CN114302789B - 研磨装置及研磨方法 - Google Patents

研磨装置及研磨方法 Download PDF

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Publication number
CN114302789B
CN114302789B CN202080060537.0A CN202080060537A CN114302789B CN 114302789 B CN114302789 B CN 114302789B CN 202080060537 A CN202080060537 A CN 202080060537A CN 114302789 B CN114302789 B CN 114302789B
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CN
China
Prior art keywords
polishing
pure water
hole
height
polishing surface
Prior art date
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Active
Application number
CN202080060537.0A
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English (en)
Chinese (zh)
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CN114302789A (zh
Inventor
高桥信行
木下将毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication of CN114302789A publication Critical patent/CN114302789A/zh
Application granted granted Critical
Publication of CN114302789B publication Critical patent/CN114302789B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN202080060537.0A 2019-08-29 2020-08-12 研磨装置及研磨方法 Active CN114302789B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-156921 2019-08-29
JP2019156921A JP7403998B2 (ja) 2019-08-29 2019-08-29 研磨装置および研磨方法
PCT/JP2020/030688 WO2021039401A1 (ja) 2019-08-29 2020-08-12 研磨装置および研磨方法

Publications (2)

Publication Number Publication Date
CN114302789A CN114302789A (zh) 2022-04-08
CN114302789B true CN114302789B (zh) 2024-06-25

Family

ID=74674667

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080060537.0A Active CN114302789B (zh) 2019-08-29 2020-08-12 研磨装置及研磨方法

Country Status (6)

Country Link
US (2) US20220288742A1 (https=)
JP (1) JP7403998B2 (https=)
KR (1) KR102846970B1 (https=)
CN (1) CN114302789B (https=)
TW (1) TWI848173B (https=)
WO (1) WO2021039401A1 (https=)

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WO2021100317A1 (ja) * 2019-11-20 2021-05-27 株式会社ロジストラボ 光学素子の製造方法及び光学素子製造システム
JP7709281B2 (ja) * 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法

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CN109382755A (zh) * 2017-08-08 2019-02-26 株式会社荏原制作所 基板研磨装置及方法

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US6628397B1 (en) * 1999-09-15 2003-09-30 Kla-Tencor Apparatus and methods for performing self-clearing optical measurements
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US6599765B1 (en) * 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
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JP2005011977A (ja) * 2003-06-18 2005-01-13 Ebara Corp 基板研磨装置および基板研磨方法
TW200613092A (en) * 2004-08-27 2006-05-01 Ebara Corp Polishing apparatus and polishing method
JP4292179B2 (ja) * 2005-10-27 2009-07-08 株式会社ナノテム 砥石
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CN109382755A (zh) * 2017-08-08 2019-02-26 株式会社荏原制作所 基板研磨装置及方法

Also Published As

Publication number Publication date
US20220288742A1 (en) 2022-09-15
JP2021030408A (ja) 2021-03-01
KR20220049596A (ko) 2022-04-21
US20260054345A1 (en) 2026-02-26
KR102846970B1 (ko) 2025-08-18
JP7403998B2 (ja) 2023-12-25
TW202113957A (zh) 2021-04-01
TWI848173B (zh) 2024-07-11
CN114302789A (zh) 2022-04-08
WO2021039401A1 (ja) 2021-03-04

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