CN114280453A - Miniature flexible electrode array and test method - Google Patents
Miniature flexible electrode array and test method Download PDFInfo
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Abstract
A micro flexible electrode array and a test method relate to a chip and a chip detection tool. The micro flexible electrode array includes: a transparent substrate; the upper surface of the transparent substrate is provided with a metal circuit layer, and one surface of the metal circuit layer, which is far away from the transparent substrate, is provided with a transparent or semitransparent flexible buffer layer; the buffer layer is arranged on the upper surface of the metal circuit layer, the metal electrode layers are arranged on the upper surface and the side surface of the buffer layer, the metal electrode layers are connected with the metal circuit layer, the metal electrode layers are right opposite to the electrodes of the microchip to be detected, and the insulating layer is arranged between the two metal circuit layers. And moving the transparent substrate to make the metal electrode layer in alignment contact with the electrode of the microchip to be detected, electrifying the microchip to be detected to test the characteristics, and screening the chip. The flexible structure prevents the microchip to be tested from being damaged by the probe, is favorable for reliable contact with the uneven electrode of the microchip to be tested, and the transparent substrate and the transparent or semitransparent buffer layer are conveniently and accurately aligned with the electrode of the microchip to be tested; the electrode array is beneficial to batch test of the micro chips to be tested, and the chip detection speed is improved.
Description
Technical Field
The invention relates to the technical field of chips and chip detection tools, in particular to a miniature flexible electrode array and a test method.
Background
With the rapid development of optoelectronic and biological technologies, the size of Micro-chips and biochips becomes smaller and smaller, such as current Micro-LED (Light Emitting Diode) technology, i.e., LED scaling and matrixing technology. Before the LEDs are transferred to the target substrate, the photoelectric performance consistency of each LED is ensured. Similarly, the micro IC chip is required to ensure that each chip is normally usable before being soldered or embedded into a circuit board, which is essential for detecting the functional characteristics of the micro IC chip. The traditional electric test method of the microchip adopts probe contact, but when the size of the chip is less than 30 micrometers, the size of an electrode is only a few micrometers, and the probe detection method is difficult to meet the requirement.
As shown in fig. 1, the conventional chip electrical characteristic test contacts the chip negative electrode 106 and the chip positive electrode 107 of the chip by using the probe 108, and in the process, the conventional test method requires that the chips on the chip substrate 104 are energized one by one with the probe 108 and the characteristic of each chip is tested. As shown in fig. 2, this conventional inspection method also requires that the probes individually energize the chips 110 on the substrate. Therefore, for the microchip, the size of the chip 110 is very small, the difficulty of aligning the probe with the electrode of the chip 110 is high, and the time consumption is long, and there is a risk of short circuit and chip 110 puncture due to the probe diameter being larger than the chip 110 in the process of using the probe to energize the chip on the chip substrate. In addition, the surface of the chip is not perfectly flat, and the probes can be adapted to the height difference between the electrodes. In addition, conventional inspection methods require mechanically moving the probe position, resulting in slower batch chip inspection speeds.
The existing manufacturing process of the micro-electrode includes the steps of preparing the designed micro-electrode on the prepared copper film by adopting the laser direct writing technology, and preparing a large-area micron-scale circuit [ a method for preparing a flexible micro-electrode circuit by large-area laser direct writing, invention patent, publication number: CN108633186A ], and the lithium niobate substrate is used as cathode, immersed in the plating bath containing the plating solution, and forms a loop with the anode, and the non-cyanide plating process is performed to make the micro electrode [ a micro electrode plating process, utility model, publication No.: CN203360615U ]. And a large-area micro electrode for touch display panel identification and sensing [ touch panel, patent publication No. CN109871148A ]. The existing flexible electrode has large size and non-array structure, and the manufacturing process is difficult to reach micron level. For example, a PDMS layer is spin-coated on a rigid substrate, then a gold film is grown on the PDMS layer as a flexible substrate, and finally the PDMS layer is peeled off to form a flexible electrode [ a flexible electrode preparation method and a flexible electrode, patent of invention, publication No.: CN106950267B ], such as a large-area and large-size flexible electrode film with planar grooves [ a flexible electrode film and applications, patent of invention, publication No.: CN111354508A ] and a method for manufacturing a single large-area electrode composed of a flexible substrate, titanium metal and gold by photolithography for an electrocardiograph monitor [ a flexible electrode and a manufacturing method thereof, invention patent, publication No.: CN109350046A ]. And then for example, by chemical bath deposition and compounding, the carbon cloth/transition metal oxide precursor compound is calcined to obtain a flexible electrode which is randomly arranged [ a preparation method of the flexible electrode, a product and an application thereof, an invention patent, publication number: CN111276342A ]. And a flexible electrode is manufactured by a screen printing technology [ a flexible electrode and a preparation method thereof, invention patent, publication number: CN111916260A ]. The electrode manufactured by the patent can only be used for conventional tests, the size is difficult to reach micron level, and the electrode cannot be used for testing a microchip.
Disclosure of Invention
The invention aims to provide a micro flexible electrode array and a testing method which can realize the contact of uneven electrodes of a micro chip and perform batch electrical testing aiming at the defects in the prior art. The flexible electrode structure is adopted to avoid the damage to the micro chip to be detected; the transparent substrate and the transparent or semitransparent buffer layer can be adopted to accurately align the electrodes of the to-be-detected microchip and improve the detection speed of the chip, so that the chips can be screened in batches quickly.
A micro flexible electrode array, comprising:
a transparent substrate;
the metal circuit layer is arranged on the upper surface of the transparent substrate, and a transparent or semitransparent flexible buffer layer is arranged on one surface, far away from the transparent substrate, of the metal circuit layer;
the buffer layer is arranged on the upper surface of the metal circuit layer, and a metal electrode layer is arranged on one surface of the buffer layer, which is far away from the metal circuit layer, and one side surface of the buffer layer;
the metal electrode layers are arranged on the upper surface and the side surfaces of the buffer layer and are connected with the metal circuit layer, and the metal electrode layers are right opposite to the electrodes of the micro chip to be detected;
and the insulating layer is arranged between the two metal circuit layers.
The layout of the micro flexible electrode array conforms to the specific regular arrangement of the chips in batches, the array comprises a series of regularly arranged flexible electrodes, and the size and the number of the electrodes are adjusted according to the size and the number of the micro chips to be detected.
The miniature flexible electrode array comprises a series of flexible electrodes which are regularly arranged, and the array can be used for detecting the characteristics of the micro chips to be detected in batches in a power-on mode.
The flexible electrode comprises a transparent substrate, and the transparent substrate is used for conveniently and quickly aligning the flexible electrode to the microchip electrode to be detected.
The flexible electrode comprises a transparent or semitransparent flexible buffer layer which is beneficial to the flexible electrode to conveniently and quickly align to the microchip electrode to be detected and is suitable for the microchip to be detected with different electrode heights.
Further, the microchip to be detected comprises:
the chip body is arranged on the upper end face of the chip substrate; and
the electrode to be detected is arranged on the upper end face or the lower end face of the chip body;
wherein the electrode to be detected comprises:
a positive chip electrode facing the positive electrode of the flexible electrode; and
a negative chip electrode facing the negative electrode of the flexible electrode.
Further, the transparent substrate is made of a non-metal material including at least one of silicon dioxide, silicate, polymethyl methacrylate (PMMA), and the like.
Further, the transparent or semitransparent flexible buffer layer is made of a polymer material, the polymer material at least comprises one of Polydimethylsiloxane (PDMS), Polyimide (PI), and polymethyl methacrylate (PMMA), and the manufacturing process includes but is not limited to etching, spin coating, deposition, plating, inkjet printing, evaporation, and the like.
Further, the insulating layer is made of an insulating material, the insulating material at least comprises one of Polydimethylsiloxane (PDMS), Polyimide (PI), silicon oxide, polymethyl methacrylate (PMMA) or resin, and the manufacturing process includes but is not limited to etching, spin coating, deposition, plating, inkjet printing, and evaporation.
A test method of a miniature flexible electrode array is characterized in that a transparent substrate is moved, so that a metal electrode layer is in aligned contact with an electrode of a miniature chip to be tested, the miniature chip to be tested is electrified to test the chip characteristics, and then the chip is screened; the method specifically comprises the following steps:
1) providing a source table and a multiplexing gating module, wherein the multiplexing gating module is interconnected and communicated with the metal circuit layer according to rules; the multiplexing gating module is communicated with an external source meter, and the metal electrode layer opposite to the chip to be tested is communicated with the source meter by controlling the multiplexing gating module, wherein the source meter has the functions of testing a power supply and a universal meter;
2) providing a three-dimensional moving platform, a monitoring camera, a beam splitter, a lens and optical detection equipment, wherein the three-dimensional moving platform operates a transparent substrate through a mechanical arm, the monitoring camera observes the relative position of the transparent substrate and a chip to be detected, the beam splitter receives and splits light emitted by the chip to be detected, and the optical detection equipment receives the light emitted by the beam splitter through the lens and tests the optical characteristics of the chip to be detected, so that the chip is screened; the optical detection device includes but is not limited to a spectrometer, an industrial camera.
Furthermore, the three-dimensional moving platform operates the transparent substrate through a mechanical arm, the metal electrode layer is in aligned contact with the chip electrode to be tested under the assistance of the monitoring camera, and the source meter and the multiplexing gating module alternately gate the chip array to be tested and test the electrical characteristics of the chip array; the optical detection equipment receives the light emitted by the chip to be detected and tests the optical characteristics of the chip to be detected, so as to screen the chip.
The invention has the advantages that:
1. the flexible structure is adopted to avoid the damage of the microchip to be tested by the probe, and the reliable electric contact with the uneven electrode of the microchip to be tested is facilitated.
2. The transparent substrate and the transparent or semitransparent buffer layer are adopted to facilitate the accurate alignment with the electrode of the microchip to be detected.
3. The electrode array is beneficial to the batch test of the micro chips to be tested, and the detection speed of the chips is greatly improved.
Drawings
FIG. 1 is a schematic view 1 of a conventional microchip inspection method.
FIG. 2 is a schematic diagram 2 of a conventional microchip inspection method.
FIG. 3 is a schematic view 1 of a micro flexible electrode array according to the present invention.
FIG. 4 is a schematic view 2 of the micro flexible electrode array according to the present invention.
FIG. 5 is a schematic view 3 of the micro flexible electrode array according to the present invention.
FIG. 6 is a schematic view 4 of the micro flexible electrode array according to the present invention.
FIG. 7 is a schematic diagram 5 of a micro flexible electrode array according to the present invention.
FIG. 8 is a schematic view 6 of the micro flexible electrode array according to the present invention.
FIG. 9 is a schematic view 7 of the micro flexible electrode array according to the present invention.
FIG. 10 is a schematic diagram 8 of a micro flexible electrode array according to the present invention.
FIG. 11 is a schematic view 9 of a micro flexible electrode array according to the present invention.
FIG. 12 is a schematic view 10 of a micro compliant electrode array according to the present invention.
The various references in the drawings are: 100. a transparent substrate; 101. a metal wiring layer; 102. a metal electrode layer; 103. a transparent or translucent flexible buffer layer; 104. a chip substrate; 105. a chip body; 106. a chip negative electrode; 107. a chip positive electrode; 108. a probe; 109. detecting the circuit board; 110. a chip; 111. a connecting wire; 112. an insulating layer; 113. a multiplexing gating module; 114. a source table; 115. a light; 116. an optical detection device; 117. a surveillance camera; 118. a three-dimensional mobile platform; 119. a beam splitter; 120. a lens.
Detailed Description
The embodiment of the invention provides a micro flexible electrode array, which can be used for manufacturing detection electrode arrays with corresponding sizes according to chips with different sizes and chips with different quantities to carry out batch detection on chip characteristics and can adapt to chips with different electrode heights, wherein the chip to be detected can be in a flip structure or a vertical structure. In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the embodiments and claims, the terms "a" and "an" can mean "one or more" unless the article is specifically limited. In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 3 to 6, the flexible electrode of the micro flexible electrode array includes a transparent substrate 100, a metal circuit layer 101, a metal electrode layer 102, and a transparent or semitransparent flexible buffer layer 103. Specifically, transparent substrate 100 sets up metal wiring layer 101 lower extreme, metal wiring layer 101 is kept away from transparent substrate 100's one side is provided with transparent or semitransparent flexible buffer layer 103, transparent or semitransparent flexible buffer layer 103 is in metal wiring layer 101 upper surface, transparent or semitransparent flexible buffer layer 103 is kept away from metal wiring layer 101's one side and buffer layer 103's a side is provided with metal electrode layer 102, metal electrode layer 102 is in transparent or semitransparent flexible buffer layer 103 upper surface and side, metal electrode layer 102 with metal wiring layer 101 is connected and the connected mode can be connected perpendicularly or takes certain slope to connect, metal electrode layer 102 is just to waiting to examine the electrode of examining the miniature chip.
Through the technical scheme, the transparent substrate 100 is moved, so that the metal electrode layer 102 is in aligned contact with the electrode of the microchip to be detected, the microchip to be detected is electrified to test the characteristics, and the chip is screened. In addition, the flexible structure is adopted to avoid the damage of the microchip to be tested by the probe, the reliable contact with the uneven electrode of the microchip to be tested is facilitated, and the transparent substrate and the transparent or semitransparent buffer layer are adopted to facilitate the accurate alignment with the electrode of the microchip to be tested; and the electrode array is beneficial to the batch test of the micro chips to be tested, and the detection speed of the chips is greatly improved.
Referring to fig. 7 and 8, in a specific implementation of an embodiment, the micro flexible electrode array includes a transparent substrate 100, a metal wiring layer 101, a metal electrode layer 102, a transparent or semi-transparent flexible buffer layer 103, a detection circuit board 109, a connection line 111, and an insulating layer 112. Specifically, the metal electrode layer 102 is opposite to the electrode of the microchip to be detected, the insulating layer 112 is between the two metal circuit layers 101, and the metal circuit layers 101 are respectively connected with the detection circuit board 109 through the transparent substrate 100 and the connecting wires 111. According to actual requirements, the design of the microchip may be different, for example, the area size and the pitch of the microchip may be different, and thus the arrangement positions of the metal circuit layer 101, the metal electrode layer 102, the transparent or semitransparent flexible buffer layer 103, and the insulating layer 112 may also be different; in addition, the number of the micro chips to be tested is different, and the number of the metal circuit layer 101, the metal electrode layer 102, the transparent or semitransparent flexible buffer layer 103 and the insulating layer 112 is also different. In the application, the transparent substrate 100 is moved to make the metal electrode layer 102 in alignment contact with the electrode of the microchip to be tested, so as to test the characteristics of the microchip to be tested by electrifying, thereby screening the chip.
Referring to fig. 9, in an embodiment, the micro flexible electrode array includes a transparent substrate 100, a metal wiring layer 101, a metal electrode layer 102, a transparent or semi-transparent flexible buffer layer 103, a detection circuit board 109, and a connection line 111. Specifically, the metal electrode layer 102 is opposite to the electrode of the microchip to be detected, and the metal circuit layer 101 is respectively connected with the detection circuit board 109 through the transparent substrate 100 and the connecting wire 111. According to actual requirements, the design of the microchip may be different, for example, the area size and the pitch of the microchip may be different, and thus the arrangement positions of the metal circuit layer 101, the metal electrode layer 102, the transparent or semitransparent flexible buffer layer 103, and the insulating layer 112 may also be different; in addition, the number of the micro chips to be tested is different, and the number of the metal circuit layer 101, the metal electrode layer 102, the transparent or semitransparent flexible buffer layer 103 and the insulating layer 112 is also different. In the application, the transparent substrate 100 is moved to make the metal electrode layer 102 in alignment contact with the electrode of the microchip to be tested, so as to test the characteristics of the microchip to be tested by electrifying, thereby screening the chip.
Referring to fig. 10, in a specific implementation manner of an embodiment, the flexible electrode structure of the micro flexible electrode array includes a transparent substrate 100, a metal wiring layer 101, a metal electrode layer 102, a transparent or semitransparent flexible buffer layer 103, a chip substrate 104, a chip body 105, a chip negative electrode 106, a chip positive electrode 107, a detection circuit board 109, and a connection line 111. Specifically, the chip negative electrode 106 and the chip positive electrode are on the same side of the chip body 105, the metal electrode layer 102 faces the negative electrode 106 and the positive electrode 107 of the chip to be detected, and the metal circuit layer 101 is connected to the detection circuit board 109 through the transparent substrate 100 and the connection line 111. According to practical requirements, the design of the microchip may vary, for example, the area size and the pitch of the microchip may vary, and thus the positions of the metal circuit layer 101, the metal electrode layer 102, and the transparent or semitransparent flexible buffer layer 103 may also vary. In the application, the transparent substrate 100 is moved to make the metal electrode layer 102 in alignment contact with the electrode of the microchip to be tested, so as to test the characteristics of the microchip to be tested by electrifying, thereby screening the chip.
Referring to fig. 11, in an embodiment, the flexible electrode structure of the micro flexible electrode array includes a transparent substrate 100, a metal wiring layer 101, a metal electrode layer 102, a transparent or semitransparent flexible buffer layer 103, a chip body 105, a chip negative electrode 106, a chip positive electrode 107, a detection circuit board 109, and a connection line 111. Specifically, the chip negative electrode 106 and the chip positive electrode are on different sides of the chip body 105, the metal electrode layer 102 faces the negative electrode 106 and the positive electrode 107 of the chip to be detected, and the metal circuit layer 101 is respectively connected to the detection circuit board 109 through the transparent substrate 100 and the connection line 111. According to practical requirements, the design of the microchip may vary, for example, the area size, the pitch and the height of the microchip may vary, and thus the positions of the metal circuit layer 101, the metal electrode layer 102 and the transparent or semitransparent flexible buffer layer 103 may also vary. In the application, the transparent substrate 100 is moved to make the metal electrode layer 102 in alignment contact with the electrode of the microchip to be tested, so as to test the characteristics of the microchip to be tested by electrifying, thereby screening the chip.
Referring to fig. 12, the present invention further provides a testing method of a micro flexible electrode array, including:
providing a source table 114 and a multiplexing gating module 113, wherein the multiplexing gating module 113 and the metal line layer 101 are interconnected and intercommunicated according to a specific rule; and the multiplexing gating module 113 is communicated with the source meter 114, and the metal electrode layer 102 opposite to the chip to be tested is communicated with the source meter 114 by controlling the multiplexing gating module 113.
Providing a three-dimensional moving platform 118, a monitoring camera 117, a beam splitter 119, a lens 120 and an optical detection device 116, wherein the three-dimensional moving platform 118 can operate the transparent substrate 100 through a mechanical arm, the monitoring camera 117 observes the relative position of the transparent substrate 100 and a chip to be tested, the beam splitter 119 receives light 115 emitted by the chip to be tested and splits the light 115, and the optical detection device 116 receives the light 115 emitted by the beam splitter 119 through the lens 120 and tests the optical characteristics of the chip to be tested.
In one embodiment, the three-dimensional moving platform 118 operates the transparent substrate 100 by a robot arm to bring the metal electrode layer 102 into alignment contact with the chip electrode to be tested with the aid of the monitoring camera 117. The source meter 114 and the multiplexing gating module 113 alternately gate the chip array to be tested and test the electrical characteristics of the chip array. The optical detection device 116 receives the light 115 emitted from the chip to be tested and tests the optical characteristics of the chip to be tested, thereby screening the chip.
In a specific implementation manner of an embodiment, the transparent substrate is made of a non-metal material, which may be silicon dioxide, silicate, polymethyl methacrylate (PMMA), etc., the transparent or semi-transparent flexible buffer layer is made of a polymer material including at least one of Polydimethylsiloxane (PDMS), Polyimide (PI), and polymethyl methacrylate (PMMA), and the insulating layer is made of an insulating material including at least one of Polydimethylsiloxane (PDMS), Polyimide (PI), silicon oxide, polymethyl methacrylate (PMMA), and resin.
In summary, the micro flexible electrode array provided by the present invention includes: a transparent substrate 100; a metal circuit layer 101, wherein the metal circuit layer 101 is arranged on the upper surface of the transparent substrate 100; a transparent or semitransparent flexible buffer layer 103, wherein the transparent or semitransparent flexible buffer layer 103 is arranged on the upper surface of the metal circuit layer 101, and a metal electrode layer 102 is arranged on one surface of the transparent or semitransparent flexible buffer layer 103, which is far away from the metal circuit layer 101, and one side surface of the transparent or semitransparent flexible buffer layer 103; the metal electrode layer 102 is arranged on the upper surface and the side surface of the transparent or semitransparent flexible buffer layer 103, the metal electrode layer 102 is connected with the metal circuit layer 101, and the metal electrode layer 102 is right opposite to an electrode of the micro chip to be detected; an insulating layer 112, wherein the insulating layer 112 is between two of the metal circuit layers 101. The invention adopts the movable transparent substrate 100 to make the metal electrode layer 102 in alignment contact with the electrode of the microchip to be detected, and electrifys the microchip to be detected to test the characteristics, thereby screening the chip. In addition, the flexible structure is adopted to avoid the damage of the microchip to be tested by the probe, and the reliable contact with the uneven electrode of the microchip to be tested is facilitated, and the transparent substrate and the transparent or semitransparent buffer layer are adopted to facilitate the accurate alignment with the electrode of the microchip to be tested; and the electrode array is beneficial to the batch test of the micro chips to be tested, and the detection speed of the chips is greatly improved.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A micro flexible electrode array is characterized by comprising a transparent substrate, a metal circuit layer, a transparent or semitransparent flexible buffer layer, a metal electrode layer and an insulating layer; the metal circuit layer is arranged on the upper surface of the transparent substrate, and a transparent or semitransparent flexible buffer layer is arranged on one surface, far away from the transparent substrate, of the metal circuit layer; the buffer layer is arranged on the upper surface of the metal circuit layer, and a metal electrode layer is arranged on one surface of the buffer layer, which is far away from the metal circuit layer, and one side surface of the buffer layer; the metal electrode layers are arranged on the upper surface and the side surfaces of the buffer layer and are connected with the metal circuit layer, and the metal electrode layers are right opposite to the electrodes of the micro chip to be detected; the insulating layer is arranged between the two metal circuit layers.
2. The micro flexible electrode array according to claim 1, wherein the micro flexible electrode array comprises a series of flexible electrodes regularly arranged, and the size and number of the flexible electrodes are adjusted according to the size and number of the micro chips to be tested.
3. The array of claim 1, wherein the array comprises a plurality of flexible electrodes arranged regularly for detecting the performance of the micro chips under test.
4. The array of miniature flexible electrodes of claim 1, wherein the transparent substrate is made of a non-metallic material, and the transparent substrate is used for the flexible electrodes to be conveniently and rapidly aligned with the electrodes of the microchip to be tested.
5. The array of miniature flexible electrodes of claim 4, wherein said non-metallic material comprises at least one of silicon dioxide, silicate, and polymethylmethacrylate.
6. The array of miniature flexible electrodes of claim 1, wherein the transparent or translucent flexible buffer layer is made of a polymer material for the flexible electrodes to be conveniently and quickly aligned with the electrodes of the to-be-tested miniature chip and to be adapted to the to-be-tested miniature chips with different electrode heights.
7. The array of micro flexible electrodes according to claim 6, wherein the polymer material comprises at least one of polydimethylsiloxane, polyimide, and polymethyl methacrylate, and the manufacturing process includes but is not limited to etching, spin coating, deposition, plating, ink-jet printing, and evaporation.
8. The array of micro flexible electrodes according to claim 1, wherein the insulating layer is made of an insulating material, the insulating material comprises at least one of polydimethylsiloxane, polyimide, silicon oxide, polymethyl methacrylate or resin, and the manufacturing process comprises but is not limited to etching, spin coating, deposition, coating, ink-jet printing, and evaporation.
9. A test method of a miniature flexible electrode array is characterized by comprising the following steps:
1) providing a source table and a multiplexing gating module, wherein the multiplexing gating module is interconnected and communicated with the metal circuit layer according to rules; the multiplexing gating module is communicated with an external source meter, and the metal electrode layer opposite to the chip to be tested is communicated with the source meter by controlling the multiplexing gating module, wherein the source meter has the functions of testing a power supply and a universal meter;
2) providing a three-dimensional moving platform, a monitoring camera, a beam splitter, a lens and optical detection equipment, wherein the three-dimensional moving platform operates a transparent substrate through a mechanical arm, the monitoring camera observes the relative position of the transparent substrate and a chip to be detected, the beam splitter receives and splits light emitted by the chip to be detected, and the optical detection equipment receives the light emitted by the beam splitter through the lens and tests the optical characteristics of the chip to be detected, so that the chip is screened; the optical detection device includes but is not limited to a spectrometer, an industrial camera.
10. The method for testing the micro flexible electrode array as claimed in claim 9, wherein the three-dimensional moving platform operates the transparent substrate by a mechanical arm, the metal electrode layer is aligned and contacted with the electrodes of the chip to be tested under the assistance of the monitoring camera, and the source meter and the multiplexing gating module alternately gate the chip array to be tested and test the electrical characteristics of the chip array; the optical detection equipment receives the light emitted by the chip to be detected and tests the optical characteristics of the chip to be detected, thereby screening the chip.
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