CN114287057A - 一种芯片堆叠封装及终端设备 - Google Patents

一种芯片堆叠封装及终端设备 Download PDF

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Publication number
CN114287057A
CN114287057A CN201980099842.8A CN201980099842A CN114287057A CN 114287057 A CN114287057 A CN 114287057A CN 201980099842 A CN201980099842 A CN 201980099842A CN 114287057 A CN114287057 A CN 114287057A
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China
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chip
overlapping
overlap
region
active surface
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CN201980099842.8A
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张晓东
张童龙
李珩
王思敏
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication of CN114287057A publication Critical patent/CN114287057A/zh
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Abstract

一种芯片堆叠封装及终端设备，涉及半导体技术领域，其能够在保证供电需求的同时，解决因采用硅通孔技术而导致的成本高的问题。该芯片堆叠封装(01)包括：设置于第一走线结构(10)和第二走线结构(20)之间的第一芯片(101)和第二芯片(102)；所述第一芯片(101)的有源面(S1)面向所述第二芯片(102)的有源面(S2)；第一芯片(101)的有源面(S1)包括第一交叠区域(A1)和第一非交叠区域(C1)，第二芯片(102)的有源面(S2)包括第二交叠区域(A2)和第二非交叠区域(C2)；第一交叠区域(A1)与第二交叠区域(A2)交叠，第一交叠区域(A1)和第二交叠区域(A2)连接；第一非交叠区域(C1)与第二走线结构(20)连接；第二非交叠区域(C2)与第一走线结构(10)连接。

Description

PCT国内申请，说明书已公开。

Claims (14)

  1. PCT国内申请，权利要求书已公开。
CN201980099842.8A 2019-09-30 2019-09-30 一种芯片堆叠封装及终端设备 Pending CN114287057A (zh)

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CN115250569B (zh) * 2022-06-20 2024-02-06 常州安泰诺特种印制板有限公司 一种高频线路板及其制备方法
CN117373928A (zh) * 2022-06-27 2024-01-09 矽磐微电子(重庆)有限公司 板级多芯片堆叠封装的加工方法及多芯片堆叠封装结构
CN114937633B (zh) * 2022-07-25 2022-10-18 成都万应微电子有限公司 一种射频芯片系统级封装方法及射频芯片系统级封装结构
CN115206952B (zh) * 2022-07-27 2023-03-17 北京数字光芯集成电路设计有限公司 采用堆叠式封装的Micro-LED微显示芯片
CN117219609A (zh) * 2023-09-14 2023-12-12 之江实验室 芯片封装结构及封装方法

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