CN114402709A - 安装基板制造系统、部件搭载系统以及安装基板制造方法、部件搭载方法 - Google Patents

安装基板制造系统、部件搭载系统以及安装基板制造方法、部件搭载方法 Download PDF

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Publication number
CN114402709A
CN114402709A CN202080064745.8A CN202080064745A CN114402709A CN 114402709 A CN114402709 A CN 114402709A CN 202080064745 A CN202080064745 A CN 202080064745A CN 114402709 A CN114402709 A CN 114402709A
Authority
CN
China
Prior art keywords
component
mounting
substrate
inspection
solder part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080064745.8A
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English (en)
Chinese (zh)
Inventor
永冶利彦
北贵之
木原正宏
谷口昌弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN114402709A publication Critical patent/CN114402709A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202080064745.8A 2019-09-27 2020-06-09 安装基板制造系统、部件搭载系统以及安装基板制造方法、部件搭载方法 Pending CN114402709A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019176611 2019-09-27
JP2019-176611 2019-09-27
PCT/JP2020/022604 WO2021059606A1 (ja) 2019-09-27 2020-06-09 実装基板製造システム、部品搭載システムおよび実装基板製造方法、部品搭載方法

Publications (1)

Publication Number Publication Date
CN114402709A true CN114402709A (zh) 2022-04-26

Family

ID=75166030

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080064745.8A Pending CN114402709A (zh) 2019-09-27 2020-06-09 安装基板制造系统、部件搭载系统以及安装基板制造方法、部件搭载方法

Country Status (4)

Country Link
JP (2) JP7235132B2 (ja)
CN (1) CN114402709A (ja)
DE (1) DE112020004574T5 (ja)
WO (1) WO2021059606A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134899A (ja) * 2000-10-25 2002-05-10 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
JP2003229699A (ja) * 2002-02-05 2003-08-15 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
JP2005252290A (ja) * 2005-04-08 2005-09-15 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2006196819A (ja) * 2005-01-17 2006-07-27 Matsushita Electric Ind Co Ltd 電子部品実装装置及び実装方法
JP2006287062A (ja) * 2005-04-01 2006-10-19 Yamaha Motor Co Ltd 実装基板製造装置
JP2014041893A (ja) * 2012-08-22 2014-03-06 Panasonic Corp 電子部品実装システムおよび電子部品実装装置ならびに電子部品実装方法
US20140138012A1 (en) * 2012-11-16 2014-05-22 GM Global Technology Operations LLC Automatic monitoring of vibration welding equipment
JP2016058603A (ja) * 2014-09-11 2016-04-21 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装システム
JP2018113336A (ja) * 2017-01-12 2018-07-19 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013221767A (ja) 2012-04-13 2013-10-28 Panasonic Corp 外観検査装置および外観検査方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134899A (ja) * 2000-10-25 2002-05-10 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
JP2003229699A (ja) * 2002-02-05 2003-08-15 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
JP2006196819A (ja) * 2005-01-17 2006-07-27 Matsushita Electric Ind Co Ltd 電子部品実装装置及び実装方法
JP2006287062A (ja) * 2005-04-01 2006-10-19 Yamaha Motor Co Ltd 実装基板製造装置
JP2005252290A (ja) * 2005-04-08 2005-09-15 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2014041893A (ja) * 2012-08-22 2014-03-06 Panasonic Corp 電子部品実装システムおよび電子部品実装装置ならびに電子部品実装方法
US20140138012A1 (en) * 2012-11-16 2014-05-22 GM Global Technology Operations LLC Automatic monitoring of vibration welding equipment
JP2016058603A (ja) * 2014-09-11 2016-04-21 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装システム
JP2018113336A (ja) * 2017-01-12 2018-07-19 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
张敏;寇冠中;张丽云;罗兵;: "SMT生产线多环节质量检测与控制技术", 电子质量, no. 07, 20 July 2010 (2010-07-20) *

Also Published As

Publication number Publication date
JP7235132B2 (ja) 2023-03-08
DE112020004574T5 (de) 2022-06-09
JP7496537B2 (ja) 2024-06-07
JPWO2021059606A1 (ja) 2021-04-01
JP2023057162A (ja) 2023-04-20
WO2021059606A1 (ja) 2021-04-01

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