the first loading area 130. The first buffer areas 104 are arranged in an array on the second side wall 121, and multiple first buffer areas 104 are located around the first loading area 130, so as to facilitate moving the wafer box carrying the wafer temporarily stored in the first buffer area 104 to the first loading area 130.

At this time, in order to facilitate the transmission of the first transmission arm 102, at least two first sub-guide rails 211 arranged crosswise are arranged on the bottom wall of the first box structure, one of the first sub-guide rails 211 extends from the first side wall 120 to the second side wall 121, and the other first sub-guide rail 211 is parallel to the second side wall 121.

Exemplarily, the second transmission part includes a third transmission arm 106, and the third transmission arm 106 includes a plurality of connecting rods connected end to end, and a clamping member is provided at the free end of the end connecting rod (the structure of the mechanical arm in conventional technology can be referred to, and will not be elaborated here).

Exemplarily, the fourth conveying part includes: a second box structure, a second entrance connected to the cleaning unit is opened on the fourth side wall 124 of the second box structure, a second exit connected to the unloading platform 126 is opened on the third side wall 123 of the second box structure, the second carrying area 140 is arranged at the second entrance, the fourth side wall 124 and the third side wall 123 are arranged adjacent to or opposite to each other, at least one second buffer area 110 is arranged on at least one side wall of the second box structure; a second conveying arm 112; a second control component, used to control the movement of the second conveying arm 112 to realize the conveyance of the wafer box.

In this embodiment, the third conveying part and the fourth conveying part are divided into two spaces, and the third conveying part and the fourth conveying part are separated by a baffle. The second carrying area 140 is located at the connection between the third conveying part and the fourth conveying part. An automatic door (second automatic door 109) is set at the connection. When an empty wafer box is placed in the second carrying area 140, the automatic door automatically opens to ensure a clean environment in the cleaning unit.

An empty wafer box (second wafer box 113) is placed on the unloading platform 126, and the second transfer arm 112 transfers the empty wafer box to the second loading area 140, so that the third transfer unit transfers the wafer to the empty wafer box. At this time, the empty wafer box loaded on the unloading platform 126 is transferred to the second buffer area 110 by the second transfer arm 112. After the wafer box on the second loading area 140 is fully loaded, the second transfer arm 112 takes away the fully loaded wafer box and returns to the unloading platform 126. Then the second transfer arm 112 transfers the empty wafer box temporarily stored in the second buffer area 110 to the second loading area 140 to continue loading wafers, ensuring the continuity of wafer unloading.

It should be noted that the second conveying arm 112 may include a third sub-conveying arm and a fourth sub-conveying arm. While the third sub-conveying arm takes away the fully loaded wafer box, the fourth sub-conveying arm transfers the empty wafer box temporarily stored in the second buffer area 110 to the second loading area 140 to continue loading wafers, which more effectively ensures the continuity of unloading the wafers after cleaning.

In a specific implementation of this embodiment, the fourth side wall 124 (i.e., the partition between the third transmission part and the fourth transmission part) is arranged opposite to the third side wall 123, so that the moving route of the second transmission arm 112 is simplified, but it is not limited to this.

Exemplarily, the second buffer area 110 includes a supporting plate disposed on a side wall of the second box structure, and the supporting plate is disposed horizontally.

Exemplarily, along the vertical direction, at least one second buffer area 110 is disposed on at least one side of the second loading area 140.

Exemplarily, the second control component includes a second guide rod 212 disposed in the second box structure, the second guide rod 212 is extended in a vertical direction, and the second transmission arm 112 is movably disposed on the second guide rod 212.

The second transfer arm 112 can rotate around the second guide rod 212 and can reciprocate along the extension direction of the second guide rod 212. Under the control of the second control component, the second transfer arm 112 takes away the empty wafer box on the unloading table 126, and then rotates to face away from the unloading table 126 to transfer the empty wafer box to the second loading area 140, or moves up or down along the second guide rod 212 to transfer the empty wafer box to the corresponding second buffer area 110.

It should be noted that the second transfer arm 112 includes a second telescopic arm and a clamp located at one end of the second telescopic arm. The second telescopic arm is arranged to facilitate the rotation of the second transfer arm 112 and facilitate the transfer of the wafer box between the unloading platform 126 and the second loading area 140 (or the second buffer area 110).

For example, a guide rail extending from the third side wall 123 to the fourth side wall 124 may be provided in the second box structure, and the second guide rod 212 may be movably provided on the guide rail, which is convenient for conveying the wafer box. The guide rail may be provided on at least one inner wall of the top wall and the bottom wall of the second box structure, for example, guide rails may be provided on both the top wall and the bottom wall, and the orthographic projection of the guide rail on the top wall on the bottom wall coincides with the guide rail on the bottom wall, and the opposite ends of the second guide rod 212 may be movably provided on the corresponding guide rails.

Exemplarily, along the second direction, at least one second buffer area 110 is disposed on at least one side of the second carrying area 140, and the second direction is perpendicular to the vertical direction and parallel to the fourth side wall 124 (i.e., parallel to the plane where the fourth side wall 124 is located, and the second buffer area 110 is disposed on the fourth side wall 124).

Exemplarily, the second control component includes: a second guide rod 212 extending in the vertical direction and arranged between the top wall and the bottom wall of the second box structure, and the second transmission arm 112 is movably arranged on the second guide rod 212; a second guide rail is arranged on the top wall and/or the bottom wall of the second box structure, and the second guide rail includes at least one second sub-guide rail in a plane parallel to the horizontal direction, and the second guide rod 212 is movably arranged on at least one of the second sub-guide rails.

When the second transfer arm 112 rotates around the second guide rod 212 and is sufficient to transfer the empty wafer box located on the unloading platform 126 to the second loading area 140, the second guide rail does not need to be set in the direction from the third side wall 123 to the fourth side wall 124. When the empty wafer box needs to be transferred to the corresponding second buffer area 110, the second guide rod 212 needs to move along the corresponding second sub-guide rail to drive the second transfer arm 112 to move. At this time, at least one of the second sub-guide rails is set in the horizontal direction and parallel to the fourth side wall 124.

It should be noted that the second transmission arm 112 may be a telescopic structure. For example, the second transmission arm 112 includes a second telescopic arm and a second clamp located at one end of the second telescopic arm. In this case, the second guide rail may be omitted.

Exemplarily, along the vertical direction, at least one second buffer area 110 is disposed on at least one side of the second carrying area 140, and along the horizontal direction, at least one second buffer area 110 is disposed on at least one side of the second carrying area 140.

Exemplarily, the second buffer areas 110 are arranged in an array around the second loading area 140, that is, the second buffer areas 110 are arranged in an array on the fourth side wall 124, and a plurality of the second buffer areas 110 are located around the second loading area 140, so as to facilitate moving the empty wafer boxes temporarily stored in the second buffer areas 110 to the second loading area 140.

At this time, in order to facilitate the transmission of the second transmission arm 112, at least two second sub-guide rails arranged in a cross-arrangement are arranged on the bottom wall of the second box structure, one of which extends from the third side wall 123 to the fourth side wall 124, and one of which is parallel to the fourth side wall 124.

In this embodiment, a screening program is provided on the first top wall 103 of the first conveying part to ensure a clean environment of the first conveying part.

In this embodiment, a screening program is provided on the second top wall 111 of the fourth conveying part to ensure a clean environment of the fourth conveying part.

Exemplarily, the third transmission part includes a fourth transmission arm 108, and the fourth transmission arm 108 includes a connecting rod hinged end to end, and a clamping member arranged at the free end of the end connecting rod (the structure of the mechanical arm in conventional technology can be referred to, which will not be elaborated here).

In this embodiment, the cleaning unit includes a plurality of cleaning tanks, each of which contains a different cleaning liquid to clean the wafer.

The cleaning unit is equipped with a wafer transfer arm 107, which can move between multiple cleaning tanks.

It should be noted that the technical solutions described in the embodiments of the present invention can be combined arbitrarily without conflict. The above are only the preferred embodiments of the present invention and are not used to limit the scope of implementation of the present invention. If the present invention is modified or replaced equivalently without departing from the spirit and scope of the present invention, it should be covered by the protection scope of the patent application of the present invention.

101: First wafer box

102: First transmission arm

103: First top wall

104: First cache area

105: First automatic door

106: The third transmission arm

107: Wafer handling arm

108: Fourth transmission arm

109: Second automatic door

110: Second cache area

111: Second top wall

112: Second transmission arm

113: Second wafer box

120: First side wall

121: Second side wall

123: Third side wall

124: Fourth side wall

125: Loading table

126: Unloading table

130: First loading area

140: Second loading area

210: First guide rod

212: Second guide rod

Claims (13)

A tank cleaning device includes a loading unit, a cleaning unit and an unloading unit. The loading unit includes: a first conveying structure and a second conveying structure; the first conveying structure includes a first conveying part, a first carrying area and at least one first buffer area, the first conveying part is used to convey a wafer box carrying a wafer on a loading table to the first carrying area, or to convey a wafer box carrying a wafer to the corresponding first buffer area for buffering, or to convey the wafer box carrying a wafer to the corresponding first buffer area for buffering. The wafer box carrying the wafers stored in the first buffer area is transferred to the first loading area; the first transfer part includes a first sub-transfer part and a second sub-transfer part. When the first sub-transfer part transfers the wafer box above the first loading area to the loading platform, the second sub-transfer part transfers the wafer box carrying the wafers temporarily stored in the first buffer area to the first loading area; the second transfer structure includes a second transfer part, which is used to transfer the wafer box placed on the first loading area to the loading platform. The wafers in the wafer box in the loading area are transferred to the cleaning unit; the unloading unit includes a third transfer structure and a fourth transfer structure; the third transfer structure includes a third transfer part, which is used to transfer the wafers after cleaning to the empty wafer box placed in the second carrying area of the fourth transfer structure; the fourth transfer structure includes a fourth transfer part, a second carrying area and at least one second buffer area, and the fourth transfer part is used to transfer the empty wafer box to the second loading area, or to transfer the empty wafer box to the corresponding second buffer area for buffering, or to transfer the empty wafer box buffered in the second buffer area to the second loading area; the fourth transfer part includes a third sub-transfer part and a fourth sub-transfer part, and the third sub-transfer part takes away the full wafer box, while the fourth sub-transfer part transfers the empty wafer box temporarily stored in the second buffer area to the second loading area to continue loading wafers. The tank cleaning device as described in claim 1, wherein the first conveying part comprises: a first box structure, a first inlet connected to the loading platform is provided on the first side wall of the first box structure, a first outlet connected to the second conveying part is provided on the second side wall of the first box structure, the first carrying area is arranged at the first outlet, the second side wall is arranged adjacent to or opposite to the first side wall, and at least one first buffer area is arranged on at least one side wall of the first box structure; a first conveying arm; and a first control component for controlling the movement of the first conveying arm to realize the conveyance of the wafer box. A tank cleaning device as described in claim 2, wherein the first buffer area includes a support plate disposed on a side wall of the first box structure, and the support plate is disposed horizontally. The tank cleaning device as described in claim 2, wherein at least one first buffer area is provided on at least one side of the first carrying area along the vertical direction. The tank cleaning device as described in claim 4, wherein the first control component includes a first guide rod disposed in the first box structure, the first guide rod extends in a vertical direction, and the first transmission arm is movably disposed on the first guide rod. The tank cleaning device as described in claim 5, wherein at least one first buffer area is provided on at least one side of the first carrying area along a first direction, the first direction being perpendicular to the vertical direction and parallel to the second side wall. The tank cleaning device as described in claim 6, wherein the first control component comprises: a first guide rod extending in the vertical direction and arranged between the top wall and the bottom wall of the first box structure, the first conveying arm being movably arranged on the first guide rod; a first guide rail being arranged on the top wall and/or the bottom wall of the first box structure, the first guide rail comprising at least one first sub-guide rail in a plane parallel to the horizontal direction, the first guide rod being movably arranged on at least one of the first sub-guide rails. The tank cleaning device as described in claim 1, wherein the fourth conveying part comprises: a second box structure, a second inlet connected to the cleaning unit is provided on the third side wall of the second box structure, a second outlet connected to the unloading platform is provided on the fourth side wall of the second box structure, the second carrying area is arranged at the second inlet, the fourth side wall is arranged adjacent to or opposite to the third side wall, and at least one second buffer area is arranged on at least one side wall of the second box structure; a second conveying arm; and a second control component for controlling the movement of the second conveying arm to realize the conveyance of the wafer box. A tank cleaning device as described in claim 8, wherein the second buffer area includes a support plate disposed on the side wall of the second box structure, and the support plate is disposed horizontally. A tank-type cleaning device as described in claim 8, wherein at least one second buffer area is provided on at least one side of the second carrying area along the vertical direction. The tank cleaning device as described in claim 10, wherein the second control component includes a second guide rod disposed in the second box structure, the second guide rod extends in a vertical direction, and the second transmission arm is movably disposed on the second guide rod. The tank-type cleaning device as described in claim 11, wherein at least one second buffer area is provided on at least one side of the second carrying area along the second direction, and the second direction is perpendicular to the vertical direction and parallel to the fourth side wall. The tank cleaning device as described in claim 12, wherein the second control component includes: a second guide rod extending in the vertical direction and arranged between the top wall and the bottom wall of the second box structure, and the second transmission arm is movably arranged on the second guide rod; a second guide rail is arranged on the top wall and/or the bottom wall of the second box structure, and the second guide rail includes at least one second sub-guide rail in a plane parallel to the horizontal direction, and the second guide rod is movably arranged on at least one of the second sub-guide rails.