CN114222418A - Multilayer board deviation identification structure - Google Patents
Multilayer board deviation identification structure Download PDFInfo
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- CN114222418A CN114222418A CN202111475852.2A CN202111475852A CN114222418A CN 114222418 A CN114222418 A CN 114222418A CN 202111475852 A CN202111475852 A CN 202111475852A CN 114222418 A CN114222418 A CN 114222418A
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- deviation
- flexible circuit
- identification
- circuit board
- layer
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- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a multilayer board deviation identification structure which comprises a multilayer board structure and a plurality of groups of deviation identification structures, wherein the multilayer board structure comprises an inner-layer flexible circuit board and an outer-layer flexible circuit board which are stacked in a multilayer mode, and each group of deviation identification structures comprise a first deviation identification structure arranged at the edge position of the inner-layer flexible circuit board and a second deviation identification structure arranged on the outer-layer flexible circuit board and corresponding to the first deviation identification structure. According to the dislocation identification structure of the staggered layer board, the first dislocation identification structure is arranged on the inner layer flexible circuit board, the second dislocation identification structure which corresponds to the first dislocation identification structure in a mutual deviation identification mode is designed on the outer layer flexible circuit board, the dislocation condition of each layer can be visually detected and identified through naked eyes, accurate alignment and combination of the laminated multilayer flexible circuit boards are effectively guaranteed, and the quality of finished products of the multilayer board structure is guaranteed.
Description
Technical Field
The invention relates to the technical field of lamination of multilayer flexible circuit boards, in particular to a multilayer board deviation identification structure.
Background
The flexible circuit board is called FPC for short, is light, thin, bendable and multi-layer combined, ensures that the conducting process flow of each circuit is complex, and is required to be combined together in a pressing mode when one layer is added in the production process, and the pressing is not consistent due to the fact that the layers are staggered due to the automatic stretching factor of the material pressing resultant force, so that the flexible circuit board cannot be inspected by naked eyes, and finally the finished product is scrapped in batches.
Disclosure of Invention
The embodiment of the invention provides a multilayer board deviation identification structure, which aims to solve the technical problem that the batch scrapping of finished products is caused by the staggering of layers due to the factors such as the automatic stretching of the material under the compression force and the like when a plurality of layers of flexible circuit boards are combined together in a pressing mode.
The invention provides a multilayer board deviation identification structure which comprises a multilayer board structure and a plurality of groups of deviation identification structures, wherein the multilayer board structure comprises an inner-layer flexible circuit board and an outer-layer flexible circuit board which are stacked in a multilayer mode, and each group of deviation identification structures comprise a first deviation identification structure arranged at the edge position of the inner-layer flexible circuit board and a second deviation identification structure arranged on the outer-layer flexible circuit board and corresponding to the first deviation identification structure.
In some embodiments, the first deviation identification structure is a first deviation identification hole provided at an edge position of the inner-layer flexible circuit board, and the second deviation identification structure is a second avoidance structure provided on the outer-layer flexible circuit board.
In some embodiments, the first offset identifying hole is formed on the inner layer flexible circuit board in an exposure manner.
In some embodiments, the second deviation identification structure is a PI light-transmitting layer formed by etching.
In some embodiments, the plurality of sets of offset identifying structures are arranged along a length direction or a width direction of the multi-layer plate structure.
In some embodiments, each outer layer flexible circuit board is further provided with a substrate equipment hole, and the substrate equipment hole is located on one side of the second avoiding structure.
In some embodiments, each of the inner flexible circuit boards is provided with a first deviation identification mark, each of the outer flexible circuit boards is provided with a second deviation identification mark, and the first deviation identification mark and the second deviation identification mark of each group of mutual deviation identification marks are stacked.
In some embodiments, the first offset identification mark is used to identify an offset identification number of the inner-layer flexible circuit board and an offset identification number of an outer-layer flexible circuit board corresponding to the offset identification number, and is denoted as "number of inner-layer layers to number of outer-layer layers";
the second deviation identification mark is used for identifying the deviation identification number of the outer-layer flexible circuit board and the deviation identification number of the inner-layer flexible circuit board corresponding to the deviation identification mark, and is marked as 'outer-layer deviation identification number-inner-layer deviation identification number'.
In some embodiments, the first deviation identifying hole is a bright light color hole.
In some embodiments, the first deviation identifying hole is a bright yellow hole.
The technical scheme provided by the invention has the beneficial effects that:
according to the dislocation identification structure of the staggered layer board, the first dislocation identification structure is arranged on the inner layer flexible circuit board, the second dislocation identification structure which corresponds to the first dislocation identification structure in a mutual deviation identification mode is designed on the outer layer flexible circuit board, the dislocation condition of each layer can be visually detected and identified through naked eyes, accurate alignment and combination of the laminated multilayer flexible circuit boards are effectively guaranteed, and the quality of finished products of the multilayer board structure is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic top view of a multilayer board deviation identification structure according to an embodiment of the present invention;
FIG. 2 is a schematic view of the structure of the circle of FIG. 1 according to the present invention.
In the figure:
100. a flexible circuit board; 10. a first offset identification hole; 20. a PI euphotic layer; 30. a substrate device well.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment of the invention provides a multilayer board deviation identification structure which can solve the technical problem that the multilayer flexible circuit board 100 is combined together in a pressing mode, and the batch scrapping of finished products is caused by the fact that the layers are staggered due to the fact that materials are automatically stretched by the aid of pressing force and the like.
Referring to fig. 1, a multilayer board deviation identification structure includes a multilayer board structure and a plurality of sets of deviation identification structures, where the multilayer board structure includes a multilayer inner flexible circuit board 100 and a multilayer outer flexible circuit board 100, and each set of deviation identification structure includes a first deviation identification structure disposed at an edge of the inner flexible circuit board 100 and a second deviation identification structure disposed on the outer flexible circuit board 100 and corresponding to the first deviation identification structure for deviation identification.
As described above, the inner layer flexible circuit board 100 is defined as a reference object for deviation identification, the outer layer flexible circuit board 100 is positioned as an object to be identified by deviation, for example, the first layer flexible circuit board 100 and the second layer flexible circuit board 100 perform deviation identification, the second layer flexible circuit board 100 is defined as the inner layer flexible circuit board 100, and the first layer flexible circuit board 100 is defined as the outer layer flexible circuit board 100 to perform deviation identification.
Based on different objects identified by deviation, the same layer of flexible circuit board 100 may be the inner layer of flexible circuit board 100 or the outer layer of flexible circuit board 100. In one embodiment, the second layer of flexible circuit board 100 is used as the inner layer of flexible circuit board 100 of the first layer of flexible circuit board 100 for offset recognition. When the second layer flexible circuit board 100 and the third layer flexible circuit board 100 perform deviation identification, the second layer flexible circuit board 100 is used as the outer layer flexible circuit board 100, and the third layer flexible circuit board 100 is used as the inner layer flexible circuit board 100.
According to the dislocation identification structure of the staggered layer board, the first deviation identification structure is arranged on the inner layer flexible circuit board 100, the second deviation identification structure which corresponds to the first deviation identification structure and identifies the deviation is designed on the outer layer flexible circuit board 100, the deviation condition of each layer and the inner layer flexible circuit board 100 can be visually identified through naked eyes, accurate alignment and compounding of the laminated multilayer flexible circuit board 100 are effectively guaranteed, and the quality of finished products of the multilayer board structure is guaranteed.
In an embodiment, the first deviation identification structure is a first deviation identification hole 10 disposed at an edge position of the inner flexible circuit board 100, and the second deviation identification structure is a second avoiding structure disposed on the outer flexible circuit board 100. The complete first deviation identification hole 10 on the inner-layer flexible circuit board 100 can be seen through the second avoiding structure, and it can be determined that the deviation condition does not exist between the inner-layer flexible circuit board 100 and the outer-layer flexible circuit board 100 of the group.
As described above, the first deviation identifying hole 10 is implemented as a non-through hole and may have an identifying feature, such as a bright circle or a bright ring or other marking feature circular structure.
In one embodiment, the first deviation identifying hole 10 is formed on the inner layer flexible circuit board 100 by exposure. The mode of forming the identification hole through exposure of the flexible circuit board 100 has the advantages of simple and convenient processing, low processing cost, strong operability and high identifiability.
In an embodiment, the second deviation identification structure is a PI transparent layer 20 formed by etching the flexible circuit board 100. The PI layer formed by etching does not affect the overall structure of the flexible circuit board 100, and has the insulation performance and the flexibility, and the second deviation identification structure is high in flexibility in the position of the flexible circuit board 100 and only needs to avoid the position of a line.
In an embodiment, the plurality of sets of deviation identification structures are arranged along the length direction or the width direction of the multilayer board structure, so that the deviation condition of each layer of the multilayer board structure can be checked conveniently.
In an embodiment, the plurality of sets of deviation identification structures are arranged at intervals along the width direction of the multi-layer board structure, and are arranged at intervals in an increasing manner according to the deviation identification numbers of the outer-layer flexible circuit board 100, so as to form an ordered arrangement manner, which is convenient for equipment or operators to quickly and effectively perform deviation inspection.
In an embodiment, each outer flexible circuit board 100 is further provided with a substrate equipment hole 30, and the substrate equipment hole 30 is located at one side of the second avoiding structure.
In an embodiment, each of the inner flexible printed circuits 100 is provided with a first deviation identification mark, each of the outer flexible printed circuits 100 is provided with a second deviation identification mark, and the first deviation identification mark and the second deviation identification mark of each group of mutual deviation identification are stacked in a vertical direction.
In an embodiment, as shown in fig. 2, a first deviation identification mark is disposed on each inner-layer flexible circuit board 100, a second deviation identification mark is disposed on each outer-layer flexible circuit board 100, and the first deviation identification mark and the second deviation identification mark of each group of mutual deviation identification are arranged side by side in a staggered manner in a vertical direction.
In an embodiment, the first offset identification mark is used to identify the offset identification number of the inner flexible circuit board 100 and the offset identification number of the outer flexible circuit board 100 corresponding to the offset identification, and is marked as "number of inner layers-number of outer layers";
the second deviation identification mark is used to identify the deviation identification number of the outer-layer flexible circuit board 100 and the deviation identification number of the inner-layer flexible circuit board 100 corresponding to the deviation identification mark, and is marked as "outer-layer deviation identification number — inner-layer deviation identification number".
As shown in fig. 2, the first row is the deviation identification of the first layer flexible circuit board 100 and the second layer flexible circuit board 100, the deviation identification numbers are respectively "1-2" and "2-1", the second row is the deviation identification of the first layer flexible circuit board 100 and the third layer flexible circuit board 100, the deviation identification numbers are respectively "1-2" and "2-1", the third row is the deviation identification of the third layer flexible circuit board 100 and the fourth layer flexible circuit board 100, the deviation identification numbers are respectively "1-3" and "3-1", the fourth row is the deviation identification of the fourth layer flexible circuit board 100 and the fifth layer flexible circuit board 100, the deviation identification numbers are respectively "4-5" and "5-4", the fifth row is the deviation identification of the fourth layer flexible circuit board 100 and the sixth layer flexible circuit board 100, the deviation identification numbers are respectively "4-6" and "6-4", the sixth row is the deviation identification of the fifth layer flexible circuit board 100 and the sixth layer flexible circuit board 100, and the deviation identification numbers are respectively 5-6 and 6-5.
In an embodiment, the first deviation identifying hole 10 is a bright color hole, so that visual inspection or equipment detection and identification can be performed efficiently.
In one embodiment, the first deviation identification hole 10 is a bright yellow hole formed by exposing the flexible circuit board 100.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is to be noted that, in the present invention, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A multilayer board deviation identification structure is characterized by comprising:
the multilayer board structure comprises an inner-layer flexible circuit board and an outer-layer flexible circuit board which are stacked in a multilayer mode, and each group of deviation identification structures comprise first deviation identification structures arranged at the edge positions of the inner-layer flexible circuit board and second deviation identification structures arranged on the outer-layer flexible circuit board and corresponding to the first deviation identification structures.
2. The multilayer board deviation identifying structure according to claim 1, wherein the first deviation identifying structure is a first deviation identifying hole provided at an edge position of the inner flexible circuit board, and the second deviation identifying structure is a second avoiding structure provided on the outer flexible circuit board.
3. The multilayer board deviation identifying structure according to claim 2, wherein said first deviation identifying hole is formed on said inner layer flexible circuit board by exposure.
4. The multilayer plate misalignment-identifying structure of claim 2 wherein the second misalignment-identifying structure is an etched PI light-transmitting layer.
5. The multilayer plate misalignment identification structure of claim 1, wherein multiple sets of the misalignment identification structures are arranged along the length or width of the multilayer plate structure.
6. The multilayer board deviation identifying structure according to claim 2, wherein each of said outer flexible circuit boards further comprises a substrate equipment hole, said substrate equipment hole being located at one side of said second avoiding structure.
7. The multilayer board misalignment identification structure according to claim 6, wherein each of the inner flexible circuit boards is provided with a first misalignment identification, each of the outer flexible circuit boards is provided with a second misalignment identification, and the first misalignment identification and the second misalignment identification of each set of mutual misalignment identification are stacked.
8. The multilayer board deviation identification structure according to claim 7, wherein the first deviation identification mark is used for identifying the deviation identification number of the inner-layer flexible circuit board and the deviation identification number of the outer-layer flexible circuit board corresponding to the deviation identification, and is recorded as "number of inner-layer to number of outer-layer";
the second deviation identification mark is used for identifying the deviation identification number of the outer-layer flexible circuit board and the deviation identification number of the inner-layer flexible circuit board corresponding to the deviation identification mark, and is marked as 'outer-layer deviation identification number-inner-layer deviation identification number'.
9. The multilayer plate misalignment identification structure of claim 2 wherein the first misalignment identification hole is a bright color hole.
10. The multi-layer plate misalignment identification structure of claim 9 wherein the first misalignment identification hole is a bright yellow hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111475852.2A CN114222418B (en) | 2021-12-06 | 2021-12-06 | Multilayer board deviation recognition structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111475852.2A CN114222418B (en) | 2021-12-06 | 2021-12-06 | Multilayer board deviation recognition structure |
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| CN114222418A true CN114222418A (en) | 2022-03-22 |
| CN114222418B CN114222418B (en) | 2024-10-15 |
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2021
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|---|---|
| CN114222418B (en) | 2024-10-15 |
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