TW484350B - Multi-layer printed circuit board and measuring method of inter-layer dislocation - Google Patents

Abstract

The present invention relates to a kind of multi-layer printed circuit board and the measuring method of inter-layer dislocation. That is, the invention is provided to observe and record the deformation amount of each inner conductor layer of a multi-layer printed circuit board. A solid mark 22 and a hollow mark 23 are formed at the rear conductor layer on the surface of an inner layer double-sided circuit board 61 for a multi-layer printed circuit board 60. For example, a solid mark 22-1b is concentrically arranged with a hollow guide mark 23-2a, in which both solid mark and hollow mark are provided at the adjoining conductor layers, so as to form the solid and the hollow marks 22, 23 arranged concentrically for each adjoining conductor layer. The set of concentric solid and hollow guide marks 22 (1a-5a) and 23 (1b-5b) are arranged in, for example, three rows and three columns within a guide mark frame 21 whose profile is accommodated in the sight field of an X-ray camera. Guide mark groups 20 are provided at, for example, four corners of the multi-layer printed circuit board. A single guide mark group takes in all guide mark images in the frame at a single X-ray irradiation, and the coordinate values are calculated. Based on the coordinate value of a guide mark in four guide mark groups, the deformation amount of wiring pattern formed at each conductor layer is calculated and the result is recorded.

Description

V. Description of the invention (1) [Detailed description of the invention] [Technical field to which the invention belongs] The present invention relates to a multi-directional, multi-directional identification of guide marks formed on a conductor layer and a layer-to-layer misalignment of each conductor in the inner layer. Determination method. Even if the printed circuit board is suitable for measuring this [prior art] Recently, with the miniaturization of integrated circuit (JC) chips and "use of electronic components, the density of surface structures such as p-resistors and capacitors is increased, so there are multiple layers. The printed circuit board of the printed ^ ° is also required for civilian use, and the number of conductor layers up to 4 is also not limited. The trend is immediate board, and the industry uses more layers. The multilayer printed circuit board is a multilayer printed circuit board. Its structure is a printed circuit board. The two-layer semiconductor layer and the uncovered layer are placed on the road, and an insulating substrate is inserted between the outer surface and the back conductor layer. Composition, the conductor layer of each multilayer printed circuit board is used: f-board joint conductor layer. Foil. For example, a steel with a thickness of about 18 dragons is used for thermosetting glass-fiber-reinforced epoxy resin, and glass is used for high school seniors. Fibers are made of polyimide resin and glass fiber. ^ ^ ^ Γ 6 or more layers in the circuit board have only a large number of conductors in the inner layer. Therefore, as a method for manufacturing a multilayer printed circuit board η ′ 口 ι = Description of a 6-layer multilayer printed circuit board system Attack within Double-sided circuit board formed by printing a conductor portion

\ liW Page 5 484350

A top view of the pattern '(c) shows a side view of the rear panel. Fig. 11 is a diagram showing the state before the hot pressing operation and the state of the layered circuit board (a) and (b) of the laminated board used for the six-layer electric drawing of the laminated layer. …, 1 and heat-hardened into a single piece of a as shown in Figure 1 ……… μ dust is b 4, (Us, the conductor layers 62, 62 and the inner bank b4a 64 are sandwiched between two layers of dew 61, thereby forming The 6-layer multi-functional printed circuit board φφ also has a printed circuit board 61, ^^, and a multi-layer printed circuit board 600. On the double-sided printed circuit board 6 which constitutes the inner layer, the surface of the copper foil on the back surface becomes the single product. = 6 1 a, 6 1 a (6 in the picture), etc.

In the above-mentioned double-sided circuit board 61, the guide holes 6 5 and 6 5 are preliminarily used, and the patterns 61 a, ... 61 a of the guide holes 6 5 are used, so that the surface patterns hold the circuit boards 6 1 and 6 1 on each other on a plane. , Using the same seat 6la,. &Quot; 61a, etc. At least two positioning guides 6 and 6 are formed on the 61 to form the front and back surfaces, and the two sides of the double-sided printed circuit boards 61 and 61 are positioned on the surface. In this way, a pattern is formed in the guide holes 65 and 65 at the positions of the two double-sided electrical markers, and the pattern formed by the double-sided printed circuit board 61 which becomes the inner layer board is removed.

Circuit board patterns 6 1 a, ... 6 1 a, there are also a number of subsequent work using 'Y reference hole guide marks 66, 66 (2 in the central part) or guide mark spoons 66b, ~ 66b (4 on each corner Etc.), as well as the front and back identification

For the position of the reference hole, guide the mark 6 6 a, and form some bows and guide marks in the worm carving operation. It is advisable to place multiple engraved double-sided printed circuit boards for the inner layer, and the positional relationship of the pattern formed by the conductor portion of the circuit board, which becomes a stack. 484350 V. Description of the Invention (3) (Lay up). A jig plate 68 having two pins 68a and 68a is provided. The center distances of the pins 68a, 68a are equal to the center distances of the guide holes 6 5, 6 5 for forming the patterns 61a, ... 6ia on the double-sided printed circuit board 61. An etched double-sided printed circuit board 61 has pins 68a, 68a of the jig board 68 inserted into its guide holes 65, 65, and is placed on the jig board 68. A pre-heated substrate material (referred to as a preform) 64a having the via holes 65 and 65 completed is loaded on the circuit. Then insert another double-sided circuit board 61 in its guide holes ", 65, and insert the pins 68a, 68a of the clamp plate 68, and then superimpose it on the clamp plate 68a. In this section, 'two double-sided circuit boards 6 !, 61' After the preform 64 in between, the lamination is completed. As shown in the cross-sectional view of ® 11 (a), the sides of the laminated boards 6 1 and 6 1 are separated by the Chu Shijie 丨 uc 1 ^ R9 田 # 广 ^ 者 Preformed sheets 64 and 64 and conductive material copper foils 62 and 62 are pressurized by hot pressing and the preformed sheets inserted in the middle of the white fi4 force are, and the copper ruled 62 and both sides The circuit board 61 .L and i are heat-hardened to become (excellent) the substrate 63, and the 夂 mona p bow is completed from 4 Liyi Yifeng k ,, * 巴, 味) # 容 @ t The connection of the mouth becomes the Figure (b) shows a multilayer printed circuit board 60. Then, the new reference hole in the multi-layer circuit board is opened as a new reference hole corresponding to its unique design, and the through-hole is added: J 仃 取[Buyer's conductor wiring pattern, money industry, etc., and machining eight. D advance: electrical mining operations, anti-recording processing, and: made into multiple layers; = circuit board, cut out the required external guide: morning heat to make : The positioning hole used in the two stacks is called the positioning hole used in the operation is called the reference hole. C: \ 2D-CODE \ 90-01 \ 89122293.ptd 484350 V. Description of the invention (4) As explained above Inner layer circuit — In addition to the patterns 61a ~ 6 ia of a single circuit board, it is also guaranteed that in the formed pattern, in addition to the guide marks 66, 66, 66a, etc., and a plurality of reference holes are etched for reference: already. These The coordinates of the guide marks are set to Λ. The bow 1 guide 6 1 a ··· 6 1 a is maintained at a certain position, and the pattern of the previous wiring board is set into a circuit: = seat; and &quot; determines the position of these guide marks The guide mark 6 formed on the inner layer of the new datum 'plate 60 corresponding to the above-mentioned multi-layer ray (reference hole) opening 66 is used. As a rule, X ″ Cbb is usually used in hot pressing as described above. After pressing, the surface and back of the multi-layer circuit board can clearly see through the inner layer, such as a layer covering, and it is impossible to use visible light with the naked eye. At present, the usual bow guide marks. The inner layer board was measured by various X-rays to see through the multi-layer circuit board, waves and other methods to guide the position of the mark, but the ultrasonic mechanism was also used to measure the inner layer. In summary, it can be summarized as a method of using a position other than visible light to form a guide mark on the stack ^ Γ. mark. In order to describe the deformation state of the inner layer board to the extreme value at the position where the guide layer is formed on one of the conductor layers in the inner layer board, two guide marks are used as the closest trend to each other. Of deformation. As shown in FIG. 8, the number of guide marks is collected to capture the four corners of the inner layer board. The number of the cattle is 66b, which is shown by &quot; 66b. A conductor measures the deformation state of the bow. The guide mark can be used in two directions perpendicular to the plane. <For example, an example of four guide marks is shown in FIG. 10. V. Description of the invention (5) When a circuit board is used. There are some deformations in the pressure and the pressure of the inner plate, and the inner plate is pressurized. Therefore, the distance between the guide marks on the inner plate is inevitably different. However, back: the design values are different. The pins are used in order to set the reference on the penetrating fixture plate to be equal to the interval between the pins on the fixture plate. Then: Top: The reference hole interval is called the bisection type. Same as: = L two partitions. The way to open the reference hole According to the number of reference holes in the following 2; ::, you can choose more than two. Guidance marks and real and negative: characteristics, when the number of reference holes is set on the inner board, _ ;, and &amp; settings are often different. Identify. The reference datum hole into which the lock plate lock is inserted is used for the number of operations on the front and back of the face. It will be worn and deformed in some cases. Sometimes it will be designed as much as you can now: 右 "Right stem group reference hole. Design coordinate system. Use this n, when The coordinate system used is called the placket value of the guide mark. The π system blade indicates the immovable part formed on the conductor layer. ^ It is fixed to the isometric axis of the hole punching machine. &Quot; Parallel to the movement direction of the main component : ;; Specially put the multilayer printed circuit board on the observation guide mark, then use 夂: 丨 j # 丄 to use the X-ray camera rate value, for example, the reference hole coordinates of the most approximate m return in the direction of the coordinate axis can also be converted. For machine ;:

Page 9 Coordinate values,] ίί:;, coordinate values. Statistical processing ί 484350

V. Description of the invention (6) The machine is indicated by the mechanical coordinate system, and it moves to this position to perform the coordinates of the reference tie coordinate 糸. If the reference hole is located, the hole can be moved by the spindle with the reference hole drill. Various calculation methods are also proposed for the case where the reference mark measurement value is used to infer the above-mentioned design coordinates, and the built-in calculation mechanism of 夂 π m 9 β is guided according to the guidance. Below &gt; Figure 12 § Brother Yuetian is a general overview of the function of a 2-hole splitter. As the guide 椤 # 刀 式 暴 准 孔 66, the two marked numbers are connected to V; 疋 For example, in the figure with k Ζ marks in Figure 10, a reference hole is opened so that it is located between the two and fu The distance from the straight, -spring point of each to the reference hole is equal, and φ π. The size of the center of the search distance. Moreover, the center interval of the center hole is prescribed. Fig. 12 (a) is a front view of the perspective view of the perspective view of the casing 71a. This figure is also the same as that shown in FIG. 12 (FIG. 10), which illustrates the housing 713 from the plane of the operator. X 的 架 架 73 at. As mentioned above, U, and the pain are shown on the right side of the fixed part of the hole punching machine. Youji Seiji 50 is a coordinate system that fixes the origin to parallel, along the 2 axis of the operator and the main movement of the machine. In the vertical direction, the Ym axis and the Xm axis are respectively set, and the A-axis 73a and the screw 73b that are fixed in the housing 71a are vertically movable. The anvil and the port 2 are provided with a linear guide 73a and a moving stand 73. The uppermost portion holds two groove-shaped X-moving stands 73. The X-ray guides 78a, ... and the helical = radiation generating device 74 are provided below the two X-moving pedestals 73 in a coherent manner to support the Y-moving pedestal 78 movably. The size of the printed circuit board is parallel to the Xm axis of the mechanical coordinate system in accordance with the f-direction, and the interval can be 484350.

--- V. Description of the invention (8), Y2). This inch is arranged on the X-ray-proof multilayer printed circuit board opening part of the hi pressure plate: fall, press the circuit board to move. To prevent the opening of the multi-layer printed circuit board at a right angle to it; the deformation of the surrounding multi-layer circuit board ', but suddenly, as described above, the guide mark 66b on the top, f = a Three reference holes are formed at the corners and the like according to the plane deformation of the J 5 laminate. t near, used for transplanting. Xizhi. Divided hole punching machines are also being put to use. [Problems to be Solved by the Invention] Recently, as a consistent quality assurance, for multilayer printed circuit boards, there are more and more conditions for providing quality information on manufacturing operations. Material counter-quota, the characteristic value distribution of the product needs to be measured at the end of each operation, and the results are stored. In the completion inspection of the circuit board, it is necessary to grasp the deformation of the inner layer board pattern than in the past, and to make the data complex. Therefore, so far, although the focus has been on the conductive layer with the finest pattern, If a guide mark is set on the multilayer circuit board, there is no obstacle in the manufacture of the multilayer circuit board. However, the obligation that is being formed in the future is to measure the deformation displacement of the other conductor layers, and to keep the results. user. The amount of deformation displacement of the conductor pattern indicates the mutual displacement between conductor layers, so it is generally called &quot; interlayer displacement, |.

Page 12 484350 V. Description of the invention (9) Before the completion inspection, for example, if the reference hole is open when the reference hole is opened after the hot stamping operation between the patterns formed by the body layer, the position of the multi-layer circuit board is good. The operation can also be less differentiated, it is = for the wiring board manufacturer, and the unqualified products in the final inspection are reduced .., used. However, to know that each conductor forms a guide mark for each layer, and the inter-layer deviation of i ^, it is necessary to form a phase similar to the previous size on the conductor layer compared to the total of the guide mark ::::: f. If the space of each conductor is too large, guide according to the wiring board two j '. I have guided the setting of the marker material, which incurs the cost of raw materials. 2 ::: 'Jrg asks for a larger shape than before. At the end, in order to reduce the measurement uncertainty, a guide mark is placed on the camera's view group. Ding Shaocheng has always been at the center of the field of view of the women's volleyball team. Therefore, the "inductive path" that can be measured is _ person measured one. Therefore, for the purpose of _, the shovel, shovel this 3 丨 pole. V private machine is equipped with the machine ^ need to be careful because of the increase in observation time and processing time increased. [Method to solve the problem] shout. In order to solve the above-mentioned problem, the present invention provides a multilayer printed circuit board having a conductive layer formed on a conductive layer constituting the inner layer of the multilayer printed circuit board, and the inside of the contour line is ^ Ming0 ancient <The hollow guide mark of the bright part, and the conductor layer formed in the thickness direction with the guide: layer :, and the inner part of the outline is (as the image surrounding the dark part) of the dark part. Solid guide marks, multi-layer printed electronics: When the board is viewed through the thickness direction of the board, the outline of the hollow guide marks is internally configured. 1 C: \ 2D-OODE \ 90-OJ \ 89122293.ptd 5. Description of the invention (10) Heart guide Mark and its large, the outline of the guide mark does not touch ", the outline of the hollow guide mark and the solid layer of the conductor layer that leads the multilayer printed circuit handle in the board thickness direction g of the circuit board, when designing its pattern, configure the position of the center of gravity and Solid guide = the next day, the outline of the hollow guide mark. The multi-layer printing of the present invention ^ Remembers that the image's center of gravity is the same. The conductor layer is formed: Except the guide J board is the inner layer of the multilayer printed circuit board. The same = t multiple guide mark frames in each conductor layer; the thickness of the printed circuit board of the guide mark frame layer is formed into a size that is included in the field of vision of the imaging section in the multi-device to see through the guide mark. Observe the solid internal configuration, and arrange the hollow guide mark group and guide mark group in the guide mark frame. At least one of the mark and the hollow guide mark. The invention also proposes to match the specially formed solid guide mark with a printed circuit. On the conductor layer of the inner layer of the board, the inner part can be specified, the center of the above-mentioned guide mark frame.: Contour lines that mark the outline by guiding the two outline lines, guide marks. A concentric circular ring guide mark is hollow The present invention proposes one: a method for measuring the inner layer of a circuit board. The first method is to remove multiple conductors at the multi-layer printed μ guide mark frame: two are at the same position of the multi-layer printing factory, which is: small; medium: ; Drought guidance markers in the image section V ^ Guiding marker group of the group 'and in the 14th stomach 484350 V. Description of the invention (11) All guidance markers in one guidance marker group are taken in the observation It is also proposed to calculate the coordinates of all the guide marks in the same guide mark frame based on the position of the guide marks arranged in the center of the field of view. Another method is to use all the coordinate values of the guide marks included in the guide mark group. The method of measuring the position of the inner layer by determining the coordinate value of a part of it or determining the inter-layer offset of the reference hole coordinate. [Embodiment of the Invention] As an example of an embodiment of the present invention, a multilayer printed circuit will be described with reference to FIGS. 1 and 2. Guide marks formed on each conductor layer of the inner layer board. Fig. 1 shows as an example the case where the inner conductor layer is 10 layers, and Fig. 1 (a) is a schematic sectional view of the guide mark portion of each conductor layer, and Fig. 1 (b ) Indicates an example of a guide mark appearing in the field of view of the X-ray camera for measurement. Figures 2 (a) and 2 (b) respectively show the guide marks (2 3 — 1 b, 2 2 — 1) formed on the second conductor layer in the inner layer (the back of the double-sided wiring board 6 1 — 1 in FIG. 1). b) and a guide mark (23-2a, 22-2a) formed on the third conductor layer (the surface of the double-sided wiring board 61-2) in the inner layer. The multilayer printed circuit board 60 of FIG. 1 is composed of 10 layers (there are five double-sided circuit boards 61 for the inner layer). In addition, digits from 1 to 5 are added to distinguish from the top of FIG. 1 (a). For convenience, the upper side of the figure is used as the surface, and the lower side is used as the back surface, and the characters a and b are added respectively. Fig. 2 (c) shows an example in which the guide mark group 20 (A, B, C, D, E, F) is arranged in a multilayer printed circuit board 60. The other component numbers are shared with FIG. 10 and FIG. 11 described above. Incidentally, 62 is an outer conductor, and 63 is an insulating substrate.

Page 15 C: \ 2D-C0DE \ 90-01 \ 89122293.ptd

A 484350 V. Description of the invention (12) As shown in Fig. 1 (a), for example, the solid guide mark 2 2 —la formed on the surface of the double-sided circuit board 6 1 — 1 is in the thickness direction (up and down direction in the figure). ) A guide mark 23_lb is formed on an adjacent conductor layer. The solid guide marks 22 a 1 a and the hollow guide marks 2 3 — 1 b are arranged concentrically in design. Adjacent to the hollow marks 2 3 — 1 b, solid guide marks 2 2 — 1 b are formed on the same conductor layer, and the hollow guide marks 23 — 2a formed on the conductor layers adjacent to the board thickness direction are arranged concentrically. In this way, between the conductor layers adjacent in the board thickness direction, a solid guide mark 22 and a hollow guide mark 23 are formed concentrically, and from the surface conductor layer of the double-sided circuit board 6 1-1 to the double-sided circuit board 6 1-5 The back conductor layers are associated with each other. __ Actually, as shown in FIG. 1 (b), nine sets of solid guide marks 22 and hollow guide marks 23 are arranged in, for example, 3 rows and 3 columns so as to be included in the field of view of a substantially square X-ray camera. In this multilayer printed circuit board 60, a guide mark frame 21 (21 —la, 21 — lb, 21 — 2 a · · · 2 1 — 5b) for removing copper pigs is formed on each inner conductor layer, and does not block X Rays. The ten guide mark frames 21 are superposed to form a void portion for removing unnecessary copper foil, so that the solid guide mark 22 and the hollow guide mark 23 disposed inside can be observed. This guide mark frame 21 may be provided with or without copper cymbals on the outside. The X-ray camera image, as shown in Fig. 1 (b), can observe the guide marks formed in each layer φ in batches. Figures 2 (a) and (b) show examples of the pattern of each conductor layer constituting the image. (A) indicates that the back of the double-sided circuit board (ie, double-sided wiring board) 6 1 — 1 is seen from the surface, and the guide mark frame 2 1 — b is provided with a hollow mark 23 — lb and a solid guide mark 22 — lb. (b Day out

Page 16 V. Description of the invention (13) Double-sided circuit board 61 ~ 2 ## and the main one, the hollow guide, the meaning of the guide mark frame 2 1-2 a with internal overlay ^ mark 23-solid guide mark 22-2a. Guide mark ΐ:;: f image of X-ray shown in Figure 1 (b). The central part of the residual copper box Erdou = J =, where the solid guide mark 22 is the guide mark 23: the second part is the dark part); the hollow lead is the bright part). Ｍ The central (inside) part without copper foil (dark part of the image, empty, two shapes are shown as the basic contour lines inside are black on the bright side 1 ^ ^. The shape of Ji 2 3 is shown inside the basic contour lines ：: ^ ^ "In the example, only the case where the contour line is a concentric circle is used as a practical size number, guide 俨 q / οΓ, an example, refer to the symbol ^ Μ in box 21 of Figure 1 (b) A square with a side F of about 10 °, the approach path is 1 ° 23 °, and the inner distance is about 1.4_ and 2. · 4_, respectively. Guide table = The size F of the guide mark frame 21 is set to be larger than that of the X-ray camera The size is that even if the multilayer printing is deformed in the second view after the hot pressing operation, the position of each guide mark changes and is accepted in the field of view of the road board machine. Radiographs Q a) and (b) show two inner layer boards. An example of the shape of a guide mark on a side conductor layer. As shown in Fig. 2 (a), the guide marks formed on the back conductor layer of the bow I layer plate 61-1 are shown from the top. Fig. 2 (f) is adjacent to the back conductor layer of the inner layer plate 61-1. The inner layer plate 6 shows 484350 V. Description of the invention (14) The guide mark formed on the surface conductor layer, and compare the position of the center of gravity of the solid guide mark 22 and the center of gravity of the hollow guide mark 23-2a. Here, 〇 ^ Said to form the center of gravity of the top view of the figure, that is, the center of gravity of the figure. ^ By comparing the positions of the centers of gravity of adjacent guide marks in order, we can know the positions of all the guide marks. As shown in Figure 2 ((3)), Circuit board (wiring board) 6 〇 At least 2 OA, ^ two sets of guide mark groups. If you observe the two sets of guide mark groups, the calculation of the gravity center position distribution of each conductor layer in the inner layer and the rotation around the center of gravity.

The w angle makes it possible to reliably grasp the deformation near the straight line passing through the guide mark groups 20A and 20B. 2 at the four corners of the circuit board 60, guide mark groups, 20e, and are used to calculate the pattern design of each conductor layer in the inner layer: the amount of movement of the origin and the direction of the coordinate axis can infer multilayer printing The amount of plane deformation of the conductor layers of the circuit. Figure 2 shows the design of the guide mark group in the design of the whole system (c), which is common to the conductor layer with the origin 0d and the inner layer of the orthogonal coordinate axis. Η, Vd coordinates This design coordinate

Into: 丨 (/) towel, on the entire surface of the double-sided printed circuit board 60, the back, but not necessarily, all conductor layers are provided with a guide mark: the surface circuit board 6,: the body layer to form a guide mark. For example, it is possible to measure the surface back 3 of the double-sided circuit board 61 by stacking the door lintel / inspection to check with the measurement result, or it can be only "", if the user's understanding between the layers is not very clear Important conductor sounds 5. Explanation of the invention (15) The offset does not need to be measured, and the guide marks on this layer can be omitted. As shown in Fig. 3: The X-ray tube is photographed by the X-ray tube. She is a schematic diagram showing the overview of the X-ray camera. The X-ray fluorescence multiplier 3 is usually installed in the Λ machine 6 as shown in FIG. 2: 丄:). Built-in input target consisting of fluorescent light = 31 and photoelectric surface 32, and fluorescent film 33 are collected.刼 pole A, input 60 × X //, ^ ^ ^ ^ ^ ^ ^ t „The inside of a light film or the like [enters the fluorescent film 31 to convert the fluorescent light into an optical image 36. Using this light, the fluorescent light On the inner surface of the film W, photoelectrons are emitted from the densely-arranged photoelectric surface 32. The output beam is multiplied by the application of electricity C and the like, and the image is taken by the optical lens system 34 on the output fluorescent film M Charge Coupled Device (CCD, Charge Coupled Device) CCD camera element 35. In 囷 3 (a), l1 is the distance between the X-ray and the multilayer circuit board 60, and L2 is the X-ray and X-ray multiplication. The distance between the fluorescent film of the tube. Unlike visible light, optical lenses cannot be used for X-rays, so the image 3 6 on the fluorescent film 31 and the guide mark formed on the multilayer circuit board are taken as a substantially similar image, and its size is Zoom in to [(L2) / (L1)]. Recently, the sensitivity of the CCD camera element 35 has increased, so a CCD sensor and phase element 3 5 are also placed closely behind the fluorescent film 3 1 to directly place the fluorescent light. The image of the film 31 is taken into the CCD camera element, and the X-ray image of the multiplier tube 34 is omitted.

Page 19 484350 V. Description of the invention (16) Camera, but the above relationship is also true. /: Figure 3 (b, the relationship between the position and shape of the image on the phosphor film. For the picture B1 of the figure, position, subject and image, shoot from the X-ray tube ... The similar shape of the central mark B1, whose image Z1 directly formed by the weight, and / 1 is the center of the original I pattern)> The center of the field of view with the same emperor position. The midwife t τ; also changes from the original mark B1. Kawari, has nothing to do with M and L2. The position of the center of gravity does not have X-rays in the formula of μ «μ at an angle of α angle. Its size changes. The image of the image Z2 of \ 82 is not exactly the same as the shape of the image Z2 at the end of the previous paragraph :, Second: The corners are slightly changed, and the 'marking' is similar. For example, let the outline shape of the marker B 2 be ::, and the shape of the kZ2 is ellipse '. However, the center of the circle is mapped to the expanded circle. The position is at α. Corner of the line. The center of gravity of the guide mark is not the field of view Ϊ = Rishou, and it is also corrected using a simple ratio calculation by using the position of the center of gravity above the line of the angle α. In this way, the image distortion caused by the incident angle of X-rays can be avoided. In some cases, the fluorescent film 31 of the X-ray fluorescent multiplier tube 30 has a spherical surface, so that some deviation is added, but the error increase is very small. As shown exaggeratedly in FIG. 3 (c), when there are marks on the front and back surfaces of the multilayer circuit board 60 serving as the subject, the positions of the images appear due to the distance between the marks (board thickness of the circuit board) 11, 12. difference. Actually, although the marks Bl and B2 on the front and back surfaces are arranged concentrically, when the x-ray has an incident angle α, the images Z1 and Z2 become concentric. If the plate thickness u is small, as shown in the first half, the deviation Q 1 is small; when the plate thickness 12 is large, as shown in the following half, the deviation sQ2 becomes very large; as shown in the figure, the rain guides Mark heavy

IIBH C: \ 2D-CODE \ 90-01 \ 89122293.ptd

Page 20 484350 V. Description of the invention (17) If it is overlapped, it cannot be analyzed. As an example, if L1 is 20〇111111, L2 is 22 0mm, and the maximum distance of the guide mark measured diagonally is 4.2 mm (the position of 22 — la in FIG. 1 (b)), then the angle α is about 1. 2 degrees, if the thickness t1 is 0.2 mm or less, the deviation Q1 is less than that, and there is no problem at all. When the plate thickness is about 0, the deviation Q1 is close to the limit of use when it is about 0.01 _. Therefore, comparing the bow and guide marks provided on adjacent conductor layers to minimize the board thickness, the influence can be minimized. If the center of view of the basic guide mark is used as the center of the field of view, and it is arranged and measured like the guide mark B1 in Fig. 3 (b), the errors in Figs. 3 (b) and 3 (c) can be completely eliminated. The image of the guide mark taken by the CCD camera element is shown in the schematic diagram in Figure 4 (i). Fig. 4 U &quot; cuts out a group of guide marks in the guide mark group shown in Fig. 4 (a2) and enlarges it. The self-image of the guide image taken by the CCD camera element 35 is binarized according to an appropriate threshold value, and the types of all the images are divided into two types: bright and dark. Mosaic. Now set the coordinate origin 0 to the lower left corner of the image, and draw the orthogonal X, γ axis. For example, drawing along X, starting from; ^ ft 0 关 仏 Μ &gt; starting to calculate how many bright primitives in the i-th primitive column, you can automatically get the money of dark primitives (because the cut graphics are known The number of primitives along the X axis). Similarly, it is also possible to know the number of bright and dark primitives in the J-th row of FIG. 7L starting from the origin 0 along the γ axis. As explained in FIG. 1 previously, the image of FIG. 4 (, 21 ^ ^ overlaps the hollow and solid guide rods without a set of guide marks 51 ^ ^ δ. It is a soft analysis method 41 484350 V. Invention Explanation (18) Separate the image, and calculate the center of gravity coordinates of the figure from each number of primitives. There are many descriptions of soft analysis methods, and one example will be described with reference to Fig. 4 (b). As shown in Fig. 4 (a 1) or (b) As shown in the figure, the figure that becomes the reference in calculating the center of gravity is the contour line 22A as the outer diameter of the solid guide mark 22 and the contour line 23A as the inner diameter of the hollow guide mark 23. Defines a separation slightly larger than the diameter of the contour line 22A of the solid guide mark 22 Circle C1, and accumulating the number of dark primitives existing in the separation circle C1, also accumulates the moment (distance X weight) about the origin 0 of the separation circle C1 along each coordinate axis. In this case, the distance is separated from the original The number of primitives at point 0 indicates that the weight is replaced by the number of dark primitives. For example, the moment along the X-th column in Figure 4 (a 1) is i X (the number of dark primitives in this column) = 5 X 3. Separate The cumulative moment in circle C1 divided by the number of dark primitives in the separating circle, then The X-coordinate of the center of gravity of the solid guide mark must be expressed by the number of primitives. There is also a moment along the Y axis, for example, the moment of the j-th row is 8 X 5, and the Y-coordinate of the center of gravity can be obtained by the same calculation. The contour line 23A has a slightly larger separation circle C2. When the inside of the separation circle C1 is treated as a bright picture element at the same time, the solid guide mark 22 disappears. If the bright picture element inside the separation circle C 2 is processed, By calculating the center of gravity, the center of gravity coordinates of the hollow guide mark 23 can be known. In this way, by adding the separation circles Cl and C2 by a soft analysis method, the center of gravity of the solid guide mark 22 and the hollow guide mark 23 can be independently calculated. Performing such a gravity center calculation on each solid and hollow guide mark group can determine the position of the center of gravity of all the guide marks in a guide mark frame, and convert them into mechanical coordinates set on the punching machine by simple conversion.

m p. 22 484350 V. Description of the invention (19) The quality is increased from 0. In fact, the number of primitives allocated to a guide mark is greater than the figure (bi), so the error in the calculation of the center of gravity mentioned above is not a practical problem. In a good multilayer printed circuit board, “the displacement mark of the guide mark ^ separated circle Cl, C2 the element overflow used to calculate the center of gravity can be equal to = very” In this way, the two figures with the same center of gravity are combined. Guide marks, and setting these two lead times 1 v 'note on two adjacent conductor layers, through tt * 鲂 two guide marks per group, can calculate the seat t between the two ... .Compared with a guide mark to calculate the center of gravity, compared to 'this day, the difference can be made much smaller. As mentioned above, the central part of the field of view of the X-ray camera. The marker is determined by taking the small 'coordinates', so the coordinate value represented by the coordinate system in the mechanical coordinate system can be simply calculated. In order to correct the measured value, ^ is shown by LI shown in machine (a) , L2 image magnification and other initial decisions are predictable Enter the constant value of the machine in Fig. 3. Generally, it is not necessary for each circuit to observe the guide mark group around the X-ray photographic sample, which can ensure high measurement accuracy. The coordinates of Yikou are in the middle, but to correct the image magnification, plate thickness == mechanical position of the image center of gravity in the field, etc., it is necessary to input the values of the Xingkou circuit board of the camera into the camera. It is troublesome, and the accuracy is greatly reduced. In the description of printing the sigma layer in Figure 1, it is arranged according to Figure 1 (a) &quot; Other original if m I $ Figure 1 (b) 3 rows and 3 columns, but it is not required Starting from the above Twilight Carving and Circle Setting, as long as each adjacent conductor layer is organized into the upper left, left, right, top, left, right, left, right, right, left, right, left, right, left, right, left, right, left, right key points. ^ Just call, for example will

484350 V. Description of the invention (20) The solid guide mark formed on the important conductor layer is arranged at the center. As another form of the guide mark, a ring-shaped guide mark shown in Fig. 5 can be used. Fig. 5 shows the inside of the day-out guide mark frame 20, and Figs. 5 (a1) to (a3) show a case where the hollow guide mark 23 of Fig. 1 is replaced with a ring guide mark 24 ', and Fig. 5 (bl) (B3) is a case where the ring guide marks 24 are arranged concentrically in a plurality. FIG. 5 (c) is an explanatory diagram when the separation circle C3 is further defined in a fuzzy analysis manner in addition to the above separation circles C 1 and C 2. As shown in FIG. 5 (c), the center of gravity is obtained by defining the partitioning circle C1 for the inner solid guide mark 22, which is the same as that of FIG. When the outer contour of the hollow guide mark 23 is changed from a square to a circular circle ^ In the case of a ring guide mark 2 4 'If the dividing circle C 2 is defined and processed together with the dividing circle C1, it is the same as the above example and can be obtained The ring guides the center of gravity of the bright entities inside the marker. That is, the ring guide mark 24 can be considered as a hollow guide mark whose inner diameter is taken as the contour line 24N. This situation is equivalent to the hollow guide mark 2 3 in FIG. 1. Further, a dividing circle C3 having a slightly larger outer diameter than the ring guide mark 24 is defined, and at the same time, a process of treating the inside of the dividing circle C2 as a dark picture element and calculating the center of gravity of the dark picture element inside the dividing circle C3 is performed, and The outer diameter of the ring guide mark 24 is equivalent to the solid guide mark of the contour line 24G. In this way, if the guide mark is taken as a circle, only the soft analysis process can become equivalent to the hollow and solid guide marks. In particular, as shown in FIG. 5 (b 1), if the contour lines constituting the guide mark are taken as concentric circles centered in the center of the full field of view, the influence of the error described in FIG. 3 (b) can be improved. Take care to make the boot mark bit

C: \ 2D-C0DE \ 90-01 \ 89122293.ptd Page 24 V. Description of the invention (21) For X-ray camera Yanling ^ If X-ray photography can be used to observe the direction accuracy. If the field of view of the spoon is about 10 mm, even if it is separated from 6 t 制 制 as shown in Fig. 1 (b) :, it can cover the inner layer of 6 conductor layers. Multi-layer printed circuit board capable of ^ 的 9 high-end civilian equipment used. Introducing $ ^ self (= 2 matching) Jin, / b3) 'The ^ formed by these concentric circles is placed in a circle m that is phase-concentrated in adjacent conductor layers, which can reduce Figure 3 (c) The influence of the thickness of the inner plate. In the following, σ Erming can observe the (multi-point bisecting) reference hole punching machine of the multilayer printed circuit board forming the above-mentioned guide marks at four corners. Fig. 6 is an external perspective view of the above-mentioned hole punching machine, showing a perspective view of its casing 2. Fig. 7 (a) is a front view of the hole punching machine 1, and Fig. 7 (b) is a side view '^ Figure ^', (b ) Shows a plan view of the position change of the movable table 丨 2 of the hole punching machine 1, and FIG. 7 and FIG. 8 both see through the casing 2 and show the inside thereof. The mechanical coordinate system (origin 0m, Xm, Ym, &amp;) is a coordinate system fixed to the fixed part (such as the housing and the stand 3) of the hole punching machine 1. The movement direction of the various mechanical parts of the feeding device is parallel to this coordinate axis. Basically, X is calculated using this coordinate system. The ray camera observes the coordinate values obtained from the guide marks in the multilayer printed circuit board and the opening coordinates of the reference hole. The blank arrow number 17 in Figure 6 is the positioning of the operator, and the operator τ stands in the direction of the arrow (the positive direction of the Ym axis). , Put the multilayer printed circuit board (not shown in the figure), observe the guide mark, open the reference hole; after the operation is completed, take out the multilayer printed circuit board from the hole punching machine 1. ° In the following description, let ’s consider the workpiece The multilayer printed circuit board is shown in Figure 2 (c

Page 25, 484350 V. Description of the invention (22) / shown 'observe the four corners of the guide mark group 2 oc, 2 oD, 2 0 E, 2 0 F, and at different coordinates from those of the previous guide mark group (For example, near 20A and 20B) Open a reference hole. In the evening, a stand 3 is fixed inside the casing 2 of the hole punch 1. The left and right pair of χ moving stages 10 and 10 are formed in a substantially groove shape and have a mirror-image relationship. The X-moving gantry 10 and 10 are supported by linear guides 103 and 10a arranged on the upper end of the gantry 3. By using the screw 10b and the nut mounted on the χ moving stand 丨 〇 ^, the nut (not shown in the figure), the stand iQ moves in parallel with the ^ axis in advance according to the size of the electrical reaction in which the reference hole is opened. Wait at the observable guide mark position. 1 〇, separately at each X moving rack ^

To drive X mobile stand alone! 〇 1 0 Screw 10 b. The X-ray generating devices 4 and 4 are fixed to the upper portions of the X-moving gantry 10 and 10, and one = the female linear guides 11a and 11a. Therefore, using the linear guide 11a to support the multi-moving stage 1 1, 1 1 ° using the screw 1 lb and the nut (not shown in the figure) fitted under the γ shift = port 11 with the screw, the γ moving frame can be aligned. The Ym axis moves in parallel.

The movable wooden tables 1 1 and 1 1 are formed in a trough shape, and an X-ray protective tube 5 ′ is arranged on the upper side thereof, as shown in FIG. 7, and the pressure plate 9 and the pressure plate 9 are moved side by side to the cylinder 9 a. The lower part is fixedly equipped with a main axis ". X-ray camera 6. 1 revolution 1 2 pairs of parallel movement in the axis' and arranged and fixed in parallel with the Ym axis; 2 linear guides 12a and screw 12b supported at the central part And drive, j is loaded with a multilayer printed circuit board. 'The movable table 1 2 is placed at the position of 1 2 A as a workpiece, and a reference hole is to be opened.

V. Description of the invention (23) The printed circuit board of the evening layer is moved along the Ym axis to be introduced to the position of the measurement guide and the reference hole. '11 does not show the control arrangement for driving the screws 10b, 11b, and 12b and controlling the movement of the (moving stage, 10 and Y moving stage (iJ, and movable stage) 2). Here, as the main constituent unit of the hole-opening machine, the x-ray generating device 4, the X-ray protective tube 5 and the x-ray camera 6 are used to form a guide mark observation device: the hole device is formed by the main shaft 7 and the pressure plate 9, and the gantry is moved by χ] 〇, / 1 〇 ^ ° 1 1 The movable table 12 and the linear guide rails 11a, 12a, the screw 10b, Ub, m, etc. that support and drive these tables form a driving device. The upper control device is controlled by a series of opening operation programs. Its most important function is to calculate the coordinate value based on the X-ray image of the pre-J J observed by the observation device, and calculate the opening position of the reference hole based on the coordinate value and the reference hole design coordinate input by the pre-J. Fig. 2 (c) shows an observation method of a multilayer printed circuit board βQ in which four guide marks Junyang 202, 0, and F are formed at four corners. First, based on the dimensions of the open circuit board and the coordinates of the superscript I group 20C, D, E, and F, determine the position of the x-moving stage ι 2 and _ 2 axis. 10. Move to this position, etc. ^ When the moving table 12 is at the position 12A in FIG. 6, the operator prints multiple layers on a predetermined position on the moving table 12 on the circuit board 6. The circuit board 6. Temporarily fixes the ζ12. The movable table 12 moves to a position where the guide marks 20C and 20D below the x-ray S 4a built in the X-ray camera 4 arrive.

Page 27 ^ 4350 V. Description of the invention (24) Observe the marker groups 20C, 6 with X-ray perspective, measure each conductor layer, and store the coordinate value in a figure not shown in the figure, which will be described later Like 2 0 D 'and use the X-ray camera 6 to guide the coordinates of the coordinates 2, 2 and 3 in the memory of the control device. = The moving stage 12 moves only the distance under the guide mark group 20 £ and 20f wire 4a in the Ym direction. ^) X-ray X-ray Observe the 9nf line of the guide chain, and use X-ray cameras 6, ^ to measure and quote § 20E, 20F, and store the coordinate values of each conductor sound 22, 23. Wheeze. The calculation of Fang Mu, #, Shi Gu, and t will be used to calculate the seat of the reference hole H2 and H2 after the guide marks in the layer: According to the positions of the seats HI and H2 of the four groups of guide marks, the main axes 7, 7 Γf The movable table 12 moves to the reference holes to perform the reference hole HI, H2 and the coordinates of the reference holes H1, H2, and the board 60, then the reference hole plus work t ^ &amp; The author takes out the circuit of the hole such as ΪΞΓ. Explain the aforementioned forces ...;, γ. The type of equipment loaded on the mobile platform; ；: Π :) position of the platform 11 _ look at the upper half of the left χ mobile platform 10, γ mobile platform 10, and the table is not removed from the top view X) The upper surface of 2 is viewed from the positive direction of the Xm axis. Figs. 9 (C) and (d) The X-ray camera 6 is used to observe and guide the moving platform 10, and the conditions are disassembled and shown respectively.

20C, &quot; JOF's observation and measurement position to guide the mark group, protective tube 5 and X-ray camera 6 come to X

484350 V. Description of the invention (25) Directly below the tube 4a. The X-ray generating device is started according to the instruction of the control device not shown in FIG. 7F. The X-rays radiated from the X-ray tube 4a pass through the center of the X-ray protection tube = the circuit board placed on the movable table 12 inside the perspective. The image is sent to a computer in the control device, and the coordinates of V 軚 ji (22, 23, 24, etc.) are counted and stored. Phase Λ completes the observation of the four leading marker groups in the 2ΐ observation, and calculates the coordinates of the reference hole based on the 忒 lean material. The meter head is used to open the reference hole. According to the reference hole coordinate value of the mouth T #, when moving the hole, move to the reference hole 移动 1 · 2 = fine adjustment, and move to the Ym axis coordinate of the reference hole Η1. γMovement _ ^ — The mobile platform 1 1 moves The center of the rule is used as a reference for movement: the distance s between the centers of the shots is so much. The main shaft V is: Ϊ, high-speed electric turbine or south frequency with the main shaft 7 motor as the rotation source. 通常 Usually made of super-hard alloy. Although not shown in the drawings, the cutting feed of the drill 7b is performed by using a reference servo motor for the upper opening. The cylinder that moves downward or the pressure plate 9 disposed directly above the main shaft 7 is pressed down and the pressure plate is placed on the movable table 12 to place an actuator: on which the circuit board 60 is moved. And circuit board 60 to prevent the above guide hole from being observed and guided mark group 'and open the reference hole according to the observation result. Ⅴ. Description of the invention (26) The mechanical process of the hole puncher is described below according to the guide 栌, circuit board 6 The observation results of the inner guide of 0, the calculation of multi-layer printing has already talked about design; At the time of design, the design coordinate system of the conductor icon axis of all inner layer guides = the inner conductor layer of the board 60 is set: for the electric layer t, orthogonal ud and Vd are used as the coordinate axis and the Xm axis of the mechanical coordinate system is reversely input. In the case of a hole puncher, it is set to, for example, a Ud conductor pattern, and at the same time, in Rule 6: the axis is also parallel to the Ym axis. The guide marks of the constituent elements of Lu Jiqun—Ji, ΛΑ; ^ position $ 自 入 as the shape of the four guide marks, the shape of the guide mark group is taken as the solid guide mark 22 as the generation of this layer (b = shape, for example, From the observation results of Mark 22, we can see that Xu ,,,, and% si private notes. Based on the coordinate values of the four guide descriptions. 导 ～ 5 丨 The guide marks the four guide 4 w designs formed in the body of the four mechanical coordinate systems. Where the coordinate system is, and the measured value of / ^^ 2 is inferred, the design coordinate u point is obtained to arrange the mechanical n layer. That is, the slope to the Xm axis is sufficient. The coordinate values of the hall, table, and Ud axis Assumed to observe 'points (solid: ^ $ ϋ ten probability values), but often use the center of gravity as a fixed, mass point, find its center of gravity, guide the coordinate value of the mark, find the distance between the coordinate value and the measured value, The slope of the Xm axis and other methods. A specific example of the calculation process of Ud where the square sum is small. Since the same flat 1 1-29327 1 patent was filed, this is a very rough explanation of the general Japanese patent application.

Page 30 5. Description of invention (27). 1 ^ Preparation, according to the coordinates of the solid guide mark design above, treat each bow IV mark as a unit particle and calculate the center of gravity. With this center of gravity as the origin, the H f scale is parallel to Ud, and the coordinate axis v is parallel to Vd. In the first step, change the coordinate value of each nose guide mark. The coordinates of the center of gravity are calculated based on the measured coordinate guidance marker values in advance. Lieutenant General Ϊ is used as the origin and the coordinate system is parallel to the mechanical coordinate system. According to the coordinate values and measured values on the design, the slope of the coordinate axis can be determined in a straightforward manner. ”&Amp; m” Description = Two points of the body layer can be used as the data to use the mechanical coordinate system to record U ,: ", that is, the offset between layers. Coordinate axis slope? ΠΥ: The basis, the hole coordinates according to the original description of 1 The coordinates of the points and the material of all inner conductor layers of the board are used to determine the reference hole. The important conductor layer is used to determine the displacement of the inner conductor layer. It is possible to consider about 4 to 10 layers. According to the actual manufacturing, the position of the reference hole is also determined by the characteristics of the interlayer offset value plates of various conductor layers. It is proposed according to the customer's prior requirements. = The useful information in the memory of the hole puncher can be processed. Become the reference hole opening of the manufacturer's quality tube after hot-dust processing _ Clean limb layer pattern etching, through hole 1 page 31 C: \ 2D-C0DE \ 90-01 \ 89122293.ptd 5. Description of the invention (28), etc. For the single hole industry, you can use this reference hole to make a hole :: external operation and other necessary operations without increasing the processing time. 糸 For measuring the interlayer deviation of the inner conductor layer, the reference hole is explained above. The hole function becomes the standard for observation guidance and widens: f hole machine Remove hole-opening power storage device and high-speed measurement; high-quality measuring device. Large-capacity range, but X-ray, line camera, etc. as a special feature / courtesy of the disc comparator is an independent product leader, and 扣, 卞The call mechanism is shared with most hole-opening machines, because of the [effect of the invention] h to measure the function of the person. 2 Shi Ke said that the multiple camera guide marks formed on a bean layer in a multilayer printed circuit board are arranged in the same camera field of view. , And a single x-ray irradiation is the same: 7 See all the guide mark images in the field, so it can measure all the interlayer = said interlayer offset without increasing the measurement time. It can provide production management information that meets the customer's prior requirements without increasing the processing time. The effect is very large. As a manufacturing method, it can be expected to receive the economic effect of improving the production yield because appropriate intermediate management resources can be obtained in advance.-The guide marks formed between adjacent conductor layers are arranged concentrically to measure the gap.旎 Minimize the reduction in measurement accuracy caused by the thickness of the inner layer and the insulating substrate. If multiple rings are used to guide the mark, the number of layers is concentrically arranged It is effective to determine the interlayer deflection of a small number of inner conductor layers. The form of bow and guide marks, as a reference hole opening machine for multiple marks, can be calculated based on the position of the center of gravity after the image is taken. Increase the degree of soft analysis

484350 V. Description of Invention (29). This point can also be highly evaluated. [Explanation of component numbers] 1: Hole punching machine 2: Housing 3: Stand 4: X-ray generator 4a: X-ray tube 5: X-ray protective tube

5 a: 孑 L 6: X-ray camera 7: Spindle 7a: Chuck 7b: Drill 7c: Cylinder 8: Spindle table 9: Press plate 9a: Cylinder 10: X moving table 11: Y moving table 12: Movable tables 10a, 11a , 12a: Linear guide (LM guide) 10b, 1 lb, 12b: Nut 1 6: Hole position (1,2 holes) 1 6a: Hole position (3, 4 holes)

Page 33 484350 V. Description of the invention (30) 17 Operator position (blank arrow) 20 Guide mark group 21 Guide mark frame 22 Solid guide mark 23 Hollow guide mark 24 Ring guide mark C1, C2 C3; Separating circle 22A ， 23A • Contour line 2 4 N: Contour line (inside) 24G: Contour line (outside) (characters added: starting from the top of the inner plate 1, 2, L · ~ 5, a: surface of the inner plate (upper side) , B: back side (lower side) of the inner layer board.) 3 0: X-ray fluorescent multiplier tube 31: fluorescent film 32: photoelectric surface 33: output fluorescent film 34: optical lens system 35: CCD camera element (charge coupled device) ) 36: Image A: Anode S: Beam electrode f 5 0: Mechanical coordinate system (X m, Y m, Z m, mechanical origin 0 m) 51: Design coordinate system (Ud, Vd, origin Od) HI , H2 ·· Reference hole 6 0: Multilayer printed circuit board

Page 34 484350 Five --- | One—12 3 44567889 no no no no no ΡΌ no no no no no co bright surface monomer must be I hole said double-conductor C pre-lead 3 ^ · _ ·· send aa electric board Board case board base} Slit edge type hole-forming guide belt = slogan guide shape M Bu Xixi board board board L Liao Xiao Road electrical encirclement Liangjiang t 1 Standard / Position electricity small — large floor / sound Based on P and d, take P 1 stack of the most fy-identified faces on the back-'' 口 标 导 1

C: \ 2D-CODE \ 90-01 \ 89122293.ptd Page 35 —__ Brief Description of Drawings Figure 1 shows the invention of the invention, and Figure 2 is a schematic diagram of the guide marks used as C and in the present invention. The shape of the inner markers and the inner markers formed by the inner markers JS | Q ^ bow 丨 i only show the dry sound diagram of the 5 group configuration example. 0 Figure 3 shows the X-ray induction. ^ ^ ^ ^ ΛΑ rs V 軚 Remembering the method of pattern measurement and explanation guide

Know the schematic diagram of the image. Uu T Figure 4 is a schematic diagram showing a CTD day caller α-p,. W ,,,, and the like to capture a guide mark image and a schematic diagram illustrating an image processing method. Fig. 5 is an illustration of two types of guide marks as another embodiment of the present invention. Fig. 6 is a perspective view of a reference hole &amp; Fig. 7 is a front view and a side view of the reference hole punching machine. Fig. 8 is a plan view showing a position of a movable table in the reference hole punching machine. FIG. 9 is a projection view of each side of the X-moving stage in the reference hole opening machine. Θ 1 0 is a perspective view and a plan view showing the structure of a multilayer printed circuit board, and a simplified diagram of a jig board used in hot pressing operations. FIG. 11 is a sectional view showing the structure of a multilayer printed wiring board. Fig. 12 is a front view and a top view of a bisected 2-hole reference hole punching machine.

Claims (1)

/ 、、 The scope of the patent application is in the structure: ί: Γ Brush circuit board 'characterized in that' it has: The inner side of the outer line :: f The inner layer of the circuit board-the conductor layer formed on the conductor layer, the contour line ::: mouth: Solid guide marks formed on adjacent conductor layers with wheels on both sides and dark parts on the conductor layer; Guide marks: 透视 透视 The thickness direction of the board sees through the temple of Nichi 'the aforementioned hollow guide is forward "; the guide marks and The contour lines are set in size.祆 The contour line avoids the multilayer printed circuit board with the solid guide mark described in item 2 and above, where the front multilayer printed ::::: "When designing the layer conductor pattern, it is configured to make the aforementioned The position of the center of gravity is the same. Set /, let alone, the pattern of the outline of the heart guide mark, the multilayer printed circuit board of the first three items described above, in which a guide mark frame; the opposite inner conductor layer is formed to remove the conductor. The guide mark frame is included in the above-mentioned multi-layer printing at a low sound of each conductor; 2 "position ', the observation of the large guide mark formed by it i Φ and the thickness direction of the plate to observe the solid guide mark and the interior of the empty note The configured leader set. 71 v "At least one group consisting of 汜 4. Such as the multilayer printed circuit board of the scope of patent application No. 2 wherein, in ml C: \ 2D-CODE \ 90-01 \ 89122293.ptd page 37 484350 VI. Application Scope of the patent: On the inner conductor layer of the foregoing multilayer printed circuit board, a plurality of guide mark frames for removing conductors are formed. The guide mark frame is at the same position of each conductor layer, and the size formed is included in the thickness of the multilayer printed circuit board. Fang Shang sees through in the field of vision of the imaging unit in the observation device for observing the guide mark; the guide mark frame is provided with at least one set of guide marks composed of the through-heart guide mark and the hollow guide mark inside the hollow guide mark; 5. The multilayer printed circuit board according to item 2 of the scope of patent application, wherein the solid $ guide mark formed on the inner conductor layer of the specific multilayer printed circuit board is arranged in the center of the guide mark frame. 6 · 如Multilayer &gt; Brushed Circuit Boards with Patent Application Scope 3, wherein The solid guide mark is disposed in the center of the aforementioned guide mark frame. 7. The multilayer printed circuit board according to item 4 of the patent application scope, wherein the solid guide mark formed on the inner conductor layer of the specific multilayer printed circuit board is disposed on the The center of the aforementioned guide mark frame. 8. The multilayer printed circuit board according to any one of items 2 to 7 of the scope of patent application, wherein a contour line including the aforementioned outline of the hollow guide mark is specified, and two outlines are used. The line is taken as two concentric circular ring guide marks f as hollow guide marks. 9. A method for measuring the interlayer offset of a multilayer printed circuit board, characterized in that it is formed and removed on the inner conductor layer of the multilayer printed circuit board. Multiple conductor Page 38 484350 VI. Patent application guide mark frame, the guide mark frame is located at the same position of each of the aforementioned conductor layers, and the size formed is included in the thickness direction of the multilayer printed circuit board to observe the observation of the foregoing guide mark In the field of vision of the imaging unit in the device; observe the guide mark group of at least one guide mark group arranged inside the guide mark frame, the solid guide mark arranged inside the hollow guide mark and the hollow guide j mark, and Images of all guide mark groups in a guide mark group are taken in one observation. 10. According to the method for measuring the inter-layer deviation of item 9 in the scope of the patent application, the coordinates of all the guide marks in the same guide mark frame are calculated on the basis of the position of the guide marks arranged in the center of the visual field. 11. The method for measuring the inter-layer offset according to item 9 of the scope of patent application, wherein all or a part of the coordinate values of the foregoing guide marks included in the foregoing guide mark group are used to infer the coordinate position of the inner layer and determine the reference Hole coordinates. Page 39