CN114378475B - 焊膏 - Google Patents

焊膏 Download PDF

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Publication number
CN114378475B
CN114378475B CN202111153728.4A CN202111153728A CN114378475B CN 114378475 B CN114378475 B CN 114378475B CN 202111153728 A CN202111153728 A CN 202111153728A CN 114378475 B CN114378475 B CN 114378475B
Authority
CN
China
Prior art keywords
mass
solder
less
flux
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111153728.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN114378475A (zh
Inventor
川崎浩由
白鸟正人
川又浩彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of CN114378475A publication Critical patent/CN114378475A/zh
Application granted granted Critical
Publication of CN114378475B publication Critical patent/CN114378475B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
CN202111153728.4A 2020-10-02 2021-09-29 焊膏 Active CN114378475B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-168038 2020-10-02
JP2020168038A JP6928294B1 (ja) 2020-10-02 2020-10-02 ソルダペースト

Publications (2)

Publication Number Publication Date
CN114378475A CN114378475A (zh) 2022-04-22
CN114378475B true CN114378475B (zh) 2023-05-23

Family

ID=77456294

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111153728.4A Active CN114378475B (zh) 2020-10-02 2021-09-29 焊膏

Country Status (4)

Country Link
JP (1) JP6928294B1 (ko)
KR (1) KR102540568B1 (ko)
CN (1) CN114378475B (ko)
TW (1) TWI782723B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7450318B2 (ja) * 2021-09-16 2024-03-15 株式会社タムラ製作所 はんだ組成物およびフレキシブル回路基板の製造方法
JP2023150783A (ja) 2022-03-31 2023-10-16 サトーホールディングス株式会社 通信デバイスの通信制御方法、物品管理器具、及び、物品管理システム
CN116140860B (zh) * 2022-11-25 2024-07-26 卢世雄 一种半导体测试探针卡专用焊锡及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101880893A (zh) * 2005-07-01 2010-11-10 日矿金属株式会社 高纯度锡或锡合金及高纯度锡的制造方法
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP4385061B2 (ja) * 2006-08-28 2009-12-16 ハリマ化成株式会社 はんだペースト組成物およびその用途
JP5612571B2 (ja) * 2008-06-23 2014-10-22 イーエルシー マネージメント エルエルシー 持続性化粧品形成用組成物
EP2578350B1 (en) * 2010-06-01 2018-10-03 Senju Metal Industry Co., Ltd No-clean lead-free solder paste
JP6717559B2 (ja) 2013-10-16 2020-07-01 三井金属鉱業株式会社 半田合金及び半田粉
JP5590260B1 (ja) * 2014-02-04 2014-09-17 千住金属工業株式会社 Ａｇボール、Ａｇ核ボール、フラックスコートＡｇボール、フラックスコートＡｇ核ボール、はんだ継手、フォームはんだ、はんだペースト、Ａｇペースト及びＡｇ核ペースト
JP6569905B2 (ja) * 2014-11-21 2019-09-04 荒川化学工業株式会社 スクリーン印刷用フラックス
EP3263272B1 (en) * 2015-02-27 2020-04-01 Senju Metal Industry Co., Ltd. Flux
KR102600306B1 (ko) * 2017-11-24 2023-11-10 센주긴조쿠고교 가부시키가이샤 땜납 재료, 솔더 페이스트 및 납땜 이음
JP6540788B1 (ja) * 2017-12-29 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
JP6521160B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
WO2020116372A1 (ja) * 2018-12-03 2020-06-11 千住金属工業株式会社 フラックス、はんだ合金、接合体、及び接合体の製造方法
JP6643745B1 (ja) * 2019-05-27 2020-02-12 千住金属工業株式会社 はんだペースト及びはんだペースト用フラックス

Also Published As

Publication number Publication date
JP6928294B1 (ja) 2021-09-01
KR102540568B1 (ko) 2023-06-07
TWI782723B (zh) 2022-11-01
JP2022060052A (ja) 2022-04-14
KR20220044667A (ko) 2022-04-11
TW202221146A (zh) 2022-06-01
CN114378475A (zh) 2022-04-22

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