CN210579438U - Printed circuit board with positioning circle - Google Patents
Printed circuit board with positioning circle Download PDFInfo
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- CN210579438U CN210579438U CN201921407813.7U CN201921407813U CN210579438U CN 210579438 U CN210579438 U CN 210579438U CN 201921407813 U CN201921407813 U CN 201921407813U CN 210579438 U CN210579438 U CN 210579438U
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- transparent part
- positioning circle
- printed circuit
- circle
- circuit board
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Abstract
The utility model relates to the technical field of printed circuit boards, in particular to a printed circuit board with a positioning circle, which comprises a body; the body comprises a first core plate, a middle plate and a second core plate; a positioning circle is arranged in the rectangular bonding pad; the positioning circle is provided with a first transparent part, a second transparent part, a third transparent part and a fourth transparent part in four equal parts; the color of the first transparent part is the same as that of the third transparent part; the color of the second transparent part is the same as that of the fourth transparent part; the first transparent part has a color different from a color of the second transparent part. The utility model discloses an all set up rectangle pad and location circle on first core board, intermediate lamella and second core board to be provided with the transparent portion of two kinds of colours on the location circle, when carrying out the alignment between the layer, whether the colour through observing transparent portion has the overlapping to judge whether counterpoint of first core board, intermediate lamella and second core is accurate, and the user of being convenient for observes and the management and control layer is inclined to one side.
Description
Technical Field
The utility model relates to a printed wiring board technical field, concretely relates to printed wiring board with location circle.
Background
In the production of the existing printed circuit board, the requirement for interlayer alignment is more and more strict. Therefore, the alignment condition between the laminated layers of the boards with different designs can be timely and accurately judged in the production process, and accurate judgment basis is provided for subsequent adjustment and optimization. The traditional layer deflection and shrinkage judging method is mostly realized by setting concentric circles or utilizing an X-ray measuring target. Although the former has simple measurement, the former cannot read accurate data and only can roughly estimate the deviation direction and the deviation size; the latter can achieve accurate data acquisition, but measurement is time-consuming and the manufacturing of instruments and measurement files is complicated.
Disclosure of Invention
The utility model aims at the above-mentioned among the prior art not enough, provide a printed wiring board with location circle.
The purpose of the utility model is realized through the following technical scheme: a printed circuit board with a positioning circle comprises a body; the body comprises a first core plate, a middle plate and a second core plate which are sequentially arranged; rectangular pads are correspondingly arranged on the edge of the first core board, the edge of the middle board and the edge of the second core board; a positioning circle is arranged in the rectangular bonding pad; the positioning circle is provided with a first transparent part, a second transparent part, a third transparent part and a fourth transparent part in four equal parts; the first transparent part and the third transparent part are symmetrically arranged around the center of the positioning circle; the second transparent part and the fourth transparent part are symmetrically arranged around the center of the positioning circle; the color of the first transparent part is the same as that of the third transparent part; the color of the second transparent part is the same as that of the fourth transparent part; the first transparent part has a color different from a color of the second transparent part.
The utility model discloses further set up to, be equipped with the clearance between rectangle pad and the location circle.
The utility model discloses further set up to, the cover is equipped with the heat dissipation frame around the body.
The utility model discloses further set up to, be equipped with a plurality of radiating grooves on the heat dissipation frame.
The utility model is further arranged that the middle plate comprises a plurality of PP resin sheets which are overlapped; the upper surface and the lower surface of the first core plate are respectively provided with a first surface and a second surface; the upper surface and the lower surface of the second core plate are respectively provided with a third surface and a fourth surface; the second surface is arranged on the top of the PP resin sheet; the third surface is arranged at the bottom of the PP resin sheet.
The utility model discloses further set up as, first surface and second surface all cover have first copper layer.
The utility model discloses further set up to, third surface and fourth surface all cover and have the second copper layer.
The utility model has the advantages that: the utility model discloses an all set up rectangle pad and location circle on first core board, intermediate lamella and second core board to be provided with the transparent portion of two kinds of colours on the location circle, when carrying out the alignment between the layer, overlap the location circle on first core board, intermediate lamella and the second core board and aim at, whether the colour through observing transparent portion has the overlap to judge first core board, intermediate lamella and second core board whether to counterpoint the accuracy, the user of being convenient for observes and the management and control layer is inclined to one side.
Drawings
The invention is further described with the aid of the accompanying drawings, in which, however, the embodiments do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived from the following drawings without inventive effort.
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of the rectangular bonding pad and the positioning circle of the present invention;
figure 3 is a cross-sectional view of the body of the present invention;
wherein: 1-body; 2-a first core plate; 21-a first surface; 22-a second surface; 3-a middle plate; 31-PP resin sheet; 4-a second core board; 41-a third surface; 42-a fourth surface; 5-rectangular pads; 51-gap; 6-positioning a circle; 61-a first transparent portion; 62-a second transparent portion; 63-a third transparent portion; 64-a fourth transparent portion; 7-a heat dissipation frame; 71-heat sink; 81-a first copper layer; 82-second copper layer.
Detailed Description
The invention will be further described with reference to the following examples.
As can be seen from fig. 1 to 3; the printed circuit board with the positioning circle comprises a body 1; the body 1 comprises a first core plate 2, a middle plate 3 and a second core plate 4 which are arranged in sequence; rectangular bonding pads 5 are correspondingly arranged on the edge of the first core plate 2, the edge of the middle plate 3 and the edge of the second core plate 4; a positioning circle 6 is arranged in the rectangular bonding pad 5; the positioning circle 6 is provided with a first transparent part 61, a second transparent part 62, a third transparent part 63 and a fourth transparent part 64 in four equal parts; the first transparent part 61 and the third transparent part 63 are symmetrically arranged around the center of the positioning circle 6; the second transparent part 62 and the fourth transparent part 64 are symmetrically arranged about the center of the positioning circle 6; the color of the first transparent part 61 is the same as that of the third transparent part 63; the color of the second transparent part 62 is the same as the color of the fourth transparent part 64; the first transparent part 61 has a color different from that of the second transparent part 62.
Specifically, this embodiment the printed wiring board, through all set up rectangle pad 5 and location circle 6 on first core board 2, intermediate lamella 3 and second core board 4 to be provided with the transparent portion of two kinds of colours on the circle 6 of location, when carrying out the alignment between the layer, overlap the alignment with the circle 6 of location on first core board 2, intermediate lamella 3 and the second core board 4, whether the colour through observing the transparent portion has the overlap to judge first core board 2, intermediate lamella 3 and second core board 4 and whether counterpoint accurately, be convenient for the user to observe and manage and control the layer partially.
In the printed circuit board with the positioning circle according to this embodiment, a gap 51 is provided between the rectangular pad 5 and the positioning circle 6. Specifically, by providing the gap 51 between the rectangular pad 5 and the positioning circle 6, the rectangular pad 5 is facilitated to be soldered.
In the printed circuit board with the positioning circle of this embodiment, the heat dissipation frame 7 is sleeved on the periphery of the body 1. Through the arrangement, the printed circuit board can be cooled.
In the printed circuit board with positioning circles of this embodiment, the heat dissipation frame 7 is provided with a plurality of heat dissipation grooves 71. The heat dissipation area of the heat dissipation frame 7 can be increased by the above arrangement, so that the heat dissipation performance is further enhanced.
In the printed circuit board with positioning circles of this embodiment, the middle board 3 includes a plurality of PP resin sheets 31 stacked one on another; the upper surface and the lower surface of the first core plate 2 are respectively provided with a first surface 21 and a second surface 22; the upper surface and the lower surface of the second core plate 4 are respectively provided with a third surface 41 and a fourth surface 42; the second surface 22 is arranged on the top of the PP resin sheet 31; the third surface 41 is provided on the bottom of the PP resin sheet 31. Specifically, this embodiment is through placing PP resin piece 31 in the middle of, and relative two surfaces set up first core 2 and second core 4 respectively to can reduce the production degree of difficulty when the difficult management and control scheduling problem of the big, the difficult management and control of pressfitting thickness of PP resin piece 31 gummosis causes connects, reduce the pressfitting risk when PP resin piece 31 number is many, make pressfitting quality and layer partially become to change the management and control more.
In the printed circuit board with positioning circles of this embodiment, the first surface 21 and the second surface 22 are covered with the first copper layer 81. In the printed circuit board with positioning circles of the embodiment, the third surface 41 and the fourth surface 42 are covered with the second copper layer 82. Through improvement, the processing requirements of some copper layers can be met, and the overall strength of the printed circuit board can be enhanced.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (7)
1. The utility model provides a printed wiring board with location circle which characterized in that: comprises a body (1); the body (1) comprises a first core plate (2), a middle plate (3) and a second core plate (4) which are arranged in sequence; rectangular pads (5) are correspondingly arranged on the edge of the first core plate (2), the edge of the middle plate (3) and the edge of the second core plate (4); a positioning circle (6) is arranged in the rectangular bonding pad (5); the positioning circle (6) is provided with a first transparent part (61), a second transparent part (62), a third transparent part (63) and a fourth transparent part (64) in four equal parts; the first transparent part (61) and the third transparent part (63) are symmetrically arranged around the center of the positioning circle (6); the second transparent part (62) and the fourth transparent part (64) are symmetrically arranged around the center of the positioning circle (6); the color of the first transparent part (61) is the same as the color of the third transparent part (63); the color of the second transparent part (62) is the same as the color of the fourth transparent part (64); the first transparent part (61) has a color different from that of the second transparent part (62).
2. The printed circuit board with the positioning circle of claim 1, wherein: a gap (51) is arranged between the rectangular bonding pad (5) and the positioning circle (6).
3. The printed circuit board with the positioning circle of claim 1, wherein: the periphery of the body (1) is sleeved with a heat dissipation frame (7).
4. The printed circuit board with the positioning circle of claim 3, wherein: the heat dissipation frame (7) is provided with a plurality of heat dissipation grooves (71).
5. The printed circuit board with the positioning circle of claim 1, wherein: the middle plate (3) comprises a plurality of PP resin sheets (31) which are overlapped; the upper surface and the lower surface of the first core plate (2) are respectively provided with a first surface (21) and a second surface (22); the upper surface and the lower surface of the second core plate (4) are respectively provided with a third surface (41) and a fourth surface (42); the second surface (22) is arranged on the top of the PP resin sheet (31); the third surface (41) is provided on the bottom of the PP resin sheet (31).
6. The printed circuit board with the positioning circle of claim 5, wherein: the first surface (21) and the second surface (22) are each covered with a first copper layer (81).
7. The printed circuit board with the positioning circle of claim 5, wherein: the third surface (41) and the fourth surface (42) are each covered with a second copper layer (82).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921407813.7U CN210579438U (en) | 2019-08-27 | 2019-08-27 | Printed circuit board with positioning circle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921407813.7U CN210579438U (en) | 2019-08-27 | 2019-08-27 | Printed circuit board with positioning circle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210579438U true CN210579438U (en) | 2020-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921407813.7U Active CN210579438U (en) | 2019-08-27 | 2019-08-27 | Printed circuit board with positioning circle |
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| Country | Link |
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| CN (1) | CN210579438U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114189979A (en) * | 2021-12-06 | 2022-03-15 | 深圳市鑫达辉软性电路科技有限公司 | Multilayer board blind hole mark layer alignment structure and method |
| CN114222418A (en) * | 2021-12-06 | 2022-03-22 | 深圳市鑫达辉软性电路科技有限公司 | Multilayer board deviation identification structure |
-
2019
- 2019-08-27 CN CN201921407813.7U patent/CN210579438U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114189979A (en) * | 2021-12-06 | 2022-03-15 | 深圳市鑫达辉软性电路科技有限公司 | Multilayer board blind hole mark layer alignment structure and method |
| CN114222418A (en) * | 2021-12-06 | 2022-03-22 | 深圳市鑫达辉软性电路科技有限公司 | Multilayer board deviation identification structure |
| CN114189979B (en) * | 2021-12-06 | 2024-05-28 | 深圳市鑫达辉软性电路科技有限公司 | Multi-layer board blind hole marking layer alignment structure and method |
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