JP2012146794A - Module for attaching semiconductor light-emitting element and semiconductor light-emitting element module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module for attaching a semiconductor light-emitting element which can deform the overall shape without transmitting a stress due to deformation to an LED while ensuring excellent productivity, can attach the LED easily while exhibiting excellent heat dissipation, and can reduce the loss of illumination light of the LED, and to provide a semiconductor light-emitting element module.SOLUTION: The module for attaching a semiconductor light-emitting element comprises a metallic conduction plate 17, a contact 26, and a flexible surface insulation part 60. The conduction plate has a plurality of first conduction parts 18A, 18B, 18C, and a first feeding part 21 and a second feeding part 24 coming into conduction with the first conduction parts, respectively. The contact 26 has cathode side contact parts 28, 33 coming into contact with the first conduction parts and brought into conduction with the cathode 83 of a semiconductor light-emitting element 80, respectively, and an anode side contact part 36 coming into contact with each first conduction part and brought into conduction with the anode 82 of a semiconductor light-emitting element 82, and exposes a part of the first conduction part facing the semiconductor light-emitting element.

Description

  The present invention relates to a semiconductor light emitting element mounting module capable of mounting a plurality of semiconductor light emitting elements (LEDs), and a semiconductor light emitting element module.

In recent years, lighting fixtures using LEDs (semiconductor light emitting elements) have been used in various fields such as indoor lighting fixtures and backlights for liquid crystal monitors.
In general, lighting fixtures using LEDs arrange a plurality of circuit boards (rigid boards) each having one or more LEDs mounted on one side in a chain (linear or planar), and adjacent circuit boards are arranged together. It is comprised by connecting with an electrical connector (for example, patent documents 1-4). However, the LED lighting apparatus having this configuration is poor in productivity because it is necessary to connect a plurality of circuit boards with electrical connectors.
Furthermore, when the attachment object has a curved shape, it is necessary to configure the LED lighting apparatus in such a manner that each LED is positioned on one curved surface, but it is difficult to meet this requirement with the LED lighting apparatus having the above configuration.

  On the other hand, an LED lighting apparatus having a configuration in which a plurality of LEDs are soldered to the surface of a long FPC (flexible printed circuit board) does not require a connection operation by a connector, and each LED is curved by bending the FPC. It is possible to position it above.

Special table 2010-525523 Special table 2010-505232 gazette JP 2010-62556 A JP 2010-98302 A

However, LED lighting fixtures using FPC have the following drawbacks.
First, since the LED is directly soldered on the circuit (conductor layer) of the FPC, when the FPC is bent, stress is generated in the solder portion. There is a risk of falling off. Moreover, there is a possibility that solder cracks are promoted by the thermal history due to repeated ON / OFF of the LED.
Secondly, since the resin material constituting the FPC generally has a low reflectance, a loss of light emitted from each LED is increased. It is difficult to devise and take measures against optical design such as reflection with an FPC alone, and it is necessary to install another member such as a reflector on the FPC in order to improve reflectivity.
Thirdly, in order to automate the soldering such as SMT (Surface Mount Technology), a plurality of facilities are required according to the transfer of the substrate and the like, the pick-up of the parts, the reflow for the solder bonding, and the like. However, if each facility is a general-purpose facility, when the substrate such as FPC becomes long, the operation of each facility and the movement of the FPC between facilities become difficult, and it becomes difficult to automate the soldering work, so the productivity is remarkably lowered. . In addition, the length of the FPC that can be handled may be determined due to restrictions on the facility side.
Fourth, the FPC has excellent flexibility but low rigidity. Therefore, when fixing the FPC with the LED mounted on a heat sink or the like, it is necessary to fix the entire surface of the FPC using double-sided tape or adhesive. is there. However, since these inclusions (double-sided tape or adhesive) hinder heat transfer, fixing the inclusions on the entire surface of the FPC may cause a reduction in heat dissipation.

  The object of the present invention is that the productivity is good and the entire shape can be deformed, but the stress due to the deformation is not transmitted to the LED, the mounting of the LED is easy, the heat dissipation is excellent, and the illumination light of the LED is An object is to provide a semiconductor light emitting element mounting module and a semiconductor light emitting element module capable of reducing loss.

  A module for mounting a semiconductor light emitting element according to the present invention includes a conductive plate made of metal, a metal contact in contact with the conductive plate, and a surface insulating portion made of a resin material covering the surface of the conductive plate and the contact. A module for mounting a semiconductor light emitting device, wherein the conductive plate is electrically connected to a plurality of first conductive portions arranged in one direction in a state of being separated from each other, and the first conductive portions located at both ends of the one direction. A first power supply portion and a second power supply portion, wherein the contact serves as an elastically deformable portion having one end in contact with the first conduction portion and the other end in conduction with the cathode of the semiconductor light emitting device. A cathode side contact portion provided at least one for each first conduction portion, one end of which contacts the first conduction portion, and the other end contacts the cathode side contact of the adjacent first conduction portion. The above cathode conducts to the part An anode-side contact portion provided at least one for each first conductive portion, which is an elastically deformable portion capable of conducting with the anode of the semiconductor light-emitting element, and the surface insulating portion is flexible And the elastic deformation part of the cathode side contact part and the anode side contact part, the part of the first conduction part facing the semiconductor light emitting element, and the first feeding part and the second feeding part A part of the elastic deformation portion of the cathode side contact portion and the anode side contact portion is exposed in the plate thickness direction of the first conduction portion and the conduction plate.

  The conduction plate includes a second conduction part provided side by side with the first conduction part and connected to the first conduction part located at one end in the one direction, and the second conduction part includes the second conduction part. The end on the same side as the one power feeding unit may constitute the second power feeding unit.

  At least one of the first conducting part and the second conducting part may have flexibility.

  The whole cathode side contact part and the whole anode side contact part may oppose the thickness direction of the first conduction part and the conduction plate.

  The entire semiconductor light emitting element may be opposed to the first conducting portion in the thickness direction of the conducting plate.

  You may provide the contact which comprises the said cathode side contact part and the anode side contact part separately from the said 1st conduction | electrical_connection part.

  The cathode-side contact portion and the anode-side contact portion that are in contact with the different first conducting portions and sandwich the semiconductor light-emitting element, and the cathode-side contact portion and the anode-side contact portion that can be connected and disconnected And a contact having a bridge.

You may connect the said adjacent 1st conduction | electrical_connection part by the bridge | bridging which can be cut | disconnected physically.
Moreover, when it has a 2nd conduction | electrical_connection part, you may connect the said 1st conduction | electrical_connection part adjacent to each other and each 1st conduction | electrical_connection part and the said 2nd conduction | electrical_connection part by the bridge | bridging which can be cut | disconnected physically.

  The semiconductor light emitting element attached to the surface insulating part may include a retaining metal that restricts the cathode side contact part and the anode side contact part from separating in the thickness direction of the conductive plate.

  The semiconductor light emitting device module of the present invention includes a semiconductor light emitting device mounting module, and a semiconductor in which an anode and a cathode are electrically connected to the cathode side contact portion and the anode side contact portion of the semiconductor light emitting device mounting module. And a light emitting element.

  According to another aspect of the semiconductor light emitting element mounting module of the present invention, a base plate portion made of metal, a metal contact in contact with the base plate portion, and a resin material covering the base plate portion and the surface of the contact A plurality of semiconductor light emitting element fixing portions each including a first conductive portion and a second conductive portion, wherein the base plate portion is provided side by side in one direction. And a first power supply unit and a second power supply unit that are electrically connected to the first conductive unit and the second conductive unit located at both ends, respectively, and the contact has one end of the first conductive unit and the second conductive unit. A first contact portion and a second contact portion that are in contact with the conductive portion and have the other end electrically conductive and elastically deformable with the anode and the cathode of the semiconductor light emitting device, respectively, and the surface insulating portion has flexibility. And having the first Contact portion and the other end of the second contact portion, opposed portions of the semiconductor light emitting element of the semiconductor light emitting element fixing portion, and is characterized by exposing the said first feeding portion and the second feeding portion.

  The semiconductor light emitting element fixing portion may have flexibility.

  The semiconductor light emitting element fixing part may be provided with a pair of fixing pieces that can be fixed in a state where the semiconductor light emitting element is sandwiched, and the surface insulating part may expose the fixing piece.

  All the first conducting parts separated from each other can be conducted with the second conducting part of the same semiconductor light emitting element fixing part as the other, and the other semiconductor is located on one side in the longitudinal direction of the base plate part You may connect to the said 2nd conduction | electrical_connection part of a light emitting element fixing | fixed part.

  All the first conductive parts are connected to each other, all the second conductive parts are connected to each other, the first conductive part and the second conductive part are separated from each other, and the first conductive part is the same semiconductor as itself. You may make it possible to conduct | electrically_connect with the said 2nd conduction | electrical_connection part of a light emitting element fixing | fixed part.

  All the first conductive parts are connected to each other, all the second conductive parts are connected to each other, and the first conductive part of the semiconductor light emitting element fixing part located on one end side of the base plate part and Only the second conduction part may be connected to each other, and the first conduction part may be electrically connected to the second conduction part of the same semiconductor light emitting element fixing part as itself.

  The first contact portion and the second contact portion are made of a metal that is separate from the semiconductor light emitting element fixing portion and has elasticity, and one end contacts the first conduction portion and the second conduction portion, and the other end. May be a first contact piece and a second contact piece that are spaced apart from each semiconductor light emitting element fixing portion and can be electrically connected to the anode and the cathode of the semiconductor light emitting element, respectively.

  The semiconductor light emitting element fixing portion may be wider than other portions of the base plate portion.

  An exposed portion for exposing a part of the base plate portion may be formed on the surface insulating portion.

  You may connect the said 1st conduction | electrical_connection part and the said 2nd conduction | electrical_connection part of the same semiconductor light-emitting element fixing | fixed part as this 1st conduction | electrical_connection part by the cutting | disconnection bridge | bridging which can be cut | disconnected physically.

  A support portion for supporting a diffusion lens for diffusing light emitted from the semiconductor light emitting element may be formed on the surface insulating portion.

  The semiconductor light-emitting element module of the present invention includes a semiconductor light-emitting element mounting module and a semiconductor in which an anode and a cathode are electrically connected to the first contact portion and the second contact portion of the semiconductor light-emitting element mounting module, respectively. And a light emitting element.

According to invention of Claim 1 and 12, LED (semiconductor light emitting element) is pinched | interposed between the cathode side contact part of a contact, and an anode side contact part (LED to a 1st contact part and a 2nd contact part) Since the LED can be attached to the module for attaching the semiconductor light emitting device (by bringing the LED into contact with each other), the attachment of each LED is easy. Further, even if the semiconductor light emitting element mounting module is bent (for example, the surface insulating portion is bent at a position corresponding to the gap between the adjacent first conductive portions), the cathode side contact portion (second contact portion) and the anode side contact portion. Since the (first contact portion) can be elastically deformed and has excellent followability, each LED is securely held without falling off, and stress due to deformation of the module for mounting a semiconductor light emitting element does not occur on each LED. Further, since there is no need to perform reflow, there is no possibility that the semiconductor light emitting element is damaged by heat.
Furthermore, since the surface insulating portion is resinous, it is possible to select a material and color (and color tone) that have flexibility and high reflectivity. Furthermore, since it is easy to form the surface insulating portion in an arbitrary shape, the loss of illumination light of each LED can be reduced by making the shape of the peripheral portion of the LED optimal. In other words, the module itself can realize an optical design considering reflection and the like, and there is no need to install another member such as a reflector.
In addition, since one semiconductor light emitting element mounting module can be lengthened and a large number of LEDs can be mounted, assembly and manufacture of the semiconductor light emitting element module and the semiconductor light emitting element mounting module are easy.
In addition, a metal conductive plate (base plate portion) having excellent thermal conductivity and rigidity constitutes the majority of the module for mounting a semiconductor light emitting element, and the entire conductive plate is covered with a surface insulating portion made of resin. The flexibility and rigidity of the semiconductor light emitting element mounting module can be compatible. For this reason, when fixing the semiconductor light emitting element mounting module to an external component (such as a heat sink), only a part of the semiconductor light emitting element mounting module needs to be fixed. The heat dissipation effect can be enhanced by contacting the part. Furthermore, since the heat of the LED and the heat transmitted from the elastically deformable portion can be efficiently received by the conductive plate (base plate portion), the heat generated by the LED is efficiently transmitted through the conductive plate (base plate portion) and the thin surface insulating portion. It is often dissipated outside. That is, the module for mounting a semiconductor light emitting element can realize both flexibility and heat dissipation.

  According to the second aspect of the present invention, power feeding to the semiconductor light emitting element mounting module is performed only from one end side, so that wiring for power feeding can be simplified. In addition, since there is no power feeding portion on the other end side, the degree of freedom in design for fixing to other members is improved.

  According to the third aspect of the present invention, since the first conductive portion itself or (and) the second conductive portion itself has flexibility, the semiconductor light emitting element mounting module can be more easily bent.

  According to invention of Claim 4, since the heat | fever of a cathode side contact part and an anode side contact part becomes easier to be transmitted with respect to a 1st conduction | electrical_connection part, heat dissipation is further improved.

  According to the fifth aspect of the present invention, the heat of the semiconductor light emitting element can be more easily transmitted to the first conduction portion, so that the heat dissipation is further improved.

  According to the invention described in claim 6, since the cathode side contact part and the anode side contact part are separate from the first conduction part, a part of the first conduction part is cut and raised, and the cathode side contact part and the anode side contact part. There is no need to form a hole or a slit in the first conduction part as in the case of forming the film, and the area can be increased, so that the heat dissipation is further improved.

  According to the seventh aspect of the present invention, since the cathode side contact portion and the anode side contact portion are manufactured as a part of the integral contact, the dimensions of the cathode side contact portion and the anode side contact portion when the contact is manufactured. The accuracy is high, and the dimensional accuracy is maintained even if the cutting bridge is cut after the surface insulating portion is formed. Therefore, when the semiconductor light emitting device is sandwiched between the cathode side contact portion and the anode side contact portion, the insertion force of the semiconductor light emitting device to the cathode side contact portion and the anode side contact portion and the holding force by the cathode side contact portion and the anode side contact portion are stabilized. There will be less variation.

  According to the eighth and ninth aspects of the invention, since the first conductive portions can be integrated by the bridge, the surface insulation is performed so that each portion of the conductive plate does not shift (while maintaining the exact position of each portion). The part can be molded. Further, after forming the surface insulating portion, the first conductive portions can be separated from each other by physically cutting the bridge (an unnecessary portion as a conductive path can be removed).

  According to the tenth aspect of the present invention, the semiconductor light emitting element can be reliably brought into conduction with the cathode side contact portion and the anode side contact portion.

  According to the thirteenth aspect of the invention, the module for mounting the semiconductor light emitting element can be easily bent.

According to the fourteenth aspect of the present invention, since the semiconductor light emitting element can be fixed to the conductive plate by fitting, it is not necessary to solder and reflow them, and the productivity is good.
Further, since there is no need to perform reflow, there is no possibility that the semiconductor light emitting element is damaged by heat.
In addition, since the heat of the semiconductor light emitting element can be efficiently passed through the conductive plate through the fixed piece, the thermal conductivity and the heat dissipation are improved.

  According to the fifteenth aspect of the present invention, since the series circuit having a small variation in current value is formed on the conductive plate, the variation in luminance of each semiconductor light emitting element is reduced.

  According to the invention described in claim 16, since a parallel circuit is configured on the conductive plate, even if one semiconductor light emitting element is deteriorated or damaged, the other semiconductor light emitting elements included in the module can emit light. It is suitable for instruments that require long life and reliability.

  According to the seventeenth aspect of the present invention, the same effects as those of the sixteenth aspect of the present invention can be exhibited with fewer wires than the sixteenth aspect.

  According to the invention described in claim 18, since only the first contact piece and the second contact piece are made of a metal material having excellent spring property, and the metal material having no spring property can be used for other portions of the conductive plate. The portion having the spring property can be reduced, and the manufacturing cost of the entire conductive plate can be reduced.

  According to the nineteenth aspect of the invention, since the portion excluding the semiconductor light emitting element fixing portion that mainly exhibits a heat dissipation effect can be made thin (narrow), the conductive plate and the surface insulating portion can be reduced in weight, and Module manufacturing costs can be reduced.

  According to the twentieth aspect of the present invention, the heat transmitted from the semiconductor light emitting element to the conductive plate is radiated to the outside through the exposed portion, so that the heat dissipation is further improved. In addition, the degree of freedom in thermal design of a device (for example, a curved display) on which the semiconductor light emitting element mounting module is mounted is increased.

  According to the twenty-first aspect of the present invention, since the first conducting portion and the second conducting portion can be integrated by the cutting bridge, each conducting plate can be molded with high positional accuracy without deviation when the surface insulating portion is molded. Further, after forming the surface insulating portion, the first conductive portion and the second conductive portion can be separated by physically cutting the cutting bridge.

  According to the twenty-second aspect, the lens can be positioned at an appropriate position with respect to the semiconductor light emitting element. In addition, since a lens having a diffusing function can be disposed in the immediate vicinity of the semiconductor light emitting element, light emitted from the semiconductor light emitting element can be efficiently diffused, and the entire module including the lens can be reduced in height.

It is a perspective view of the conduction | electrical_connection board of the 1st Embodiment of this invention. It is a perspective view which shows the state which mounted the contact in the conduction | electrical_connection board. It is an expansion perspective view of a contact. It is a top view which shows the state which mounted the contact in the conduction | electrical_connection board. It is an enlarged plan view of the V section of FIG. It is a perspective view which shows the state which coat | covered the conduction | electrical_connection board and the contact with the surface insulation part. FIG. 6 is an enlarged plan view similar to FIG. 5 when a conductive plate and a contact are covered with a surface insulating portion. It is a bottom view when a conduction plate and a contact are covered with a surface insulating portion. FIG. 6 is an enlarged plan view similar to FIG. 5 when the cutting bridge is cut. It is a bottom view when a cutting bridge is cut. It is a perspective view which shows the state which attached the securing metal fitting to the surface insulation part. It is an expansion perspective view of a retaining metal fitting. FIG. 6 is an enlarged plan view similar to FIG. 5 when a retaining metal fitting is attached to the surface insulating portion. It is a perspective view of the LED module of the completion state which mounted | wore with LED. It is an enlarged plan view similar to FIG. 5 of the LED module in a completed state. It is a top view of the LED module of a completion state. It is the expansion perspective view seen from the upper part of a contact, a metal fitting, and LED. It is the expansion perspective view seen from the lower part of a contact, a metal fitting, and LED. It is sectional drawing which follows the XIX-XIX arrow line of FIG. It is sectional drawing which follows the XX-XX arrow line of FIG. It is a schematic diagram of the series circuit formed on the conduction | electrical_connection board. It is a side view when an LED module is curved in an arc shape and fixed to a heat sink having an arc cross section. It is a top view of the conduction board of the modification of a 1st embodiment. It is a schematic diagram of the series circuit of the modification of 1st Embodiment. It is a perspective view of the module for LED attachment of the 2nd Embodiment of this invention. It is an expanded sectional view which follows the XXVI-XXVI arrow line of FIG. It is a disassembled perspective view of the module for LED attachment which removed the diffusion lens and the LED element. It is an enlarged view of the XXVIII part of FIG. It is a front view of an LED module when a diffusion lens is removed. It is a front view of the module for LED attachment which removed the diffusion lens and the LED element. It is a rear view of an LED module. It is an expanded sectional view which follows the XXXII-XXXII arrow line of FIG. It is an expanded sectional view which follows the XXXIII-XXXIII arrow line of FIG. It is an expanded sectional view which follows the XXXIV-XXXIV arrow line of FIG. It is a front view of the conduction | electrical_connection board comprised for series circuits. It is a rear view of the conduction | electrical_connection board comprised for series circuits. It is a schematic diagram of a conduction plate and its series circuit. It is an expansion perspective view of a LED fixing | fixed part. It is a side view similar to FIG. It is a front view of the conduction | electrical_connection board comprised for parallel circuits. It is a schematic diagram of the conduction | electrical_connection board comprised for parallel circuits, and its parallel circuit. It is a schematic diagram of the conduction board comprised for another type of parallel circuit, and its parallel circuit.

Hereinafter, a first embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, the vertical direction, the horizontal direction, and the front and rear directions are based on the arrow direction shown in the drawing (the same applies to the description of the second embodiment and each modification).
In the present embodiment, the present invention is applied to an LED module 10 that is entirely bendable (can be bent).

First, the detailed structure and manufacturing procedure of the LED module 10 will be described with reference to FIGS. For the sake of space, the LED module 10 in the following description has six LED elements (semiconductor light emitting elements) 80 mounted thereon, but in reality, more (or a smaller number) of LED elements 80 can be mounted.
The LED module 10 is obtained by attaching an LED element 80 to an LED attachment module 15, and the LED attachment module 15 includes a conductive plate 17, a contact 26, a retaining metal fitting 40, and a surface insulating portion 60.

  FIG. 1 shows a conductive plate 17 that is a base material of the LED mounting module 15. The conducting plate 17 is a long plate-like member extending in the front-rear direction obtained by stamping a metal plate having conductivity and elasticity (flexibility) such as brass, phosphor bronze, iron, and aluminum. The conduction plate 17 includes a plurality of first conduction portions 18A, 18B, and 18C located on a straight line extending in the front-rear direction. The left and right widths of the first conduction portions 18A, 18B, and 18C are all the same, but the front-rear dimension of the first conduction portion 18C is shorter than the first conduction portion 18B, and the front-rear dimension of the first conduction portion 18A is the first conduction portion 18C. Shorter. In addition, a pair of positioning protrusions 19 project from the upper surface of the first conducting portion 18B, and one positioning projection 19 projects from the upper surfaces of the first conducting portion 18A and the first conducting portion 18C. All the positioning projections 19 are positioned on a straight line extending in the front-rear direction. Further, adjacent first conductive portions 18A, 18B, and 18C are connected to each other by a cutting bridge 20, and a first power feeding portion 21 extends forward from the first conductive portion 18A. On the right side of the first conduction parts 18A, 18B, 18C, there is located a second conduction part 22 that extends in the front-rear direction and has a narrower left-right width than the first conduction parts 18A, 18B, 18C, and the first conduction parts 18B, 18C. A circuit design bridge 23 extending from the second conductive portion 22 is connected to the second conductive portion 22. Further, a second power feeding portion 24 extends forward from the front end portion of the second conducting portion 22.

  The contact 26 shown in FIG. 2, FIG. 3, FIG. 4, FIG. 5 and the like is formed into the illustrated shape by stamping using a flat plate made of phosphor bronze (other metal may be used), for example. The contact 26 includes a flat large base portion 27 that constitutes a central portion thereof. An elastically deformable first cathode side contact portion 28 having one end supported by the large size base portion 27 is formed by cutting and raising the central portion of the large size base portion 27, and the distal end portion of the first cathode side contact portion 28 is formed. A contact end 29 is formed on the surface. The first cathode side contact portion 28 can be elastically deformed (flexed) in the vertical direction (the thickness direction of the large base portion 27) around its base end, and the first cathode side contact portion 28 in a free state. The contact end portion 29 side is located above the large base portion 27. Further, a substantially semicircular side edge recess 30 is formed in the right edge of the large base 27. Connected to the rear edge of the large-sized base 27 is a small-sized base 32 having a flat plate shape located on the same plane as the large-sized base 27 and having a positioning hole 31 formed therein. Further, the left and right edges of the small-sized base 32 constitute an elastically deformable portion 34 that extends upward and curves while being bent downward, and that its distal end side (portion extending downward) is deformable in the front-rear direction. A pair of second cathode side contact portions 33 are provided so as to project. Further, a small-sized base portion 35 that is symmetrical with the small-sized base portion 32 is positioned in front of the large-sized base portion 27, and is symmetrical with the second cathode side contact portion 33 at the left and right edges of the small-sized base portion 35. A pair of anode-side contact portions 36 formed is projected. A cutting bridge 37 located on the same plane as the large base 27 and the small base 35 is connected between the large base 27 and the small base 35. The cutting bridge 37 divides the contact 26 into an anode conduction portion 26A located in front of the cutting bridge 37 and a cathode conduction portion 26B located in the rear of the cutting bridge 37.

  The retaining metal fitting 40 shown in FIG. 12 or the like is formed by stamping a metal plate into the illustrated shape, and includes a connection piece 41 extending in the left-right direction and a left end portion of the connection piece 41 positioned below the connection piece 41. A fitting arm 42 extending forward from the top, a holding portion 44 projecting from the top surface of the tip of the fitting arm 42, a fitting projection 46 extending downward from the right end of the connection piece 41, and a fitting projection 46 And a restraining arm 48 extending forward from the front end portion. A pair of locking projections 43 project from both front and rear end faces of the fitting arm 42, and restraining projections 45 projecting to the right are formed at both front and rear end portions of the restraining portion 44. Further, a pair of locking projections 47 project from both front and rear end faces of the fitting projection 46, and a restraining projection 49 extending to the left is projected from the upper surface of the restraining arm 48. A pressing portion 50 having a substantially arc shape in plan view is formed on the portion.

Next, the manufacturing procedure of the LED mounting module 15 will be described.
First, the conductive plate 17 is placed on a work surface (not shown) in the posture shown in FIG. 1, and then, as shown in FIGS. 2, 4, and 5, each contact 26 is adjacent to two first conductive portions 18 </ b> A, 18 </ b> B, It is placed on the upper surface of the conductive plate 17 so as to straddle 18C (surface contact), and each cutting bridge 37 is placed on the upper surface of each cutting bridge 20 (the upper surface of the cutting bridge 20 is completely covered by the cutting bridge 37). At this time, the positioning hole 31 of the small-sized base portion 35 is fitted to the positioning projection 19 formed in the first conductive portions 18A and 18B, and the first conductive portion 18A in which the small-sized base portion 35 is placed on the positioning hole 31 of the small-sized base portion 32. , 18B are fitted to the positioning projections 19 of the other first conductive portions 18B, 18C located immediately after. Further, each positioning projection 19 is caulked with the corresponding positioning hole 31 to position each contact 26 with respect to the conduction plate 17.
Subsequently, the integrated conductive plate 17 and contact 26 are placed in a mold (not shown) in a positioned state, and after the mold is clamped, resin (for example, PBT, LCP, nylon) is placed in the mold cavity. Etc.). When the resin is cooled and hardened in the cavity, the conductive plate 17, the contact 26, and the hardened resin material are separated from the mold. Then, as shown in FIGS. 6, 7, 8, etc., the conductive plate 17 and the respective contacts 26 except for the end portions of the first power supply portion 21 and the second power supply portion 24, the first cathode side contact portion 28, etc. A surface insulating portion 60 having elasticity (flexibility) made of the resin is formed (injected) on the entire surface. The material and color (and color tone) of the resin material constituting the surface insulating portion 60 can be selected in consideration of reflectance and required specifications. In consideration of light absorption / reflection, the resin material is preferably white with a deep color tone (high reflectance). Since the first conductive portions 18A, 18B, 18C and the second conductive portion 22 of the conductive plate 17 are connected (integrated) to each other by the cutting bridge 20 and the circuit design bridge 23, surface insulation in the mold is performed. The first conductive portions 18A, 18B, 18C, and the second conductive portion 22 are not scattered or displaced in the mold during the molding of the portion 60, and an extremely accurate position is maintained. In addition, when shape | molding the long module 15 for LED attachment, the surface insulation part 60 is formed in one edge part (front-end part or rear-end part) of the conduction | electrical_connection board 17 using a metal mold | die, and after mold release A portion adjacent to the portion of the conductive plate 17 (a portion where the surface insulating portion 60 is not formed) is moved into the die by a transfer device installed around the die, and the surface insulating portion 60 is injected into the portion by injection molding. Form. And the surface insulation part 60 is formed in the whole conduction | electrical_connection board 17 by repeating this operation | work (injection molding) in multiple times.

As shown in the figure, a left side wall 61 and a right side wall 62 that extend in the front-rear direction, and a rear wall 63 that connects the rear ends of the left side wall 61 and the right side wall 62 are formed on the upper surface of the hardened surface insulating portion 60. An upper surface recess 64 extending in the front-rear direction is formed in a portion surrounded by the left side wall 61, the right side wall 62, and the rear wall 63.
On the bottom surface (upper surface) of the upper surface recess 64, a circular exposure hole 65 for exposing each cutting bridge 37, the first cathode side contact portion 28, a part of the large base portion 27, and the circuit design bridge 23 are provided. And the second cathode side contact portion 33 and the side edge portions of the small base portion 32 and the anode side contact portion 36 and the side edge portions of the small size base portion 35 are extended in the front-rear direction. An exposure hole 67 made of a long hole is formed. On the other hand, a circular exposure hole 68 for exposing each cutting bridge 20 and a circular exposure hole 69 for exposing each circuit design bridge 23 are formed on the lower surface of the surface insulating portion 60.
Further, on the bottom surface of the upper surface recess 64, a support that extends from between a pair of left and right exposure holes 67 to above the upper ends of the second cathode side contact portion 33 and the anode side contact portion 36 and has an engagement recess 71 on the upper surface. A protrusion 70 is provided (the rear part of the rearmost support protrusion 70 is integrated with the rear wall 63).
Further, a plurality of mounting grooves 73 (the same number as the first cathode side contact portions 28) are recessed downward on the upper surface of the left side wall 61. The planar shape of each mounting groove 73 is an elongated shape extending in the front-rear direction, and the lateral width thereof is substantially the same as the thickness of the fitting arm 42. Further, a connecting piece escape recess 74 and a pair of front and rear restraining projection relief recesses 75 are formed in the upper end surface of the right edge of the left side wall 61 (the inner part of each mounting groove 73). On the other hand, on the upper surface of the right side wall 62, the same number of mounting grooves 76 as the mounting grooves 73 and a holding arm escape groove 77 positioned immediately before the mounting groove 76 are both recessed downward. The planar shape of each attachment groove 76 is an elongated shape extending in the front-rear direction that is shorter than the attachment groove 73. Each holding arm escape groove 77 is a recess shallower than the mounting groove 76, its rear end communicates with the holding arm escape groove 77, and its front end is open. Further, a connection piece relief recess 78 is provided in the upper end surface of the left side edge portion (inner portion of each mounting groove 76) of the right side wall 62.

The retaining member 40 is attached to the hardened surface insulating portion 60. Before the retaining member 40 is attached, all of the parts except the circuit design bridge 23 located at the rearmost part are used by using the exposure holes 65, 66, 68, 69. The cutting bridge 20, the circuit design bridge 23, and the cutting bridge 37 are physically cut (see FIGS. 9 and 10).
Subsequently, the fitting arm 42 and the fitting protrusion 46 of the retaining metal fitting 40 are fitted into the attachment groove 73 and the attachment groove 76 of the surface insulating portion 60 from above, respectively, and the intermediate portion of the holding arm 48 against the holding arm escape groove 77. The top portion of the holding arm 48 is positioned in the upper surface recess 64. Then, the pair of locking projections 43 bite into the front and rear end surfaces of the corresponding mounting groove 73, and the pair of locking projections 47 bite into the front and rear end surfaces of the corresponding mounting groove 76. Fixed. Further, since the lateral width of the restraining arm escape groove 77 is larger than the thickness of the restraining arm 48, the restraining arm 48 can be elastically deformed in the lateral direction within the restraining arm escape groove 77. Further, both end portions of the connection piece 41 are fitted into the connection piece relief recess 74 and the connection piece relief recess 78, and the center portion of the connection piece 41 is fitted into the engagement recess 71. Further, the lower portions of the front and rear restraining projections 45 are positioned in the front and rear restraining projection relief recesses 75.

The LED module 10 is completed by attaching a plurality of (same number as the first cathode side contact portions 28) LED elements 80, which are semiconductor light emitting elements, to the LED mounting module 15 configured as described above.
The LED element 80 has a light emitting surface 81 on the upper surface, a pair of left and right anodes 82 on the front surface, a pair of left and right cathodes 83 on the rear surface, and a plane having one cathode (not shown) on the lower surface. This is a rectangular member.
When each LED element 80 is fitted from above into a space surrounded by the left side wall 61, the right side wall 62, and two adjacent support protrusions 70, as shown in FIGS. 15 and 17 to 20, The elastic deformation portions 34 of the pair of anode-side contact portions 36 positioned immediately before the LED elements 80 are in contact with the pair of anodes 82 while being slightly elastically deformed, and a pair of second electrodes positioned immediately after the LED elements 80. Since the elastic deformation part 34 of the cathode side contact part 33 contacts the pair of cathodes 83 while being slightly elastically deformed (the second cathode side contact part 33 and the anode side contact part 36 sandwich the LED element 80 in the front-rear direction). Each LED element 80 is positioned back and forth with respect to the LED mounting module 15. In addition, the LED element 80 is elastically deformed to the right side when the LED element 80 comes into contact with the inclined surface (the upper surface of the left side portion) formed on the holding protrusion 49 of each retaining bracket 40, and then the LED element 80 is lowered to a predetermined position. When the pressing arm 50 is elastically returned to the left side, the pressing portion 50 moves and urges the right side surface of the LED element 80 to the left side, and the left side surface of each LED element 80 is moved to the right side surface of the left side wall 61. Because of the surface contact, each LED element 80 is positioned to the left and right with respect to the LED mounting module 15. Further, the contact end portion 29 of the first cathode side contact portion 28 slightly elastically deformed downward contacts the cathode on the lower surface of each LED element 80 from below to urge the LED element 80 to move upward, and Since the left and right side edges of the upper surface of the LED element 80 are engaged with the restraining protrusion 45 and the restraining protrusion 49 from below, each LED element 80 is positioned vertically with respect to the LED mounting module 15.

The LED module 10 assembled in the above manner is fixed to a heat sink 85 (see FIG. 22) in which a metal plate is curved in an arc shape. Specifically, the conductive plate 17 and the surface insulating portion 60, both of which are flexible (elastic), are curved with substantially the same curvature as the heat sink 85, and the opposing surfaces of the LED module 10 and the heat sink 85 are brought into contact with each other. Fix both.
At this time, the conducting plate 17 may bend the first conducting portions 18A, 18B, 18C and the second conducting portion 22 itself, or may bend only the second conducting portion 22 to form the first conducting portions 18A, 18B, 18C itself may change the direction of the adjacent first conductive portions 18A, 18B, 18C without bending (surface insulating portion 60 facing the gap between the adjacent first conductive portions 18A, 18B, 18C. And the same front-rear position as the gap of the second conductive portion 22 are bent).
As a fixing means of the LED module 10 and the heat sink 85, for example, a latch (not shown) that can be engaged with the other member formed on one member of the LED module 10 and the heat sink 85, or the LED module 10 and the heat sink. Locking means that is a separate member from the plate 85 can be used.
In addition, through holes are formed at several locations on the surface insulating portion 60 when the surface insulating portion 60 is molded, and screw holes are formed at several locations on the heat radiating plate 85, and screws inserted into the through holes are inserted into the heat radiating plate 85. The LED module 10 and the heat radiating plate 85 may be fixed by screwing into the screw holes. In this case, it is important not to short-circuit the heat sink 85 and the screw.
Or it is also possible to fix the LED module 10 and the heat sink 85 using the adhesive agent, double-sided tape, etc. which have heat conductivity.
The first power supply portion 21 of the LED mounting module 15 is connected to the anode side of the power supply (not shown) and the second power supply portion 24 is connected to the cathode side of the power supply via a cable or the like not shown. When a switch (not shown) is turned on, a current flows from the power source to the LED module 10 via the cable. Therefore, as shown in the schematic diagram of FIG. 21, the current flows from the first power feeding unit 21 to the first conduction unit 18A. Current flows to the LED element 80 through the anode conduction part 26A, and further flows from the cathode conduction part 26B to the adjacent first conduction part 18B. Similarly, a current flows from the first conduction part 18B to the adjacent first conduction part 18B via the LED element 80, and from the first conduction part 18B located on the opposite side to the first conduction part 18A via the LED element 80. A current flows through the first conduction unit 18C, and a current flows from the first conduction unit 18C to the second conduction unit 22. Thus, since a series circuit is formed inside the LED module 10, each LED element 80 located on the series circuit emits light (see FIG. 22).

According to this embodiment described above, since a large number of LED elements 80 can be attached to one LED module 10, assembly and manufacture of the LED module 10 are easy. Furthermore, since each LED element 80 is located in the surface insulation part 60 (upper surface recessed part 64), the LED module 10 can be reduced in thickness.
Further, since the surface of the conductive plate 17 is covered with the surface insulating portion 60, the insulating property of the LED mounting module 15 is good.

Furthermore, each LED element 80 is attached to the LED mounting module 15 by sandwiching the LED element 80 between the second cathode side contact portion 33 and the anode side contact portion 36. Attachment to the module 15 is easy.
Further, since it is not necessary to perform reflow (since soldering is not performed), there is no possibility that each LED element 80 is damaged by heat.
Further, the second cathode side contact portion 33 and the anode side contact portion 36, which can be elastically deformed even when the LED mounting module 15 is bent, securely holds each LED element 80, so that each LED element 80 is used for LED mounting. It will not fall out of the module 15.
Further, since the second cathode side contact portion 33 and the anode side contact portion 36 can be elastically deformed and have excellent followability, even if the LED mounting module 15 is bent, each LED element 80 can be deformed. The resulting stress does not occur, and both the physical characteristics and light emission characteristics of each LED element 80 are maintained.
Further, since the resin surface insulating portion 60 has flexibility and can select a material or color (and color tone) having high reflectivity, and can be easily formed in an arbitrary shape, the periphery of the LED element 80 The loss of illumination light of each LED element 80 can be reduced by making the shape of the portion optimal. That is, the LED mounting module 15 itself can realize an optical design considering reflection and the like, and there is no need to install another member such as a reflector.

Further, most of the LED mounting module 15 is constituted by a metal conductive plate 17 having excellent thermal conductivity and rigidity (the thickness of the conductive plate 17 can be increased to some extent if necessary). It is covered with a surface insulating part 60 made of resin. In addition, since the entire LED element 80 as a heat source body faces each of the first conductive portions 18A, 18B, and 18C in the thickness direction of the conductive plate 17, the heat of the LED element 80 is easily transmitted to the conductive plate 17. Further, the anode conduction portion 26A and the cathode conduction portion 26B are portions that are in contact with the anode 82 and the cathode 83 of the LED element 80, and therefore are portions where the heat of the LED element 80 is particularly easily transmitted. 18A, 18B, 18C and the conductive plate 17 are opposed to each other in the thickness direction, and the small base portions 32, 35 that are adjacent to the anode conductive portions 26A and the cathode conductive portions 26B are in direct contact with the conductive plate 17, In addition, since the conduction plate 17 is located immediately below and in the immediate vicinity of the elastic deformation portion 34, the heat of the anode conduction portion 26 </ b> A and the cathode conduction portion 26 </ b> B is easily transmitted directly and indirectly to the conduction plate 17. Therefore, the LED mounting module 15 of the present embodiment efficiently transfers the heat generated by each LED element 80 from the anode conduction portion 26A and the cathode conduction portion 26B to the conduction plate 17, and the conduction plate 17 and the thin surface insulation. Heat can be efficiently radiated to the outside (for example, the heat radiating plate 85) through the portion 60. Therefore, since the temperature rise of the LED mounting module 15 and the LED element 80 can be suppressed, a decrease in the light emission efficiency of the LED element 80 can be prevented.
Further, since the contact 26 (the anode conduction part 26A and the cathode conduction part 26B) is a separate body from the conduction plate 17, a part of the first conduction parts 18A, 18B, and 18C is cut and raised to connect the anode conduction part 26A and the cathode conduction part 26B. There is no need to form holes or slits in the first conductive portions 18A, 18B, 18C as in the case of forming. Therefore, the area of the metal (conductive plate 17) can be increased compared to the case where the first conductive portion 18A, 18B, and 18C are partially cut and raised to form the anode conductive portion 26A and the cathode conductive portion 26B. The LED mounting module 15 has good heat dissipation.

Further, after forming the surface insulating portion 60 around the contact 26 manufactured as an integral body, the cutting bridge 37 is cut to separate the anode conducting portion 26A and the cathode conducting portion 26B from each other, so that the anode conducting portion 26A and the cathode conducting portion 26B are separated. Even if they are separated, there is no influence on the assembly tolerance to the conductive plate 17. Therefore, the insertion force of the LED element 80 with respect to the anode conduction part 26A and the cathode conduction part 26B and the holding force by the anode conduction part 26A and the cathode conduction part 26B can be stably reduced. Further, since it is not necessary to perform reflow, there is no possibility that each LED element 80 is damaged by heat.
Further, since each LED element 80 is arranged on the series circuit formed on the LED mounting module 15, the anode conduction part 26A, and the cathode conduction part 26B, it is possible to reduce the variation in luminance of each LED element 80. It is.

The first embodiment described above can be implemented in the form of a modified example described below.
For example, various types of circuits can be easily configured on the conductive plate 17 by slightly changing the shape of the conductive plate 17. 23 and 24 show an example in which a series circuit of a type different from the above embodiment is formed on the conduction plate 17, the anode conduction part 26A, and the cathode conduction part 26B.
The conductive plate 17 ′ of this modified example does not include the second conductive portion 22 and the circuit design bridge 23 (from the time of manufacture), and the first conductive portion 18 </ b> C is symmetrical with the first power feeding portion 21. A second power feeding unit 21A is provided so as to protrude.
In the case of manufacturing the LED module 10 using the conductive plate 17 ′ of this modification, the surface insulating portion 60 is mounted on the conductive plate 17 ′ in the same manner as described above after each contact 26 is mounted on the conductive plate 17 ′. And end portions of the first power supply unit 21 and the second power supply unit 21 </ b> A are exposed to the outside of the surface insulating unit 60. Next, all the cutting bridges 20 and the cutting bridges 37 are cut using the exposure holes 65, and the retaining bracket 40 is attached to the surface insulating portion 60 to constitute the LED mounting module 15. The element 80 is attached to complete the LED module 10 (the LED attachment module 15 and the LED module 10 are not shown).
The LED module 10 of this modification can also be fixed to the heat sink 85 after being bent. Then, the first power supply unit 21 is connected to the anode side of the power source and the second power supply unit 21A is connected to the cathode side of the power source via a cable or the like that is not illustrated, and the main switch that is not illustrated is turned on. Then, as shown in the schematic diagram of FIG. 23, since a series circuit is formed on the conduction plate 17 ′, the anode conduction part 26A, and the cathode conduction part 26B, each LED element 80 emits light.

  Further, a fitting recess (not shown) whose upper surface is closed and in which the anode 82 and the cathode 83 are respectively fitted is formed in the elastic deformation portion 34 of the second cathode side contact portion 33 and the anode side contact portion 36, You may implement | achieve the upward direction prevention of the LED element 80. FIG.

  Further, the conductive plate 17 may be made of a metal material other than the above that is excellent in conductivity, thermal conductivity, and heat dissipation, and the contact 26 may be made of a metal material other than phosphor bronze that is excellent in elasticity and conductivity. Further, the conductive plate 17 and the contact 26 may be integrally formed of a metal material that is excellent in conductivity, elasticity, and heat dissipation.

  Next, a second embodiment of the present invention will be described with reference to FIGS.

First, a detailed structure of the LED module 110 that can be bent (can be bent) will be described with reference to FIGS. 25 to 38. In addition, for the sake of space, the LED module 110 in the following description has five LED elements 160 mounted thereon, but in reality, the number of LED elements 160 corresponding to the size of the LED lighting apparatus 100 can be mounted.
The LED module 110 is obtained by attaching an LED element 160 and a diffusion lens 164 to an LED attachment module 115.
The LED mounting module 115 includes a conductive plate 117 serving as a base material, and the conductive plate 117 includes a base plate portion 120, an anode piece 139, and a cathode piece 143.
The base plate portion 120 shown in FIGS. 35 and 36 has a long shape extending in the front-rear direction obtained by stamping and molding a metal flat plate having conductivity and elasticity (flexibility) such as brass, phosphor bronze, iron, and aluminum. It is a member. The base plate 120 is roughly divided into an anode half 121 that forms the left half and a cathode half 122 that forms the right half, and the base plate 120 has a point-symmetric shape with respect to its center point. The anode half 121 and the cathode half 122 are connected to each other by a total of ten cutting bridges 123 and a total of eight circuit design bridges 124. Both front and rear ends of the anode half 121 constitute an anode-side power feeding part (first feeding part) 125, and both front and rear ends of the cathode half 122 constitute a cathode-side feeding part (second feeding part) 126. Yes. A portion excluding the anode side power feeding portion 125 before and after the anode half portion 121 is divided into a total of five anode side conduction portions (first conduction portions) 128 that are separated from each other. Further, a first gripping piece (fixed piece) 130 is projected upward from each anode-side power feeding section 128 by cutting and raising. A portion excluding the cathode side power feeding portion 126 before and after the cathode half portion 122 is divided into a total of five cathode side conduction portions (second conduction portions) 132 that are separated from each other. Further, a second grip piece (fixed piece) 134 is projected upward from each cathode side conducting portion 132 by cutting and raising. Further, the base plate portion 120 has four through holes 135 that straddle the anode half 121 and the cathode half 122 and are positioned between the pair of circuit design bridges 124.
As shown in the figure, the base plate portion 120 has an LED fixing portion (semiconductor light emitting element fixing portion) 136 (a portion on the anode half portion 121 side on the left side) that is wider than the other portions at regular intervals at five positions in the longitudinal direction. A half portion, and a portion on the cathode half portion 122 side constitutes a right half portion). Each LED fixing portion 136 has a circular through-positioning hole 137 formed in the anode half 121 side portion and the cathode half portion 122 side portion.

  As shown in FIG. 38 and the like, the anode side power feeding portion 128 of each LED fixing portion 136 has an anode piece (first contact portion) (first contact piece) 139 made of an elastic metal material such as phosphor bronze. Is on. The anode piece 139 is in contact with the LED fixing portion 136 (anode half portion 121) and fixed to the LED fixing portion 136 by caulking, welding, or the like, and a substantially rectangular fixing portion 140 extending from the fixing portion 140 obliquely upward to the front. And a cantilevered elastic deformation portion 141 spaced upward from the fixing portion 136 (anode half 121). As shown in the figure, the elastic deformation portion 141 is located on the right side of the first grip piece 130 formed on the same LED fixing portion 136, and the elastic deformation portion 141 has a connection portion (base end portion) with the fixing portion 140. It can be elastically deformed in the vertical direction around the center. In addition, a cathode piece (second contact portion) (second contact piece) 143 of the same material and shape as the anode piece 139 is placed on the cathode side conduction portion 132 of each LED fixing portion 136. The cathode piece 143 contacts the LED fixing portion 136 (cathode half 122) and is fixed to the LED fixing portion 136 by caulking, welding, or the like, and a substantially rectangular fixing portion 144 extending rearward and obliquely upward from the fixing portion 144. And an elastic deformation portion 145 spaced upward from the fixing portion 136 (cathode half portion 122). As shown in the drawing, the elastic deformation portion 145 is located immediately on the left side of the second grip piece 134 formed on the same LED fixing portion 136, and the elastic deformation portion 145 has a connection portion (base end portion) with the fixing portion 144. It can be elastically deformed in the vertical direction around the center.

The surface of the conductive plate 117 (base plate portion 120, anode piece 139, cathode piece 143) having the above configuration is covered with a resin (for example, PBT, LCP, nylon, etc.).
When coating with this resin (outsert molding), all the cutting bridges 123 and the circuit design bridges 124 of the base plate part 120 were connected and protruded into a mold (not shown). The through positioning holes 137 of the anode half 121 and the cathode half 122 are fitted to the positioning pins, and the base plate 120 (the anode half 121 and the cathode half 122) is supported in a positioned state. Next, the base plate 120 is fixed by clamping the mold, and the resin is poured into the cavity of the mold. When the resin cools and cures in the cavity, the base plate 120 and the integrally cured resin material are separated from the mold. Then, as shown in FIGS. 30 to 32, a surface insulating portion 148 made of the resin is formed on almost the entire surface of the base plate portion 120. At this time, each anode-side power feeding section 128 and cathode-side conducting section 132 are connected by the cutting bridge 123 and the circuit design bridge 124, so that the conducting plate 117 is not scattered or displaced in the mold. Absent. When the long LED mounting module 115 is molded, a surface insulating portion 148 is formed on one end portion of the conductive plate 117 using a mold, and is installed around the mold after the mold is released. A portion adjacent to the portion of the conductive plate 117 (a portion where the surface insulating portion 148 is not formed) is moved into the mold by the transfer device, and the surface insulating portion 148 is formed in the portion. Then, the surface insulating portion 148 having elasticity (flexibility) is formed on the entire conductive plate 117 by repeating this operation a plurality of times.

As shown in FIGS. 29 to 31, the surface insulating portion 148 does not cover the tips of the anode-side power feeding portion 125 and the cathode-side power feeding portion 126. The surface insulating portion 148 includes a central hole 149 for exposing the first gripping piece 130, the second gripping piece 134, the elastic deformation portion 141, and the elastic deformation portion 145 in a portion covering the upper surface of each LED fixing portion 136. ing. On the other hand, the fixing part 140 of the anode piece 139 and the fixing part 144 of the cathode piece 143 are covered with a surface insulating part 148. In addition, the portion corresponding to each LED fixing portion 136 on the upper surface of the surface insulating portion 148 has a circular outer shape and is thicker than the peripheral portion. It is an inclined surface (supporting part) 156 for supporting. The surface insulating portion 148 has the same number of molding holes 150 as the through-positioning holes 137 formed by extracting the positioning pins from the through-positioning holes 137 after molding. Further, the surface insulating portion 148 has a total of eight exposed holes (exposed portions) 151 that expose the upper surface of each LED fixing portion 136 in a portion covering the upper surface of each LED fixing portion 136, and the lower surface of each LED fixing portion 136. A total of four exposure holes 151 for exposing the lower surface of each LED fixing portion 136 are provided in a portion covering the LED. Furthermore, since the surface insulating portion 148 has cutting holes 152 for exposing the cutting bridges 123 vertically on both the upper and lower surfaces, all of the cutting holes 152 are used after the surface insulating portion 148 is formed. The cutting bridge 123 is physically cut (the cutting bridge 123 is divided into two parts and separated from each other). An exposure hole (exposed portion) 153 for exposing the base end portions of the first gripping piece 130 and the second gripping piece 134 is formed on the lower surface of the surface insulating portion 148. Further, a circular hole 154 and a long hole 155 which are smaller than the through hole 135 are formed in a portion corresponding to each through hole 135. The circular hole 154 and the long hole 155 can be used as a screwing hole or a locking hole for fixing the LED module 110 to a chassis of an application (device to which the LED module 110 is attached) or a heat sink.
The conductive plate 117 (base plate portion 120, anode piece 139, cathode piece 143) and surface insulating portion 148 described above are components of the LED mounting module 115.

The LED module 110 is configured by attaching a total of five LED elements (semiconductor light emitting elements) 160 and diffusing lenses 164 to the LED attachment module 115 comprising the conductive plate 117 and the surface insulating portion 148.
The LED element 160 includes a rectangular substrate 161 having an anode and a cathode (both not shown) on the lower surface, and an LED 162 connected to the anode and cathode supported by the substrate 161. When each LED element 160 is inserted into the central hole 149 of the corresponding LED fixing portion 136 and the substrate 161 is clamped between the first gripping piece 130 and the second gripping piece 134 (at this time, the first gripping piece 130 and the second gripping piece The grip piece 134 is slightly elastically deformed in a direction away from each other), the anode formed on the lower surface of the substrate 161 is in contact with the elastic deformation portion 141 of the anode piece 139, and the cathode is in contact with the elastic deformation portion 145 of the cathode piece 143. Then, a part of each LED element 160 is enclosed by the corresponding central hole 149 (located in the central hole 149, see FIG. 32). Since the LED element 160 has polarity, an erroneous insertion key may be formed in the central hole 49 or a recognition mark may be stamped on the upper surface of the LED fixing portion 136.
Furthermore, a diffuser lens 164 having a back concave portion 165 at the center of the lower surface is fixed to the surface insulating portion 148 by adhesion or the like. As shown in FIG. 26, the annular inclined surface formed on the peripheral surface of the back recess 165 is positioned by fitting (surface contact) with the support portion 156 of the surface insulating portion 148, and when the diffusion lens 164 is fixed, the back recess The LED element 160 is located in 165 (the LED element 160 is located immediately below the bottom surface of the back recess 165).

As in the first embodiment (FIG. 22), the LED module 110 assembled in the above manner has a conductive plate 117 and a surface insulating portion 148, both of which are flexible (elastic), with substantially the same curvature as the heat sink 85. It can be fixed to the heat sink 85 by bending. Adhesives, double-sided tape, screws, or the like can be used as fixing means for the heat sink 85. When using screws, screws inserted into the circular holes 154 and the long holes 155 are screwed into the screw holes of the heat sink 85. .
Then, via a cable (not shown) or the like, the anode side power feeding portion 125 of the LED mounting module 115 is connected to the anode side of the power source (not shown) and the cathode side power feeding portion 126 is connected to the cathode side of the power source. When a switch (not shown) is turned on, a current flows from the power source to the LED module 110 via the cable. As shown in FIG. 37, on the upper surface of the conductive plate 117 of the present embodiment, the anode-side power feeding unit 128 and the cathode-side conductive unit 132 formed on the same LED fixing unit 136 are the anode piece 139, the cathode piece 143, and the LED element. The anode-side power supply unit 128 and the cathode-side conductive unit 132 formed on the LED fixing unit 136 adjacent to the LED fixing unit 136 on which the anode-side power supply unit 128 is formed are electrically connected to each other. Since the electrical connection is established via the circuit design bridge 124, a series circuit is formed on the upper surface of the conductive plate 117. Therefore, when a current flows through the LED module 110, each LED 162 located on the series circuit emits light. The illumination light emitted from the LED 162 travels upward while being diffused by each diffusion lens 164.

According to the present embodiment described above, the LED mounting module 115 (LED module 110) can be thinned because it can be attached to a single conductive plate 117 in a form that includes a part of a large number of LED elements 160. In addition, it is easy to assemble and manufacture, and the process of assembling the LED module 110 into the LED lighting apparatus 100 can be reduced, so that productivity is good.
Further, since the surface of the conductive plate 117 is covered with the surface insulating portion 148, the insulating property of the LED mounting module 115 is good. Furthermore, since the base plate portion 120 is made of a single plate material and the surface thereof is covered with the surface insulating portion 148, the LED mounting module 115 has great rigidity.

Further, each LED element 160 is attached to the LED mounting module 115 by sandwiching the LED element 160 between the first gripping piece 130 and the second gripping piece 134, and thus the LED mounting module 115 of each LED element 160. Is easy to mount. Further, since it is not necessary to perform reflow (because soldering is not performed), there is no possibility that each LED element 160 is damaged by heat.
In addition, since the elastic deformation portion 141 (anode piece 139) and the elastic deformation portion 145 (cathode piece 143) that can be elastically deformed even when the LED mounting module 115 is bent, each LED element 160 is securely clamped. The element 160 is not dropped from the LED mounting module 115.
Furthermore, the elastic deformation portion 141 (anode piece 139) and the elastic deformation portion 145 (cathode piece 143) are elastically deformable and have excellent followability. Therefore, even if the LED mounting module 115 is bent, the LED mounting is performed on each LED element 160. The stress caused by the deformation of the module 115 does not occur, and both the physical characteristics and the light emission characteristics of the LED elements 160 are maintained.
Furthermore, since the resin surface insulating portion 148 has flexibility and can select a material and color (and color tone) having high reflectivity, and can be easily formed into an arbitrary shape, the periphery of the LED element 160 The loss of the illumination light of each LED element 160 can be reduced by making the shape of the portion optimal. That is, the LED mounting module 115 itself can realize an optical design in consideration of reflection and the like, and there is no need to install another member such as a reflector.

  Furthermore, it is possible to efficiently flow the heat of the LED element 160 to the conduction plate 117 through the first holding piece 130 and the second holding piece 134, and the base plate is formed by a metal material that is a material having excellent thermal conductivity and heat dissipation. The area and thickness of the portion 120 can be increased, and the heat transmitted to the conduction plate 117 can be radiated to the outside through the exposed holes 151 and 53 and the thin surface insulating portion 148. Excellent. Therefore, the heat generated by each LED element 160 can be efficiently radiated to the outside through the conduction plate 117 and the thin surface insulating portion 148.

  In addition, since each LED element 160 is arranged on a series circuit formed on the conduction plate 117, it is possible to reduce the variation in luminance of each LED element 160.

In addition, since the conductive plate 117 is formed by phosphor bronze having excellent spring properties, only the first grip piece 130 and the second grip piece 134 which are members for supporting the LED element 160 are manufactured. Cost can be reduced.
Further, since the base plate portion 120 is thin (narrow) except for the LED fixing portion 136 that mainly exhibits a heat dissipation effect, the conductive plate 117 and the surface insulating portion 148 are reduced in weight, and the LED mounting module. The manufacturing cost of 115 can be reduced.
Further, since the surface insulating portion 148 has the support portion 156 for fixing the LED element 160, the diffusion lens 164 can be positioned at an appropriate position with respect to the LED mounting module 115. Further, since the diffusing lens 164 having a diffusing function can be disposed in the immediate vicinity of the LED element 160, the light emitted from the LED element 160 can be efficiently diffused, and the entire LED mounting module 115 including the diffusing lens 164 can be reduced in height.

Furthermore, various types of circuits can be easily configured on the conductive plate 117 by changing the type (position) of the bridge formed on the base plate portion 120 during the stamping molding.
For example, FIGS. 40 and 41 show an example in which a parallel circuit is formed on the conductive plate 117. The conductive plate 117 of this modification is formed with an anode bridge 129 that connects adjacent anode-side power feeding portions 128 and a cathode bridge 133 that connects adjacent cathode-side conductive portions 132 by the stamping molding. On the other hand, there is no circuit design bridge 124. When the LED element 160 is attached to such a conductive plate 117 (each cutting bridge 123 is physically cut after the surface insulating portion 148 is formed), the adjacent anode-side power feeding portions 128 are connected to each other as shown in FIG. 129 are electrically connected to each other, adjacent cathode-side conductive portions 132 are electrically connected to each other via the cathode bridge 133, and the anode-side power feeding portion 128 formed on the same LED fixing portion 136 is connected to the cathode side. Since the conducting part 132 is electrically conducted by the anode piece 139, the cathode piece 143, and the LED element 160, a parallel circuit is formed on the upper surface of the conducting plate 117. For this reason, even if one LED element 160 is damaged, the other LED elements 160 remain in a state capable of emitting light, which is suitable for use in equipment (such as lighting fixtures) that requires light emission life and reliability. .

Further, FIG. 42 shows an example in which a parallel circuit of a type different from those of FIGS. 40 and 41 is formed on the conductive plate 117. The conductive plate 117 of this modification differs from the conductive plate 117 of FIG. 40 in that only the cutting bridges 123 located at one end (rear end in the figure) are left without being cut. If this parallel circuit is formed on the conductive plate 117, the same effect as that of the parallel circuit of FIGS. 40 and 41 can be obtained with fewer wires than the case of forming the parallel circuit of FIGS. it can. When this parallel circuit is formed, the cutting bridge 123 is connected between the anode-side power feeding portion 128 and the cathode-side conducting portion 132 formed on the LED fixing portion 136 on one end side of the base plate portion 120 by stamping. All of the disconnecting bridges 123 may be physically disconnected after being connected by another bridge.
Note that all bridges (cutting bridge 123, circuit design bridge 124, anode bridge 129, cathode bridge 133) are formed on the base plate portion 120 by stamping, and then any one of the bridges is selectively physically selected. An arbitrary electric circuit may be formed on the conductive plate 117.

Although the present invention has been described based on the above embodiment, the present invention can be implemented in various modes different from the above embodiment.
For example, the base plate portion 120 is made of a metal material other than the above that is excellent in conductivity, thermal conductivity, and heat dissipation, and the anode piece 139 and the cathode piece 143 are made of a metal material other than phosphor bronze that is excellent in elasticity and conductivity. It may be configured. Further, the base plate portion 120, the anode piece 139, and the cathode piece 143 may be integrally formed by configuring the entire conductive plate 117 with a metal material that is excellent in conductivity, elasticity, and heat dissipation.

Further, a notch or the like for exposing the conductive plate 117 may be formed in the surface insulating portion 148 instead of the exposure hole 151.
Further, the number of LED fixing portions 136 formed on one base plate portion 120 (the number of LED elements 160 and diffusing lenses 164 that can be attached to one LED attachment module 115), and the LEDs included in one LED lighting device 100 are provided. The number of modules 110 is not limited to that of the above embodiment.

  Further, in any embodiment, an annular body (for example, an annular shape) is configured using one or a plurality of LED modules 10 and 110, and the LED elements 80 and 160 are directed toward the inner peripheral side or the outer peripheral side of the annular body. You may make it light-emit.

10 LED module (semiconductor light-emitting element module)
15 LED mounting module (semiconductor light emitting device mounting module)
17 17 'Conducting plate 18A 18B 18C First conducting portion 19 Positioning protrusion 20 Cutting bridge (bridge)
21 1st electric power feeding part 21A 2nd electric power feeding part 22 2nd conduction | electrical_connection part 23 cutting bridge (bridge)
24 Second power feeding portion 26 Contact 26A Anode conducting portion 26B Cathode conducting portion 27 Large base portion 28 First cathode side contact portion 29 Contact end portion 30 Side edge recess portion 31 Positioning hole 32 Small size base portion 33 Second cathode side contact portion 34 Elasticity Deformation part 35 Small base part 36 Anode side contact part 37 Cutting bridge 40 Detachment fitting 41 Connection piece 42 Fitting arm 43 Locking protrusion 44 Holding part 45 Holding protrusion 46 Fitting protrusion 47 Locking protrusion 48 Holding arm 49 Holding protrusion 50 Pressing part 60 Surface insulating part 61 Left side wall 62 Right side wall 63 Rear part wall 64 Upper surface recess 65 66 67 68 69 Exposed hole 70 Supporting protrusion 71 Engaging recess 73 Mounting groove 74 Connection piece escape recess 75 Suppression protrusion escape recess 76 Attachment groove 77 Retaining arm relief groove 78 Connection piece relief recess 80 LED element (semiconductor light emitting element)
81 Light Emitting Surface 82 Anode 83 Cathode 85 Heat Dissipation Plate 110 LED Module (Semiconductor Light Emitting Element Module)
115 LED mounting module (semiconductor light emitting device mounting module)
117 conductive plate 120 base plate portion 121 anode half portion 122 cathode half portion 123 cutting bridge 124 circuit design bridge 125 anode side feeding portion (first feeding portion)
126 Cathode side feeding part (second feeding part)
128 Anode-side conduction part (first conduction part)
129 Anode bridge 130 First grip piece (fixed piece)
132 Cathode side conduction part (second conduction part)
133 Cathode bridge 134 Second grip piece (fixed piece)
135 Through-hole 136 LED fixing part (semiconductor light emitting element fixing part)
137 Through-positioning hole 139 Anode piece (contact) (first contact portion) (first contact piece)
140 Fixing part 141 Elastic deformation part 143 Cathode piece (contact) (second contact part) (second contact piece)
144 Fixing part 145 Elastic deformation part 148 Surface insulating part 149 Central hole 150 Molding hole 151 Exposed hole (exposed part)
152 Cutting hole 153 Exposed hole (exposed part)
154 Circular hole 155 Long hole 156 Support part 160 LED element (semiconductor light emitting element)
161 Substrate 162 LED
164 Diffuse lens 165 Back concave portion

Claims (23)

A conductive plate made of metal;
A metal contact in contact with the conductive plate;
A surface insulating portion made of a resin material covering the surfaces of the conductive plate and the contact;
A module for mounting a semiconductor light emitting device comprising:
The conductive plate is
A plurality of first conductive portions arranged in one direction apart from each other;
A first power feeding unit and a second power feeding unit respectively conducting with the first conducting unit located at both ends in the one direction;
Have
The above contact
A cathode side contact portion provided at least one for each first conduction portion, one end of which is in contact with the first conduction portion and the other end is an elastically deformable portion capable of conduction with the cathode of the semiconductor light emitting device. When,
One end is in contact with the first conducting portion, and the other end is an elastically deformable portion capable of conducting with the anode of the semiconductor light emitting element in which the cathode is conducted to the cathode side contact portion of the adjacent first conducting portion. An anode side contact portion provided at least one for each first conducting portion;
Have
The surface insulating portion is flexible, and the cathode-side contact portion and the anode-side contact portion are elastically deformable portions, the first conducting portion is opposed to the semiconductor light emitting element, and the first Exposing a part of the 1 power feeding part and the second power feeding part,
The module for mounting a semiconductor light emitting element, wherein the entire elastic deformation portion of the cathode side contact portion and the anode side contact portion opposes the first conducting portion in the thickness direction of the conducting plate. In the semiconductor light emitting element mounting module according to claim 1,
The conductive plate includes a second conductive portion provided side by side with the first conductive portion and connected to the first conductive portion located at one end in the one direction,
A module for mounting a semiconductor light emitting element, wherein an end of the second conducting portion on the same side as the first feeding portion constitutes the second feeding portion. In the semiconductor light emitting element mounting module according to claim 1 or 2,
A module for mounting a semiconductor light emitting element, wherein at least one of the first conducting portion and the second conducting portion is flexible. In the semiconductor light emitting element mounting module according to any one of claims 1 to 3,
A module for mounting a semiconductor light emitting element, wherein the whole cathode side contact portion and the whole anode side contact portion face each other in the thickness direction of the first conduction portion and the conduction plate. In the semiconductor light emitting element mounting module according to any one of claims 1 to 4,
A module for mounting a semiconductor light emitting device, wherein the entire semiconductor light emitting device faces the first conducting portion in the thickness direction of the conducting plate. In the semiconductor light emitting element mounting module according to any one of claims 1 to 5,
A module for mounting a semiconductor light emitting device, comprising a contact separate from the first conducting portion and having the cathode side contact portion and the anode side contact portion. In the semiconductor light emitting element mounting module according to any one of claims 1 to 6,
The cathode-side contact portion and the anode-side contact portion that are in contact with the different first conducting portions and sandwich the semiconductor light-emitting element, and the cathode-side contact portion and the anode-side contact portion that can be connected and disconnected A semiconductor light emitting element mounting module comprising a contact having a bridge. The semiconductor light emitting element mounting module according to any one of claims 1 and 3 to 7 depending on claim 1,
A module for mounting a semiconductor light emitting element, wherein adjacent first conductive portions are connected by a bridge that can be physically cut. In the semiconductor light-emitting element mounting module according to any one of claims 2 and 3 to 7 depending on claim 2,
A semiconductor light emitting element mounting module in which the first conductive parts adjacent to each other and each first conductive part and the second conductive part are connected by a physically disconnectable bridge. In the semiconductor light emitting element mounting module according to any one of claims 1 to 9,
A module for mounting a semiconductor light emitting device, comprising: a metal fitting that is attached to the surface insulating portion and that includes a metal fitting that restricts the cathode side contact portion and the anode side contact portion from separating in the thickness direction of the conductive plate. A module for mounting a semiconductor light emitting device according to any one of claims 1 to 10,
A semiconductor light emitting element in which the anode and the cathode thereof are electrically connected to the cathode side contact part and the anode side contact part of the semiconductor light emitting element mounting module;
A semiconductor light-emitting element module comprising: A base plate made of metal,
A metal contact in contact with the base plate,
A surface insulating portion made of a resin material covering the surface of the base plate portion and the contact;
A module for mounting a semiconductor light emitting device comprising:
The base plate part is
A plurality of semiconductor light-emitting element fixing portions each provided with a first conduction portion and a second conduction portion, arranged side by side in one direction;
A first power feeding unit and a second power feeding unit respectively conducting with the first conducting unit and the second conducting unit located at both ends;
Have
The above contact
One end is in contact with each of the first conduction portion and the second conduction portion, and the other end has a first contact portion and a second contact portion that are respectively conductive and elastically deformable with the anode and the cathode of the semiconductor light emitting device,
The surface insulating portion has flexibility, and the other end of the first contact portion and the second contact portion, a portion of the semiconductor light emitting element fixing portion facing the semiconductor light emitting element, and the first contact A module for mounting a semiconductor light emitting element, wherein the first power feeding portion and the second power feeding portion are exposed. The module for mounting a semiconductor light emitting element according to claim 12,
A module for mounting a semiconductor light emitting device, wherein the semiconductor light emitting device fixing portion has flexibility. In the semiconductor light emitting element mounting module according to claim 12 or 13,
In the semiconductor light emitting element fixing portion, a pair of fixing pieces that can be fixed in a state where the semiconductor light emitting element is sandwiched are provided,
A module for mounting a semiconductor light emitting element, wherein the surface insulating portion exposes the fixed piece. In the semiconductor light emitting element mounting module according to any one of claims 12 to 14,
All the first conducting parts separated from each other can be conducted with the second conducting part of the same semiconductor light emitting element fixing part as the other, and the other semiconductor is located on one side in the longitudinal direction of the base plate part A semiconductor light emitting element mounting module connected to the second conducting part of the light emitting element fixing part. In the semiconductor light emitting element mounting module according to any one of claims 12 to 14,
Connecting all the first conducting parts to each other;
Connecting all the second conductive parts to each other;
Separating the first conducting portion and the second conducting portion from each other;
A module for mounting a semiconductor light emitting element, wherein the first conductive part is electrically connectable with the second conductive part of the same semiconductor light emitting element fixing part. In the semiconductor light emitting element mounting module according to any one of claims 12 to 14,
Connecting all the first conducting parts to each other;
Connecting all the second conductive parts to each other;
Only the first conduction part and the second conduction part of the semiconductor light emitting element fixing part located on one end side of the base plate part are connected to each other,
A module for mounting a semiconductor light emitting element, wherein the first conductive part is electrically connectable with the second conductive part of the same semiconductor light emitting element fixing part. In the semiconductor light emitting element mounting module according to any one of claims 12 to 17,
The first contact portion and the second contact portion are
The semiconductor light-emitting element fixing part is made of a metal that is separate and elastic, one end is in contact with the first conducting part and the second conducting part, and the other end is spaced from each semiconductor light-emitting element fixing part. A module for mounting a semiconductor light emitting device, which is a first contact piece and a second contact piece that can be electrically connected to an anode and a cathode of the light emitting device, respectively. The semiconductor light emitting element mounting module according to any one of claims 12 to 18,
The semiconductor light emitting element mounting module, wherein the semiconductor light emitting element fixing portion is wider than other portions of the base plate portion. The semiconductor light emitting element mounting module according to any one of claims 12 to 19,
A module for mounting a semiconductor light emitting element, wherein an exposed portion for exposing a part of the base plate portion is formed on the surface insulating portion. The semiconductor light emitting element mounting module according to any one of claims 12 to 20,
A module for mounting a semiconductor light emitting element, wherein the first conductive part and the second conductive part of the same semiconductor light emitting element fixing part as the first conductive part are connected by a physically disconnectable cutting bridge. In the semiconductor light emitting element mounting module according to any one of claims 12 to 21,
A module for mounting a semiconductor light emitting device, wherein a support portion for supporting a diffusion lens for diffusing light emitted from the semiconductor light emitting device is formed on the surface insulating portion. A module for mounting a semiconductor light emitting device according to any one of claims 12 to 22,
A semiconductor light emitting element in which an anode and a cathode thereof are electrically connected to the first contact portion and the second contact portion of the semiconductor light emitting device mounting module;
A semiconductor light-emitting element module comprising: