CN215529459U - High multiply wood pressfitting, drilling counterpoint equipment - Google Patents
High multiply wood pressfitting, drilling counterpoint equipment Download PDFInfo
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- CN215529459U CN215529459U CN202121870663.0U CN202121870663U CN215529459U CN 215529459 U CN215529459 U CN 215529459U CN 202121870663 U CN202121870663 U CN 202121870663U CN 215529459 U CN215529459 U CN 215529459U
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Abstract
The utility model provides high multi-layer board pressing and drilling alignment equipment, which relates to the technical field of printed circuit board manufacturing and comprises a positioning board, wherein a pressing long target is arranged on the top surface of the positioning board, standby targets are bonded on the top surface of the positioning board in an array mode, electromagnetic hot frits are fixed on the top surface of the positioning board, layering targets are fixed on the top surface of the positioning board and are respectively positioned on the long sides and the short sides of the positioning board, four groups of layering targets are arranged, concentric circles are formed on the top surface of the positioning board, rivet holes are formed in the top surface of the positioning board, a drilling deviation inspection target is arranged on the top surface of the positioning board and is bonded on the top surface of the positioning board, a three-target system is adopted, the lower left corner is foolproof, and three standby targets are designed by using short targets; the electromagnetic hot melting blocks are designed for a plurality of core plates, and when the electromagnetic hot melting machine is used for production, the A/C hot melting blocks are adopted, and the A/B hot melting blocks are used during manual fusion, so that the alignment precision between the lamination layers of the high-multilayer circuit board is effectively improved, and the stability of the structure of the high-multilayer circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of printed circuit board manufacturing, in particular to high-rise board laminating and drilling alignment equipment.
Background
With the development of electronic products toward high density, high precision and multifunction, the requirements on the design and manufacturing process of a Printed Circuit Board (PCB) are higher and higher, and the products are also developed from a multilayer board with a simple structure to high-end printed board products such as a High Density Interconnect (HDI), a high-rise circuit board (more than 10 layers), a rigid-flex printed board and the like. The high-precision interlayer alignment system is a key technology for manufacturing the high-multilayer circuit board, so the laminated interlayer alignment precision restricts the processing capacity of the high-multilayer circuit board, the multiple lamination process of the conventional multilayer circuit board adopts a pin positioning system manufacturing method with relatively high precision, and because the same set of pin positioning slotted hole is used for manufacturing for multiple times, although the method has certain technical advantages in the interlayer alignment precision compared with the conventional riveting process, the interlayer alignment precision of the high-multilayer circuit board of the multiple lamination process cannot meet the production quality requirement due to the influence of the procedures after lamination, such as drilling, electroplating and outer layer etching, on the size processing precision of the board part and the accumulated alignment precision deviation after multiple times of lamination.
The traditional multiple (secondary or more) pressing process of the multilayer circuit board adopts a pin positioning system with relatively high precision, and because the same set of pin positioning slotted hole is repeatedly used for manufacturing, although the method has certain technical advantages in the interlayer alignment precision compared with the conventional riveting process, the interlayer alignment precision of the high multilayer circuit board of the multiple pressing process can not meet the production quality requirement due to the influence on the graphic dimension precision after the processes such as drilling, electroplating and outer layer etching after the pressing and the deviation accumulation of the pressing alignment precision of the two or more pressing processes.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides high-rise board laminating and drilling alignment equipment.
In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides a high multiply wood pressfitting, drilling counterpoint equipment, includes the locating plate, the locating plate top surface is equipped with the long target of pressfitting, locating plate top surface array bonding has reserve target, the locating plate top surface is fixed with the electromagnetic hot frit, the locating plate top surface is fixed with the layering target, and the layering target is located the length limit of locating plate respectively, and the layering target totally four groups, the concentric circles has been seted up to the locating plate top surface, the rivet hole has been seted up to the locating plate top surface, the locating plate top surface is equipped with drilling skew inspection target, and drilling skew inspection target bonds in the locating plate top surface.
Preferably, three circular rings are wound around the pressed long target and the spare target, the spacing between the copper wound disks of the spare target is 0.28mm, and the thickness of the circular ring of the spare target is 0.3 mm.
Preferably, the box of the spare target is 7.0mm, and the copper plate at the very center of the box of the spare target is 1.375 mm.
Preferably, the box of the layered target is 8mm and the copper disk within the layered target is 1.375 mm.
Preferably, the concentric circles are respectively located at corners of the positioning plate.
Preferably, the rivet holes are located on the surfaces of the long and short sides of the positioning plate, and two rivet holes are respectively arranged on the long and short sides of the positioning plate.
Preferably, the rivet hole is 40mm away from the positioning plate edge.
Preferably, the drilling offset inspection targets are 6 groups. And the borehole offset inspection targets are in groups of two.
Preferably, the diameter of the copper disc of the drilling offset inspection target is 1.3 mm.
Preferably, four groups of the drilling deviation checking targets are respectively positioned at the corners of the positioning plate, and two groups of the drilling deviation checking targets are positioned on the long edges of the positioning plate.
Advantageous effects
In the utility model, by adopting a three-target system, the lower left corner is foolproof, and three standby targets are designed for short targets; the electromagnetic hot melting blocks are designed for a plurality of core plates, and when the electromagnetic hot melting machine is used for production, the A/C hot melting blocks are adopted, and the A/B hot melting blocks are used during manual fusion, so that the alignment precision between the lamination layers of the high-multilayer circuit board is effectively improved, and the stability of the structure of the high-multilayer circuit board is improved.
According to the utility model, through the interlayer offset checking tool design of the layered target, the concentric circles at four corners of the plate edge, the rivet hole and the drilling offset checking target, the interlayer offset degree of pressing and drilling is effectively identified, and the interlayer alignment precision is improved.
According to the utility model, the drilling deviation checking target is used for drilling trial drilling, and whether the drilling deviation exists at four corners after trial drilling is finished, so that the coefficient can be adjusted in time, and the drilling precision of drilling is improved.
Drawings
FIG. 1 is an overall schematic view of the present invention;
FIG. 2 is an overall view of a laminated long target of the present invention;
FIG. 3 is an overall view of a backup target of the present invention;
FIG. 4 is an overall view of the electromagnetic thermofuse of the present invention;
FIG. 5 is an overall view of a layered target of the present invention.
Illustration of the drawings:
1. positioning a plate; 2. pressing the long target; 3. a standby target; 4. an electromagnetic hot frit; 5. layering a target; 6. concentric circles; 7. rivet holes; 8. the borehole is offset to inspect the target.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the utility model easily understood, the utility model is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the utility model, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.
Specific embodiments of the present invention are described below with reference to the accompanying drawings.
The specific embodiment is as follows:
referring to fig. 1-5, a high multi-layer board pressing and drilling alignment device comprises a positioning plate 1, wherein a pressing long target 2 is arranged on the top surface of the positioning plate 1, spare targets 3 are adhered to the top surface of the positioning plate 1 in an array mode, three circular rings are wound around the pressing long target 2 and the spare targets 3, the spacing between copper discs wound on the spare targets 3 is 0.28mm, the thickness of the circular rings of the spare targets 3 is 0.3mm, the square frame of the spare targets 3 is 7.0mm, the copper disc at the center of the square frame of the spare targets 3 is 1.375mm, pins are milled and drilled by x-ray positioning, if x-ray target holes are damaged, the spare targets are used for positioning 3, an electromagnetic hot melting block 4 is fixed on the top surface of the positioning plate 1, layered targets 5 are fixed on the top surface of the positioning plate 1, the layered targets 5 are respectively positioned on the long side and the short side of the positioning plate 1, the layered targets 5 are four groups, the square frame of the layered targets 5 is 8mm, the copper disc in the layered targets 5 is 1.375mm, the layered targets 5 are used for a plurality of copper core plates with thin cathode and anode plates or different thicknesses, the method comprises the steps of adding 1.375mm copper pads in an 8.0mm square frame, adding 1.2.3 … numbers beside different core boards for digital discrimination, measuring a layering compensation expansion and contraction value by using a quadratic element for lamination, placing a circuit board on a positioning plate 1, positioning the circuit board by arranging a lamination long target 2, a standby target 3 and a layering target 5 on the positioning plate 1 through the positioning plate 1, positioning the circuit board when laminating the circuit board, positioning the circuit board by using the lamination long target 2 and the standby target 3 at two short sides of the positioning plate 1, respectively arranging the layering target 5 at each of the long side and the short side of the positioning plate 1, arranging electromagnetic hot melting blocks 4 by using a plurality of long-side core boards 2 and electromagnetic hot melting blocks 4, wherein the copper blocks are 7.0x2.0mm rectangular, the long direction is 5mm, and no object is added in the short direction within 8mm, and when the electromagnetic hot melting machine is produced, adopting A/C hot melting blocks, and manually using A/B hot melting blocks during lamination, so that the precision of the circuit board is improved. The top surface of the positioning plate 1 is provided with concentric circles 6, the concentric circles 6 are respectively located at the corners of the positioning plate 1, the first-layer line specification of the concentric circles 6 is 0.8mm X0.4mm circular rings, one ring is sleeved with one ring, from the first layer to the last layer of lines, the distance between the circular rings is 0.076mm, after lamination, when the concentric circles 6 are tangent, the expansion and shrinkage exceed the standard, the top surface of the positioning plate 1 is provided with rivet holes 7, the rivet holes 7 are located on the long and short side surfaces of the positioning plate 1, two rivet holes 7 on the long and short sides of the positioning plate 1, the rivet holes 7 are 40mm away from the side of the positioning plate 1, the top surface of the positioning plate 1 is provided with a drilling deviation inspection target 8, the drilling deviation inspection target 8 is bonded on the top surface of the positioning plate 1, and the drilling deviation inspection targets 8 are 6 groups. The drilling deviation checking targets 8 are two groups, the diameter of a copper disc of the drilling deviation checking targets 8 is 1.3mm, the four groups of the drilling deviation checking targets 8 are respectively positioned at the corners of the positioning plate 1, and the two groups of the drilling deviation checking targets 8 are positioned on the long edges of the positioning plate 1.
The working principle of the utility model is as follows: a circuit board is placed on a positioning plate 1, the circuit board can be positioned by arranging a pressing long target 2, a standby target 3 and a layering target 5 on the positioning plate 1, the circuit board can be positioned when being pressed, the pressing long target 2 and the standby target 3 are positioned at two short sides of the positioning plate 1, the layering target 5 is respectively arranged at one of the long sides and the short sides of the positioning plate 1, an electromagnetic hot melting block 4 is an electromagnetic hot melting block 4 consisting of a plurality of core plate long sides 2, a copper block 7.0x2.0mm rectangle is arranged in the long direction 5mm, no object is added in the short direction 8mm to avoid copper, an A/C hot melting block is adopted when an electromagnetic hot melting machine is produced, the A/B hot melting block is used during manual melting, the precision of the circuit board during pressing is improved, a rivet hole 7 is arranged on a concentric circle 6 arranged at a corner of the top surface of the positioning plate 1 and the positioning plate 1, a drilling layer of the rivet hole 7 is drilled with 4.0mm to remove a rivet, can fix when the circuit board pressfitting to whether the hole of having examined through drilling skew inspection target 8 to the hole of boring detects, whether the hole that has examined the brill takes place the deviation, in time adjusts, has improved the precision of drilling.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides a high multiply wood pressfitting, drilling counterpoint equipment, includes locating plate (1), its characterized in that: the improved positioning plate is characterized in that a long press-fit target (2) is arranged on the top surface of the positioning plate (1), standby targets (3) are bonded on the top surface of the positioning plate (1) in an array mode, electromagnetic hot frits (4) are fixed to the top surface of the positioning plate (1), layered targets (5) are fixed to the top surface of the positioning plate (1), the layered targets (5) are respectively located on the long sides and the short sides of the positioning plate (1), four groups of the layered targets (5) are arranged, concentric circles (6) are arranged on the top surface of the positioning plate (1), rivet holes (7) are arranged on the top surface of the positioning plate (1), a drilling deviation inspection target (8) is arranged on the top surface of the positioning plate (1), and the drilling deviation inspection target (8) is bonded on the top surface of the positioning plate (1).
2. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: three circular rings are wound around the pressing long target (2) and the standby target (3), the spacing between copper winding disks of the standby target (3) is 0.28mm, and the thickness of the circular ring of the standby target (3) is 0.3 mm.
3. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: the frame of the standby target (3) is 7.0mm, and the copper plate in the center of the frame of the standby target (3) is 1.375 mm.
4. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: the box of the layered target (5) is 8mm and the copper disc inside the layered target (5) is 1.375 mm.
5. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: the concentric circles (6) are respectively positioned at the corners of the positioning plate (1).
6. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: the rivet holes (7) are located on the surfaces of the long and short sides of the positioning plate (1), and two rivet holes (7) are respectively arranged on the long and short sides of the positioning plate (1).
7. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: the distance between the rivet hole (7) and the edge of the positioning plate (1) is 40 mm.
8. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: the drilling deviation checking targets (8) are 6 groups in total, and the drilling deviation checking targets (8) are two groups.
9. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: the diameter of the copper disc of the drilling deviation inspection target (8) is 1.3 mm.
10. The high multilayer board pressing and drilling alignment equipment as claimed in claim 1, wherein: the four groups of the drilling deviation checking targets (8) are respectively positioned at the corners of the positioning plate (1), and the two groups of the drilling deviation checking targets (8) are positioned on the long sides of the positioning plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121870663.0U CN215529459U (en) | 2021-08-11 | 2021-08-11 | High multiply wood pressfitting, drilling counterpoint equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121870663.0U CN215529459U (en) | 2021-08-11 | 2021-08-11 | High multiply wood pressfitting, drilling counterpoint equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215529459U true CN215529459U (en) | 2022-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121870663.0U Active CN215529459U (en) | 2021-08-11 | 2021-08-11 | High multiply wood pressfitting, drilling counterpoint equipment |
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| CN (1) | CN215529459U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117998769A (en) * | 2024-04-03 | 2024-05-07 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
-
2021
- 2021-08-11 CN CN202121870663.0U patent/CN215529459U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117998769A (en) * | 2024-04-03 | 2024-05-07 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
| CN117998769B (en) * | 2024-04-03 | 2024-06-04 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
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