CN101750521A - LED carrying piece and electrical property testing platform thereof - Google Patents
LED carrying piece and electrical property testing platform thereof Download PDFInfo
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- CN101750521A CN101750521A CN 200810185679 CN200810185679A CN101750521A CN 101750521 A CN101750521 A CN 101750521A CN 200810185679 CN200810185679 CN 200810185679 CN 200810185679 A CN200810185679 A CN 200810185679A CN 101750521 A CN101750521 A CN 101750521A
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- led
- light emitting
- emitting diode
- carrier
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Abstract
The invention relates to an LED carrying piece and an electrical property testing platform thereof; the LED carrying piece is mainly provided with an electrode contact surface used for conducting current on a carrier, and the electrode contact surface is provided with a plurality of LEDs and is electrically contacted with an electrode arranged at the bottom surface of each LED at the same time; the testing platform comprises an electric connecting piece used for being electrically connected with the electrode contact surface, at least one probe, wherein the least one probe is connected with the electric connecting piece and is electrically contacted with an electrode on the top surface of each LED on the carrying piece, so that a circuit is formed between the probe and the electrode contact surface so as to be used for testing whether the LEDs are normal or not; furthermore, compared with the common method that two probes form a group and are simultaneously contacted with two electrodes of the single LED, the invention not only reduces half using quantity of the probes, but also further shortens the operation time of electrical property test.
Description
Technical field
The present invention is about a kind of LED-mounted and at described LED-mounted platform that carries out testing electrical property.
Background technology
Existing mode of carrying out testing electrical property at light emitting diode, please refer to shown in Figure 5, be mainly on a microscope carrier 60, to place a carrying film 70, wherein carry film 70 surfaces and be provided with a plurality of light emitting diodes to be measured 71 (only showing among the figure that is a representative), be two electrodes of one group the same light emitting diode 71 of the corresponding respectively contact of probe 80 with two again, and one by one each light emitting diode 71 is carried out testing electrical property, or simultaneously a plurality of light emitting diodes 71 are carried out testing electrical property with many groups probe 80, though this kind test mode is to operate via the action of computer cooperative mechanical, but owing to be to serve as precision and program consuming time with two steps that are one group probe 80 is aimed at two electrodes of contact light emitting diode 71 respectively, so therefore the overall operation time elongated, improvement makes integrated artistic quicker to shorten the activity duration to remain to do further at test mode.
Summary of the invention
Because the shortcoming of prior art, a purpose of the present invention is to provide a kind of LED-mounted, can make a test platform only need use corresponding single the light emitting diode of single probe to carry out testing electrical property, the probe use amount is reduced by half and shorten activity duration of testing electrical property relatively.
Desire to reach the employed technological means of above-mentioned purpose, but described LED-mounted is the electrode contact surface that mainly is provided with a conducting electric current in a carrier, the light emitting diode that can provide a plurality of bottom surfaces and end face to be equipped with electrode is arranged on the described electrode contact surface, and described electrode contact surface is electrically contacted with the electrode of each light emitting diode bottom surface simultaneously.
Another object of the present invention is to provide the light emitting diode electrical property testing platform of LED-mounted of a kind of application of aforementioned.
Reaching the employed technological means of this purpose, is to make described light emitting diode electrical property testing platform comprise:
One electrical connector is that power supply connects aforementioned LED-mounted electrode contact surface; And
At least one probe, be to connect described electrical connector, whether the electrode of the light emitting diode end face in aforementioned LED-mounted of described at least one probe power supply property contact, it is normal to test each light emitting diode to make probe and LED-mounted electrode contact surface constitute the loop by this.
Described light emitting diode electrical property testing platform can comprise further that a microscope carrier for described LED-mounted storing location thereon.
Because LED-mounted electrode contact surface provides the shared described electrode contact surface of electrode of a plurality of light emitting diodes bottom surface, when carrying out testing electrical property, single light emitting diode only needs by another electrode of the corresponding contact of a probe, so the use that can save second probe, can promote the speed of integrated testability operation, reduce the time cost of technology.
Description of drawings
Fig. 1: the schematic perspective view that is first embodiment of the invention.
Fig. 2: the side view that is Fig. 1.
Fig. 3: the side view of second embodiment of the invention.
Fig. 4: the side view of third embodiment of the invention.
Fig. 5: the schematic perspective view of existing light emitting diode electrical property testing platform.
Drawing reference numeral
10 carriers, 100 electrode contact surfaces
The 11 metallic film 12A glued membrane that insulate
12B conductive adhesive film 20 light emitting diodes
200 first electrodes, 201 second electrodes
30 probes, 40 microscope carriers
41 perforation, 50 electrical connectors
60 microscope carriers, 70 carrying films
71 light emitting diodes, 80 probes
Embodiment
The present invention includes a kind of LED-mounted and a kind ofly provide described LED-mounted test platform that carries out the light emitting diode testing electrical property, described LED-mounted, please refer to shown in Figure 1, be to disclose a carrier 10 is arranged, but on the described carrier 10 electrode contact surface 100 that is provided with a conducting electric current, in the present embodiment, described carrier 10 is that metal material or semiconductor material are made; Be provided with a plurality of light emitting diodes 20 (only showing among the figure) in described electrode contact surface 100 as representative, the bottom surface of each light emitting diode 20 is provided with one first electrode 200 and the described electrode contact surface 10 of common electrically contact, the end face of each light emitting diode 20 then is provided with one second electrode 201, this kind light-emitting diodes form of tubes is different from the light-emitting diodes form of tubes that general both positive and negative polarity is all established same surface, can increase the light-emitting zone area of end face and promote brightness, and the thermal source that can directly light emitting diode be produced directly dissipates by negative pole.
Aforementioned LED-mounted carrier 10 except that can be metal material or semiconductor material made, still can comprise other kinds enforcement aspect, as shown in Figure 3, Figure 4, described carrier 10 can comprise a base material 12A, 12B and one is plated on base material 12A, the metallic film 11 on 12B surface, thereby with this metallic film 11 as electrode contact surface 100, described base material 12A, 12B can be an insulation glued membrane 12A or a conductive adhesive film 12B.
About aforesaid LED-mounted test platform that carries out the light emitting diode testing electrical property is provided, as shown in Figure 1, comprising:
One electrical connector 50 is the ends (not shown described voltage source) that connect a test voltage source, and described electrical connector 50 is electrode contact surfaces 100 that power supply connects described LED-mounted carrier 10, in the present embodiment, is to be a clip-type; And
At least one probe 30 is the other ends that connect aforementioned test voltage source, and described at least one probe 30 is second electrodes 201 of described these light emitting diode 20 end faces of power supply property contact.
The two ends that are connected the test voltage source owing to probe 30 and electrical connector 50 respectively, when probe 30 contacts second electrode 201 of light emitting diodes 20 end faces, can be between the electrical connector 50 of probe 30 and connection electrode surface of contact 100 by two electrodes 200 of light emitting diode 20,201 constitute a loop, and then whether input test voltage is normally shinny with test light emitting diode 20 to light emitting diode 20.Because first electrode 200 of the directly fixing electrically contact of the electrode contact surface 100 of carrier 10 light emitting diode 20 bottom surfaces, so needn't as prior art, must use two to be the electrode that one group probe is aimed at the same light emitting diode of contact respectively simultaneously, and can shorten the time of testing electrical property cost effectively.
Aforementioned LED test platform can further comprise a microscope carrier 40 for described carrier 10 storing location thereon as shown in Figures 1 to 4, and described microscope carrier 40 can be by the fixing described carrier 10 of vacuum suction mode.
The described microscope carrier 40 that provides carrier 10 to put can further have a perforation 41 and be communicated with carrier 10 bottom surfaces, as shown in Figure 4, embodiment with this figure, when the base material of carrier 10 is conductive adhesive film 12B, aforementioned electric web member 50 can be electrically connected conductive adhesive film 12B by perforation 41 from microscope carrier 40 belows, the convenient conductive adhesive film 12B test transmission voltage that passes through is to metallic film 11.
The present invention is by the design of preceding exposure optical diode carrying tablet and test platform thereof, make each light emitting diode only need use a probe to contact its electrode to carry out testing electrical property, it is luminous if integral body constitutes the loop conducting, represent that promptly the light emitting diode state is normal, need use two to be one group probe simultaneously compared to prior art, the present invention only uses a probe to test at single light emitting diode, comparatively convenient and can shorten the activity duration of testing electrical property and reduce the probe demand, further reduce the technology cost.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; any technician with the technical field of the invention; without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is when being as the criterion with claim institute confining spectrum.
Claims (9)
1. one kind LED-mounted, it is characterized in that, but described LED-mounted is the electrode contact surface that mainly is provided with a conducting electric current in a carrier, the light emitting diode that can provide a plurality of bottom surfaces and end face to be equipped with electrode is arranged on the described electrode contact surface, and described electrode contact surface is electrically contacted with the electrode of each light emitting diode bottom surface simultaneously.
2. LED-mounted as claimed in claim 1, it is characterized in that described carrier is that metal material or semiconductor material are made.
3. LED-mounted as claimed in claim 1, it is characterized in that described carrier comprises that a base material and is plated on the metallic film of substrate surface, with this metallic film as electrode contact surface.
4. LED-mounted as claimed in claim 3, it is characterized in that described base material is an insulation glued membrane.
5. LED-mounted as claimed in claim 3, it is characterized in that described base material is a conductive adhesive film.
6. light emitting diode electrical property testing platform, it is characterized in that, described light emitting diode electrical property testing platform provides as described LED-mounted of arbitrary claim in the claim 1 to 5 and carries out the light emitting diode testing electrical property, and described LED test platform comprises:
One electrical connector is the electrode contact surface that power supply connects described LED-mounted carrier; And
At least one probe is to connect described electrical connector, and described at least one probe is the electrode of the light emitting diode end face in aforementioned LED-mounted of the power supply property contact, makes the electrode contact surface formation testing electrical property loop of probe and carrier.
7. light emitting diode electrical property testing platform as claimed in claim 6 is characterized in that, described light emitting diode electrical property testing platform comprises that further a microscope carrier supplies LED-mounted carrier to put the location thereon.
8. light emitting diode electrical property testing platform as claimed in claim 7 is characterized in that, described microscope carrier is by the fixing described LED-mounted carrier of vacuum suction mode.
9. light emitting diode electrical property testing platform as claimed in claim 8 is characterized in that, described microscope carrier has a perforation can be communicated with LED-mounted carrier bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810185679 CN101750521A (en) | 2008-12-19 | 2008-12-19 | LED carrying piece and electrical property testing platform thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810185679 CN101750521A (en) | 2008-12-19 | 2008-12-19 | LED carrying piece and electrical property testing platform thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101750521A true CN101750521A (en) | 2010-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810185679 Pending CN101750521A (en) | 2008-12-19 | 2008-12-19 | LED carrying piece and electrical property testing platform thereof |
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| CN (1) | CN101750521A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102466787A (en) * | 2010-11-18 | 2012-05-23 | 亚旭电脑股份有限公司 | Light emitting diode array detection jig |
| CN104251944A (en) * | 2013-06-28 | 2014-12-31 | 上海信耀电子有限公司 | LED (light emitting diode) drive module detection system |
| CN104603626A (en) * | 2012-09-11 | 2015-05-06 | 夏普株式会社 | Testing jig, inspection device, mounting device, and testing device |
| CN106526443A (en) * | 2016-10-31 | 2017-03-22 | 广东利扬芯片测试股份有限公司 | Silicon wafer testing probe bench |
| CN114295948A (en) * | 2020-10-07 | 2022-04-08 | 台湾爱司帝科技股份有限公司 | Electronic component measuring apparatus, electronic component measuring method, and method of manufacturing light emitting diode |
-
2008
- 2008-12-19 CN CN 200810185679 patent/CN101750521A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102466787A (en) * | 2010-11-18 | 2012-05-23 | 亚旭电脑股份有限公司 | Light emitting diode array detection jig |
| CN104603626A (en) * | 2012-09-11 | 2015-05-06 | 夏普株式会社 | Testing jig, inspection device, mounting device, and testing device |
| CN104603626B (en) * | 2012-09-11 | 2017-03-08 | 夏普株式会社 | Test fixture, check device, mounting apparatus and assay device |
| CN104251944A (en) * | 2013-06-28 | 2014-12-31 | 上海信耀电子有限公司 | LED (light emitting diode) drive module detection system |
| CN106526443A (en) * | 2016-10-31 | 2017-03-22 | 广东利扬芯片测试股份有限公司 | Silicon wafer testing probe bench |
| CN114295948A (en) * | 2020-10-07 | 2022-04-08 | 台湾爱司帝科技股份有限公司 | Electronic component measuring apparatus, electronic component measuring method, and method of manufacturing light emitting diode |
| CN114295948B (en) * | 2020-10-07 | 2023-11-14 | 台湾爱司帝科技股份有限公司 | Electronic component measuring apparatus, electronic component measuring method, and manufacturing method of light emitting diode |
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Open date: 20100623 |