CN114388396A - Resin sealing device and method for manufacturing resin sealing product - Google Patents

Resin sealing device and method for manufacturing resin sealing product Download PDF

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Publication number
CN114388396A
CN114388396A CN202110949136.7A CN202110949136A CN114388396A CN 114388396 A CN114388396 A CN 114388396A CN 202110949136 A CN202110949136 A CN 202110949136A CN 114388396 A CN114388396 A CN 114388396A
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CN
China
Prior art keywords
mold
resin sealing
workpiece
robot
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110949136.7A
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Chinese (zh)
Inventor
高山凌
柳泽高行
小口达司
佐藤洋平
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Apic Yamada Corp
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Apic Yamada Corp
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Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of CN114388396A publication Critical patent/CN114388396A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention provides a resin sealing device and a method for manufacturing resin sealing products, which can restrain the load of a loading manipulator on a supporting part and restrain the generation of defective products. A resin sealing device (1) is provided with: the work handling apparatus comprises a loader robot (120) having a first cleaner unit (140), an unloader robot (220) having a second cleaner unit, and a control unit (C) for controlling the loader robot (120) and the unloader robot (220), wherein the control unit (C) cleans at least a mold surface (23A) of a lower mold (23) of a resin-sealed mold (21) by the loader robot (120) when a work is loaded into the resin-sealed mold (21), and cleans at least a mold surface (23A) of the lower mold (23) of the resin-sealed mold (21) by the unloader robot (220) when the work is unloaded from the resin-sealed mold (21).

Description

Resin sealing device and method for manufacturing resin sealing product
Technical Field
The present invention relates to a resin sealing device and a method for manufacturing a resin sealed product.
Background
In a resin sealing device for resin-sealing a workpiece with resin, it is necessary to periodically clean a die surface of a resin sealing die.
Patent document 1 discloses a conveying mechanism including a cleaner unit in a mold entrance portion of a loader (loader) and an unloader (unloader), wherein a rotating brush of the cleaner unit cleans mold surfaces of a lower mold and an upper mold when a workpiece is carried in or out.
Patent document 2 discloses a resin sealing device in which a cleaner device for collecting dust while cleaning an upper mold surface and/or a lower mold surface when advancing and retreating to and from a resin sealing mold opened in a mold is provided in a loader and/or an unloader, the resin sealing device including: a cleaning brush for scraping off the dust attached to the upper die surface and/or the lower die surface, and a duct opening for collecting dust on the upper die surface and/or the lower die surface.
[ Prior art documents ]
[ patent document ]
[ patent document 1] Japanese patent application laid-open No. 2008-179025
[ patent document 2] Japanese patent laid-open No. 2002-240046
Disclosure of Invention
[ problems to be solved by the invention ]
Generally, the unloader robot is provided with a cleaner unit for cleaning the mold surface, and the loader robot is not provided with a redundant cleaner unit. In this case, although the load on the portion supporting the loader robot is reduced, dust falling on the mold surface after cleaning by the unloader robot and before the loader robot carries the workpiece in may cause a defective product. On the other hand, since both the unloader robot and the loader robot can have the cleaner portions having the same configuration, there is a conventional example in which both the unloader robot and the loader robot have the cleaner portions having the same configuration as described in patent documents 1 and 2, and the load on the loader may increase due to an increase in the weight to be supported caused by an increase in the size of the loader robot, a reaction of the operation of the brush, or the like. In addition, in consideration of the problems that the mechanism of the loader becomes complicated due to the existence of the overlapped cleaner portions and the cost of the resin sealing device becomes high, and that cleaning is required immediately after resin molding in order to prevent resin scraps after resin molding from scattering in the device, the cleaner portion is actually provided only in the unloader robot.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin sealing device and a method of manufacturing a resin sealed product, which can suppress the load of a loader robot on a support portion and suppress the occurrence of defective products.
[ means for solving problems ]
A resin sealing apparatus according to an aspect of the present invention is a resin sealing apparatus for resin-sealing a workpiece using a resin sealing mold including an upper mold and a lower mold, the resin sealing apparatus including: a loader robot configured to be able to advance and retreat with respect to a space between the upper mold and the lower mold; an unloader robot configured to be able to advance and retreat with respect to a space between the upper mold and the lower mold; and a control unit for controlling the operations of the loader robot and the unloader robot, wherein the loader robot has a first workpiece holding unit and a first cleaner unit, the first workpiece holding section is configured to be capable of holding a workpiece, the first cleaner section is disposed further forward than the first workpiece holding section in an advancing direction into the resin sealing mold, the unloader robot has a second workpiece holding section and a second cleaner section, the second workpiece holding portion is configured to be capable of holding the workpiece, the second cleaner portion is disposed further forward than the second workpiece holding portion in an advancing direction into the resin sealing mold, and the control portion is configured to carry the workpiece into the resin sealing mold, cleaning at least the mold surface of the lower mold of the resin-sealed mold by the loader robot, when the work is carried out of the resin sealing mold, at least the mold surface of the lower mold of the resin sealing mold is cleaned by the unloader robot.
According to the above aspect, for example, the loader robot can remove dust that falls onto the mold surface of the resin sealing mold after being cleaned by the unloader robot. For example, by removing dust immediately before setting the work, the yield of defective products can be reduced.
In the above aspect, the control unit may control: an operation of moving a loader robot holding a workpiece by a first workpiece holding unit into a space between an upper mold and a lower mold in a state where a first cleaner unit is brought close to a mold surface of the lower mold, and cleaning the mold surface of the lower mold; an operation of transferring the workpiece from the first workpiece holding section to the die surface of the lower die; and an operation of releasing the workpiece from the first workpiece holding portion and withdrawing the loader robot from the space between the upper mold and the lower mold in a state where the first cleaner portion is separated from the mold surface of the lower mold.
In the aspect, the first cleaner portion has a first suction hole that opens to the mold surface of the resin sealing mold, the second cleaner portion has a second suction hole that opens to the mold surface of the resin sealing mold, and a brush at least a part of which is accommodated in the second suction hole.
According to the above aspect, since the dust fixed to the mold surface of the resin sealing mold is scraped off by the brush provided in the second cleaner section of the unloader robot, the dust can be removed by sucking the dust through the first suction hole in the first cleaner section of the loader robot. Therefore, the size and weight increase of the loader robot can be suppressed, and the load on the loader supporting the loader robot can be reduced.
In the above aspect, the first cleaner unit may further include a first dust collection member that protrudes toward the mold surface of the resin sealing mold and is configured to be able to form a suction space that is depressurized between the first suction hole and the mold surface of the resin sealing mold.
According to the above aspect, the suction force of the first suction hole is increased, whereby the cleaning efficiency of the first cleaner portion is improved, and the yield of defective products can be reduced.
In the above aspect, the first dust collection member may be configured in a frame shape surrounding the first suction hole.
According to this mode, the suction force of the first suction hole is further increased.
In the above aspect, the first dust collection member has a first front portion disposed on a front side in the entering direction of the loader robot with respect to the first suction hole, and a first rear portion disposed on a rear side in the entering direction of the loader robot with respect to the first suction hole, and a front end of the first front portion is closer to the first suction hole than a front end of the first rear portion in a vertical direction of the mold surface of the resin sealing mold.
According to the above aspect, dust scattering to the workpiece side during cleaning can be reduced.
In the above aspect, the first cleaner unit may be configured such that at least a part thereof is movable in a direction perpendicular to the mold surface of the resin sealing mold, and the first front portion may be configured to be separated from the mold surface of the resin sealing mold when the first rear portion is in sliding contact with the mold surface of the resin sealing mold.
According to the above aspect, dust can be taken into the suction space while scattering of dust to the workpiece side can be reduced.
In the above aspect, the mold may further include a film supply device that supplies a release film that assists the release of the work from the resin sealing mold to the mold surface of the upper mold.
According to the mode, the mold surface of the upper mold is protected by the release film, so that dust can not be attached. Therefore, the first cleaner unit and the second cleaner unit only need to clean the mold surface of the lower mold, and the size and weight increase of the loader robot and the unloader robot can be suppressed.
A method for manufacturing a resin-sealed product according to an embodiment of the present invention includes: resin sealing the first workpiece with a resin sealing mold; cleaning a mold surface of the resin sealing mold by the unloader robot when the first work having been resin-sealed is carried out of the resin sealing mold by the unloader robot; and cleaning the mold surface of the resin sealing mold by the loader robot when the second workpiece is carried into the resin sealing mold by the loader robot.
According to the above aspect, for example, by removing dust immediately before setting the work, the yield of defective products can be reduced.
In the above aspect, the performing cleaning by the loader robot may include: in a state where a workpiece is held by a first workpiece holding portion of a loader robot, a first cleaner portion of the loader robot is brought close to a mold surface of a lower mold in a resin-sealed mold, and the loader robot is moved into a space between an upper mold and the lower mold of the resin-sealed mold to clean the mold surface of the lower mold.
In the above aspect, the cleaning by the unloader robot may include: the sweeping of the mold surface of the resin sealing mold by the brush and the suction of the mold surface of the resin sealing mold by the suction hole by the loader robot may further include: the mold surface of the resin sealing mold is sucked by the suction holes.
According to the above-described mode, the dust fixed on the mold surface of the resin-sealed mold is scraped off by the brush of the unloader robot, and thus the loader robot can be removed by sucking the dust using the first suction hole. Therefore, the size and weight increase of the loader robot can be suppressed, and the load on the loader supporting the loader robot can be reduced.
[ Effect of the invention ]
According to the present invention, it is possible to provide a resin sealing device and a method of manufacturing a resin sealed product, which can suppress the load of a loader robot on a support portion and suppress the occurrence of defective products.
Drawings
Fig. 1 is a plan view schematically showing the structure of a resin sealing device according to a first embodiment.
Fig. 2 is a plan view schematically showing the structure of the loader robot.
Fig. 3 is a sectional view schematically showing the structure of a loader robot which enters a resin sealing mold.
Fig. 4 is a plan view schematically showing the structure of the unloader robot.
Fig. 5 is a sectional view schematically showing the structure of an unloader robot which withdraws from the resin sealing mold.
Fig. 6 is a flowchart showing a process for manufacturing a resin-sealed product using the resin sealing apparatus according to the first embodiment.
[ description of symbols ]
1: resin sealing device
10: inner module
13: index unit
15: frame supply part
17: material sheet feeding part
19: workpiece heating part
20-50: pressing module
21-51: resin sealing mold
22: upper die
23: lower die
22A, 23A: die surface
25: film supply device
26: extraction part
27: winding part
90: outer module
91: tray for pouring gate
93: sprue beating manipulator
95: workpiece storage part
100: loading machine
120: loader manipulator
121. 122: a first workpiece holding part
125: material sheet holding hole
140: first cleaner part
141: a first suction hole
142: a first dust collecting member
142A: first front part
142B: first rear part
145. 245: actuator
190: loader body
200: unloading machine
220: mechanical arm of unloading machine
221. 222: second work holding part
240: second cleaner part
241: second suction hole
242: a second dust collecting member
242A: second front part
242B: second rear part
243: brush with brush head
290: unloader body
300: guide part
C: control unit
P: resin tablet
RF: release film
S10-S40: procedure (ii)
W: workpiece
XYZ: coordinate axes
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of the embodiments are for illustration, the sizes and shapes of the respective portions are schematic, and the technical scope of the invention of the present application should not be construed as being limited to the embodiments.
< first embodiment >
The structure of a resin sealing device 1 according to an embodiment of the present invention will be described with reference to fig. 1. Fig. 1 is a plan view schematically showing the structure of a resin sealing device according to a first embodiment.
In the drawings, in order to clarify the relationship between the drawings and to facilitate understanding of the positional relationship between the members, an orthogonal coordinate system including an X axis, a Y axis, and a Z axis may be given for convenience. A plane including the X axis and the Y axis is referred to as an "XY plane", a direction in which an arrow of the Z axis faces is referred to as an upward direction, and a direction opposite to the direction of the arrow of the Z axis is referred to as a downward direction.
The resin sealing apparatus 1 is used for resin sealing (molding) a workpiece W with resin. As shown in fig. 1, the resin sealing apparatus 1 includes: an inner block 10 for supplying a work W before resin sealing; a press module 20, a press module 30, a press module 40, a press module 50 that resin-seals the work W with resin; and an outer mold block 90 for recovering the resin-sealed workpiece W. The resin sealing apparatus 1 includes a conveyance mechanism provided over the inner block 10, the press blocks 20 to 50, and the outer block 90.
In the example shown in fig. 1, the inner module 10, the press modules 20 to 50, and the outer module 90 are arranged in the X-axis direction, and the loader 100 and the unloader 200 are configured to be movable along the guide 300 extending over the modules. The operations of the loader 100 and the unloader 200 are controlled by a control unit C that controls the entire resin sealing apparatus 1.
The resin sealing apparatus 1 resin-seals the work W. The resin sealing apparatus 1 is, for example, a transfer molding machine that performs resin molding by the filling pressure of resin injected into the cavity of the closed resin sealing mold 21 to resin sealing mold 51. In the following examples, the entire apparatus including the press modules 20 to 50 for resin-sealing the workpiece W will be described as an example of the resin sealing apparatus, but the resin sealing apparatus of the present invention is not necessarily limited to the one including the press modules. The resin sealing device of the present invention may be any device (for example, a loader robot, or the like) that has the resin supply mechanism of the present embodiment and is used for resin sealing of a workpiece.
The resin sealing device 1 is, for example, a semiconductor resin sealing device that resin-seals a semiconductor element. In this case, the workpiece W includes, for example, a semiconductor element and a support for the semiconductor element. The workpiece W is not limited, and may be, for example, a lead frame on which a semiconductor device is mounted, an interposer (interposer) substrate on which a semiconductor device is mounted, or a carrier plate (carrier plate) with an adhesive sheet to which a semiconductor device is temporarily bonded. The resin sealing device 1 is not limited to the use in a semiconductor resin sealing device, and may be used in a resin sealing device for resin sealing of elements other than semiconductor elements (for example, Micro-Electro-Mechanical System (MEMS) chips, electronic devices, and the like). In the embodiment described below, a thin, long interposer substrate is used, which is warped or undulated by heating, but it may be a work other than this.
The structure of each module shown in fig. 1 will be described below.
The inner block 10 includes a frame feeding section 15, an index (index) section 13, a web feeding section 17, and a workpiece heating section 19. A supply magazine (magazine) in which a plurality of workpieces W are stacked and stored is arranged in the frame supply portion 15. The index portion 13 positions the orientation of the workpiece W. For example, the index portion 13 is a table that is rotatably provided, and two workpieces W received from the supply magazine of the frame supply portion 15 are arranged so that the same sides thereof face each other. The index section 13 supplies the two aligned workpieces W to the workpiece heating section 19. The web feed portion 17 feeds the aligned plurality of resin webs P to the web holding hole 125 of the loader robot 120. The resin web P is formed by, for example, compacting a powder, a pellet, or the like of a resin into a columnar shape, or by molding a resin into a columnar shape. The workpiece heating unit 19 performs heating (hereinafter, referred to as "preheating") in advance before the workpiece W is carried into the resin sealing mold 21 to the resin sealing mold 51, and reduces a temperature difference between the workpiece W and the resin sealing mold 21 to the resin sealing mold 51. The workpiece heating unit 19 is configured to be able to receive the workpiece W from the index unit 13.
The press module 20, the press module 30, the press module 40, and the press module 50 respectively include a resin sealing mold 21, a resin sealing mold 31, a resin sealing mold 41, and a resin sealing mold 51. The press modules 20 to 50 are arranged in the X-axis direction, and the resin sealing dies 21 to 51 are also arranged in the X-axis direction. The resin sealing dies 21 to 51 are a pair of dies that can be opened and closed, including a lower die and an upper die, for example. The press modules 20 to 50 can hold the workpiece W in the cavities formed inside the resin sealing dies 21 to 51. The press modules 20 to 50 inject resin into the cavity, thereby resin-sealing the work W. The resin injected into the cavity is formed by softening the resin sheet P inside the resin sealing mold 21 to 51. In the present embodiment, the resin sealing apparatus 1 includes, for example, four press modules, but the number of the press modules can be changed as appropriate.
The outer block 90 includes a degating tray (degate pallet)91, a degating hand (degate hand)93, and a workpiece receiving portion 95. The degating tray 91 receives the workpiece W to which the unnecessary resin is connected from the unloader 200, and conveys the workpiece W to a position below the degating robot 93. The gating robot 93 separates unnecessary resin (cull pool (well) and runner (runner)) from the conveyed workpiece W. The separated useless resin is recycled to the rejecting pool box. The work W from which the unnecessary resin is separated and which has been sealed with resin is stored in the storage magazine of the work storage portion 95. The outer mold block 90 is disposed on the opposite side of the inner mold block 10 as viewed from the press module 20 to the press module 50. However, the arrangement of the modules is not limited to the above, and the inner module 10 and the outer module 90 may be provided on the same side as viewed from the press modules 20 to 50.
The conveying mechanism includes a guide 300, a loader 100, and an unloader 200. The guide 300 extends in the X-axis direction so as to cross the inner block 10, the press blocks 20 to 50, and the outer block 90.
The conveying mechanism conveys the workpiece W and the resin sheet P. Specifically, the loader 100 conveys the workpiece W and the resin sheet P from the inner block 10 to the press modules 20 to 50, respectively, and the loader robot 120 of the loader 100 conveys the workpiece W and the resin sheet P into the resin sealing mold 21 to the resin sealing mold 51. The unloader robot of the unloader 200 carries out the resin-sealed workpiece W from the resin sealing mold 21 to the resin sealing mold 51, and the unloader 200 carries the resin-sealed workpiece W from the press modules 20 to 50 to the outer mold block 90.
The control unit C cleans at least the die surface 23A of the lower die 23 of the resin sealing die 21 by the loader robot 120 when the workpiece W is carried into the resin sealing die 21, and cleans at least the die surface 23A of the lower die 23 of the resin sealing die 21 by the unloader robot 220 when the workpiece W is carried out of the resin sealing die 21. The control unit C may include a plurality of control units including a control unit that controls the operation of the loader 100 and a control unit that controls the operation of the unloader 200.
Next, referring to fig. 2 and 3, the structure of the resin sealing mold 21 and the loader robot 120 will be described. Fig. 2 is a plan view schematically showing the structure of the loader robot. Fig. 3 is a sectional view schematically showing the structure of a loader robot which enters a resin sealing mold. The structures of the resin sealing dies 31 to 51 are the same as those of the resin sealing die 21, and therefore, the description thereof is omitted.
The resin sealing mold 21 includes an upper mold 22 and a lower mold 23. The upper die 22 has a die surface 22A facing the lower die 23, and the lower die 23 has a die surface 23A facing the upper die 22. When the mold is opened, the upper mold 22 and the lower mold 23 are separated from each other, and a space into which the loader robot 120 and the unloader robot 220 can enter is formed between the mold surface 22A of the upper mold 22 and the mold surface 23A of the lower mold 23. A film supply device 25 is provided on the upper die 22 side. The film supply device 25 supplies the release film RF to the die surface 22A of the upper die 22. The film supply device 25 includes: a drawing-out section 26 for drawing out the release film RF every time the mold is opened after resin sealing is performed by the resin sealing mold 21; and a winding unit 27 for winding the extracted release film RF. The release film RF assists the release of the resin-sealed workpiece W from the resin sealing mold 21. Further, the release film RF prevents dust such as resin from adhering to the mold surface 22A of the upper mold 22, and thus it is not necessary to clean the mold surface 22A of the upper mold 22.
The loader 100 includes: a loader body 190 configured to be movable along the guide 300; and a loader robot 120 supported by the loader main body 190 and configured to be able to advance and retreat with respect to the inside of the resin sealing mold 21 (the space between the upper mold 22 and the lower mold 23). The operation of the loader robot 120 is controlled by the control unit C.
The loader robot 120 includes: for example, the first workpiece holding unit 121 and the first workpiece holding unit 122 for holding the workpiece W before resin sealing in order to carry it into the resin sealing mold 21; a plurality of web holding holes 125 for holding the resin web P to be carried into the resin sealing mold 21; and a first cleaner unit 140 disposed further forward than the first workpiece holding unit 121 and the first workpiece holding unit 122 in the direction of entry into the resin sealing mold 21. For example, the first workpiece holding portions 121 and 122 are aligned in the X-axis direction, and the plurality of web holding holes 125 are aligned in the Y-axis direction. The plurality of web holding holes 125 are arranged between the first workpiece holding portion 121 and the first workpiece holding portion 122. The arrangement of the first workpiece holding portion 121, the first workpiece holding portion 122, and the plurality of web holding holes 125 is not limited to the above.
The first cleaner unit 140 cleans the die surface 23A of the lower die 23 at the time of entry for carrying the workpiece W into the resin sealing die 21. In other words, the loader robot 120 enters the space between the upper die 22 and the lower die 23 while cleaning the die surface 23A of the lower die 23 by the first cleaner unit 140 in a state where the workpiece W is held by the first workpiece holding portion 121 and the first workpiece holding portion 122. The dust cleaned by the first cleaner unit 140 is dust that falls onto the mold surface 23A of the lower mold 23 after being cleaned by the unloader robot 220 described later and before the loader robot 120 enters, and is, for example, a resin sheet or the like that is peeled off from the release film RF.
The first cleaner unit 140 is configured to be movable in a vertical (Z-axis) direction of the die surface 23A of the lower die 23. Thus, the controller C moves the loader robot 120 holding the workpiece W in the first workpiece holding portion 121 and the first workpiece holding portion 122 into the resin-sealed mold 21 in a state where the first cleaner portion 140 is brought close to the mold surface 23A of the lower mold 23, and cleans the mold surface 23A of the lower mold 23. After the workpiece W is transferred from the first workpiece holding portion 121 and the first workpiece holding portion 122 to the die surface 23A of the lower die 23, the control portion C withdraws the loader robot 120, which has released the workpiece W from the first workpiece holding portion 121 and the first workpiece holding portion 122, from the inside of the resin sealing die 21 in a state where the first cleaner portion 140 is separated from the die surface 23A of the lower die 23. In the present configuration, since the release film RF is always disposed on the upper mold 22, the first cleaner unit 140 for cleaning only the lower mold 23 is provided, but in the case of a configuration in which the release film RF is not required, it is preferable that the loader robot 120 further be provided with an upward cleaner unit for cleaning the mold surface 22A of the upper mold 22.
The first cleaner part 140 includes: a first suction hole 141 opening to the die surface 23A of the lower die 23; and a first dust collection member 142 configured to protrude toward the die surface 23A of the lower die 23 and to be capable of forming a suction space for pressure reduction between the first suction hole 141 and the die surface 23A of the lower die 23.
The first suction hole 141 sucks dust from the suction space and sends it to a duct, not shown. The first suction hole 141 extends in the X-axis direction and faces the entire first workpiece holding portion 121 and the entire first workpiece holding portion 122 in the Y-axis direction.
The first dust collection member 142 has a first front portion 142A disposed on the front side in the entering direction of the loader robot 120 with respect to the first suction hole 141, and a first rear portion 142B disposed on the rear side in the entering direction of the loader robot 120 with respect to the first suction hole 141. The first front portion 142A and the first rear portion 142B are formed of an elastic material such as heat-resistant silicone rubber or sponge. For example, the first front portion 142A and the first rear portion 142B have one ends connected to each other and the other ends connected to each other. That is, the first dust collection member 142 is provided in a frame shape surrounding the first suction hole 141.
In the vertical direction of the die surface 23A of the lower die 23, the front end of the first front portion 142A is slightly spaced apart from the die surface 23A than the front end of the first rear portion 142B. In other words, the front end of the first front portion 142A is closer to the first suction hole 141 than the front end of the first rear portion 142B. When the loader robot 120 enters the resin sealing mold 21, that is, when the first cleaner section 140 cleans the mold surface 23A of the lower mold 23, the actuator 145 installed between the first cleaner section 140 and the loader robot 120 is movably extended, and the first rear portion 142B is brought into sliding contact with the mold surface 23A of the lower mold 23 to prevent dust from being scattered. At this time, the first front portion 142A is separated from the die surface 23A of the lower die 23 so that an air flow is generated to take in dust to the suction space. When the loader robot 120 is retreated from the resin sealing mold 21, both the first front portion 142A and the first rear portion 142B are separated from the mold surface 23A of the lower mold 23 in order to avoid contact with the workpiece W provided on the mold surface 23A of the lower mold 23.
The structure of the first dust collection member 142 is not limited to the above. For example, the first front portion 142A and the first rear portion 142B may be plate-shaped members separated from each other. In addition, the respective front ends of the first front portion 142A and the first rear portion 142B may be separated from the first suction holes 141 to the same extent in the vertical direction of the mold surface 23A of the lower mold 23.
Next, the structure of the unloader robot 220 will be described with reference to fig. 4 and 5. Fig. 4 is a plan view schematically showing the structure of the unloader robot. Fig. 5 is a sectional view schematically showing the structure of an unloader robot which withdraws from the resin sealing mold. The structures of the resin sealing dies 31 to 51 are the same as those of the resin sealing die 21, and therefore, the description thereof is omitted.
The unloader 200 includes: an unloader body 290 configured to be movable along the guide 300; and an unloader robot 220 supported by the unloader body 290 and configured to be able to advance and retreat with respect to the inside of the resin sealing mold 21 (a space between the upper mold 22 and the lower mold 23). The operation of the unloader robot 220 is controlled by the control unit C.
The unloader robot 220 includes: for example, the second workpiece holding portion 221 and the second workpiece holding portion 222 for holding the resin-sealed workpiece W (molded article) in order to carry it out of the resin sealing mold 21; and a second cleaner 240 disposed further forward than the second workpiece holding portions 221, 222 in the direction of entry into the resin sealing mold 21.
The second cleaner portion 240 cleans the die surface 23A of the lower die 23 at the time of withdrawal for carrying out the workpiece W from the resin sealing die 21. In other words, the unloader robot 220 is retracted from the space between the upper die 22 and the lower die 23 while cleaning the die surface 23A of the lower die 23 by the second cleaner unit 240 in a state where the workpiece W is held by the second workpiece holding unit 221 and the second workpiece holding unit 222. The dust cleaned by the second cleaner section 240 is, for example, dust (flash burr) or the like in which resin for resin sealing is fixed to the mold surface 23A of the lower mold 23.
The second cleaner unit 240 is configured to be movable in a direction perpendicular to the die surface 23A of the lower die 23. Thus, the controller C causes the unloader robot 220, which is empty of the second workpiece holding unit 221 and the second workpiece holding unit 222, to enter the resin sealing mold 21 with the second cleaner unit 240 separated from the mold surface 23A of the lower mold 23. Further, the controller C receives the resin-sealed workpiece W by the second workpiece holding unit 221 and the second workpiece holding unit 222, and then withdraws the unloader robot 220 from the inside of the resin-sealed mold 21 in a state where the second cleaner unit 240 is brought close to the mold surface 23A of the lower mold 23, thereby cleaning the mold surface 23A of the lower mold 23. In the present configuration, since the release film RF is always disposed on the upper mold 22, the second cleaner unit 240 for cleaning only the lower mold 23 is provided, but in the case of a configuration in which the release film RF is not required, it is preferable that the unloader robot 220 further be provided with an upward cleaner unit for cleaning the mold surface 22A of the upper mold 22.
The second cleaner part 240 includes: a second suction hole 241 opened toward the die surface 23A of the lower die 23; a second dust collection member 242 configured to protrude toward the die surface 23A of the lower die 23 and to be capable of forming a suction space for pressure reduction between the second suction hole 241 and the die surface 23A of the lower die 23; and a brush 243 to scrape off dust adhered to the die face 23A of the lower die 23 in the suction space. The brush 243 is, for example, a rotary brush. The second dust collection member 242 also functions to prevent dust scraped off by the brush 243 from scattering around.
The second suction hole 241 sucks dust from the suction space and sends it to a duct, not shown. The second suction hole 241 extends in the X-axis direction, and faces the entire second workpiece holding portion 221 and the second workpiece holding portion 222 in the Y-axis direction.
The second dust collection member 242 has a second front portion 242A disposed on the front side in the entering direction of the unloader robot 220 with respect to the second suction hole 241, and a second rear portion 242B disposed on the rear side in the entering direction of the unloader robot 220 with respect to the second suction hole 241. The second front portion 242A and the second rear portion 242B are formed of an elastic material such as heat-resistant silicone rubber or sponge. For example, one ends of the second front portion 242A and the second rear portion 242B are connected to each other, and the other ends are connected to each other. That is, the second dust collection member 242 is provided in a frame shape surrounding the second suction hole 241.
When the unloader robot 220 is retreated from the resin sealing mold 21, that is, when the second cleaner unit 240 cleans the mold surface 23A of the lower mold 23, the actuator 245 attached between the second cleaner unit 240 and the unloader robot 220 is movably extended to be in sliding contact with the mold surface 23A of the lower mold 23. When the unloader robot 220 enters the resin sealing mold 21, both the second front portion 242A and the second rear portion 242B are separated from the mold surface 23A of the lower mold 23 in order to avoid contact with the workpiece W provided on the mold surface 23A of the lower mold 23.
The structure of the second dust collection member 242 is not limited to the above.
Next, a method for manufacturing the resin-sealed product will be described with reference to fig. 6. Fig. 6 is a flowchart showing a process for manufacturing a resin-sealed product using the resin sealing apparatus according to the first embodiment.
First, the work W is carried into the resin sealing mold 21 (S10). The preheated work W before resin sealing is held by the loader robot 120, and is carried into the opened resin sealing mold 21 and set on the mold surface 23A of the lower mold 23.
Next, the work W is resin-sealed (S20). The resin sealing mold 21 is closed, and liquid resin is injected into the cavity of the resin sealing mold 21. The resin is cured by heating while applying pressure to the resin.
Next, the resin sealing die 21 is cleaned while the workpiece W is carried out of the resin sealing die 21 (S30). First, the resin sealing mold 21 is opened, and the unloader robot 220 is moved into the resin sealing mold 21 so as not to interfere with the workpiece W on the mold surface 23A of the lower mold 23 in a state where the second workpiece holding portion 221 and the second workpiece holding portion 222 are separated from the mold surface 23A of the lower mold 23. Next, the second workpiece holding portion 221 and the second workpiece holding portion 222 receive the resin-sealed workpiece (molded article) W, and extend the actuator 245 to cause the second cleaner portion 240 to approach the die surface 23A of the lower die 23. Next, while the second cleaner unit 240 cleans the die surface 23A of the lower die 23, the unloader robot 220 holding the workpiece W in the second workpiece holding unit 221 and the second workpiece holding unit 222 is retracted from the inside of the resin sealing die 21. That is, the cleaning of the mold surface 23A of the lower mold 23 is performed not when the unloader robot 220 enters the inside of the resin sealing mold 21 but when it exits. The cleaning by the second cleaner unit 240 of the unloader robot 220 after the mold opening is performed before the molded resin residue is scattered into the apparatus, and the resin, the resin carbide, or the like fixed to the mold surface 23A of the lower mold 23 is removed by suction through the second suction holes 241 while being scraped off by the brush 243.
Subsequently, the resin sealing die 21 is cleaned while the workpiece W is carried into the resin sealing die 21 (S40). First, after the unloader robot 220 cleans the resin sealing mold 21, the film supply device 25 is operated to renew the release film RF on the upper mold 22 side. Next, in a state where the work W before resin sealing is held by the first work holding portion 121 and the first work holding portion 122, the actuator 145 is extended to cause the first cleaner portion 140 to approach the die surface 23A of the lower die 23. Next, while the first cleaner unit 140 is caused to clean the die surface 23A of the lower die 23, the unloader robot 120 that holds the workpiece W in the first workpiece holding unit 121 and the first workpiece holding unit 122 is caused to enter the resin sealing die 21. Next, the workpiece W is transferred from the first workpiece holding portion 121 and the first workpiece holding portion 122 to the die surface 23A of the lower die 23, and the actuator 145 is contracted to separate the first cleaner portion 140 from the die surface 23A of the lower die 23. Next, in a state where the first workpiece holding portion 121 and the first workpiece holding portion 122 are separated from the die surface 23A of the lower die 23, the loader robot 120 is retracted from the inside of the resin-sealed die 21 so as not to interfere with the workpiece W on the die surface 23A of the lower die 23. That is, the cleaning of the mold surface 23A of the lower mold 23 is performed when the loader robot 120 enters the resin sealing mold 21, and is not performed when it exits. In the second cleaning after the mold opening, the resin web or the like falling on the mold surface 23A of the lower mold 23 is sucked and removed by the first suction holes 141.
The resin sealing mold 31 to the resin sealing mold 51 are also sequentially manufactured in the same manner as described above.
As described above, the resin sealing device 1 according to the embodiment of the present invention includes: the robot system includes a loader robot 120 having a first cleaner unit 140, an unloader robot 220 having a second cleaner unit 240, and a controller C for controlling operations of the loader robot 120 and the unloader robot 220, wherein the controller C cleans the resin sealing molds 21 to 51 by the loader robot 120 when the loader robot 120 carries the workpiece W into the resin sealing molds 21 to 51. For example, the control unit C controls: an operation of bringing the loader robot 120 holding the workpiece W on the first workpiece holding portion 121 and the first workpiece holding portion 122 into the space between the upper die 22 and the lower die 23 in a state where the first cleaner portion 140 is brought close to the die surface 23A of the lower die 23, cleaning the die surface 23A of the lower die 23, releasing the workpiece W from the first workpiece holding portion 121 and the first workpiece holding portion 122 in a state where the first cleaner portion 140 is separated from the die surface 23A of the lower die 23, and withdrawing the loader robot 120 from the space between the upper die 22 and the lower die 23.
Accordingly, for example, the loader robot 120 can remove dust falling on the mold surfaces of the resin sealing molds 21 to 51 after being cleaned by the unloader robot 220. By removing dust immediately before setting the work W, the yield of defective products can be reduced.
The first cleaner part 140 has a first suction hole 141, and the second cleaner part 240 has a second suction hole 241 and a brush 243.
The resin residues fixed to the mold surfaces of the resin sealing molds 21 to 51 are scraped off by the brush 243 provided in the second cleaner unit 240 of the unloader robot 220. The unloader robot 220 inevitably includes a mechanism for moving the brush, and the weight of the unloader robot 220 increases, which increases the size of the unloader body 290. In the first cleaner part 140 of one of the loader robots 120, it can be removed by sucking dust using the first suction hole 141. Therefore, the load on the loader main body 190 supporting the loader robot 120 can be reduced while suppressing an increase in size and weight of the loader robot 120.
In the above-described aspect, the first cleaner part 140 may further include a first dust collection member 142, and the first dust collection member 142 may be configured to form a suction space.
Accordingly, the suction force of the first suction holes 141 is increased, thereby improving the cleaning efficiency of the first cleaner part 140 and reducing the generation rate of defective products.
In the above-described aspect, the first dust collection member 142 may be configured in a frame shape surrounding the first suction hole 141.
Accordingly, the suction force of the first suction hole 141 is further increased.
In this manner, the front end of the first front portion 142A of the first dust collection member 142 may also be closer to the first suction hole 141 than the front end of the first rear portion 142B.
This can reduce dust scattering toward the workpiece W during cleaning.
In the above-described embodiment, when the first rear portion 142B is in sliding contact with the mold surfaces of the resin sealing mold 21 to the resin sealing mold 51, the first front portion 142A may be configured to be separated from the mold surfaces of the resin sealing mold 21 to the resin sealing mold 51.
Accordingly, dust can be taken into the suction space while dust can be reduced from spilling toward the workpiece W side.
In the above-described aspect, the second cleaner part 240 may further include a second dust collection member 242, and the second dust collection member 242 may be configured to form a suction space.
Accordingly, the suction force of the second suction holes 241 is increased, thereby improving the cleaning efficiency of the second cleaner part 240 and reducing the generation rate of defective products.
In the above-described aspect, the second dust collection member 242 may be configured in a frame shape surrounding the second suction hole 241.
Accordingly, the suction force of the second suction hole 241 is further increased.
In the above-described aspect, the first cleaner unit 140 may clean the mold surface of the lower mold.
Accordingly, since most of dust generated after cleaning by the unloader robot 220 is attached to the lower mold as a falling object, the generation of defective products can be sufficiently reduced by cleaning the mold surface of the lower mold.
In the above embodiment, the resin sealing apparatus 1 may further include a film supply device 25 for supplying the release film RF to the mold surface of the upper mold.
Accordingly, the mold surface of the upper mold is protected by the release film RF, and thus, adhesion of dust is not generated. Therefore, the first cleaner unit 140 and the second cleaner unit 240 only need to clean the mold surface of the lower mold, and the size and weight increase of the loader robot 120 and the unloader robot 220 can be suppressed. In addition, in the case where the release film RF is not required in the upper mold 22, the loader robot 120 may further include an upward cleaner portion for cleaning the mold surface 22A of the upper mold 22.
A method for manufacturing a resin-sealed product according to an embodiment of the present invention includes: when the first work W sealed with resin is carried out of the resin sealing mold 21 to the resin sealing mold 51 by the unloader robot 220, the mold surfaces of the resin sealing mold 21 to the resin sealing mold 51 are cleaned by the unloader robot 220; and when the second workpiece W is carried into the resin sealing mold 21 to the resin sealing mold 51 by the loader robot 120, the mold surfaces of the resin sealing mold 21 to the resin sealing mold 51 are cleaned by the loader robot 120. For example, the cleaning by the loader robot 120 includes: in a state where the workpiece W is held by the first workpiece holding portion 121 and the first workpiece holding portion 122 of the loader robot 120, the first cleaner portion 140 of the loader robot 120 is brought close to the mold surface 23A of the lower mold 23 in the resin-sealed mold 21, and the loader robot 120 is moved into a space between the upper mold 22 and the lower mold 23 to clean the mold surface 23A of the lower mold 23.
Accordingly, for example, by removing dust immediately before setting the work, the yield of defective products can be reduced.
In the above aspect, the cleaning by the unloader robot 220 may include: the sweeping of the mold surfaces of the resin sealing mold 21 to the resin sealing mold 51 by the brush 243 and the suction of the mold surfaces of the resin sealing mold 21 to the resin sealing mold 51 by the second suction hole 241 by the loader robot 120 may include: the first suction holes 141 suck the mold surfaces of the resin sealing molds 21 to 51.
Accordingly, since the dust (resin residue) fixed to the mold surfaces of the resin sealing molds 21 to 51 is scraped off by the brush 243 included in the second cleaner unit 240 of the unloader robot 220, the dust can be removed by sucking the dust through the first suction hole 141 in the first cleaner unit 140 of the loader robot 120. Therefore, the size and weight increase of the loader robot 120 can be suppressed, and the load on the loader supporting the loader robot 120 can be reduced.
In the above embodiment, the second cleaner unit 240 has been described as an example of a configuration in which only the upper mold or the lower mold of the resin sealing molds 21 to 51 is cleaned, but the second cleaner unit 240 may be configured to clean both the upper mold and the lower mold. Similarly, the first cleaner unit 140 may be configured to clean both the upper mold and the lower mold.
As described above, according to one aspect of the present invention, it is possible to provide a resin sealing device and a method of manufacturing a resin sealed product, which can suppress the load of a loader robot on a support portion and suppress the occurrence of defective products.
The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to be construed as limiting the present invention. The elements included in the embodiments, and their arrangement, materials, conditions, shapes, sizes, and the like are not limited to those illustrated in the drawings, and may be appropriately changed. In addition, the structures shown in different embodiments can be partially replaced or combined with each other.

Claims (11)

1. A resin sealing apparatus for resin-sealing a workpiece using a resin sealing mold including an upper mold and a lower mold, the resin sealing apparatus comprising:
a loader robot configured to be able to advance and retreat with respect to a space between the upper mold and the lower mold;
an unloader robot configured to be able to advance and retreat with respect to a space between the upper mold and the lower mold; and
a control unit for controlling the operation of the loader robot and the unloader robot, and
the loader robot includes a first workpiece holding portion configured to be capable of holding a workpiece, and a first cleaner portion disposed further forward than the first workpiece holding portion in an advancing direction into the resin sealing mold,
the unloader robot includes a second workpiece holding section configured to be capable of holding a workpiece, and a second cleaner section disposed further forward than the second workpiece holding section in an advancing direction into the resin sealing mold,
the control unit cleans at least a mold surface of the lower mold of the resin sealing mold by the loader robot when the workpiece is carried into the resin sealing mold, and cleans at least a mold surface of the lower mold of the resin sealing mold by the unloader robot when the workpiece is carried out of the resin sealing mold.
2. The resin sealing device according to claim 1, wherein
The control unit controls:
an operation of bringing the loader robot holding the workpiece on the first workpiece holding portion into a space between the upper die and the lower die and cleaning a die surface of the lower die in a state where the first cleaner portion is brought close to the die surface of the lower die;
an operation of transferring the workpiece from the first workpiece holding section to the die surface of the lower die; and
and an operation of releasing the workpiece from the first workpiece holding portion and withdrawing the loader robot from the space between the upper die and the lower die in a state where the first cleaner portion is separated from the die surface of the lower die.
3. The resin sealing device according to claim 1 or 2, wherein
The first cleaner section has a first suction hole that opens toward a mold surface of the resin sealing mold,
the second cleaner portion has a second suction hole that opens toward a mold surface of the resin sealing mold, and a brush that has at least a portion thereof received in the second suction hole.
4. The resin sealing device according to claim 3, wherein
The first cleaner unit further includes a first dust collection member configured to protrude toward the mold surface of the resin sealing mold and to form a suction space with a reduced pressure between the first suction hole and the mold surface of the resin sealing mold.
5. The resin sealing device according to claim 4, wherein
The first dust collection member is configured in a frame shape surrounding the first suction hole.
6. The resin sealing device according to claim 4, wherein
The first dust collection member has a first front portion arranged on a front side in an entry direction of the loader robot with respect to the first suction hole, and a first rear portion arranged on a rear side in the entry direction of the loader robot with respect to the first suction hole and arranged on a rear side in the entry direction of the loader robot with respect to the first suction hole
The front end of the first front portion is closer to the first suction hole than the front end of the first rear portion in a vertical direction of a mold surface of the resin sealing mold.
7. The resin sealing device according to claim 6, wherein
The first cleaner portion is configured to be movable at least partially in a direction perpendicular to a mold surface of the resin sealing mold,
the first front portion is configured to be separated from the mold surface of the resin sealing mold when the first rear portion is in sliding contact with the mold surface of the resin sealing mold.
8. The resin sealing device according to claim 1 or 2,
the mold further comprises a film supply device which supplies a release film to the mold surface of the upper mold, the release film assisting in the demolding of the workpiece from the resin sealing mold.
9. A method for manufacturing a resin-sealed product, comprising:
resin sealing the first workpiece with a resin sealing mold;
cleaning a mold surface of a resin sealing mold by an unloader robot when the first workpiece subjected to resin sealing is carried out of the resin sealing mold by the unloader robot; and
when a second workpiece is carried into the resin sealing mold by a loader robot, a mold surface of the resin sealing mold is cleaned by the loader robot.
10. The method for producing a resin-sealed product according to claim 9, wherein
The cleaning by the loader robot includes: the method includes the steps of bringing a first cleaner portion of the loader robot close to a mold surface of a lower mold of the resin-sealed mold while holding a workpiece on a first workpiece holding portion of the loader robot, and entering the loader robot into a space between an upper mold and a lower mold of the resin-sealed mold to clean the mold surface of the lower mold.
11. The method for producing a resin-sealed article according to claim 9 or 10, wherein
The performing of the cleaning by the unloader robot includes: sweeping the mold surface of the resin sealing mold with a brush and sucking the mold surface of the resin sealing mold with a suction hole,
the cleaning by the loader robot includes: the mold surface of the resin sealing mold is sucked by a suction hole.
CN202110949136.7A 2020-10-02 2021-08-18 Resin sealing device and method for manufacturing resin sealing product Pending CN114388396A (en)

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JP2020-167504 2020-10-02
JP2020167504A JP2022059734A (en) 2020-10-02 2020-10-02 Resin sealing device and method for manufacturing resin sealed product

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Publication number Priority date Publication date Assignee Title
JP4555488B2 (en) 2001-02-15 2010-09-29 アピックヤマダ株式会社 CLEANER DEVICE AND RESIN SEALING DEVICE
JP4838158B2 (en) 2007-01-24 2011-12-14 住友重機械工業株式会社 Material transport mechanism for resin-sealed molds

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