KR101282725B1 - Module for Mounting LED And LED Module - Google Patents

Abstract

The present invention has good heat dissipation, and there is little possibility of short-circuit even when a conductive member such as a heat sink is disposed in close proximity, and a semiconductor light emitting element attachment module and semiconductor which can be easily attached to the side of the liquid crystal panel unit. It is to provide a light emitting device module.
According to the present invention, a metal conductive plate (17) having an anode (58) and a cathode (59) of a semiconductor light emitting element (57) and a cathode side terminal (21) and a cathode side terminal (25) which can be connected to each other are formed on one surface thereof. ) And the surface insulating portion 37 covering the surfaces of the conductive plate and the heat radiating member while the metal heat radiating member 45 and at least a part of the heat radiating member, the positive electrode terminal and the negative electrode terminal are exposed to each other. , 50),
The surface insulating portion is provided with a pair of sandwiching pieces 51A, 51B protruding to face each other with an anode side terminal and a cathode side terminal formed on one surface of the conductive plate therebetween.

Description

Module for semiconductor light emitting device attachment and semiconductor light emitting device module {Module for Mounting LED And LED Module}

The present invention relates to a semiconductor light emitting device attachment module and a semiconductor light emitting device module to which a semiconductor light emitting device (LED) can be attached.

In recent years, lighting fixtures using LEDs (semiconductor light emitting elements) have been used in various fields such as indoor lighting fixtures and backlights for liquid crystal monitors.

Lighting fixtures using LEDs generally have a plurality of circuit boards (rigid boards) mounted with one or a plurality of LEDs on one side in a line (linear or planar) with a plurality of side by side electrical connectors. It is comprised by connecting to (for example, patent documents 1-4).

<Patent Document 1> Japanese Patent Application Publication No. 2010-525523 <Patent Document 2> Japanese Patent Application Publication No. 2010-505232 <Patent Document 3> Japanese Unexamined Patent Publication No. 2010-62556 <Patent Document 4> Japanese Patent Application Laid-Open No. 2010-98302

However, since the circuit boards (rigid boards) used in Patent Literatures 1 to 4 cannot be said to have good heat dissipation, the lighting equipment of Patent Literatures 1 to 4 cannot efficiently radiate heat generated from LEDs.

In addition, an electrically conductive portion (for example, a circuit pattern) is exposed on the surface of the circuit board. For this reason, if a heat sink made of metal for absorbing heat of the luminaire or an inner surface of the metal frame housing the luminaire is disposed near these luminaires, a short circuit may occur between the heat sink or the metal frame and the luminaire. There is concern.

In addition, since the heat sink can not be approached to the lighting fixture, when the heat sink is used, sufficient heat dissipation effect cannot be obtained.

In addition, it is easy to fix the luminaire to the side of the liquid crystal panel unit with good accuracy when fixing the luminaire to the side of the liquid crystal panel unit, which is a stack of the liquid crystal panel, the light guide plate and the reflecting plate, and incident light from the side of the dimming plate. Did not. When the adhesion accuracy was lowered, sufficient light did not enter the light guide plate, resulting in a decrease in brightness or a spot of brightness.

An object of the present invention is to provide a semiconductor light emitting element attachment module which has good heat dissipation and is less likely to short-circuit even when a conductive member such as a heat sink is disposed in close proximity, and is highly accurate and easily attached to the side of the liquid crystal panel unit. And a semiconductor light emitting device module.

The module for attaching a semiconductor light emitting device of the present invention includes a metal conduction plate formed on one side of an anode side terminal and a cathode side terminal connectable to an anode and a cathode of a semiconductor light emitting element, and a metal heat dissipation member spaced apart from the conducting plate; And a surface insulating portion covering the surfaces of the conductive plate and the heat radiating member in a state where at least a portion of the heat radiating member, the positive electrode terminal, and the negative electrode terminal are exposed, wherein the surface insulating portion has one surface of the conductive plate. A pair of sandwiching pieces protruding to face each other with an anode side terminal and a cathode side terminal formed on the surface thereof is provided.

The surface insulating portion may expose a part of the heat dissipation member from the one side, and may expose a part different from the part of the heat dissipation member from the part different from the one side.

A pair of connecting terminals electrically connected to the positive terminal and the negative terminal and the surface insulating portion exposing the connecting terminals, the connecting terminals being connectable to the connecting terminals of other semiconductor light emitting element attachment modules, Also good.

In this case, the conductive plate and the connection terminal may be separate.

The conducting plate is a plate extending linearly, and the connecting terminals may be provided at both ends in the longitudinal direction of the conducting plate.

The conductive plate may include a plurality of pairs of the positive electrode terminal and the negative electrode terminal.

The semiconductor light emitting device module according to the present invention includes a semiconductor light emitting device for attaching the semiconductor light emitting device attachment module, a semiconductor light emitting device having its anode and cathode connected to the anode side terminal and the cathode side terminal, and the anode, the anode side terminal, and the cathode; It is characterized by including a wire bonding for connecting the cathode-side terminals, respectively.

The surface of the semiconductor light emitting element and the wire bonding may be covered with a sealing agent made of a light transmitting resin.

According to the present invention, since the heat dissipation member having excellent thermal conductivity and rigidity is located in the vicinity of the semiconductor light emitting device (LED) and exposed to the outer surface of the module for attaching the semiconductor light emitting device, the heat generated from the LED is efficiently transmitted through the heat dissipation member. Good heat dissipation to the outside. In addition, since the heat sink can be brought close to the semiconductor light emitting element attachment module (semiconductor light emitting element module), the heat radiation plate can be more effectively obtained by using the heat sink.

In addition, since the entire conductive plate except for the positive terminal and the negative terminal is covered with a surface insulating part made of resin, the heat of the LED is efficiently received and dispersed by the conductive plate, and the heat is radiated to the outside through the conductive plate and the thin surface insulating part. do.

That is, a synergistic heat dissipation effect can be obtained by direct heat dissipation by the heat dissipation member and indirect heat dissipation through the conductive plate and the surface insulation. For this reason, it is difficult for heat to remain in the semiconductor light emitting device module, and the degradation of the heat radiation efficiency of the LED can be suppressed.

In addition, since the entire surface of the conductive plate except for the positive terminal and the negative terminal is covered by the surface insulator, and the part of the heat dissipation member is exposed away from the conductive plate (isolated by the surface insulator), the other side Even if the inner surface of the metal frame housing the heat sink or the semiconductor light emitting element attachment module (semiconductor light emitting device module) is disposed on the surface side of the heat sink, a short circuit does not occur between the heat sink and the metal frame body.

Moreover, since the side part of a liquid crystal panel unit can be fitted between a pair of clamping pieces formed in the surface insulation part, it can attach easily and accurately to the side part of a liquid crystal panel unit. As a result, it is possible to suppress the lowering of the brightness and the unevenness of the liquid crystal panel.

According to invention of Claim 2, the more excellent heat radiation effect is acquired.

According to the invention described in claim 3, a plurality of semiconductor light emitting element attachment modules can be connected.

According to invention of Claim 4, since the design freedom degree of a terminal part improves, it can be set to arbitrary shapes.

According to invention of Claim 5, since it can connect in a chain form, it can be set as the module for attaching the semiconductor light emitting element of arbitrary length.

According to the invention of claim 6, a plurality of semiconductor light emitting device modules can be attached to one semiconductor light emitting device attachment module.

According to the invention of claim 7, since the anode-side and cathode-side terminals and the anode and cathode of the semiconductor light-emitting device are connected by wire bonding, when the semiconductor light-emitting device is connected to the anode-side and cathode-side terminals by soldering, In comparison, the interval between the semiconductor light emitting elements can be narrowed. As a result, it is possible to reduce the luminance stain of the semiconductor light emitting device module and to improve the luminance.

In addition, since there is no need to perform reflow as in the case of soldering, when the semiconductor light emitting device is connected (mounted) to the positive terminal and the negative terminal, the semiconductor light emitting module is adversely affected by heat (for example, discoloration of the resin). There is no fear of receiving.

According to the invention of claim 8, the semiconductor light emitting element and the wire bonding can be protected by an encapsulant.

1 is a plan view of a conductive plate in one embodiment of the present invention.
2 is a side view of the conductive plate.
3 is a perspective view viewed from above to incline toward the front of the conductive plate.
Fig. 4 is an enlarged perspective view of the positive electrode terminal and the negative electrode terminal of the conductive plate and the peripheral portion thereof inclined forward.
Fig. 5 is an enlarged perspective view viewed from above with the front plate of the conductive plate and the front connecting terminal inclined forward.
Fig. 6 is an enlarged perspective view of the rear end of the conductive plate and the rear connecting terminal inclined forward.
Fig. 7 is a plan view of an integral body in which primary surface insulation is formed on the surfaces of the conductive plate, the front connection terminal, and the rear connection terminal.
Fig. 8 is a bottom view of an integrated body in which primary surface insulation is formed on the surfaces of the conductive plate, the front connection terminal and the rear connection terminal.
Fig. 9 is an enlarged perspective view of the conductive plate, the front connecting terminal and the rear connecting terminal inclined forward with respect to all of the integrally formed articles having the primary surface insulation.
Fig. 10 is an enlarged perspective view viewed from above, inclined forward with respect to the rear end of the integrated body having the primary surface insulation formed on the surfaces of the conduction plate, the front connection terminal and the rear connection terminal.
Fig. 11 is a perspective view of the conductive plate, front connecting terminal, rear connecting terminal, and the front surface insulator which are inclined forward with respect to the integrated body during the first cut.
Fig. 12 is a plan view of the conductive plate, the front connection terminal, the rear connection terminal, and the integrated body of the primary surface insulation part when performing the primary cut.
FIG. 13 is an enlarged cross-sectional view taken along the line XIII-XIII of FIG. 12.
FIG. 14 is an enlarged cross-sectional view taken along the line XIV-XIV of FIG. 12.
Fig. 15 is a perspective view of the conductive plate, the front side connection terminal, the rear side connection terminal, and the integrating body of the primary surface insulating portion and the heat dissipation member inclined forward and viewed from above.
Fig. 16 is a perspective view from below of the conductive plate, the front connection terminal, the rear connection terminal, and inclined backward with respect to the separated state of the integral part of the primary surface insulating portion and the heat dissipation member;
Fig. 17 is a perspective view, viewed from above, inclined forward when the heat dissipation member is mounted on the conductive plate, the front connection terminal, the rear connection terminal, and the integral surface insulation unit.
FIG. 18 is an enlarged perspective view similar to FIG. 13 for an integrated body of a conduction plate, a front connection terminal, a rear connection terminal, a primary surface insulating portion, and a heat dissipation member.
FIG. 19 is an enlarged perspective view similar to FIG. 14 with respect to an integrated body of a conductive plate, a front connection terminal, a rear connection terminal, a primary surface insulating portion, and a heat dissipation member.
20 is a plan view of the LED attachment module completed by forming the secondary surface insulation on the surface of the primary surface insulation.
21 is a bottom view of the LED mounting module.
Fig. 22 is a perspective view from above, inclined toward the front of the LED attachment module.
FIG. 23 is an enlarged cross-sectional view taken along the line XIII-XIII of FIG. 20.
24 is an enlarged cross-sectional view taken along the line XIV-XIV of FIG. 20.
FIG. 25 is an enlarged cross-sectional view taken along the line XV-XV of FIG. 20.
FIG. 26 is an enlarged cross-sectional view similar to FIGS. 24 and 25 when connecting the connection terminals of two LED modules.
Fig. 27 is a perspective view, viewed from above, inclined toward the front of the LED attachment module when the LED element is mounted on each of the positive terminal and the negative terminal.
FIG. 28 is an enlarged cross-sectional view similar to FIG. 23 when the LED element is placed on each of the positive terminal and the negative terminal.
FIG. 29 is an enlarged cross-sectional view similar to FIG. 14 when the LED element is placed on each of the positive terminal and the negative terminal.
30 is a perspective view of the LED module and the liquid crystal panel unit separated from the front to be inclined forward.
Fig. 31 is a perspective view from above, inclined forward when fitting the side edges of the liquid crystal panel unit to the LED module.
32 is a side view when fitting the side edge of the liquid crystal panel unit to the LED module.
33 is an enlarged cross-sectional view taken along the line XIII-XIII of FIG. 32.
34 is a schematic diagram of a conductive plate and a parallel circuit thereof.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, each direction of up, down, left and right, and front and back in the following description is based on the arrow line direction shown in the drawing.

This embodiment applies the present invention to an LED module and the LED module 10 can be used as a light source of the liquid crystal unit 100 (see FIGS. 30 to 33). The liquid crystal unit 100 of the present embodiment is a so-called edge light type for injecting light from the side surface of the light guide plate 102.

The LED module 10 (semiconductor light emitting element module) attaches an LED element 57 (semiconductor light emitting element), wire bonding 61, and an encapsulant to an LED attaching module (semiconductor light emitting element attaching module). The module 15 includes a conductive plate 17, a front connection terminal 30, a rear connection terminal 33, a primary surface insulation unit 37, a heat dissipation member 45, and a secondary surface insulation unit 50. .

First, the detailed structure and manufacturing method of the LED attachment module 15 will be described.

1 to 4 show a conductive plate 17 serving as a base of the LED mounting module 15. The conducting plate 17 is, for example, stamped and formed a metal plate having excellent conductivity, thermal conductivity, rigidity, and elasticity (urinable), such as brass, beryllium copper, and colosone copper alloy. Moreover, since silver plating is given to the surface of the conductive plate 17, the (wide) reflectance of the surface of the conductive plate 17 is good. The overall shape of the conductive plate 17 is a long shape (for example, a length of about 15 cm in front and rear) extending in the front-rear direction, and will be described later with the positive electrode terminal 21, the positive electrode side end protrusion 23, and the negative electrode terminal ( 25) and the part except the cathode side end protrusion 27 are flat. The left and right both sides of the conducting plate 17 are constituted by carrier portions 18A and 18B extending in the front-rear direction, and a plurality of locations of the carrier portion 18A and the carrier portion 18B are provided at equal intervals in the front-back direction. The carrier connection part 19 is connected. Each part surrounded by the carrier portions 18A and 18B and two adjacent carrier connecting portions 19 extends in the front-rear direction and is spaced apart from each other in the left-right direction (the first circuit forming portion 20 and the second circuit forming portion ( 24 are formed respectively (a plurality of pairs of the first circuit forming portion 20 and the two circuit forming portions 24 are formed on one conductive plate 17). 22 A of communication recesses are recessed in the several place of the 1st circuit formation part 20, and the edge of the communication recess 22A is once located upward rather than the 1st circuit formation part 20. As shown in FIG. The positive terminal 21 is provided so as to protrude integrally. In addition, the temporary holding recesses 22B and the communication recesses 22C are recessed in the vicinity of the front and rear ends of the first circuit forming unit 20. In addition, at the rear end of the first circuit forming unit 20, the anode side end protruding member 23, which is positioned upwardly and formed in an L shape in plan view, is integrally protruded from the first circuit forming unit 20. It is. A communication recess 26A is recessed in a portion corresponding to each of the anode-side terminals 21 of the second circuit forming portion 24, and a second circuit forming portion (2) is formed at the edge of the communication recess 26A. The cathode-side terminal 25 located once above 24 is integrally protruded. In addition, the temporary holding recess 26B and the communication recess 26C are provided in the vicinity of the front and rear ends of the second circuit forming portion 24. In addition, at the front end portion of the second circuit forming portion 24, the cathode side end protruding piece 27, which is positioned above the second circuit forming portion 24 and formed L-shaped in plan view, protrudes integrally. It is. The carrier portion 18A and the first circuit forming portion 20 and the carrier portion 18B and the second circuit forming portion 24 are connected by a plurality of cutting bridges 28 extending in the horizontal direction. Moreover, many circular conveyance holes (not shown) are provided in the outer edge of the carrier part 18A, 18B side by side in the front-back direction.

Front and rear connection terminals 30 (terminal portions) and rear connection terminals 33 (terminal portions) can be attached to both front and rear ends of the conductive plate 17.

The pair of left and right front connection terminals 30 shown in Figs. 5, 24, 26 and the like, for example, are formed by stamping molding a metal plate having conductive and elastic properties such as phosphor bronze or the like (other metals may be used). The surface is plated with gold or tin. The left and right front connection terminals 30 are provided with a caulking portion 31 constituting the rear end thereof, and a contact piece 32 extending forward from the caulking portion 31, and near the front end of the contact piece 32. The contact block part 32A is formed in the part. As shown in Fig. 5, the left and right front connection terminals 30 are temporarily stopped with respect to the conductive plate 17 by inserting and fixing the caulking portion 31 to the temporary holding recesses 22B and 26B.

On the other hand, the left and right pairs of rear connection terminals 33 shown in Figs. 6, 25, 26, etc. are also made of metal plates having conductivity and elasticity, such as phosphor bronze or the like (may be other metals), for stamping molding. The surface is plated with gold or tin. The rear connection terminal 33 includes a caulking portion 34 constituting the front end portion thereof, and a contact piece 35 extending backward from the caulking portion 34 and positioned below the caulking portion 34 once. . As shown in FIG. 6 and the like, the left and right rear connecting terminals 33 are temporarily stopped with respect to the conductive plate 17 by inserting and fixing the caulking portion 34 to the temporary holding recesses 22B and 26B.

The conductive plate 17, the front connection terminal 30, and the rear connection terminal 33 integrated in this manner are fitted with the sprockets of a conveying apparatus (not shown) to each of the conveying holes of the conductive plate 17, and the respective sprockets are aligned. It is conveyed backward by rotating. And when conveyed to a predetermined position, the primary shaping | molding die (not shown) which consists of a pair of metal mold | die located on the upper and lower sides of the said integral body is closed, and the said integral body is accommodated in a primary shaping | molding die. Then, by fitting a plurality of support pins (not shown) provided in the primary mold to each conveying hole from which the sprocket is displaced, the integral body is fixed in the primary mold and is insulated and (wide). Injection molding (primary molding) using a resin material having high reflectance and heat resistance (for example, a liquid crystal polymer) is performed in the primary molding frame. Then, after the resin material has cured, each mold of the primary molding die is separated up and down from the assembly to take out the assembly from the primary mold, and the conductive plate 17, the front connecting terminal 30, and the rear connecting terminal 33 An integral body formed by integrally forming the primary surface insulation unit 37 appears on the surface of () (see FIGS. 7 to 10 and the like).

As shown, the primary surface insulation 37 includes the positive electrode terminal 21, the end protruding piece 23, the negative electrode terminal 25, the end protruding piece 27, the contact piece 32 (part of), And the surfaces of the conductive plate 17, the front connection terminal 30 and the rear connection terminal 33 integrally cover the exposed contact piece 35 (part of). On the upper surface of the primary surface insulating portion 37, between the communication communicating recesses 22A (communication recesses 26A) adjacent to each other, the communicating communication recesses 22A (communication recesses 26A) and the ends of the front ends are formed. A plurality of upper surface recesses 38 are formed between the protruding pieces 27 and between the communication recesses 22A (communication recesses 26A) at the rear end and the end protrusion 23. The lower surface of the primary surface insulating portion 37 is provided with a concave lower surface concave portion 40 which communicates with the lower end of the side surface concave portion 39. A plurality of surfaces on the left side of the primary surface insulating portion 37 are provided. The engaging projection 41 is provided so as to protrude, and the portions located above and above the conducting plate 17 of the primary surface insulating portion 37 are the communication recesses 22A and the temporary holding portions. It integrates with each other through the resin material hardened | cured in the inside recesses 22B and 26B and the communication recesses 22C and 26C.

Subsequently, the carrier connection part 19 and the cutting | disconnection of the whole body of the conductive plate 17, the front side connection terminal 30, the rear side connection terminal 33, and the primary surface insulation part 37 are cut | disconnected by the primary cutting device not shown. The primary cut which cuts the bridge 28 linearly in the front-back direction along the left and right sides of the primary surface insulation part 37 is performed (refer FIG. 11 thru | or 14).

As the primary cut is completed, a metal heat dissipation member 45 is applied to the upper concave portion 39, the side concave portion 37, and the lower surface concave portion 40 of the primary surface insulating portion 37. The heat radiating member 45 is a press-molded product of a metal plate, and corresponds to the upper surface covering part 46 and the side recess 39 of the plurality (the same number as the upper recess 38) in the shape corresponding to the upper recess 38. The lower surface covering part 48 of the shape corresponding to the side coating part 47 and the lower surface recessed part 40 of the shape is provided integrally, and the engaging protrusion 41 is attached to the upper edge of the side coating part 47. Corresponding numbers and shapes of cutouts 49 are formed. Although not shown, the heat radiating member 45 includes a pair of left and right carrier portions (not shown) corresponding to the carrier portions 18A and 18B, and a plurality of cutting bridges (carrier portion and the radiating member) corresponding to the cutting bridge 28. And a part for connecting the part shown in (45)) are integrally provided. The heat dissipation member 45 allows the conductive plate 17, the front connection terminal 30, the rear connection terminal 33, and the primary surface insulation portion 37 to approach the integrated body from the left side (see Figs. 15 and 16), The upper surface covering part 46 is covered by the side recesses 39, and the fitting projections 41 are engaged with the cutouts 49 while the side covering parts 47 are covered by the side recesses 39. If the covering part 48 is attached, it will stick to the recessed part 40, and will adhere to the said integrated object (refer FIG. 17-FIG. 19).

Subsequently, the integrated body of the conduction plate 17, the front connection terminal 30, the rear connection terminal 33, the primary surface insulation portion 37, and the heat dissipation member 45 is conveyed downward to a predetermined position. Then, the secondary molding die (not shown) made up of a pair of molds located above and below the integral article is closed, and the integral article is stored in the secondary molding die. A plurality of supporting pins (not shown) provided in the secondary molding die are fitted into each of the conveying holes (not shown) formed in the upper and lower carriers of the heat dissipation member 45 to fix the integral body in the secondary molding die. The resin material (for example, liquid crystal polymer, etc.) with high insulation is injection-molded (secondary shaping | molding) in a shaping | molding die. After the resin is cured, the secondary mold is separated up and down, and the conductive plate 17, the front side connection terminal 30, the rear side connection terminal 33, the primary surface insulating portion 37, and the heat dissipation member are separated from the secondary mold. 45, the surface of the conductive plate 17, the anode side end protrusion 23, the cathode side end protrusion 27, the primary surface insulation portion 37, and the heat dissipation member 45 are removed. The integral body in which the part 50 was formed appears (refer FIG. 20-26). However, since the upper surface exposed grooves 55 are formed in the center portion in the width direction of the upper surface of the secondary surface insulating portion 50, the entire center portion in the width direction of the upper surface of the integrated body (part of the positive electrode terminal 21), The negative electrode terminal 27 (part of), the upper surface covering part 46 (part of), the positive electrode side end projecting piece 23 (part of), and the negative electrode side end 27 (part of)) are exposed. . In addition, the secondary surface insulating portion 50 includes a contact piece 32 (part of), a contact piece 35 (part of), a lower surface covering part 48 (part of), and the carrier part of the heat dissipation member 45. And the cutting bridge portion is exposed.

As shown, the gripping piece 51A protruding upward is integrally formed on the entire left edge of the upper surface of the secondary surface insulating portion 50, and the gripping piece lower than the gripping piece 51A is formed on the entire right edge of the upper surface. 51B is provided so that it may protrude integrally upward. A connecting recess 52 is recessed at the front end of the lower surface of the secondary surface insulating section 50, and the left and right front connecting terminals 30 (contact pieces 32) are located in the connecting recess 52. Is located. The connecting block 53 protrudes from the lower end of the second half of the secondary surface insulating section 50, and the left and right rear connecting terminals 33 (connection pieces 35) are formed of the connecting block 53. Protrude from upper surface The lower surface of the secondary insulating portion 50 is provided with a lower surface exposure hole 54 for exposing the entire central portion (parts except the left and right sides) of the lower surface covering portion 48. The secondary insulator 50 covers the cross section (see FIGS. 11, 15, and 17) of each of the cutting bridges 28 cut at the primary cut and exposed at the side of the primary surface insulator 37. .

After the secondary molding is completed, a secondary cut is performed to cut the cutting bridge of the heat dissipation member 45 linearly in the front and rear directions along the left and right sides of the secondary surface insulation unit 50 by a secondary cutting device (not shown). Then, the LED attachment module 15 of the shape shown in FIGS. 20-26 is completed.

Next, as shown in FIGS. 27 to 29, the LED device 57 having a light emitting surface on the upper surface of the anode-side terminal 21 and the cathode-side terminal 25, which form a pair of the LED mounting module 15, is formed. Fix it by placing it through adhesive or heat transfer sheet. As shown in FIG. 29, the anode 58 and the anode side terminal 21 of the LED element 57 are connected by a plurality of wire bonding 61 made of a conductive metal material (for example, gold or aluminum). The cathode 59 and the cathode side terminal 25 of the LED element 57 are then connected.

Subsequently, an encapsulant 62 (refer to FIG. 28) made of a thermosetting resin material, an ultraviolet curable resin material, or the like having a light-transmitting and insulating property in an upper end portion (upper opening) of the upper surface exposure groove 55 of the secondary surface insulation portion 50. It coat | covers the surface of the anode side terminal 21, the cathode side terminal 25, the LED element 57, and the wire bonding 61 with the sealing agent 62. As shown in FIG.

The front connection terminal 30 (contact piece 32) and the rear connection terminal 33 (contact piece 35) of the LED module 10 are connected to the front connection terminal 30 of the other LED module 10 (contact piece). (32) and the rear connection terminal 33 (contact piece 35) can be connected. That is, as shown in Fig. 26, the convex portion 53 for connecting the LED module 10 (located in the front) to the concave portion for connecting the LED module 10 (located in the rear) ( 52) while contacting the rear end face of one LED module 10 and the front end face of the other LED module 10, the contact pieces of the left and right rear connection terminals 33 on one side of the LED module 10; 35 contacts the left and right contact convex portions 32A from the lower side while elastically deforming the right and left contact pieces 32 of the other side LED module 10, respectively. Then, the upper surface of the rear connection terminal 33 (contact piece 35) is covered by the connection recess 52, and the lower surface and the side surface of the front connection terminal 30 (contact piece 32) are convex for connection. Since it is covered by the part 53, the entire periphery of the front connection terminal 30 (contact piece 32) and the rear connection terminal 33 (contact piece 35) is connected to the connection recess 52. It is completely covered by the dragon convex part 53. Further, locking means (not shown) may be provided at both front and rear ends of each LED module 10 to maintain this connection state when connected to the end of each of the other LED modules 10.

The convex portion 53 for connecting the other side (located in the rear) of the LED module 10 is located at the rear of the LED module 10 of the other side, and the concave portion for connecting the other LED module 10 ( 52) can be connected. That is, the plurality of LED modules 10 can be connected in a straight line, and the plurality of LED modules 10 can be connected to form a long elongated lighting device 63 in the front-rear direction.

In addition, as shown in FIG. 26, it is also possible to mount the LED device 57 between the continuous ends of the adjacent LED module 10. That is, since the upper end of the LED module 10 is exposed to the cathode side end projection piece 27 near the front end portion, and the anode side end projection piece 23 is exposed to the rear end portion near the upper surface of the LED module 10, When connected, the cathode side end projection 27 and the anode side end projection 23 are adjacent to each other at the same interval as the gap between the anode side terminal 21 and the cathode side terminal 25. Therefore, in order to connect the LED element 57 to the adjacent cathode side end protrusion 27 and the anode side end protrusion 23 according to the same method as in the case of the anode side terminal 21 and the cathode side terminal 25, Even when the LED module 10 is connected, each LED element 57 can be provided at equal intervals, and also the space | interval of LED elements 57 can be narrowed. The LED element 57 which connects the LED element 57 to the cathode side end protrusion piece 27 and the anode side end protrusion piece 23 is connected to the cathode side end protrusion piece 27 and the anode side end protrusion piece ( After connecting to 23), a sealing agent can be attached.

The liquid crystal panel unit 100 (the stack of the liquid crystal panel 101, the light guide plate 102, and the reflecting plate 103) which forms a rectangle from the front of the elongated luminaire 63 assembled in the above manner in the vertical direction. One side edge of the upper surface of the secondary surface insulating portion 50 by fitting the side edge portion of the liquid crystal panel unit 100 to the groove formed between the sandwiching piece 51A and the sandwiching piece 51B. And the bottom surface of the groove formed between the sandwiching piece 51B) (see FIG. 33), the side of the liquid crystal panel unit 100 in the state where each LED element 57 faces the side end surface of the light guide plate 102. FIG. The long lighting device 63 (LED module 10) can be attached to the edge. In addition, a display device (for example, a liquid crystal TV) in which the liquid crystal panel unit 100 is incorporated in the lower surface covering portion 48 of the heat radiating member 45 of the long lighting device 63 (each LED module 10). The heat sink 104 is brought into contact (see the imaginary line in FIG. 33). When the long lighting fixture 63 and the liquid crystal panel unit 100 are fixed to the heat dissipating plate 104 by a bolt (not shown), the long lighting unit 63, the liquid crystal panel unit 100, and the heat dissipating plate 104 are fixed. Can be firmly integrated with each other.

As shown in the schematic diagram of Fig. 34, the positive pole of the power supply is connected to the front connection terminal 30 (contact piece 32) on the left side of the LED module 10 positioned at the most front side, and the right side of the LED module 10 is connected. The negative electrode of the said power supply is connected to the front side connection terminal 30 (contact piece 32), and the short circuit connector 64 is connected to the rear side connection terminal 33 of the LED module 10 which is located in the rearmost. When the main switch (not shown) of the liquid crystal panel unit 100 is turned on in the state, parallel circuits are formed on the front connection terminal 30 and the conducting plate 17 (the current flows in each LED element 57). Because of this, the liquid crystal panel 101 performs the display operation because it is reflected toward the panel 101 side.

In addition, since the circuits formed on the front connection terminal 30 and the conductive plate 17 are parallel circuits, for example, even if one LED element 57 is damaged, the other LED element 57 maintains a state in which light can be emitted. It is preferably used for a device (for example, the liquid crystal unit 100, etc.) for which the service life and reliability of the device are required. In addition, since the shorting connector is attached, the rear connection terminal 33 of the rearmost LED module 10 can be prevented. Therefore, it is possible to prevent foreign matter from adhering to the rear connection terminal 33 or to damage the rear connection terminal 33 in contact with the surrounding members.

The LED module 10 of the above-described embodiment has a structure in which the heat dissipation member 45 having excellent thermal conductivity and rigidity is located near the LED element 57 and exposed to the outer surface of the LED attachment module 15. The heat generated by the element 57 is radiated to the outside efficiently through the heat radiating member 45. In addition, since the heat sink 104 (or the inner surface of the metal frame of the display device including the liquid crystal panel unit 100) can be brought close to the module 15 for attaching the LED (the LED module 10). Since the heat sink 104 is used, a more efficient heat dissipation effect which is not obtained by the LED mounting module 15 (LED module 10) alone can be obtained.

In addition, the primary surface insulating portion 37 made of a resin is used for the entire surface of the conductive plate 17 except for the positive electrode terminal 21 and the negative electrode terminal 25 by a metal conductive plate 17 having excellent thermal conductivity and rigidity. Because of the structure covered with the secondary surface insulating portion 50, the heat generated by the LED element 57 can be efficiently received on the conductive plate 17. Therefore, the heat generated from the LED element 57 is efficiently installed through the primary surface insulation portion 37 and the secondary surface insulation portion 50 having the same thin thickness as the conductive plate 17. 10) is radiated to the outside.

That is, a synergistic heat dissipation effect can be obtained by direct heat dissipation by the heat dissipation member 45 and indirect heat dissipation by the conductive plate 17, the primary surface insulation unit 37, and the secondary surface insulation unit 50. Therefore, it is difficult for heat to remain in the module 15 for attaching an LED, and the fall of luminous efficiency of the LED element 57 can be suppressed.

In addition, the entire surface of the conductive plate 17 except for the positive electrode terminal 21 and the negative electrode terminal 25 is covered by the primary surface insulating portion 37 and the secondary surface insulating portion 50, and the upper surface covering portion 46 ) And the heat dissipation member 45 exposed by the lower surface coating portion 48 are separated from the conductive plate 17 (is insulated from the conductive plate 17 by the primary surface insulating portion 37). Even if the heat sink 17 is brought into contact with the abdomen 48, a short circuit (short) does not occur between the heat radiating member 45 (lower surface covering part 48) and the heat sink 104.

Since the side edges of the liquid crystal panel unit 100 can be fitted between the pair of sandwiching pieces 51A and 51B formed on the secondary surface insulating portion 50, the LED module ( 10) It is possible to attach with precision. Therefore, since the light generated by the LED element 57 can be incident efficiently (without loss) to the liquid crystal panel unit 100 side, it is possible to prevent the lowering of the luminance and the unevenness of the luminance.

In addition, the anode 58 and the anode side terminal 21 of the LED element 57, and the cathode 59 and the cathode side terminal 25 of the LED element 57 (also the anode 58 and the anode side protruding piece ( 23) and the cathode 59 and the cathode side end projection 27 are connected to the wire bonding 61 so that the LED attachment module 15 can be reflowed to a high temperature as in the case of being connected by soldering. no need. Therefore, bending and torsion of the LED attachment module 15 can be prevented, and damage to the primary surface insulation portion 37, the secondary surface insulation portion 50 or the LED element 57, and the primary surface insulation portion ( Reduction in reflectance due to discoloration in 37) can be reduced. Moreover, the space | interval of each LED element 57 can be narrowed. Therefore, it is possible to reduce the luminance stain of the LED module 10 and to improve the luminance.

In addition, when the LED element 57 is attached to the cathode side end protrusion 27 and the anode side end protrusion 23 by soldering, the productivity is extremely low, but the LED element 57 is used because the wire bonding 61 is used. Can be efficiently connected to the cathode side end projection 27 and the anode side end projection 23.

In addition, since the sealing material 62 made of an insulating material covers the surfaces of the anode side terminal 21, the cathode side terminal 25, the LED element 57, and the wire bonding 61, the LED element 57 and the wire bonding. (61) can be protected, and the anode side terminal 21 and the cathode side terminal 25 can be prevented from being short-circuited with other conductive materials disposed and installed around the LED module 10.

The present invention described above is not limited to the above embodiment and can be implemented while making various modifications. The present invention may be formed of a metal material other than the above having excellent conductivity, thermal conductivity and rigidity.

The number of pairs of the positive electrode terminal 21 and the negative electrode terminal 25 formed on one conductive plate 17 is not limited to the above embodiment but may be one or a plurality of different numbers from the above embodiment.

The surface of the conducting plate 17 may be plated by gold, tin or the like instead of silver plating.

In addition, you may manufacture the LED module 10 (LED attachment module 15) by the method (procedure) different from the above. For example, at least one of the front connection terminal 30 and the rear connection terminal 33 may be integrally formed with the conductive plate 17, or the carrier connection 19 and the cutting bridge 28 of the conductive plate 17 may be insulated. The carrier connecting portion 19 and the cutting bridge 28 may be cut off after attaching the heat dissipation member 45 or shaping the secondary surface insulating portion 50 without the need. In addition, the primary surface insulation portion 37 and the secondary surface insulation portion 50 are formed by insight molding in which the conductive plate 17, the front side connection terminal 30, the rear side connection terminal 33, and the heat dissipation member 45 are disposed in the molding frame. The surface insulating portion integrally provided with the portion corresponding to the cross section) may be molded by one kind of resin material.

In addition, the secondary surface insulating portion 50 may be formed so that the side surface covering portion 47 of the heat dissipation member 45 is exposed, and the heat sink is brought into contact with the surface of the side coating portion 47. Moreover, you may attach each heat radiating member divided | segmented in the state which divided | segmented the heat radiating member 45 into the LED module 10. FIG.

Alternatively, solder may be used instead of the wire bonding 61.

In addition, a device other than the liquid crystal panel unit 100 may be fitted between the sandwiching piece 51A and the sandwiching piece 51B of the LED module 10. For example, when the light-transparent plastic member including the diffusing lens is fitted together, the lighting device may be formed by the LED module 10 and the club-shaped member.

10; LED module (semiconductor light emitting device module)
15; LED attachment module (semiconductor light emitting element attachment module)
17; Conducting plates 18A, 18B; Carrier part
19; Carrier connection part 20; First circuit forming unit
21; Anode terminal 22A; Communication recess
22B; Temporary holding recesses 22C; Communication recess
23; Anode side end protrusion 24; Second circuit forming part
25; Negative electrode terminal 26A; Communication recess
26B; Temporary holding recesses 26C; Communication recess
27; cathode side end protrusion 28; Cutting bridge
30; Front connection terminal 31; Caulking part
32; Contact piece 32A; Contact convex
33; Rear connection terminal 34; Caulking part
35; Contact piece 37; Primary surface insulation
38; Upper recess 39; Side recess
40; Lower surface recess 41; Snapping
45; Heat dissipation member 46; Upper garment
47; Lateral coating 48; Underside
49; Cutout 50; Secondary surface insulation
51A, 51B; Narrowing section 52; Connection recess
53; Convex part 54 for a connection; Bottom exposure hole
55; Upper exposure hole 57; LED device (semiconductor light emitting device)
58; Anode 59; cathode
61; Wirebonding 62; Encapsulant
63; Elongated luminaires 64; connector
100; Liquid crystal panel unit 101; LCD panel
102; Light guide plate 103; Reflector
104; Heat sink

Claims (8)

A conductive plate made of metal formed on one surface of the anode side terminal and the cathode side terminal connectable to the anode and cathode of the semiconductor light emitting element, respectively;
A heat dissipation member made of metal spaced apart from the conductive plate;
And a surface insulating part covering the surfaces of the conductive plate and the heat dissipation member in a state where at least a part of the heat dissipation member, the positive electrode side terminal, and the negative electrode side terminal are exposed;
And a pair of clamping pieces protruding to face each other with the anode side terminal and the cathode side terminal formed on one surface of the conductive plate interposed therebetween. The method of claim 1,
And said surface insulating portion exposes a portion of said heat dissipation member to said one side of said surface, and exposes said portion of said heat dissipation member to a portion different from said one side of said one side. 3. The method according to claim 1 or 2,
A pair of connection terminals electrically connected to the positive electrode terminal and the negative electrode terminal,
The surface insulating portion exposing the connection terminal;
And,
A module for attaching a semiconductor light emitting element, wherein the connection terminal can be connected to the connection terminal of another module for attaching a semiconductor light emitting element. The method of claim 3,
A module for attaching a semiconductor light emitting element, wherein the conductive plate and the connection terminal are separate. The method of claim 3,
The conductive plate is a member extending linearly,
A module for attaching a semiconductor light emitting element, wherein the connecting terminals are respectively provided at both ends of the conductive plate in the longitudinal direction. 6. The method of claim 5,
A module for attaching a semiconductor light emitting element, wherein the conductive plate includes a plurality of pairs of the anode side terminal and the cathode side terminal. The module for attaching the semiconductor light emitting element according to claim 6,
A semiconductor light emitting element in which its anode and cathode are connected to the anode side terminal and the cathode side terminal, respectively;
Wire bonding connecting the positive electrode and the positive electrode terminal, and the negative electrode and the negative electrode terminal, respectively;
Semiconductor light emitting device module comprising a. 8. The method of claim 7,
A semiconductor light emitting device module, wherein the surface of the semiconductor light emitting device and the wire bonding are coated with an encapsulant made of a light transmitting resin.

Images