CN114189979A - Multilayer board blind hole mark layer alignment structure and method - Google Patents
Multilayer board blind hole mark layer alignment structure and method Download PDFInfo
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- CN114189979A CN114189979A CN202111475876.8A CN202111475876A CN114189979A CN 114189979 A CN114189979 A CN 114189979A CN 202111475876 A CN202111475876 A CN 202111475876A CN 114189979 A CN114189979 A CN 114189979A
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- layer
- blind hole
- alignment mechanism
- multilayer board
- marking
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000010030 laminating Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 5
- 238000010292 electrical insulation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a multilayer board blind hole marking layer alignment structure and a method. According to the staggered-layer board blind hole mark layer alignment mechanism provided by the invention, the first layer alignment mechanism is arranged through the inner layer FPC, the second layer alignment mechanism which is aligned with the inner layer FPC is arranged on other layers, when equipment is used for processing each layer of FPC, the first layer alignment mechanism is scanned through the second layer alignment mechanism, and processing is carried out based on the same datum point of the first layer alignment mechanism, so that the problem of deviation in processing each layer of FPC is avoided.
Description
Technical Field
The invention relates to the technical field of multilayer flexible circuit boards, in particular to a multilayer board blind hole marking layer alignment structure and a method.
Background
The flexible circuit board is called FPC for short, when all layers of the multilayer board are overlapped, the precision tolerance exists due to the fact that the respective processing datum points are different in the processing process, and the deviation situation exists due to tolerance difference accumulated by combining the multilayer FPCs.
Disclosure of Invention
The embodiment of the invention provides a multilayer board blind hole mark layer alignment structure and a method, which aim to solve the technical problem of processing deviation caused by different processing reference points of each layer of a multilayer FPC.
In a first aspect, the present invention provides a blind hole mark level alignment structure for a multi-layer board, comprising
The device comprises a plurality of layers of FPCs, a first layer alignment mechanism arranged on the inner layer FPC and a second layer alignment mechanism arranged on other layers and aligned with the first layer alignment mechanism.
In some embodiments, the first layer alignment mechanism is a blind mark hole formed on the inner layer FPC, and the second layer alignment mechanism is a light hole formed on the other layer FPC.
In some embodiments, the first respective alignment mechanism is a blind mark hole formed in the inner layer FPC, and the second respective alignment mechanism is a light-transmissive layer formed in the other layer FPC.
In some embodiments, the light transmissive layer is a PI (polyimide) layer.
In some embodiments, the mark blind holes are formed at four corners of the inner layer FPC, and the light-transmitting layer corresponds to the mark blind holes.
In some embodiments, the blind marking holes are circular blind holes with diameters ranging from 1.0mm to 2.0 mm.
In some embodiments, the diameter value of the marking blind hole is smaller than the width value or the diameter value of the light transmission layer.
In a second aspect, the invention provides a method for aligning blind hole mark layers of a multilayer board, comprising the following steps:
arranging a first layer of alignment mechanism on the inner layer FPC;
arranging second layer contraposition mechanisms which are opposite to the first layer contraposition mechanisms on other layers of FPCs;
laminating the inner layer FPC and other layers of FPCs to form a multilayer board;
observing the first layer alignment mechanism through the second layer alignment mechanisms of other layers;
and obtaining the lamination and alignment condition of the multilayer board according to the observation condition.
The technical scheme provided by the invention has the beneficial effects that:
according to the staggered-layer board blind hole mark layer alignment mechanism provided by the invention, the first layer alignment mechanism is arranged through the inner layer FPC, the second layer alignment mechanism which is aligned with the inner layer FPC is arranged on other layers, when equipment is used for processing each layer of FPC, the first layer alignment mechanism is scanned through the second layer alignment mechanism, and processing is carried out based on the same datum point of the first layer alignment mechanism, so that the problem of deviation in processing each layer of FPC is avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an alignment structure of a blind hole mark layer of a multilayer board according to an embodiment of the present invention;
fig. 2 is another schematic structural diagram of a blind via mark level alignment structure of a multilayer board according to an embodiment of the present invention.
In the figure:
100. FPC; 10. marking a blind hole; 20. a light transmitting layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment of the invention provides a multilayer board blind hole mark layer alignment structure, which can solve the technical problem of processing deviation caused by different processing reference points of each layer of a multilayer FPC 100.
Referring to fig. 1-2, the present invention provides a multi-layer board blind hole mark level alignment structure, which includes a multi-layer FPC100, a first level alignment mechanism disposed on the inner layer FPC100, and a second level alignment mechanism disposed on other layers and aligned with the first level alignment mechanism.
According to the staggered-layer board blind hole marking layer alignment mechanism provided by the invention, the first layer alignment mechanism is arranged through the inner-layer FPC100, the second layer alignment mechanism which is aligned with the inner-layer FPC100 is arranged on other layers, when equipment is used for processing each layer of FPC100, the first layer alignment mechanism is scanned through the second layer alignment mechanism, processing is carried out on the basis of the same datum point of the first layer alignment mechanism, the problem of deviation generated in processing each layer of FPC100 is avoided, and alignment of each layer of flexible circuit board of the multilayer FPC100 structure with the inner-layer flexible circuit board is realized.
As described above, according to the present application, the inner layer FPC100 is defined as the bottom layer FPC100 of the multi-layer FPC100 structure, and the other layer FPC100 is defined as the bottom layer upper FPC100, i.e., the non-bottom layer FPC100, of the multi-layer FPC100 structure.
As mentioned above, according to the present application, the blind marking hole 10 is defined as a non-through hole circular structure having a marking feature, such as a full circle having a color or a full circle having other marking features.
As described above, the portion of fig. 1 where the outer circle is marked 100 is only a portion of the FPC 100.
In one embodiment, the first layer alignment mechanism is a blind mark hole 10 disposed on the inner layer FPC100, and the second layer alignment mechanism is a light-transmitting hole disposed on the other layer FPC 100. The blind mark holes 10 are observed through the light holes, namely alignment, and the blind mark holes 10 are not observed through the light holes or the observed blind mark holes 10 are deviated, namely non-alignment.
Because the circuit on FPC100 sets up complicatedly, need to realize electrical insulation between the multilayer FPC100, the first layer is other to counterpoint the mechanism and for locating mark blind hole 10 on inlayer FPC100, will the second layer is other to counterpoint the mechanism and regards as the euphotic layer 20 of locating on other layers FPC100, both can realize physical isolation and electrical insulation between the multilayer FPC100, can realize seeing through the mark blind hole 10 that euphotic layer 20 observed the inlayer again, euphotic layer 20 can be on FPC100 non-circuit position design, need not to consider the circuit design on the FPC100 of lower floor, it is more convenient nimble to realize, and the design need consider adjacent circuit design and the electrical insulation effect between two-layer for the mode of euphotic hole, realize comparatively restrictedly.
In one embodiment, the light-transmitting layer 20 is a PI layer, which has a better electrical insulation property and a light-transmitting effect.
In one embodiment, the blind mark holes 10 are disposed at four corners of the inner layer FPC100, and offset recognition is performed from the four corners, and the light-transmitting layer 20 corresponds to the blind mark holes 10.
In one embodiment, the blind marking holes 10 are circular blind holes with a diameter in the range of 1.0mm to 2.0 mm.
In an embodiment, the transparent layer 20 is disposed on a transparent circle concentrically disposed in the blind mark hole 10, and a diameter of the transparent circle is greater than a diameter of the blind mark hole 10.
In an alternative embodiment of the present application, the shape of the light-transmitting layer 20 may also be implemented as a square, as long as the alignment identification between the light-transmitting layer and the blind mark hole 10 is possible.
In an embodiment, the diameter value of the blind mark hole 10 is smaller than the width value or the diameter value of the transparent layer 20.
In one embodiment, the diameter of the blind via 10 is 1/3-1/2 of the diameter of the transparent layer 20.
And observing the position of the marked blind hole 10 in the light-transmitting layer 20 through the light-transmitting layer 20 to judge the alignment condition of the multi-layer FPC 100. In order to achieve a finer detection result, after the detection is performed by the AOI device, the detection result of the marked blind hole 10 in the light-transmitting layer 20 is obtained, and then a more accurate alignment condition is obtained through analysis and calculation.
In a specific embodiment, the diameter of the blind mark hole 10 is 1.0mm, and the shape of the light-transmitting layer 20 is circular and has a diameter of 2.4 mm.
Based on the same inventive concept, the invention provides a multilayer board blind hole mark level alignment method, which comprises the following steps:
s100, arranging a first layer of respective alignment mechanism on the inner layer FPC 100;
s200, arranging a second layer alignment mechanism which is aligned with the first layer alignment mechanism on the other layers of FPC 100;
s300, laminating the inner layer FPC100 and other layers of FPCs 100 to form a multilayer board;
s400, observing the first layer alignment mechanism through the second layer alignment mechanisms of other layers;
and S500, acquiring the lamination alignment condition of the multilayer board according to the observation condition.
In one embodiment, a method for aligning blind hole mark layers of a multilayer board comprises the following steps:
s100, arranging a mark blind hole 10 on the inner-layer FPC 100;
s210, arranging light holes opposite to the marking blind holes 10 on the FPC100 with other layers;
s300, laminating the inner layer FPC100 and other layers of FPCs 100 to form a multilayer board;
s410, observing the marked blind hole 10 through the light holes of other layers;
and S510, acquiring the lamination alignment condition of the multilayer board according to the condition that the marked blind holes 10 are observed in the light transmission holes on the FPC100 of other non-bottom layers.
In one embodiment, a method for aligning blind hole mark layers of a multilayer board comprises the following steps:
s100, arranging a mark blind hole 10 on the inner-layer FPC 100;
s220, arranging light holes opposite to the marking blind holes 10 on the FPC100 with other layers;
s300, laminating the inner layer FPC100 and other layers of FPCs 100 to form a multilayer board;
s420, observing the marked blind hole 10 through the light holes of other layers;
and S520, acquiring the lamination alignment condition of the multilayer board according to the condition that the marked blind holes 10 are observed in the light holes of the FPC100 which is not the bottom layer.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is to be noted that, in the present invention, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The utility model provides a multilayer board blind hole mark level is to bit architecture which characterized in that includes:
the device comprises a plurality of layers of FPCs, a first layer alignment mechanism arranged on the inner layer FPC and a second layer alignment mechanism arranged on other layers and aligned with the first layer alignment mechanism.
2. The multilayer board blind hole marking level alignment structure according to claim 1, wherein the first level alignment mechanism is a marking blind hole provided on the inner layer FPC, and the second level alignment mechanism is a light-transmitting hole provided on the other layer FPC.
3. The multilayer board blind hole marking level alignment structure as claimed in claim 1, wherein the first level alignment mechanism is a marking blind hole provided on an inner layer FPC, and the second level alignment mechanism is a light-transmitting layer provided on other layers of FPCs.
4. The multilayer board blind hole mark level alignment structure according to claim 3, wherein the light-transmitting layer is a PI layer.
5. The multilayer board blind hole marking level alignment structure as claimed in claim 3, wherein the marking blind holes are arranged at four corners of the inner layer FPC, and the light-transmitting layer corresponds to the marking blind holes.
6. The multilayer plate blind hole marking level alignment structure as claimed in claim 3, wherein the marking blind hole is a circular blind hole with a diameter ranging from 1.0mm to 2.0 mm.
7. The multilayer board blind hole marking level alignment structure according to claim 3, wherein the diameter value of the marking blind hole is smaller than the width value or the diameter value of the euphotic layer.
8. A multilayer board blind hole mark layer alignment method is characterized by comprising the following steps:
arranging a first layer of alignment mechanism on the inner layer FPC;
arranging second layer contraposition mechanisms which are opposite to the first layer contraposition mechanisms on other layers of FPCs;
laminating the inner layer FPC and other layers of FPCs to form a multilayer board;
observing the first layer alignment mechanism through the second layer alignment mechanisms of other layers;
and obtaining the lamination and alignment condition of the multilayer board according to the observation condition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111475876.8A CN114189979B (en) | 2021-12-06 | 2021-12-06 | Multi-layer board blind hole marking layer alignment structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111475876.8A CN114189979B (en) | 2021-12-06 | 2021-12-06 | Multi-layer board blind hole marking layer alignment structure and method |
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| Publication Number | Publication Date |
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| CN114189979A true CN114189979A (en) | 2022-03-15 |
| CN114189979B CN114189979B (en) | 2024-05-28 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04158039A (en) * | 1990-10-22 | 1992-06-01 | Tdk Corp | Aligning method and device between print screen and substrate |
| JPH05232714A (en) * | 1992-01-31 | 1993-09-10 | Sanee Giken Kk | Aligning method for base board with photo-plate in exposure process |
| JPH09230800A (en) * | 1996-02-27 | 1997-09-05 | Sharp Corp | Display panel and substrate member |
| JP2003264349A (en) * | 2003-03-03 | 2003-09-19 | Canon Inc | Alignment mark structure in electric circuit board |
| US20160155722A1 (en) * | 2014-12-02 | 2016-06-02 | Glenn J. Leedy | Vertical system integration |
| CN107995771A (en) * | 2017-11-09 | 2018-05-04 | 奥士康科技股份有限公司 | A kind of high multilayer mixing second order HDI printed circuit board (PCB)s alignment system and method |
| CN210579438U (en) * | 2019-08-27 | 2020-05-19 | 东莞市东华鑫达精密电路有限公司 | Printed circuit board with positioning circle |
-
2021
- 2021-12-06 CN CN202111475876.8A patent/CN114189979B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04158039A (en) * | 1990-10-22 | 1992-06-01 | Tdk Corp | Aligning method and device between print screen and substrate |
| JPH05232714A (en) * | 1992-01-31 | 1993-09-10 | Sanee Giken Kk | Aligning method for base board with photo-plate in exposure process |
| JPH09230800A (en) * | 1996-02-27 | 1997-09-05 | Sharp Corp | Display panel and substrate member |
| JP2003264349A (en) * | 2003-03-03 | 2003-09-19 | Canon Inc | Alignment mark structure in electric circuit board |
| US20160155722A1 (en) * | 2014-12-02 | 2016-06-02 | Glenn J. Leedy | Vertical system integration |
| CN107995771A (en) * | 2017-11-09 | 2018-05-04 | 奥士康科技股份有限公司 | A kind of high multilayer mixing second order HDI printed circuit board (PCB)s alignment system and method |
| CN210579438U (en) * | 2019-08-27 | 2020-05-19 | 东莞市东华鑫达精密电路有限公司 | Printed circuit board with positioning circle |
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| CN114189979B (en) | 2024-05-28 |
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