CN114267608A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
CN114267608A
CN114267608A CN202111086478.7A CN202111086478A CN114267608A CN 114267608 A CN114267608 A CN 114267608A CN 202111086478 A CN202111086478 A CN 202111086478A CN 114267608 A CN114267608 A CN 114267608A
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CN
China
Prior art keywords
substrate
door
processing apparatus
heater
substrate processing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111086478.7A
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Chinese (zh)
Inventor
尹奎相
刘载贤
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Semes Co Ltd
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Semes Co Ltd
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Publication date
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Publication of CN114267608A publication Critical patent/CN114267608A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

The invention provides a substrate processing apparatus. In one example, a substrate processing apparatus includes: a housing having a processing space for processing a substrate therein and having an inlet and an outlet for allowing the substrate to enter and exit; a support unit positioned in the processing space and supporting the substrate; a shutter member having a door for opening and closing the doorway; and a heater for heating the door, the heater being disposed in the processing space adjacent to the door, and the shutter member further comprising: and an actuator for moving the door between a closed position when the door closes the doorway and an open position when the door opens the doorway.

Description

Substrate processing apparatus
Technical Field
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for compensating for a temperature decrease around an inlet and outlet due to opening and closing of the inlet and outlet.
Background
Liquid crystal display elements (LCDs), Plasma Display Panel (PDP) elements, and the like are recently used for the manufacture of image display devices, and substrates of flat panel display devices (FPDs) are used.
In the process of manufacturing a flat panel display device, a substrate manufacturing process, a cell manufacturing process, a module manufacturing process, and the like must be performed. In particular, in a substrate manufacturing process, a photolithography process for forming various patterns on a substrate is performed. In the photolithography process, a coating process of coating a photosensitive solution such as a photoresist on a substrate, an exposure process of forming a specific pattern on the coated photosensitive film, and a development process of developing a region corresponding to the exposed photosensitive film are sequentially performed. A baking process of heat-treating the substrate is performed before and after the coating process and the developing process are performed, respectively.
The baking process is performed inside a baking chamber sealed from the outside. However, when the substrate is loaded into the bake chamber, an external air flow is introduced into the bake chamber to lower the internal temperature. In particular, the temperature around the entrance and exit for the substrate to enter and exit provided in the baking chamber is reduced.
In order to compensate for the temperature around the doorway, a temperature compensating device is provided in the barrier for opening and closing the doorway. Figure 1 shows a typical baking chamber with baffles provided with temperature compensation means. Referring to fig. 1, an entrance 2 for allowing a substrate to enter and exit is provided at one side of a baking chamber 1. The shutter 3 rotates about the hinge 4 to open and close the doorway 2. A nickel-chromium alloy heating wire 5 is arranged as a temperature compensation device inside the baffle 3. In addition, a temperature sensor 6 for measuring the temperature of the nichrome heating wire 5 and an interlock 7 for preventing the malfunction of the baffle are provided inside the baffle.
However, since the nichrome heating wire 5, the temperature sensor 6, and the interlock 7 are supplied with power through the electric wire 8 extending from the inside to the outside of the barrier 3 and receive an electric operation signal, the electric wire 8 extending to the outside of the barrier 3 is repeatedly folded and unfolded depending on the operation of the barrier 3. Therefore, stress is applied to the electric wire 8, and the coating of the electric wire 8 is scattered in the form of powder to generate particles, and there is a problem of disconnection in some cases.
Disclosure of Invention
Problems to be solved
An object of the present invention is to provide a substrate processing apparatus that compensates for the temperature of an inlet and an outlet by heating a baffle plate.
The invention aims to provide a substrate processing device which does not cause the problem of breakage or disconnection of an electric wire for supplying power to a heater.
The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.
Means for solving the problems
The invention provides a substrate processing apparatus. In one example, a substrate processing apparatus includes: a housing having a processing space for processing a substrate therein and having an inlet and an outlet for allowing the substrate to enter and exit; a support unit positioned in the processing space and supporting the substrate; a shutter member having a door for opening and closing the doorway; and a heater for heating the door, the heater being disposed in the processing space adjacent to the door, and the shutter member may further include: and an actuator for moving the door between a closed position when the door closes the doorway and an open position when the door opens the doorway.
In one example, the shutter member further includes a rotation shaft as a rotation center of the door, and the driver may rotate the door about the rotation shaft.
In one example, the rotation axis may be disposed within the processing volume.
In one example, the heater may be provided in the rotating shaft.
In one example, the heater may be located between the supporting unit and the door.
In one example, the barrier member may further include a reflective member disposed on a side surface of the door facing the processing space.
In one example, the barrier member may further include an absorption member disposed on a side surface of the door facing the processing space.
In one example, the heater may be provided as one or more infrared lamps.
In one example, the door may have a cross section of a curved shape protruding toward the outside of the case.
In one example, the cross-section of the door may be provided in an arc shape.
In one example, the heater may be positioned in a center of the arc.
In one example, the door may be moved between the open and closed positions by rotating in a length direction of the arc.
In one example, the processing of the substrate may be a processing of heating the substrate.
In one example, the apparatus may further include: a substrate heating unit configured to heat the substrate within the processing space, the substrate heating unit being disposed at least one of a position corresponding to an upper surface of the substrate and a position corresponding to a lower surface of the substrate.
Further, a substrate processing apparatus includes: a housing having a processing space for processing a substrate therein and an inlet and an outlet for allowing the substrate to enter and exit; a support unit positioned in the processing space and supporting the substrate; a substrate heating unit for heating a substrate; a shutter member having a door for opening and closing the doorway; and a heater for heating the door, the heater being disposed in the processing space in a manner adjacent to the door, the shutter member further comprising: and a driver moving the door between a closed position when the door closes the doorway and an open position when the door opens the doorway, and the door is provided in an arc shape in cross section, the driver being capable of moving the door between the open position and the closed position by rotating in a length direction of the arc.
In one example, the shutter member may further include a rotation shaft serving as a rotation center of the door, and the driver may rotate the door about the rotation shaft.
In one example, the rotation axis may be disposed within the processing volume.
In one example, the heater may be provided in the rotating shaft.
In one example, the substrate may be provided as a rectangular substrate.
In one example, the substrate heating unit may be disposed at least one of a position corresponding to an upper surface of the substrate and a position corresponding to a lower surface of the substrate.
Effects of the invention
According to the embodiment of the invention, the temperature of the inlet and the outlet can be compensated by heating the baffle.
Further, according to the embodiments of the present invention, it is possible to prevent the problem of breakage or disconnection of the electric wire for supplying power to the heater.
Effects of the present invention are not limited to the above-described effects, and those not mentioned will be clearly understood from the present specification and drawings by those of ordinary skill in the art to which the present invention pertains.
Drawings
Fig. 1 is a cross-sectional view of a general baking chamber.
Fig. 2 is a diagram illustrating a substrate processing apparatus according to an embodiment of the present invention.
Fig. 3 is a perspective view illustrating the coating unit of fig. 2.
Fig. 4 is a cross-sectional view illustrating the drying unit of fig. 2.
Fig. 5 is a perspective view illustrating the roasting unit of fig. 2.
Fig. 6 is a cross-sectional view illustrating one example of the bake chamber of fig. 2.
Fig. 7 is a perspective view illustrating one example of the oven chamber of fig. 2.
Fig. 8 is a perspective view showing one example of the heater of fig. 6.
Fig. 9 to 10 are diagrams schematically showing a state in which a shutter operates according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This example is provided to more fully illustrate the invention to those of ordinary skill in the art. Accordingly, the shapes of the elements in the drawings are exaggerated to emphasize clearer depiction.
In addition, in the embodiment of the present invention, an apparatus for performing a baking process on a substrate in a photolithography process will be described as an example. However, the present embodiment is not limited thereto, and may be variously applied as long as the process of heat-treating the substrate is performed.
In addition, in the embodiments of the present invention, a rectangular substrate for manufacturing a flat display panel will be described as an example. However, the present embodiment is not limited thereto, and may be applied to a circular wafer.
Hereinafter, this embodiment will be described in detail with reference to fig. 2 to 10. Fig. 2 is a diagram illustrating a substrate processing apparatus according to an embodiment of the present invention. Referring to fig. 2, the substrate processing apparatus includes an index unit 100, a cleaning unit 110, a plurality of baking units 400, a coating unit 200, a drying unit 300, a buffer unit 130, and an interface 140, an exposure unit 180, an edge exposure machine 150, a developing unit 160, and an inspection unit 170. Each processing unit is arranged to be able to perform processing in a line type, and the index unit 100, the cleaning unit 110, the coating unit 200, the drying unit 300, the buffer unit 130, the interface 140, the edge exposure machine 150, the developing unit 160, and the inspection unit 170 are sequentially arranged.
The baking units 400 are disposed before and after the coating unit 200 and before and after the developing unit 160, respectively. The exposure unit 180 is disposed at one side of the interface 140. The transfer robots are respectively installed between the process units, and the transfer robots may transfer the substrate S between the adjacent process units. In the present embodiment, only the coating unit 200, the drying unit 300, and the baking unit 400 will be described, and detailed descriptions of other process units will be omitted.
The coating unit 200 coats a coating film on the substrate S. Fig. 3 is a perspective view illustrating the coating unit of fig. 2. Referring to fig. 3, the coating unit 200 includes a plate 210, a substrate moving member 220, a coating nozzle 230, and a nozzle moving member 240. Hereinafter, the width direction of the plate 210 is referred to as a first direction 12, and the length of the plate 210 is referred to as a second direction 14. The first direction 12 and the second direction 14 are arranged perpendicular to each other when viewed from above.
The air holes 212 are formed on the upper surface of the plate 210. The gas holes 212 receive gas from a gas supply line (not shown) connected thereto and inject the gas. Alternatively, the air holes 212 may provide air pressure or vacuum pressure on the plate 210. The gas injected from the gas holes 212 floats the substrate S placed on the plate 210.
The substrate moving member 220 is installed at both sides of the plate 210 facing the first direction 12. The substrate moving member 220 includes a substrate moving rail 222 and a clamping member 224. The substrate moving rail 222 is provided to be elongated in the second direction 14 on each of both sides of the board 210. Each substrate moving rail 222 is provided with a clamping member 224.
The clamping member 224 clamps the substrate S floated from the plate 210. The clamp member 224 is provided to be movable in the second direction 14 along the substrate moving rail 222. The clamp member 224 may move in the second direction 14 together with the substrate S while supporting the floated substrate S.
The coating nozzle 230 supplies the first processing liquid or the second processing liquid onto the substrate S. The coating nozzle 230 has a longitudinal direction facing the first direction 12. The coating nozzle 230 has a slit-shaped spray hole formed in the bottom surface thereof, and the longitudinal direction of the spray hole is directed in the first direction 12. The length of the ejection hole toward the first direction 12 may correspond to the width of the substrate S or may be set longer than the width. For example, the first process liquid may be a photoresist and the second process liquid may be a solvent. The photoresist may be a photoresist and the solvent may be a diluent. The photoresist and the solvent may be sprayed from one coating nozzle 230 or from each of the plurality of coating nozzles 230.
The nozzle moving member 240 includes a support 242, a vertical frame 244, a guide rail 246, and a driving unit (not shown). The support 242 is coupled with the coating nozzle 230 at the top of the plate 210. The support 242 is disposed such that its lengthwise direction faces the first direction 12. Both ends of the support 242 are connected to a vertical frame 244. Vertical frames 244 are provided to extend downward from both ends of the support 242. The lower ends of the vertical frames 244 are mounted on guide rails 246. The guide rails 246 are respectively located at both sides of the substrate moving guide 222. The guide rail 246 is disposed such that the length direction thereof faces the second direction 14. The drive unit moves the vertical frame 244 on the guide rails 246 in the second direction 14. As the vertical frame 244 moves in the second direction 14, the support 242 and the coating nozzle 230 move together in the second direction 14.
The drying unit 300 performs a drying process on the substrate in a vacuum atmosphere. Fig. 4 is a cross-sectional view illustrating the drying unit 300 of fig. 2. Referring to fig. 4, the drying unit 300 includes a drying chamber 310, a stage 320, and a decompression member 314.
The bottom edge region of the drying chamber 310 is formed with an exhaust hole 312. The stage 320 supports the substrate inside the drying chamber 310. A plurality of support pins 322 are mounted on an upper surface of the table 320. A plurality of support pins 322 are installed to protrude from an upper surface of the table 320. Each support pin 322 may support the substrate such that the substrate is spaced apart from the stage 320. The decompression member 314 is connected to the exhaust hole 312 to form the inside of the drying chamber 310 into a vacuum atmosphere.
The baking unit 400 thermally processes the substrate S. Fig. 5 is a cross-sectional view illustrating an example of the roasting unit of fig. 1, and fig. 6 to 7 are cross-sectional views illustrating a baffle and a heater provided in the roasting unit of fig. 5.
Hereinafter, the baking unit 400 of the present invention will be described with reference to fig. 5 to 7. Fig. 5 is a perspective view illustrating the bake unit 400 of fig. 2, fig. 6 is a cross-sectional view illustrating one example of the bake chamber 401 of fig. 2, and fig. 7 is a perspective view illustrating one example of the bake chamber 401 of fig. 2.
Referring to fig. 5, a plurality of bake chambers 401a, 401b, 401c, and 401d may be provided in the bake unit 400. In one example, four bake chambers 401a, 401b, 401c, and 401d may be stacked to be disposed. Each baking chamber 401a, 401b, 401c, 401d may have the same dimensions and internal configuration. Alternatively, the size or internal configuration of each baking chamber 401a, 401b, 401c, 401d may be differently set.
Referring to fig. 6 to 7, the baking unit 400 includes a case 410, a supporting unit 430, a substrate heating unit 450, a baffle member 480, and a heater 490. The case 410 is provided to have a rectangular parallelepiped shape.
The housing 410 provides a processing space 402 therein. The inlet 414 is formed on one side wall of the housing 410. The entrance 414 serves as an entrance for the substrate S. In one example, the exhaust hole 416 is formed on a side surface of the case 410. Alternatively, the exhaust hole 416 may be provided on the bottom surface of the case 410. The exhaust vent 416 is connected to an exhaust member 418. The exhaust member 418 exhausts the process byproducts generated in the processing volume 402 through an exhaust vent 416. In one example, the vent member 417 is provided as a pressure relief member. In one example, the process volume 402 may be set below atmospheric pressure during the process volume 402 being exhausted through the exhaust member 418.
The support unit 430 supports the substrate S within the case 410. In one example, a plurality of suction holes (not shown) and pin holes (not shown) may be formed on the upper surface of the supporting unit 430. The adsorption hole (not shown) may be connected to a decompression member (not shown) to vacuum-adsorb the substrate S placed on the support unit 430. The vacuum adsorption substrate S may be fixed to the support unit 430.
A lift pin 432 is provided in each pin hole (not shown). In one example, the lift pin 432 may be moved to the raised position and the lowered position by a pin drive member. Here, the ascending and descending position is a position where the upper end of the ascending and descending pin 432 protrudes from the pin hole, and the descending position is a position where the upper end of the ascending and descending pin 432 is disposed in the pin hole. For example, the elevating position may be set to a position where the upper end of the elevating pin 432 is located at a height opposite to the gateway 414.
In one example, the substrate heating unit 450 is located inside the support unit 430. The substrate heating unit 450 performs a heating process on the substrate S placed on the supporting unit 430. In one example, the substrate heating unit 450 is provided as a heating wire or a lamp. Further, the substrate heating unit 450 heats the processing space 402 to form a process atmosphere higher than a normal temperature in the processing space 402. The substrate heating unit 450 may form the processing space 402 into a heating atmosphere before the substrate S is loaded into the processing space 402.
In one embodiment, the substrate heating unit 450 may also be disposed at an upper portion of the processing volume 402. For example, the housing 440 may be disposed at an upper portion of the processing space 402, and the substrate heating unit 450 may be disposed inside the housing 440. In one example, the substrate heating unit 450 disposed inside the support unit 430 and the substrate heating unit 450 disposed inside the housing 440 may be combined to heat the processing space 402 to a desired set temperature. Alternatively, the substrate heating unit 450 may be disposed at least one of the inside of the support unit 430 and the upper portion of the processing space 402.
The shutter member 480 opens and closes the gateway 414. In one example, the baffle member 480 includes a door 460 and a drive member 470. The door 460 opens and closes the doorway 414. In one example, the cross-section of the door 460 may be provided in a curved shape. In one example, the cross-section of the door 460 may have a curved shape that is convex toward the outside of the case 410. In one example, the cross-section of the door 460 is provided in an arc shape.
The driving member 470 moves the door 460. In one example, the drive member 470 includes a rotational shaft 474 and a driver (not shown). An actuator (not shown) moves the door 460 between a closed position where the door 460 closes the doorway 414 and an open position where the door 460 opens the doorway 414. In one example, a driver (not shown) rotates the door 460 about the axis of rotation 474. The driver (not shown) is connected to the rotating shaft 474, and transmits power to the rotating shaft 474. In one example, the rotation shaft 474 is disposed within the processing volume 402. Alternatively, the driver (not shown) may make the rotation radius of the door 460 different from the rotation radius of the rotation shaft 474. For example, the driver (not shown) may be provided with a rotation cylinder that biases the rotation center of the door 460 and the rotation center of the rotation shaft 474.
In one example, the driving member 470 may further include a connection member (not shown) connecting the rotation shaft 474 and the door 460. In one example, a connection member (not shown) may be provided outside the case 410. Optionally, a connection member (not shown) may be provided inside the case 410.
The door 460 may rotate in the length direction of the arc to move between an open position and a closed position. The open position is a position where the door 460 is set to allow the substrate S to enter and exit through the entrance 414. In one example, the upper end of the door 460 is positioned at the same height as or at a lower height than the height of the upper end of the lift pin. In one example, the open position may be set such that the lower end of the door 460 in the open position does not collide with the housing 410.
The closed position is a position where the door 460 completely blocks the doorway 414. In one embodiment, a shield 412 may be provided between the housing 410 and the lower end of the door 460 so that the processing space 402 may be sealed in the closed position. The shielding plate 412 shields the housing 410 from the lower end of the door 460 so that the processing space 402 is not affected by the outside when processing the substrate S. In one example, the closed position may be set such that the upper end of the door 460 in the closed position does not collide with the case 410.
The heater 490 heats the baffle member 480. When the substrate S is loaded into the processing space 402, the temperature of the region adjacent to the shutter member 480 in the processing space 402 is lower than that of the other region due to the opening and closing of the shutter member 480. The heater 490 heats the baffle member 480 to compensate for the temperature of the region of the processing space 402 adjacent to the baffle member 480 during processing.
In one example, the heater 490 is disposed within the processing volume 402. In one example, the heater 490 is located between the support unit and the door 460. For example, the heater 490 is disposed adjacent to the door 460 to compensate for the temperature near the door 460. In one example, a rotating shaft 474 is provided. For example, as shown in fig. 8, the heater 490 is disposed inside the rotating shaft 474. Alternatively, the heater 490 may be installed outside the rotating shaft 474.
The heater 490 may be provided as one or more infrared lamps. Alternatively, the heater 490 may be provided as another type of lamp, such as a halogen lamp. Alternatively, the heater 490 may be provided as a heating wire.
The baffle member 480 may include a reflective member 464. In one example, the reflective member 464 may be disposed on a side surface of the door 460 facing the processing space 402. The door panel may be disposed on a rear surface of the reflective member 464. In one example, the reflective member 464 may be provided as a reflective plate made of a reflective material. Alternatively, the reflective member 464 may be coated on a side surface of the door 460 facing the processing space 402. The reflecting member 464 reflects heat generated from the heater 490 to the inside of the processing space 402, thereby diffusing the heat. Since the door 460 is provided in a convex shape toward the outside, the heat reflected by the reflecting member 464 may be transferred to the inside of the processing space 402.
Alternatively, the baffle member 480 may include an absorbing member instead of the reflecting member 464. Like the reflection member 464, the absorption member may be disposed on a side surface of the door 460 facing the processing space 402. The absorption member absorbs heat provided by the heater 490 to prevent the temperature of the door 460 from being lowered. The heat generated by the heater 490 when the door 460 is provided with the absorption member may be greater than when the door 460 is provided with the reflection member 464. The reflecting member reduces a temperature deviation between a region adjacent to the heating unit of the substrate S and a region adjacent to the inlet and outlet 414 in the processing space 402. In one example, the absorbing member may be made of metal having high thermal conductivity. For example, the absorbing member may be made of aluminum, copper, or the like.
Fig. 9 to 10 are diagrams schematically illustrating a state in which the shutter member 480 according to an embodiment of the present invention operates. Referring to fig. 9, the door 460 is opened to process the substrate S in the bake chamber 401. The rotation shaft 474 is rotated by a driver (not shown), and thus, the door 460 is rotated as the rotation shaft 474 and a connection member (not shown) connected to the door 460 are rotated. In one example, the processing space 402 may be heated to a preset temperature by the substrate S heating unit before the door 460 is placed in the open position. Referring to fig. 10, the door 460 is closed to perform a heat treatment on the substrate S in the bake chamber 401. The rotation shaft 474 is rotated by a driver (not shown), and thus, the connection member (not shown) is rotated to rotate the door 460.
According to the present invention, the door 460 is rotatably provided to prevent the occurrence of impact and vibration and the generation of particles in the oven chamber 401 due to collision between the door 460 and the case 410.
Further, according to the present invention, the driving member 470 of the door 460 is disposed inside the processing space 402, and thus it is possible to prevent interference between cables, wires, etc. for operating the heater 490 mounted on the door 460 to compensate for the temperature of the door 460 in the related art and the driving member 470. Therefore, the breakage or disconnection of the cable, the electric wire, or the like is prevented.
Further, according to the present invention, a heater 490 is provided on the rotating shaft 474 to prevent interference between a cable, a wire, etc. used to operate the heater 490 mounted on the door 460 to compensate for the temperature of the door 460 and the driving member 470 in the related art. Therefore, the breakage or disconnection of the cable, the electric wire, or the like is prevented.
In addition, according to the present invention, since the heater 490 is provided inside the processing space 402, a temperature decrease phenomenon near the door 460 can be prevented even when the doorway 414 is opened.
Further, according to the present invention, by providing the reflection member 464 at the inner side of the door 460, it is possible to reduce a temperature deviation in the processing space 402 and a process by-product generated due to a temperature drop.
The foregoing detailed description is illustrative of the invention. Moreover, the foregoing description shows and describes preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, variations or modifications may be effected within the scope of the inventive concept disclosed herein, within the scope and range of equivalents of the disclosed subject matter, and/or within the skill or knowledge of those in the art. The described embodiments represent the best mode for carrying out the technical idea of the invention, and various changes required for a specific application field and use of the invention are possible. Therefore, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Furthermore, the appended claims should be construed to include other embodiments.
[ description of reference ]
430: supporting unit
460: door with a door panel
470: drive member
480: a baffle member.

Claims (20)

1. A substrate processing apparatus, comprising:
a housing having a processing space therein for processing a substrate and having an inlet and an outlet for allowing the substrate to enter and exit;
a support unit positioned in the processing space and supporting the substrate;
a shutter member having a door for opening and closing the doorway; and
a heater for heating the door,
wherein the heater is disposed in the processing space adjacent to the door, and
the baffle member further includes:
a driver that moves the door between a closed position when the door closes the doorway and an open position when the door opens the doorway.
2. The substrate processing apparatus according to claim 1,
the shutter member further includes a rotation shaft as a rotation center of the door, and
the driver rotates the door about the rotation axis.
3. The substrate processing apparatus of claim 2, wherein the rotation shaft is disposed within the processing space.
4. The substrate processing apparatus according to claim 2, wherein the heater is provided in the rotation shaft.
5. The substrate processing apparatus of claim 2, wherein the heater is located between the support unit and the door.
6. The substrate processing apparatus of claim 1, wherein the baffle member further comprises a reflective member disposed on a side surface of the door facing the process space.
7. The substrate processing apparatus of claim 1, wherein the baffle member further comprises an absorbing member disposed on a side surface of the door facing the processing space.
8. The substrate processing apparatus of claim 1, wherein the heater is provided as one or more infrared lamps.
9. The substrate processing apparatus according to claim 1, wherein the door has a cross section of a curved shape that is convex toward an outside of the housing.
10. The substrate processing apparatus of claim 1, wherein a cross-section of the door is provided in an arc shape.
11. The substrate processing apparatus of claim 10, wherein the heater is positioned in a center of the arc.
12. The substrate processing apparatus of claim 10, wherein the door moves between the open position and the closed position by rotating in a length direction of the arc.
13. The substrate processing apparatus according to any one of claims 1 to 12, wherein the processing of the substrate is a processing of heating the substrate.
14. The substrate processing apparatus of claim 10, further comprising: a substrate heating unit configured to heat a substrate within the processing space,
wherein the substrate heating unit is disposed at least one of a position corresponding to an upper surface of the substrate and a position corresponding to a lower surface of the substrate.
15. A substrate processing apparatus, comprising:
a housing having a processing space therein for processing a substrate and having an inlet and an outlet for allowing the substrate to enter and exit;
a support unit positioned in the processing space and supporting the substrate;
a substrate heating unit for heating the substrate;
a shutter member having a door for opening and closing the doorway; and
a heater for heating the door,
wherein the heater is disposed in the processing space adjacent to the door,
the baffle member further includes:
a driver which moves the door between a closed position when the door closes the doorway and an open position when the door opens the doorway, and
the cross-section of the door is provided in an arc shape,
the actuator moves the door between the open position and the closed position by rotating in a length direction of the arc.
16. The substrate processing apparatus of claim 15, wherein,
the shutter member further includes a rotation shaft as a rotation center of the door, and
the driver rotates the door about the rotation axis.
17. The substrate processing apparatus of claim 16, wherein the rotation shaft is disposed within the processing volume.
18. The substrate processing apparatus of claim 16, wherein the heater is disposed in the rotating shaft.
19. The substrate processing apparatus according to any one of claims 15 to 18, wherein the substrate is provided as a rectangular substrate.
20. The substrate processing apparatus according to claim 19, wherein the substrate heating unit is provided at least one of a position corresponding to an upper surface of the substrate and a position corresponding to a lower surface of the substrate.
CN202111086478.7A 2020-09-16 2021-09-16 Substrate processing apparatus Pending CN114267608A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200118932A KR102574308B1 (en) 2020-09-16 2020-09-16 Apparatus for treating a substrate
KR10-2020-0118932 2020-09-16

Publications (1)

Publication Number Publication Date
CN114267608A true CN114267608A (en) 2022-04-01

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Application Number Title Priority Date Filing Date
CN202111086478.7A Pending CN114267608A (en) 2020-09-16 2021-09-16 Substrate processing apparatus

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CN (1) CN114267608A (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004523880A (en) * 2000-09-15 2004-08-05 アプライド　マテリアルズ　インコーポレイテッド Double double slot type load lock for processing equipment
TWM476362U (en) * 2012-09-07 2014-04-11 Applied Materials Inc Load lock chamber with slit valve doors
KR20160039768A (en) * 2014-10-01 2016-04-12 세메스 주식회사 Bake apparatus
KR102076593B1 (en) * 2018-08-21 2020-02-12 세메스 주식회사 Apparatus for treating substrate

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KR102574308B1 (en) 2023-09-05

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