JPWO2021059606A1 - - Google Patents

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Publication number
JPWO2021059606A1
JPWO2021059606A1 JP2021548337A JP2021548337A JPWO2021059606A1 JP WO2021059606 A1 JPWO2021059606 A1 JP WO2021059606A1 JP 2021548337 A JP2021548337 A JP 2021548337A JP 2021548337 A JP2021548337 A JP 2021548337A JP WO2021059606 A1 JPWO2021059606 A1 JP WO2021059606A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021548337A
Other versions
JP7235132B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021059606A1 publication Critical patent/JPWO2021059606A1/ja
Priority to JP2023024150A priority Critical patent/JP2023057162A/ja
Application granted granted Critical
Publication of JP7235132B2 publication Critical patent/JP7235132B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021548337A 2019-09-27 2020-06-09 実装基板製造システム、部品搭載システムおよび実装基板製造方法、部品搭載方法 Active JP7235132B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023024150A JP2023057162A (ja) 2019-09-27 2023-02-20 キャリブレーションデータ算出装置およびキャリブレーションデータ算出方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019176611 2019-09-27
JP2019176611 2019-09-27
PCT/JP2020/022604 WO2021059606A1 (ja) 2019-09-27 2020-06-09 実装基板製造システム、部品搭載システムおよび実装基板製造方法、部品搭載方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023024150A Division JP2023057162A (ja) 2019-09-27 2023-02-20 キャリブレーションデータ算出装置およびキャリブレーションデータ算出方法

Publications (2)

Publication Number Publication Date
JPWO2021059606A1 true JPWO2021059606A1 (ja) 2021-04-01
JP7235132B2 JP7235132B2 (ja) 2023-03-08

Family

ID=75166030

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021548337A Active JP7235132B2 (ja) 2019-09-27 2020-06-09 実装基板製造システム、部品搭載システムおよび実装基板製造方法、部品搭載方法
JP2023024150A Pending JP2023057162A (ja) 2019-09-27 2023-02-20 キャリブレーションデータ算出装置およびキャリブレーションデータ算出方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023024150A Pending JP2023057162A (ja) 2019-09-27 2023-02-20 キャリブレーションデータ算出装置およびキャリブレーションデータ算出方法

Country Status (4)

Country Link
JP (2) JP7235132B2 (ja)
CN (1) CN114402709A (ja)
DE (1) DE112020004574T5 (ja)
WO (1) WO2021059606A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134899A (ja) * 2000-10-25 2002-05-10 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
JP2016058603A (ja) * 2014-09-11 2016-04-21 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装システム
JP2018113336A (ja) * 2017-01-12 2018-07-19 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134899A (ja) * 2000-10-25 2002-05-10 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび電子部品実装方法
JP2016058603A (ja) * 2014-09-11 2016-04-21 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装システム
JP2018113336A (ja) * 2017-01-12 2018-07-19 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置

Also Published As

Publication number Publication date
DE112020004574T5 (de) 2022-06-09
WO2021059606A1 (ja) 2021-04-01
JP2023057162A (ja) 2023-04-20
CN114402709A (zh) 2022-04-26
JP7235132B2 (ja) 2023-03-08

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