JP3657186B2 - Heat treatment equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a heat treatment apparatus that heats and processes a substrate such as an LCD substrate.
[0002]
[Prior art]
  In the production of a liquid crystal display (LCD), a photoresist liquid is applied to a glass rectangular LCD substrate to form a resist film, the resist film is exposed in accordance with a circuit pattern, and this is developed. A circuit pattern is formed by photolithography. Conventionally, a resist coating / development processing system including a plurality of processing units for performing such a series of steps has been used.
[0003]
  In this resist coating / development processing system, the substrate is subjected to heat treatment by the heat treatment unit after the photoresist is coated on the substrate or before and after development. In such a heat treatment unit, a contact bake in which the substrate is directly placed on the hot plate or a proximity bake in which a slight gap is provided between the hot plate and the substrate is used. Among these, the proximity bake treatment has an advantage that a product defect due to charging of the substrate is avoided because the substrate is not placed directly on the hot plate.
[0004]
  However, the conventional heat treatment unit has a problem that the in-plane temperature of the substrate and the hot plate is difficult to be uniform due to the structure. In particular, in the case of the proximity bake, the uniformity of the in-plane temperature distribution tends to deteriorate. In order to solve this problem, it is conceivable to use a heat treatment apparatus having a hermetic airtight structure and improved temperature distribution uniformity as a heat treatment unit. However, if the heat treatment apparatus has a hermetic airtight structure, a photoresist film Sublimates and volatiles from the water are likely to accumulate, and the maintenance of the apparatus becomes difficult.
[0005]
  Therefore, the heat treatment space formed between the heat plate and the ceiling portion is configured to be openable and closable by a shutter, and a heat treatment device that exhausts in a state where a slight gap is provided between the shutter and the heat plate is a heat treatment. Used as a unit. In this heat treatment apparatus, exhaust is performed while introducing outside air through the gap between the shutter and the hot plate to prevent the resist sublimate and the like from accumulating in the heat treatment space, and maintenance is facilitated by an openable / closable surrounding member. It is configured to be able to do.
[0006]
[Problems to be solved by the invention]
  However, in the heat treatment apparatus as described above, there is a problem that the outside air introduced from the gap between the shutter and the hot plate tends to take away the heat of the hot plate and the substrate and deteriorate the temperature uniformity thereof. . In particular, when such a heat treatment apparatus is used for the heat treatment of an LCD substrate, the four corners of the hot plate and the substrate are easily cooled, and the substrate exhibits a characteristic temperature distribution in which the temperatures at the four corners are low, and the temperature uniformity. Becomes worse.
[0007]
  In order to solve this problem, in the above heat treatment apparatus, a gap is further provided between the cover member and the shutter so that outside air is taken in from this, and the outside air flowing in from the gap between the hot plate and the shutter. Measures are taken to reduce the amount of However, if such measures are taken, there is a problem that the substrate is easily affected by outside air (downflow), and the stability of the temperature distribution is deteriorated. In particular, in this case, individual differences among a plurality of heat treatment apparatuses tend to occur.
[0008]
  The present invention has been made in view of such circumstances, and resist sublimates and the like are not easily accumulated in the apparatus, and it is possible to prevent the temperature distribution of the substrate to be processed from becoming unstable due to intrusion of outside air. It is an object of the present invention to provide a heat treatment apparatus capable of controlling the temperature of a treatment substrate with high accuracy.
[0009]
[Means for Solving the Problems]
  In order to solve the above problems, according to a first aspect of the present invention,
  A hot plate on which the substrate to be processed is placed or heated, and heats the substrate to be processed;
  A surrounding member provided so as to be able to surround a heat treatment space for heat-treating the substrate to be treated defined above the hot plate;
  A seal mechanism for substantially sealing the periphery of the hot plate when the heat treatment space is surrounded by the surrounding member;
  An air flow forming means for forming an air flow from the outer periphery toward the center in the heat treatment space;
Equipped withAnd
  The surrounding member is arranged to be movable up and down, and surrounds the heat treatment space when ascending.The heat processing apparatus characterized by this is provided.
[0010]
  According to such a configuration, since the outside of the hot plate is substantially sealed to prevent intrusion of outside air from the gap around the hot plate, the temperature of the substrate to be processed varies due to intrusion of undesired outside air. It is possible to prevent the temperature distribution and the temperature distribution from becoming unstable, and to form an air flow from the outer periphery to the center in the heat treatment space, so that the temperature of the substrate to be processed can be made uniform. Therefore, the substrate temperature can be controlled with high accuracy. In addition, accumulation of sublimates can be prevented by the airflow formed.In addition, the above-mentioned surrounding member is disposed so as to be able to move up and down, and by configuring the heat treatment space so as to be able to surround at the time of ascent, when performing heat treatment, the surrounding member can be raised to surround the heat treatment space, And when performing maintenance, the maintainability of the apparatus can be improved by lowering the surrounding member.
[0011]
  The inventors of the present invention have previously proposed a heat treatment apparatus that forms an air flow from the center of the hot plate to the outer periphery by substantially sealing the periphery of the hot plate, thereby making the temperature distribution of the substrate to be processed uniform.・ It is said that the substrate temperature can be stabilized and the substrate temperature can be increased. However, although a certain amount of effect can be obtained by forming an air flow from the center to the outer periphery, if an air flow from the center to the outer periphery is formed, air tends to flow unevenly in the center in the longitudinal direction of the substrate, making it difficult to balance exhaust It has been found that a local temperature drop may occur in the central part of the long side of the peripheral edge of the substrate. Therefore, in the present invention, it is easy to balance the exhaust gas by forming an air flow from the outer periphery to the center, thereby preventing a local temperature drop of the substrate and realizing highly accurate temperature control.
[0012]
  The airflow forming means of the heat treatment apparatus is provided above the heat treatment space, and is provided above the heat treatment space with an outside air introduction unit for introducing outside air into the heat treatment space. An exhaust part for exhausting the space, an exhaust mechanism for exhausting the heat treatment space through the exhaust part, and an upper part of the heat treatment space are arranged so as to face the hot plate, and an opening is provided at the center thereof. And when the exhaust mechanism is operated, the outside air introduced from the outside air introduction section is arranged along the upper surface of the first rectifying plate, and the outer periphery of the heat treatment space. Preferably, the gas is exhausted from the exhaust section through the opening of the first rectifying plate, from the outer peripheral side of the heat treatment space to the center along the lower surface of the first rectifying plate. Can be used.
[0013]
  By using such airflow forming means, an airflow from the outer periphery to the center can be effectively formed in the heat treatment space, and outside air can be introduced while exhausting. Accumulation of resist sublimates and the like can be prevented very effectively.
[0014]
  Further, by providing a second rectifying plate disposed so as to face the opening of the first rectifying plate between the first rectifying plate and the heat plate of the air flow forming means, air around the opening is provided. Therefore, the temperature of the substrate to be processed and the hot plate can be made uniform and controlled with high accuracy.
[0015]
  According to a second aspect of the invention,
A hot plate on which the substrate to be processed is placed or heated, and heats the substrate to be processed;
A surrounding member provided so as to be able to surround a heat treatment space for heat-treating the substrate to be treated defined above the hot plate;
A seal mechanism for substantially sealing the periphery of the hot plate when the heat treatment space is surrounded by the surrounding member;
An air flow forming means for forming an air flow from the outer periphery toward the center in the heat treatment space;
Comprising
The airflow forming means includes
An outside air introduction section provided above the heat treatment space, for introducing outside air into the heat treatment space;
An exhaust unit provided above the heat treatment space, for exhausting the heat treatment space;
An exhaust mechanism for exhausting the heat treatment space through the exhaust unit;
A first rectifying plate disposed above the heat treatment space so as to face the hot plate and having an opening formed in the center thereof;
Have
When the exhaust mechanism is operated, the outside air introduced from the outside air introduction portion reaches the outer peripheral side of the heat treatment space along the upper surface of the first rectifying plate, and further, the lower surface of the first rectifying plate. From the outer peripheral side of the heat treatment space to the center, and exhausted from the exhaust part through the opening of the first rectifying plate,
The airflow forming means has a second rectifying plate disposed between the first rectifying plate and the heat plate so as to face an opening formed in the rectifying plate. A processing device is provided.
[0016]
  In the air flow forming means, the substrate to be processed is heated from both the hot plate side and the rectifying plate side by applying a highly reflective surface finish to the surface of the first rectifying plate on the hot plate side. And the substrate to be processed can be efficiently heated.
[0017]
  In the second rectifying plate, the surface on the heat plate side is subjected to a surface finish with low reflectivity, so that the second rectifying plate reflects the heat from the heat plate and is locally high on the substrate to be processed. It can prevent that a part arises.
[0018]
  Furthermore, the upper part of the heat treatment space can be covered with a cover member, and the gap below the hot plate and the gap between the cover member and the surrounding member can be closed with a sealing mechanism. Thereby, intrusion of outside air around the hot plate can be prevented.
[0019]
  Furthermore, by disposing a reflecting plate that reflects heat from the hot plate so as to cover the lower surface and the side surface of the hot plate, the heat from the hot plate can be effectively used for the heat treatment. In this case, it is possible to effectively prevent intrusion of outside air around the hot plate by closing the gap between the reflecting plate and the surrounding member by the sealing mechanism.
[0020]
  As a sealing mechanism, a pair of engaging members that are disposed on the outer peripheral side of the reflector and the inner peripheral lower portion of the surrounding member and engage with each other when the surrounding member is raised, the lower portion of the cover member, and the upper portion of the surrounding member And a pair of abutting members that abut against each other when the surrounding member is raised.
[0021]
  In the sealing mechanism, at least one of the engaging members is provided with an elastic member at a position that engages with the other engaging member, and at least one of the contacting members is in a position that comes into contact with the other contacting member. By disposing the elastic member, it is possible to effectively prevent the outside air from entering the heat treatment space.
[0022]
  First of the present invention3From the point of view
  A substrate to be processed is disposed on or above the substrate, and a heat plate for heating the substrate to be processed;
  A surrounding member provided so as to be able to surround a heat treatment space for heat-treating the substrate to be processed defined above the hot plate;
  A cover member covering the upper part of the heat treatment space;
  A sealing mechanism that closes a gap between the hot plate and the surrounding member and a gap between the cover member and the surrounding member when the heating processing space is surrounded by the surrounding member;
  A duct member provided at an outer central portion of the cover member, and having an outside air introduction portion for introducing outside air and an exhaust portion for exhausting the heat treatment space;
  An exhaust mechanism for exhausting the heat treatment space through the exhaust unit;
  A first rectifying plate disposed above the heat treatment space so as to face the hot plate and having an opening formed in the center thereof;
Comprising
  When the exhaust mechanism is operated, the outside air introduced from the outside air introduction portion reaches the outer peripheral side of the heat treatment space along the upper surface of the first rectifying plate, and further, the lower surface of the first rectifying plate. Along the direction from the outside to the center of the heat treatment space and exhausted from the exhaust part of the duct member through the opening of the first rectifying plate.,
  The surrounding member is arranged to be movable up and down, and surrounds the heat treatment space when ascending.The heat processing apparatus characterized by this is provided.
[0023]
  According to such a configuration, in the state where the heat treatment space is substantially sealed by the sealing mechanism, the heat treatment space is exhausted through the exhaust portion of the duct member, and the outside air is introduced from the outside air introduction portion, and the first rectification is performed. Since an air flow from the outer periphery to the center is formed along the lower surface of the plate, it becomes easy to balance the exhaust, and the atmosphere in the heat treatment space is replaced with the outside air without destabilizing the temperature distribution of the substrate. Accumulation can be prevented, the temperature of the substrate to be processed can be made uniform, and the substrate temperature can be controlled with high accuracy.In addition, the above-mentioned surrounding member is disposed so as to be able to move up and down, and by configuring the heat treatment space so as to be able to surround at the time of ascent, when performing heat treatment, the surrounding member can be raised to surround the heat treatment space, And when performing maintenance, the maintainability of the apparatus can be improved by lowering the surrounding member.
[0024]
  Here, a second rectifying plate is disposed between the first rectifying plate and the heat plate so as to face the opening of the first rectifying plate, and air from the heat treatment space is supplied to the first rectifying plate. It is preferable to flow through the gap between the first rectifying plate and the second rectifying plate. Thereby, the air flow around the opening of the first rectifying plate can be adjusted, and the substrate temperature can be prevented from becoming non-uniform.
[0025]
  According to a fourth aspect of the invention,
A substrate to be processed is disposed on or above the substrate, and a heat plate for heating the substrate to be processed;
An enclosing member provided so as to enclose a heat treatment space for heat-treating the substrate to be treated defined above the hot plate;
A cover member covering the upper part of the heat treatment space;
A sealing mechanism that closes a gap between the hot plate and the surrounding member and a gap between the cover member and the surrounding member when the heating processing space is surrounded by the surrounding member;
A duct member provided at an outer central portion of the cover member, and having an outside air introduction portion for introducing outside air and an exhaust portion for exhausting the heat treatment space;
An exhaust mechanism for exhausting the heat treatment space through the exhaust unit;
A first rectifying plate disposed above the heat treatment space so as to face the hot plate and having an opening formed in the center thereof;
Comprising
When the exhaust mechanism is operated, the outside air introduced from the outside air introduction portion reaches the outer peripheral side of the heat treatment space along the upper surface of the first rectifying plate, and further, the lower surface of the first rectifying plate. From the outside of the heat treatment space to the center, exhausted from the exhaust portion of the duct member through the opening of the first rectifying plate,
A second baffle plate is further disposed between the first baffle plate and the heat plate so as to face an opening formed in the first baffle plate, and the exhaust mechanism is operated. In this case, there is provided a heat treatment apparatus in which air from the heat treatment space flows through the gap between the first rectifying plate and the second rectifying plate to the opening of the first rectifying plate. Is done.
[0026]
  The duct member has a cylindrical member connected to the heat treatment space at the center, and air from the heat treatment space is exhausted from the exhaust part through the cylindrical member, and the air introduced from the outside air introduction part is the cylindrical member. It can comprise so that it may be supplied to heat processing space through the outer side. Thereby, exhaust of air from the heat treatment space and introduction of air into the heat treatment space can be effectively performed, and a desired airflow can be formed in the heat treatment space.
[0027]
  In addition, a flow path is formed between the cover member and the first rectifying plate, and the outside air introduced from the outside air introduction portion passes through this flow path and reaches the heat treatment space, thereby allowing the outside air to flow. Since it can be supplied to the heat treatment space after being heated in the flow path, the influence of outside air on the temperature of the substrate and hot plate can be further reduced, so the temperature of the substrate and hot plate is controlled with high accuracy. Preferred above.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a plan view showing a resist coating / development processing system for an LCD substrate to which the present invention is applied.
  This resist coating / development processing system includes a cassette station 1 on which a cassette C that accommodates a plurality of LCD substrates G is placed, and a plurality of processing units for performing a series of processes including resist coating and development on the substrates G. The processing unit 2 and an interface unit 3 for transferring the substrate G between the exposure apparatus (not shown) are provided. The cassette station 1 and the interface unit 3 are arranged at both ends of the processing unit 2, respectively. Has been.
[0029]
  The cassette station 1 includes a transport mechanism 10 for transporting the LCD substrate G between the cassette C and the processing unit 2. Then, the cassette C is loaded and unloaded at the cassette station 1. Further, the transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the arrangement direction of the cassette C, and the transport arm 11 transports the substrate G between the cassette C and the processing unit 2. Is done.
[0030]
  The processing section 2 is divided into a front stage section 2a, a middle stage section 2b, and a rear stage section 2c. Each of the processing sections 2 has transport paths 12, 13, and 14 at the center, and each processing unit is disposed on both sides of these transport paths. Yes. And between these, the relay parts 15 and 16 are provided.
[0031]
  The front section 2a includes a main transport device 17 that can move along the transport path 12, and two cleaning units (SCRs) 21a and 21b are arranged on one side of the transport path 12, and the transport path On the other side of FIG. 12, a processing block 25 in which an ultraviolet irradiation unit (UV) and a cooling processing unit (COL) are stacked in two stages, a processing block 26 in which a heating processing unit (HP) is stacked in two stages, and cooling. A processing block 27 in which processing units (COL) are stacked in two stages is arranged.
[0032]
  The middle stage 2 b includes a main transfer device 18 that can move along the transfer path 13. On one side of the transfer path 13, a resist coating processing unit (CT) 22 and a resist on the peripheral edge of the substrate G are provided. The peripheral resist removing unit (ER) 23 for removing the substrate is integrally provided, and on the other side of the conveyance path 13, the processing block 28 in which the heating processing units (HP) are stacked in two stages, the heating processing unit A processing block 29 in which (HP) and a cooling processing unit (COL) are vertically stacked and a processing block 30 in which an adhesion processing unit (AD) and a cooling processing unit (COL) are vertically stacked are arranged. Yes.
[0033]
  Further, the rear stage portion 2 c includes a main transport device 19 that can move along the transport path 14, and three development processing units 24 a, 24 b, 24 c are arranged on one side of the transport path 14, A processing block 31 in which heat treatment units (HP) are stacked in two stages on the other side of the conveyance path 14, and a processing block in which heat processing units (HP) and cooling processing units (COL) are both stacked vertically. 32 and 33 are arranged.
[0034]
  The processing unit 2 has only spinner units such as a cleaning processing unit 21a, a resist coating processing unit (CT) 22 and a development processing unit (DEV) 24a on one side across the conveyance path. Only the heat treatment unit such as the heat treatment unit or the cooling treatment unit is arranged on the other side.
[0035]
  Further, a chemical liquid supply unit 34 is disposed at a portion of the relay portions 15 and 16 on the spinner system unit arrangement side, and a space 35 for performing maintenance of the main transfer device is further provided.
[0036]
  The main transfer devices 17, 18, and 19 each include a two-direction X-axis drive mechanism, a Y-axis drive mechanism, and a vertical Z-axis drive mechanism in a horizontal plane, and further rotate around the Z-axis. A driving mechanism is provided, and transport arms 17a, 18a, and 19a that support the substrate G are provided.
[0037]
  The main transfer device 17 transfers the substrate G to and from the transfer arm 11 of the transfer mechanism 10, loads / unloads the substrate G to / from each processing unit of the front-stage unit 2 a, and also connects to the relay unit 15. It has a function of delivering the substrate G. The main transfer device 18 transfers the substrate G to and from the relay unit 15, and loads and unloads the substrate G to / from each processing unit of the middle stage 2 b, and further transfers the substrate G to and from the relay unit 16. It has a function to perform. Further, the main transfer device 19 transfers the substrate G to and from the relay unit 16, loads and unloads the substrate G to / from each processing unit of the rear-stage unit 2 c, and transfers the substrate G to and from the interface unit 3. It has a function to perform. The relay parts 15 and 16 also function as cooling plates.
[0038]
  The interface unit 3 includes an extension 36 that temporarily holds a substrate when the substrate is transferred to and from the processing unit 2, two buffer stages 37 that are provided on both sides of the substrate and that are provided with buffer cassettes, and these And a transfer mechanism 38 that carries in and out the substrate G between the exposure apparatus (not shown). The transport mechanism 38 includes a transport arm 39 that can move on a transport path 38 a provided along the arrangement direction of the extension 36 and the buffer stage 37. The transport arm 39 allows the substrate G to be transferred between the processing unit 2 and the exposure apparatus. Is carried out.
[0039]
  By consolidating and integrating the processing units in this way, it is possible to save space and improve processing efficiency.
[0040]
  In the resist coating / development processing system configured as described above, the substrate G in the cassette C is transported to the processing unit 2, and the processing unit 2 firstly includes an ultraviolet irradiation unit (UV) of the processing block 25 of the preceding stage 2 a. ) Is subjected to surface modification / cleaning processing and cooled by a cooling processing unit (COL), and then scrubber cleaning is performed by cleaning units (SCR) 21a and 21b. After being heated and dried by HP), it is cooled by one of the cooling processing units (COL) in the processing block 27.
[0041]
  Thereafter, the substrate G is transported to the middle stage 2b and subjected to a hydrophobic treatment (HMDS process) in the upper adhesion processing unit (AD) of the processing block 30 in order to improve the fixing property of the resist, and the lower cooling processing unit ( After cooling by COL), a resist is applied by a resist application processing unit (CT) 22, and excess resist on the periphery of the substrate G is removed by a peripheral resist removal unit (ER) 23. Thereafter, the substrate G is pre-baked by one of the heat processing units (HP) in the middle stage 2b and cooled by the lower cooling processing unit (COL) of the processing block 29 or 30.
[0042]
  Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. And the board | substrate G is again carried in via the interface part 3, and after performing a post-exposure baking process in the heat processing unit (HP) of the process blocks 31, 32, and 33 of the back | latter stage part 2c as needed, Development processing is performed in one of the development processing units (DEV) 24a, 24b, and 24c, and a predetermined circuit pattern is formed. The developed substrate G is post-baked by any one of the heat treatment units (HP) in the rear stage 2c, and then cooled by any one of the cooling processing units (COL). , 18, 17 and the transport mechanism 10 are accommodated in a predetermined cassette C on the cassette station 1.
[0043]
  Next, a heat treatment unit (HP) to which the heat treatment apparatus of the present invention used in the processing blocks 26, 28, 31, 32, 33 of the resist coating / development processing system is applied will be described. FIG. 2 is a schematic cross-sectional view of the heat treatment unit according to the first embodiment of the present invention. 3 is a schematic view showing a state of the AA cross section of FIG. 2 as viewed from above, and FIG. 4 is a schematic view of a state of the BB cross section of FIG. 2 as viewed from above.
[0044]
  As shown in FIGS. 2 to 4, this heat treatment unit (HP) mainly includes a case 60 having an opening 60 a facing the conveyance path 12, 13 or 14 side of the resist coating / development processing system, and a case A heat plate 41 for heating the substrate G accommodated in the substrate 60, a cover member 57 disposed so as to cover the upper portion of the case 60, and a heat treatment space 65 formed between the cover member 57 and the heat plate 41. A shutter (going member) 48 that can be surrounded, a first rectifying plate 54 and a second rectifying plate 55 that are disposed above the heat treatment space 65 so as to face the heat plate 41, an outside air introducing portion 59, and exhaust gas. A duct member 66 having a portion 58, and an exhaust mechanism 76 provided in an exhaust pipe 58 a connected to the exhaust portion 58. Among these, the outside air introduction portion 59, the exhaust portion 58, the exhaust mechanism 76, the first rectifying plate 54, and the second rectifying plate 55 constitute an air flow forming means that forms an air flow described later. The second rectifying plate 55 is used to prevent the airflow from being disturbed near the opening 53 and to prevent the opening 53 from adversely affecting the temperature distribution of the substrate G and the heat plate 41. It is provided for the purpose, and is not essential for forming the airflow described later.
[0045]
  The hot plate 41 is made of, for example, an aluminum alloy or the like, and has a rectangular upper surface according to the shape of the substrate G. A heater and a temperature sensor (not shown) are embedded on the back side of the hot plate 41, and the temperature detected by the temperature sensor is transmitted to a control unit (not shown), and the heating value of the heater is adjusted accordingly. The temperature of the hot plate 41 is maintained at a predetermined temperature of 120 to 150 ° C., for example.
[0046]
  For example, nine through holes 43 are provided in the hot plate 41. Support pins 44 for supporting the substrate G are inserted into the through holes 43. The support pin 44 is held by a holding member 46 provided below the hot plate 41. The holding member 46 is connected to the holding member lifting mechanism 47. Therefore, the support pin 44 can protrude and retract with respect to the surface of the hot plate 41 by raising and lowering the holding member 46 by the holding member raising and lowering mechanism 47.
[0047]
  When the substrate G is transferred between the heat treatment unit (HP) apparatus and the transfer arms 17a, 18a, 19a, the holding member 46 is raised by the holding member lifting mechanism 47, and the support pin 44 is heated. As a state of protruding from the surface of the plate 41, the substrate G is transferred between the transfer arms 17a, 18a, 19a and the support pins 44.
[0048]
  When the heat treatment is performed after receiving the substrate G, the holding member lifting mechanism 47 lowers the holding member 46 by a predetermined distance, and the substrate G is set to a predetermined position. For example, in the case of contact baking in which heating is performed while the substrate G is in contact with the hot plate 41, the support pins 44 are completely immersed from the surface of the hot plate 41, and the substrate G is placed directly on the hot plate 41. In this manner, heat treatment may be performed. Further, in the case of proximity baking in which heating is performed in a state where the substrate G is not in contact with the hot plate 41 and is supported above the support plate 44, the support pins 44 protrude from the surface of the hot plate 41 by a predetermined length. The heat treatment may be performed, or the heat treatment may be performed with a space between the substrate G and the hot plate 41 secured by a spacer (not shown).
[0049]
  Below the heat plate 41, a reflection plate 42 that reflects heat from the heat plate 41 is disposed. The reflection plate 42 covers not only the lower surface but also the side surface of the heat plate 41, that is, the reflection plate 42 has a shape like a thin container for storing the heat plate 41. The reflecting plate 42 and the hot plate 41 are arranged at a predetermined interval by a spacer (not shown), and a sealing member 42a for preventing the intrusion of outside air from below the hot plate is provided between the reflecting plate 42 and the hot plate 41. Has been placed. The shape of the reflecting plate 42 and the positional relationship between the reflecting plate 42 and the heat plate 41 are appropriately determined according to the heat generation pattern of the heater disposed on the heat plate 41 and the temperature pattern required for the heat plate 41. The seal member 42a can be made of, for example, silicon rubber.
[0050]
  The first current plate 54 is provided above the heat treatment space 65 so as to face the heat plate 41, and an opening 53 is provided at a position corresponding to the center of the heat plate 41. The first rectifying plate 54 is formed in a rectangular shape in accordance with the shape of the heat plate 41 or the substrate G. If the surface of the first rectifying plate 54 on the heat plate 41 side is subjected to a surface finish with high reflectivity such as mirroring or plating, the heat radiated from the heat plate 41 is reflected by the first rectifying plate 54, and the substrate G is preferred because it can be efficiently heated from both sides.
[0051]
  The second rectifying plate 55 is disposed between the first rectifying plate 54 and the heat plate 41 so as to be opposed to the opening 53 provided in the first rectifying plate 54, and more than the opening 53. It is a little bigger. The second rectifying plate 55 is formed in a rectangular shape according to the shape of the heat plate 41, and the second rectifying plate 55 and the heat plate 41 are substantially similar to each other as shown in FIG. Thus, the heat treatment can be performed uniformly in the surface. Further, the shape of the opening 53 and the second rectifying plate 55 are substantially similar. Further, if the reflectance of the second rectifying plate 55 is increased, the temperature of the substrate G may be locally increased by the heat reflected by the second rectifying plate 55. The surface on the 41st side is preferably provided with a surface finish that lowers the reflectance, such as making the surface black.
[0052]
  The cover member 57 is disposed above the first rectifying plate 54 so as to cover the upper portion of the heat treatment space 65, and the duct member 66 is provided at the upper center of the cover member 57. The duct member 66 has an upper part 66a and a lower part 66b. Two exhaust parts 58 are provided in the upper part 66a, and two outside air introduction parts 59 are provided in the lower part 66b. The duct member 66 has a cylindrical member 56 that extends from the bottom of the upper portion 66 a to the lower portion 66 b and reaches the opening 53 of the first rectifying plate 54 at the center thereof. The two exhaust parts 58 are provided side by side on one side wall of the upper part 66a, and the outside air introduction part 59 is provided opposite to the side surface of the lower part 66b with the cylindrical member 56 interposed therebetween.
[0053]
  The lower part of the cylindrical member 56 is inserted into a hole 57 a formed at the center of the cover member 57 and configured to be larger than the cylindrical member 56. Accordingly, a gap 56 a is formed between the cover member 57 and the cylindrical member 56 at that portion. Therefore, the outside air introduced from the outside air introduction part 59 reaches the heat treatment space 65 through the gap 56a, and the gap 56a functions as an outside air introduction path. On the other hand, the inside of the cylindrical member 56 is connected to the heat treatment space 65 through the opening 53 and functions as an exhaust path.
[0054]
  An exhaust pipe 58a is connected to the exhaust part 58, and the exhaust mechanism 76 is connected to the exhaust pipe 58a. Therefore, by operating the exhaust mechanism 76, the outside air reaches the heat treatment space 65 from the outside air introduction portion 59 through the gap 56a, and from the heat treatment space 65 to the inside of the tubular member 56, the space in the upper portion 66a, the exhaust portion. 58 is exhausted.
[0055]
  The shutter 48 is arranged to be movable up and down so as to surround the heat plate 41 and the reflection plate 42. A shutter elevating mechanism 49 is connected to the shutter 48, and the shutter 48 can be raised or lowered by driving the shutter elevating mechanism 49. When the substrate G is transferred to or from the transfer arms 17a, 18a, or 19a, the shutter 48 is moved down by the shutter lifting mechanism 49, and when the substrate G is heated, the shutter is lifted. The shutter 48 is raised by the mechanism 49 to surround the heat treatment space 65 formed between the cover member 57 and the heat plate 41. If the shutter 48 is in the lowered state, the apparatus can be easily maintained.
[0056]
  Here, a first contact member 61 is disposed at the upper end portion of the shutter 48, and a second contact member 63 is disposed on the outer peripheral side of the lower surface of the cover member 57. An elastic member 64 is attached to the lower surface of the member 63. When the shutter 48 is raised, the first contact member 61 and the second contact member 63 contact each other via the elastic member 64 and seal between the shutter 48 and the cover member 57. Thus, outside air is prevented from entering between the shutter 48 and the cover member 57 during the heat treatment.
[0057]
  On the other hand, a first engagement member 51 is disposed on the inner lower portion of the shutter 48 so as to protrude toward the inner periphery, and an elastic member 50 is attached to the upper surface of the first engagement member 51. Yes. Further, the second engaging member 45 is disposed on the reflecting plate 42 so as to protrude toward the outer periphery. The first engagement member 51 and the second engagement member 45 are engaged with each other via the elastic member 50 when the shutter 48 is raised, and the shutter 48 and the reflection plate 42 are sealed. It is configured to prevent outside air from entering between the shutter 48 and the reflection plate 42 during the heat treatment.
[0058]
  Next, a processing operation when performing the heat treatment of the substrate G using the heat treatment apparatus according to this embodiment will be described with reference to FIG. First, the support pins 44 are projected from the surface of the hot plate 41 with the shutter 48 lowered. Next, the transfer arms 17 a, 18 a, 19 a holding the substrate G are advanced from the opening 60 a, and the substrate G is transferred onto the support pins 44. Next, after the transfer arms 17a, 18a, and 19a are retracted from the opening 60a, the shutter 48 is raised by the shutter elevating mechanism 49 to substantially seal the periphery of the hot plate 41, and the support pins 44 are moved from the surface of the hot plate. The substrate G is placed in a predetermined position by being immersed for a predetermined length, and the substrate G is heated by the hot plate 41 while evacuating by operating the exhaust mechanism 76.
[0059]
  By operating the exhaust mechanism 76, the atmosphere in the heat treatment space 65 is exhausted from the exhaust part 58, and the outside air is introduced into the heat treatment space 65 from the outside air introduction part 59. By introducing the outside air while exhausting in this way, the outside air introduced from the outside air introducing portion 59 is introduced into the first rectifying plate 54 and the cover member 57 from the gap 56 a between the cylindrical member 56 and the cover member 57. , Flows along the upper surface of the first rectifying plate 54 to the outer peripheral side of the heat treatment space 65, and then along the lower surface of the first rectifying plate 54 from the outer periphery to the center of the heat treatment space. An air flow is formed that flows to the opening 53 through the gap between the first rectifying plate 54 and the second rectifying plate 55. In FIG. 6, this air flow is indicated by a dotted line, and an arrow is attached to the direction in which the air flow flows.
[0060]
  In the heat treatment apparatus according to this embodiment, the shutter 48 is raised as described above to perform the heat treatment with the periphery of the hot plate 41 in a substantially sealed state. Outside air does not enter from the gap, and it is possible to prevent the outside air from deteriorating or destabilizing the temperature distribution of the substrate G. Further, as described above, the air flows from the outside to the center of the heat treatment space along the lower surface of the first rectifying plate 54, and the air flow from the outer periphery to the center is formed, so that the temperature of the substrate G is locally determined. Can be prevented, and the temperatures of the substrate G and the hot platen 41 can be controlled with high accuracy. Further, by performing the heat treatment while replacing the atmosphere in the heat treatment space 65, the heat treatment can be performed in a state where resist sublimates and the like are not easily accumulated.
[0061]
  In the above heat treatment apparatus, exhaust air is introduced from the outside air introduction part 59 and outside air is introduced from the opening 53, and when the air flow is formed in the direction opposite to that of the present invention, the substrate G and the heat A local low temperature portion is likely to be generated in the central portion of the long side of the peripheral portion of the plate 41, and it is difficult to control the temperature of the substrate G with high accuracy.
[0062]
  On the other hand, when the air flow from the outer periphery to the center is formed as in the heat treatment apparatus according to this embodiment, the temperature of the substrate G and the hot plate 41 does not locally deviate. This is because when the air flow from the center toward the outer periphery is formed, the exhaust gas balance is difficult to balance, and the air flow is likely to be biased.Therefore, this air flow bias causes a local temperature bias. In the case of forming an air flow toward the center, it is considered that it is easy to balance the exhaust gas, and it is relatively easy to form a uniform air flow, and there is no local temperature deviation in the substrate and the heat plate.
[0063]
  In order to confirm this, in-plane variation in the heating state of the hot platen 41 was measured when an air flow from the outer periphery to the center was formed in the heat treatment apparatus and when an air flow from the center to the outer periphery was formed. That is, as shown in FIG. 7, the hot plate 41 is divided into nine regions 101 to 109, and 1.37 m.³Exhaust is performed at an exhaust rate of / min, and the hot plate 41 is heated while forming either an air flow from the outer periphery to the center or an air flow from the center to the outer periphery, and the time-dependent change in the hot plate temperature in each region 101 to 109 Was measured. The measurement results are shown in FIG. FIG. 8A shows a case where an air flow from the center toward the outer periphery is formed, and FIG. 8B shows a case where an air flow from the outer periphery toward the center is formed. From FIG. 8, it was confirmed that the temperature variation in the surface of the hot plate 41 is less when the air flow from the outer periphery to the center is formed than when the air flow from the center to the outer periphery is formed. In the heat treatment apparatus, the heating state of the substrate G behaves almost similar to the heating state of the hot plate. Therefore, the measurement result shows that the temperature variation in the plane is more when the air flow from the outer periphery to the center is formed. It shows that a small amount of heat treatment can be applied to the substrate G.
[0064]
  In the heat treatment apparatus according to this embodiment, the outside air introduced from the outside air introduction unit 59 is formed by using the first rectifying plate 54 to form an air flow from the outer periphery to the center of the heat treatment space as described above. Is easy to disperse toward the entire outer periphery of the heat treatment space 65, can form a substantially uniform air flow along the surface of the first rectifying plate 54 on the heat plate 41 side, and is a substrate generated by the bias of the air flow G and local temperature deviation of the heat plate 41 can be effectively prevented.
[0065]
  Further, by forming the airflow as described above using the first rectifying plate 54, the outside air reaches the heat plate 41 side after being warmed in the gap between the first rectifying plate 54 and the upper cover 57. The thermal influence which external air has on the board | substrate G and the hot platen 41 can be made small.
[0066]
  Further, since the second rectifying plate 55 is disposed opposite to the opening 53 of the first rectifying plate 54, the air current is prevented from being disturbed in the vicinity of the opening 53, and the opening 53 is formed on the substrate G or the like. An adverse effect on the temperature distribution of the hot plate 41 is prevented.
[0067]
  Next, a second embodiment of the present invention will be described.
  In the heat treatment unit (HP) to which the heat treatment apparatus according to the present embodiment is applied, the liquid 71 is stored along the inner periphery of the shutter 48 as shown in FIG. In some cases, the protrusion 75 provided on the outer periphery of the reflection plate 42 is submerged in the liquid 71, and the shutter 48 and the reflection plate 42 are sealed by the protrusion 75 and the liquid 71. Even with such a configuration, the space between the shutter 48 and the reflecting plate 42 can be sufficiently sealed, and intrusion of outside air from this portion can be prevented. Further, a shaft sealing member may be interposed between the through hole 43 provided in the hot plate 41 and the support pin 44 so as to seal between the through hole 43 and the support pin 44.
[0068]
  Next, a third embodiment of the present invention will be described.
  FIG. 10 is a schematic cross-sectional view of a heat treatment unit (HP) to which the heat treatment apparatus according to this embodiment is applied. In the present embodiment, the heat treatment is performed while changing the exhaust amount as a configuration in which the exhaust amount from the heat treatment space can be changed.
[0069]
  As shown in FIG. 10, the basic configuration of this heat treatment unit (HP) is the same as that of the heat treatment unit according to the first embodiment, but in this embodiment, the second rectifying plate 155 is a lifting mechanism 156. This is different from the first embodiment in this respect. The distance between the first rectifying plate 54 and the second rectifying plate 155 can be changed by raising and lowering the second rectifying plate 155 by the elevating mechanism 156, thereby adjusting the exhaust amount from the opening 53. be able to. That is, by lowering the second rectifying plate 155, the distance between the first rectifying plate 54 and the second rectifying plate 155 can be increased to increase the displacement, and the second rectifying plate 155 is raised. By doing so, the distance between the first rectifying plate 54 and the second rectifying plate 155 can be narrowed to reduce the exhaust amount. Further, the exhaust from the opening 53 can be stopped by raising the second rectifying plate 155 to a position where the opening 53 is blocked.
[0070]
  With such a configuration, for example, the amount of exhaust can be reduced by gradually raising the second rectifying plate 155 as time elapses during the heat treatment, and the exhaust is stopped during the heat treatment. Can do. In such a process, the resist sublimate can be discharged out of the heat treatment space by exhausting at the start of the heat treatment, and almost all of the resist sublimate is discharged out of the heat treatment space after a predetermined time. The substrate G can be efficiently heat-treated without being affected by the airflow generated in the heat-treatment space by reducing or stopping the exhaust amount at the same time.
[0071]
  Next, a fourth embodiment of the present invention will be described.
  FIG. 11 is a schematic cross-sectional view of a heat treatment unit (HP) to which the heat treatment apparatus according to this embodiment is applied, and FIG. 12 is an enlarged top view of the second rectifying plate 255.
[0072]
  As shown in FIG. 11, this heat treatment unit (HP) has a basic configuration similar to that of the heat treatment unit according to the first embodiment, in addition to the second current plate 255 on the first current plate 54 side. A plurality (eight in the figure) of plate-like bodies 253 are provided radially on the surface. By adopting such a structure, it is possible to reduce the bias of the heat exhaust from the second rectifying plate 255 to the exhaust portion 58, and thereby the surface of the substrate G and the first rectifying plate 54 caused by the bias of the airflow can be reduced. The thermal influence received can be reduced. From such a viewpoint, for example, as shown in FIG. 13, a plate-like body 253 ′ having a structure in which the height gradually increases toward the center of the second rectifying plate 255 may be provided. As shown in (a) and (b), four plate-like bodies 253 ″ arranged radially so as to cross each other at the center of the second rectifying plate 255 may be provided.
[0073]
  Next, a fifth embodiment of the present invention will be described.
  FIG. 15 is a schematic cross-sectional view of a heat treatment unit (HP) to which the heat treatment apparatus according to this embodiment is applied. As shown in FIG. 15, this heat treatment unit (HP) has the same basic configuration as the heat treatment unit (HP) according to the first embodiment, but the upper end of the tubular member 356 is more than the bottom of the exhaust part 358. It is configured to be high.
[0074]
  When the upper end of the cylindrical member is configured to be the same height as the bottom of the exhaust part as in the above-described embodiment, the exhaust part extends from the upper end of the cylindrical member 56 as shown by the arrows in FIGS. There is a possibility that a direct air flow is generated toward 58, the temperature of the portion in contact with the air flow locally rises, and a heat bias occurs in the exhaust unit 58. On the other hand, when the upper end of the cylindrical member 356 is configured to be higher than the bottom of the exhaust part 358 as in the present embodiment, the exhaust gas that has passed through the cylindrical member 356 is directed horizontally. Since the flow is changed, no direct airflow is generated from the upper end of the tubular member 356 toward the exhaust part 358, and a heat bias in the exhaust part 358 can be prevented. In this case, it is desirable that the upper end of the cylindrical member 356 be higher than the central portion of the exhaust part 358. On the other hand, if the upper end of the tubular member 356 is made higher than the uppermost part of the exhaust part 358, the exhaust pressure loss increases. Therefore, it is desirable that the upper end of the tubular member 356 be lower than the uppermost part of the exhaust part 358. .
[0075]
  Next, a sixth embodiment of the present invention will be described.
  In the heat treatment unit (HP) to which the heat treatment apparatus according to the present embodiment is applied, by providing a positioning roller for positioning the substrate G on the hot plate 41, the substrate G is accurately positioned to perform the heat treatment. Like that. FIG. 18 is a perspective view of the positioning roller in the present embodiment, FIG. 19 is a plan view showing a position where the positioning roller is arranged on the hot plate 41, and FIG. 20 is a diagram when the substrate G is positioned by the positioning roller. It is explanatory drawing for demonstrating operation | movement.
[0076]
  As shown in FIG. 18, the positioning roller 400 includes a roller 401, and a support body 403 that is provided with a guide 402 that guides the position of the substrate G at the lower portion and rotatably supports the roller 401. As shown in FIG. 19, two places are arranged at positions corresponding to the four corners of the substrate G arranged on the hot plate 41, for a total of eight places.
[0077]
  According to such a configuration, the substrate G can be accurately arranged at a predetermined position on the hot plate 41. That is, when the substrate G is accurately delivered to a predetermined position on the support pins 44, the substrate G is lowered on the inner side of the positioning roller 400 and arranged on the hot plate 41 as it is. On the other hand, if the substrate G is not accurately delivered to a predetermined position on the support pins 44 and a positional deviation has occurred, either end of the substrate G is a roller of the positioning roller 400 as shown in FIG. When the roller 401 on which the substrate G is placed is rotated by the weight of the substrate G, the substrate G is dropped inside the positioning roller 400 and placed at a predetermined position on the hot platen 41. Further, since the guide 402 is provided at the lower part of the support body 403, each corner of the substrate G arranged at a predetermined position on the hot plate 41 is guided by the guide 402 and thereby arranged on the hot plate 41. Thereafter, the position of the substrate G is prevented from being shifted.
[0078]
  Thus, in this embodiment, since the substrate G can be accurately placed at a predetermined position on the hot plate 41 by the positioning roller 400, the hot plate 41, the first rectifying plate, and the opening 53 of the first rectifying plate. In addition, the positional relationship between the second rectifying plate and the like and the substrate G, and further, the positional relationship between the airflow formed in the heat treatment space and the substrate G can be set as desired. Temperature distribution can be improved.
[0079]
  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, in the above embodiment, the heating apparatus according to the present invention is applied to the heat processing unit used in the resist coating / development processing system. However, the present invention is not limited to this and may be applied to other processes. Good. Moreover, although the case where the LCD substrate was used as the substrate has been described in the above embodiment, the present invention is not limited to this and can be applied to the processing of other substrates.
[0080]
【The invention's effect】
  As described above, according to the present invention, since the heat treatment is performed in a state where the heat plate is substantially sealed by the sealing mechanism, it is possible to prevent outside air from entering from the periphery of the heat plate during the heat treatment, and accordingly. In addition to avoiding substrate temperature variation and instability, the airflow forming means positively forms an airflow from the outer periphery to the center in the heat treatment space, making it easier to balance the exhaust, and the temperature locally on the substrate. Is prevented from being formed, and the temperature of the substrate to be processed can be made uniform. Therefore, the substrate temperature can be controlled with high accuracy. Moreover, accumulation of resist sublimates and the like can be prevented by forming such an air flow.In addition, the above-mentioned surrounding member is disposed so as to be able to move up and down, and by configuring the heat treatment space so as to be able to surround at the time of ascent, when performing heat treatment, the surrounding member can be raised to surround the heat treatment space, And when performing maintenance, the maintainability of the apparatus can be improved by lowering the surrounding member.
[0081]
  In this case, the air flow forming means guides the outside air introduced from the outside air introducing portion to the outer peripheral side along the upper surface of the first rectifying plate, and forms the air flow from the outer periphery to the center along the lower surface of the first rectifying plate. And by making it exhaust through the opening provided in the center of the 1st baffle plate, the air current which goes to the heat treatment space from the perimeter to the center can be formed effectively, and in the heat treatment space, Accumulation of resist sublimates and the like can be prevented very effectively. Further, in such an air flow forming means, if the second rectifying plate is disposed so as to face the opening of the first rectifying plate, the air flow in the vicinity of the opening is adjusted and the adverse effect of the opening on the substrate temperature is prevented. be able to.
[0082]
  Furthermore, in the above airflow forming means, the first rectifying plate can be efficiently heated by subjecting the first rectifying plate to a surface treatment having a high reflectivity, and the second rectifying plate has a reflectivity. By applying a low surface treatment, the uniformity of the substrate temperature can be further improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing a resist coating / development processing system for an LCD substrate to which the present invention is applied.
FIG. 2 is a schematic cross-sectional view of a heat treatment unit (HP) to which the heat treatment apparatus according to the first embodiment of the present invention is applied.
FIG. 3 is a schematic view showing a state of the AA cross section of the heat treatment unit (HP) shown in FIG. 2 as viewed from above.
4 is a schematic view showing a state of a BB cross section of FIG. 2 viewed from above. FIG.
FIG. 5 is a diagram showing a comparison between shapes of a second rectifying plate and a heat plate in the heat treatment unit (HP) shown in FIG. 2;
6 is a schematic cross-sectional view showing a state in which a heat treatment of a substrate G is performed using the heat treatment unit (HP) shown in FIG.
FIG. 7 is a view showing a state in which a hot plate is divided into nine regions 101 to 109;
FIG. 8 is a graph showing the results of measuring the change over time in the hot plate temperature.
FIG. 9 is a view showing a sealing mechanism in a heat treatment unit (HP) to which a heat treatment apparatus according to a second embodiment of the present invention is applied.
FIG. 10 is a schematic cross-sectional view of a heat treatment unit (HP) to which a heat treatment apparatus according to a third embodiment of the present invention is applied.
FIG. 11 is a schematic cross-sectional view of a heat treatment unit (HP) to which a heat treatment apparatus according to a fourth embodiment of the present invention is applied.
12 is an enlarged top view of a second current plate in the heat treatment unit (HP) shown in FIG.
13 is a view showing another example of a plate-like body in the second rectifying plate shown in FIG.
14 is a view showing still another example of the plate-like body in the second rectifying plate shown in FIG. 12. FIG.
FIG. 15 is a schematic cross-sectional view of a heat treatment unit (HP) to which a heat treatment apparatus according to a fifth embodiment is applied.
FIG. 16 is a vertical cross-sectional view for explaining airflow generated when the upper end of a cylindrical member is configured at the same height as the bottom of the exhaust part.
FIG. 17 is a transverse cross-sectional view for explaining airflow generated when the upper end of a cylindrical member is configured at the same height as the bottom of the exhaust part.
FIG. 18 is a perspective view of a positioning roller according to a sixth embodiment.
FIG. 19 is a plan view showing a position where a positioning roller is arranged on a hot plate 41 in a sixth embodiment.
FIG. 20 is an explanatory diagram for explaining an operation when the substrate G is positioned by the positioning roller in the sixth embodiment.
[Explanation of symbols]
40: HP
41: Hot plate
42: Reflector
43: Through hole
44: Support pin
45: Second engaging member
46: Holding member
47: Holding member lifting mechanism
48: Shutter (go member)
49: Shutter lifting mechanism (going member lifting mechanism)
50: Elastic member
51: First engaging member
53: Opening
54: First current plate
55: Second current plate
56: Cylindrical member
56a: gap
57: Cover member
57a: hole
58: Exhaust section
58a: exhaust pipe
59: Outside air introduction part
60: Case
61: First contact member
63: Second contact member
64: Elastic member
66: Duct member
66a: upper part
66b: lower part
71: Liquid
75: Projection
76: Exhaust mechanism

Claims (21)

A hot plate on which the substrate to be processed is placed or heated, and heats the substrate to be processed;
A surrounding member provided so as to be able to surround a heat treatment space for heat-treating the substrate to be treated defined above the hot plate;
A seal mechanism for substantially sealing the periphery of the hot plate when the heat treatment space is surrounded by the surrounding member;
An airflow forming means for forming an airflow from the outer periphery toward the center in the heat treatment space ;
The enveloping member is arranged to be movable up and down, and encloses the heat treatment space when ascending . The airflow forming means is
An outside air introduction section provided above the heat treatment space for introducing outside air into the heat treatment space;
An exhaust unit provided above the heat treatment space, for exhausting the heat treatment space;
An exhaust mechanism for exhausting the heat treatment space through the exhaust unit;
A first rectifying plate disposed at an upper portion of the heat treatment space so as to face the hot plate and having an opening formed at a center thereof;
When the exhaust mechanism is operated, the outside air introduced from the outside air introduction portion reaches the outer peripheral side of the heat treatment space along the upper surface of the first rectifying plate, and further, the lower surface of the first rectifying plate. The heat treatment apparatus according to claim 1, wherein the heat treatment space extends from the outer peripheral side of the heat treatment space to the center of the heat treatment space and is exhausted from the exhaust portion through the opening of the first rectifying plate.   The heat treatment apparatus according to claim 2, wherein the first rectifying plate has a surface finish with high reflectivity on a surface on the heat plate side.   The airflow forming means includes a second rectifying plate disposed between the first rectifying plate and the heat plate so as to face an opening formed in the rectifying plate. Item 3. The heat treatment apparatus according to Item 2. A hot plate on which the substrate to be processed is placed or heated, and heats the substrate to be processed;
  A surrounding member provided so as to be able to surround a heat treatment space for heat-treating the substrate to be treated defined above the hot plate;
  A seal mechanism for substantially sealing the periphery of the hot plate when the heat treatment space is surrounded by the surrounding member;
  An air flow forming means for forming an air flow from the outer periphery toward the center in the heat treatment space;
Comprising
  The airflow forming means is
  An outside air introduction section provided above the heat treatment space for introducing outside air into the heat treatment space;
  An exhaust section provided above the heat treatment space, for exhausting the heat treatment space;
  An exhaust mechanism for exhausting the heat treatment space through the exhaust unit;
  A first rectifying plate disposed above the heat treatment space so as to face the hot plate and having an opening formed in the center thereof;
Have
  When the exhaust mechanism is operated, the outside air introduced from the outside air introduction part reaches the outer peripheral side of the heat treatment space along the upper surface of the first rectifying plate, and further, the lower surface of the first rectifying plate. From the outer peripheral side of the heat treatment space to the center, and exhausted from the exhaust part through the opening of the first rectifying plate,
  The airflow forming means has a second rectifying plate disposed between the first rectifying plate and the heat plate so as to face an opening formed in the rectifying plate. Processing equipment. The heat treatment apparatus according to claim 5, wherein the first rectifying plate has a surface finish with high reflectivity on a surface on the heat plate side. The heat treatment apparatus according to any one of claims 4 to 6, wherein the second rectifying plate has a surface finish with low reflectivity on a surface on the heat plate side. Wherein the second of said surfaces of the first rectifier plate side of the current plate, according to claims 4, wherein a plurality of plate-like body is provided radially in any one of claims 7 Heat treatment equipment. The second rectifying plate, heat treatment apparatus according to any one of claims 8 from claim 4, characterized in that it is movable in the thickness direction of the substrate. The second rectifying plate, heat treatment apparatus according to any one of claims 9 claim 4, characterized in that it comprises the hot plate and substantially similar in shape. The second rectifying plate, heat treatment apparatus according to any one of claims 10 to claim 4, characterized in that it has the opening substantially similar in shape. The opening, heat treatment apparatus according to any one of claims 11 claim 4, characterized in that it comprises the hot plate and substantially similar in shape. The cover member which covers the upper part of the above-mentioned heat processing space is further provided, and the above-mentioned seal mechanism closes the crevice between the lower part of the above-mentioned heat plate, and the above-mentioned cover member and the above-mentioned collar member. The heat processing apparatus of any one of Claim 12 . The heating plate is further disposed so as to cover a lower surface and a side surface of the hot plate and reflects heat from the hot plate, and the sealing mechanism closes a gap between the reflective plate and the surrounding member. The heat treatment apparatus according to claim 13 . The sealing mechanism is
A pair of engaging members disposed on the outer peripheral side of the reflecting plate and the lower part on the inner peripheral side of the surrounding member and engaged with each other when the surrounding member is raised;
The heat treatment apparatus according to claim 14 , further comprising: a pair of abutting members that are disposed at the lower part of the cover member and the upper part of the surrounding member and abut against each other when the surrounding member is raised. At least one of the pair of engagement members is provided with an elastic member at a position to engage with the other engagement member, and at least one of the pair of contact members is in contact with the other contact member. The heat treatment apparatus according to claim 15 , wherein an elastic member is disposed at a position in contact with the heat treatment apparatus. A substrate to be processed is disposed on or above the substrate, and a heat plate for heating the substrate to be processed;
An enclosing member provided so as to enclose a heat treatment space for heat-treating a substrate to be processed defined above the hot plate;
A cover member covering the upper part of the heat treatment space;
A sealing mechanism that closes a gap between the hot plate and the surrounding member and a gap between the cover member and the surrounding member when the heating processing space is surrounded by the surrounding member;
A duct member provided at an outer central portion of the cover member, and having an outside air introduction portion for introducing outside air and an exhaust portion for exhausting the heat treatment space;
An exhaust mechanism for exhausting the heat treatment space through the exhaust unit;
A first rectifying plate disposed at the upper part of the heat treatment space so as to face the hot plate and having an opening formed in the center thereof;
When the exhaust mechanism is operated, the outside air introduced from the outside air introduction portion reaches the outer peripheral side of the heat treatment space along the upper surface of the first rectifying plate, and further, the lower surface of the first rectifying plate. From the outside of the heat treatment space to the center, exhausted from the exhaust portion of the duct member through the opening of the first rectifying plate ,
The enveloping member is arranged to be movable up and down, and encloses the heat treatment space when ascending . A second baffle plate is further disposed between the first baffle plate and the heat plate so as to face an opening formed in the first baffle plate, and the exhaust mechanism is operated. when, according to claim 17 in which air from the heat treatment space, characterized in that the flow to the first rectifier plate and the second opening of the rectifying plate and the first rectifier plate through the gap Heat treatment equipment. A substrate to be processed is disposed on or above the substrate, and a heat plate for heating the substrate to be processed;
  An enclosing member provided so as to enclose a heat treatment space for heat-treating a substrate to be processed defined above the hot plate;
  A cover member covering the upper part of the heat treatment space;
  A sealing mechanism that closes a gap between the hot plate and the surrounding member and a gap between the cover member and the surrounding member when the heating processing space is surrounded by the surrounding member;
  A duct member provided at an outer central portion of the cover member, and having an outside air introduction portion for introducing outside air and an exhaust portion for exhausting the heat treatment space;
  An exhaust mechanism for exhausting the heat treatment space through the exhaust unit;
  A first rectifying plate disposed above the heat treatment space so as to face the hot plate and having an opening formed in the center thereof;
A second rectifying plate disposed between the first rectifying plate and the heat plate so as to face an opening formed in the first rectifying plate;
Comprising
  When the exhaust mechanism is operated, the outside air introduced from the outside air introduction part reaches the outer peripheral side of the heat treatment space along the upper surface of the first rectifying plate, and further, the lower surface of the first rectifying plate. To the center from the outside of the heat treatment space along, and exhausted from the exhaust portion of the duct member through the opening of the first rectifying plate,
  The heat treatment apparatus, wherein air from the heat treatment space flows to an opening of the first rectifying plate through a gap between the first rectifying plate and the second rectifying plate. The duct member has a cylindrical member connected to the heat treatment space in the center, and air from the heat treatment space is exhausted from the exhaust part through the cylindrical member and introduced from the outside air introduction part. 20. The heat treatment apparatus according to claim 17, wherein the air is supplied to the heat treatment space through the outside of the cylindrical member. The flow path is formed between the cover member and the first rectifying plate, and the outside air introduced from the outside air introduction part reaches the heat treatment space through the flow path. Item 21. The heat treatment apparatus according to any one of Items 17 to 20 .

Images