CN108650809A - The monitoring method of deviation between a kind of pcb layer - Google Patents
The monitoring method of deviation between a kind of pcb layer Download PDFInfo
- Publication number
- CN108650809A CN108650809A CN201810501382.4A CN201810501382A CN108650809A CN 108650809 A CN108650809 A CN 108650809A CN 201810501382 A CN201810501382 A CN 201810501382A CN 108650809 A CN108650809 A CN 108650809A
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- Prior art keywords
- deviation
- hole
- test module
- wiring board
- pad
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of monitoring method of deviation between pcb layer, including detection sampling area is arranged in the circuit board, detection module is set in detecting sampling area, can conveniently be detected whether have deviation by the method for open-short circuit, and can determine whether that deviation occurs for which layer sandwich layer；In addition the deviation monitor value that can be combined with different test modules carrys out the range of auxiliary judgment deviation distance, and the convenient manufacture craft to wiring board carries out anomaly analysis.
Description
Technical field
The present invention relates to wiring board art more particularly to a kind of monitoring methods of wiring board deviation.
Background technology
At present in PCB production technologies, multi-layer board can have the phenomenon that core plate offset, serious core plate offset after pressing
The shading ring of PTH via holes and internal layer can be caused to connect, short circuit occurs and causes to scrap.The monitoring core plate of industry routine is inclined at this stage
The method of position is to set concentric circles Coupon in PCB layouts quadrangle（Sampling sheet）, i.e., one copper ring of every layer setting, the other copper ring of each layer
The same center of circle and diameter is incremented by successively, is detected after pressing in such a way that X-Ray is checked, confirms the serious journey of core plate offset
Degree.But there are following problems with the method：
1, concentric circles Coupon is generally unified setting, can not be carried out according to the isolation ring size difference of each project internal layer
Adjustment, can not accurately reflect disturbance degree of the core plate deviation to product function；
2, the interannular between concentric circles Coupon different layers are other is not easy to carry out classification prison to abnormal article away from only a kind of specification
Control；
3, concentric circles Coupon can only be visually confirmed artificially, be influenced by the experience, technical ability and working condition of operating personnel, abnormal article
It is easy leakage.
Invention content
In view of the above-mentioned problems, the present invention provides a kind of monitoring method of deviation between pcb layer, including:
Setting polylith deviation detects sampling area in the circuit board；N layers of core plate are equipped in wiring board, N is natural number；Deviation detects
The multiple test modules of setting in sampling area；
The test module includes the first through hole through wiring board, the second through-hole, N number of instrument connection, and instrument connection is through-hole, the
One through-hole, the second through-hole, N number of instrument connection are edge PTH hole；
The test module further include the first pad being connect with first through hole, the second pad being connect with the second through-hole, with it is N number of
N number of testing weld pad that instrument connection is connected respectively；Ground pad, integrated testability pad, Aligning degree testing weld pad are set to line
Road plate outer layer；
First through hole and the even level layers of copper of wiring board connect, corresponding second through-hole and N number of survey in the even level layers of copper of wiring board
Separator is arranged in prospect hole so that between the second through-hole and the even level layers of copper of wiring board and the idol of N number of instrument connection and wiring board
It is respectively formed cyclic annular isolation strip between several layers of layers of copper；It, will be corresponding inclined in addition to wiring board outer layer in the odd number layers of copper of assist side
It empties the part of position detection sampling area；The even level layers of copper of wiring board is corresponded with the N layer core plates in wiring board；
One deviation monitor value is set to each test module, the deviation monitor value of different test modules is different；
In test module, spacing is isolated by the survey in cyclic annular isolation strip between the second through-hole and the even level layers of copper of wiring board
The deviation monitor value of die trial block is arranged；The even level layers of copper for setting instrument connection and wiring board corresponds, instrument connection with it is corresponding
The isolation spacing of cyclic annular isolation strip between even level layers of copper is arranged by the deviation monitor value of the test module；Even level layers of copper with
The isolation spacing of isolation strip between the instrument connection of non-corresponding is not less than 0.25mm；
Electrical measurement is carried out, that is, detects and whether is connected between the first pad in a test module and the second pad, judged if being not turned on
The deviation distance of all core plates judges the deviation distance for having core plate without departing from the test module deviation monitor value if conducting
Beyond the test module deviation monitor value, then detects between the first pad and each testing weld pad and whether be connected successively, if conducting,
Judge that the deviation distance of the core plate corresponding to the testing weld pad be connected exceeds the test module deviation monitor value；
Electrical measurement is carried out to each test module in each deviation detection sampling area.
Preferably, four pieces of deviations are set in the circuit board and detect sampling area, are respectively arranged at the four corners of wiring board.
Preferably, after carrying out electrical measurement to each test module in each deviation detection sampling area, you can in conjunction with each test mould
Whether the deviation monitor value of block exceeds the test module deviation monitor value by comparing the deviation distance of each test module inner core plates
Come judge core plate deviation distance numberical range.
Preferably, the first through hole, the second through-hole, instrument connection aperture be it is consistent with minimum-value aperture in PCB units, when
When minimum-value aperture >=0.5mm, instrument connection aperture is set as 0.5mm, the first pad, the second pad, testing weld pad it is a diameter of
1mm。
Preferably, the deviation monitor value 1mil incremented by successively of the different test modules.
The monitoring method of wiring board deviation provided by the invention, advantage be, can be convenient and efficient by electrical measurement
Be detected whether have deviation, and can determine whether which layer sandwich layer occur deviation；In addition different test modules be can be combined with
Deviation monitor value carrys out the range of auxiliary judgment deviation distance, and the convenient manufacture craft to wiring board carries out anomaly analysis.
Description of the drawings
Fig. 1 is that the monitoring method embodiment setting deviation of deviation between pcb layer provided by the invention detects sampling area and shows
It is intended to.
Fig. 2 is test module in the monitoring method embodiment detection sampling area of deviation between pcb layer provided by the invention
Schematic diagram.
Fig. 3 be between pcb layer provided by the invention in the monitoring method embodiment test module of deviation wiring board outer layer and
Wiring board even number layers of copper schematic diagram.
Specific implementation mode
The present invention will be described in detail with reference to the accompanying drawings and examples.
The monitoring method of deviation between pcb layer provided by the invention, in the specific implementation including content once:
As shown in Figure 1, four pieces of deviations are arranged in assist side 1 detects sampling area 11,12,13,14, the i.e. regions Coupon, point
Be not set to the four corners of wiring board, can while not influencing wiring board internal wiring, in relatively broad range into
Row detection sampling, improves detection accuracy；Wherein, which shares 12 layers of layers of copper, inside sets the core plate that is of five storeys；As shown in Figure 2,
Deviation, which detects, is arranged 4 test modules 21,22,23,24 in sampling area；Include through the of wiring board in each test module
32,5 one through-hole 31, the second through-hole instrument connections 33,34,35,36,37, instrument connection are through-hole, first through hole, the second through-hole, 5
A instrument connection is edge PTH hole, first through hole, the second through-hole, instrument connection aperture be it is consistent with minimum-value aperture in PCB units,
As minimum-value aperture >=0.5mm, instrument connection aperture is set as 0.5mm.
As shown in Figure 2,3, further include the first pad 41 being connect with first through hole in test module, connect with the second through-hole
The second pad 42,5 testing weld pads 43,44,45,46,47 for being connected respectively with 5 instrument connections；Ground pad, entirety
Testing weld pad, Aligning degree testing weld pad are set to wiring board outer layer L1.First pad, the second pad, testing weld pad it is a diameter of
1mm.In specific make, the first pad in all test modules can an integrally-formed ground pad, as shown in Figure 2.
The even level layers of copper of the internal layer of first through hole and wiring board, that is, layers of copper L2, L4, L6, L8, L10 connection, layers of copper L2,
Separator, i.e. Anti PAD so that the second through-hole and circuit is arranged in corresponding second through-hole and 5 instrument connections on L4, L6, L8, L10
Between layers of copper L2, L4, L6, L8, L10 of plate, and divide between 5 instrument connections and layers of copper L2, L4, L6, L8, L10 of wiring board
It Xing Cheng not cyclic annular isolation strip 5；In the odd number layers of copper of assist side, in addition to wiring board outer layer, corresponding deviation is detected into sample region
It empties the part in domain.And the anti-welding whole of deviation detection sampling area is emptied, not printing ink.
5 layers of core plate and the one-to-one correspondence being belonging respectively to due to layers of copper L2, L4, L6, L8, L10 of wiring board in wiring board；If
Fixed 5 instrument connections are corresponded with layers of copper L2, L4, L6, L8, L10, namely realize 5 instrument connections and 5 layers of core plate in wiring board
One-to-one correspondence, the deviation of layers of copper L2, L4, L6, L8, L10 is detected, namely the detection to 5 layers of core plate deviation.For ease of knowing
Not, corresponding layers of copper can be identified beside the respective pad of instrument connection, as testing weld pad 43,44,45,46,47 is right respectively
Answer layers of copper L2, L4, L6, L8, L10.
One deviation monitor value is set to each test module, the deviation monitor value of different test modules is different, 4 test moulds
The deviation monitor value of block 21,22,23,24 can be set as 4mil, 5mil, 6mil, 7mil successively.
In test module, cyclic annular isolation strip between the second through-hole and L2, L4, L6, L8, L10 of wiring board is isolated
Spacing is arranged by the deviation monitor value of the test module；The isolation spacing of cyclic annular isolation strip between instrument connection and corresponding layers of copper
Also the deviation monitor value for pressing the test module is arranged；Being isolated between layers of copper L2, L4, L6, L8, L10 and the instrument connection of non-corresponding
The isolation spacing of band is not less than 0.25mm, and isolation spacing is sufficiently large, can be kept when may make the core plate deviation under general scenario
Isolation.
After test module is configured in detection sampling area, electrical measurement is carried out, that is, detects the in a test module
Whether be connected between one pad and the second pad, judge the deviation distance of all core plates without departing from the test module if being not turned on
Deviation monitor value, if conducting, judgement has layers of copper deviation and the second through-hole generates contact, to be connect with the second pad, namely
There is the deviation distance of core plate to exceed the test module deviation monitor value, then detecting successively between the first pad and each testing weld pad is
No conducting, if conducting, judges that the instrument connection that the testing weld pad be connected is connected is in contact with corresponding layers of copper, shape
At connection, you can know that the deviation distance of corresponding core plate exceeds the test module deviation monitor value.
After electrical measurement being carried out to each test module in each deviation detection sampling area, you can in conjunction with the deviation of each test module
Monitor value judges that deviation occurs for which layer core plate, and can be somebody's turn to do by comparing whether the deviation distance of each test module inner core plates exceeds
Test module deviation monitor value judges the numberical range of the deviation distance of core plate, carries out quantitative analysis.Such as testing result is
Layers of copper L2 deviations in test module 21, and layers of copper L2 not deviations in test module 22, then can determine whether that the distance of layers of copper L2 deviations is small
In 5 mil.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore it is interpreted as the limitation to the scope of the claims of the present invention, as long as skill obtained in the form of equivalent substitutions or equivalent transformations
Art scheme should all be fallen within the scope and spirit of the invention.
Claims (5)
1. the monitoring method of deviation between a kind of pcb layer, including:
Setting polylith deviation detects sampling area in the circuit board；N layers of core plate are equipped in wiring board, N is natural number；Deviation detects
The multiple test modules of setting in sampling area；
The test module includes the first through hole through wiring board, the second through-hole, N number of instrument connection, and instrument connection is through-hole, the
One through-hole, the second through-hole, N number of instrument connection are edge PTH hole；
The test module further include the first pad being connect with first through hole, the second pad being connect with the second through-hole, with it is N number of
N number of testing weld pad that instrument connection is connected respectively；Ground pad, integrated testability pad, Aligning degree testing weld pad are set to line
Road plate outer layer；
First through hole and the even level layers of copper of wiring board connect, corresponding second through-hole and N number of survey in the even level layers of copper of wiring board
Separator is arranged in prospect hole so that between the second through-hole and the even level layers of copper of wiring board and the idol of N number of instrument connection and wiring board
It is respectively formed cyclic annular isolation strip between several layers of layers of copper；It, will be corresponding inclined in addition to wiring board outer layer in the odd number layers of copper of assist side
It empties the part of position detection sampling area；The even level layers of copper of wiring board is corresponded with the N layer core plates in wiring board；
One deviation monitor value is set to each test module, the deviation monitor value of different test modules is different；
In test module, spacing is isolated by the survey in cyclic annular isolation strip between the second through-hole and the even level layers of copper of wiring board
The deviation monitor value of die trial block is arranged；The even level layers of copper for setting instrument connection and wiring board corresponds, instrument connection with it is corresponding
The isolation spacing of cyclic annular isolation strip between even level layers of copper is arranged by the deviation monitor value of the test module；Even level layers of copper with
The isolation spacing of isolation strip between the instrument connection of non-corresponding is not less than 0.25mm；
Electrical measurement is carried out, that is, detects and whether is connected between the first pad in a test module and the second pad, judged if being not turned on
The deviation distance of all core plates judges the deviation distance for having core plate without departing from the test module deviation monitor value if conducting
Beyond the test module deviation monitor value, then detects between the first pad and each testing weld pad and whether be connected successively, if conducting,
Judge that the deviation distance of the core plate corresponding to the testing weld pad be connected exceeds the test module deviation monitor value；
Electrical measurement is carried out to each test module in each deviation detection sampling area.
2. the monitoring method according to deviation between pcb layer described in claim 1, it is characterised in that：Four pieces are arranged in the circuit board
Deviation detects sampling area, is respectively arranged at the four corners of wiring board.
3. the monitoring method according to deviation between pcb layer described in claim 1, it is characterised in that：Sample region is detected to each deviation
After each test module in domain carries out electrical measurement, you can in conjunction with the deviation monitor value of each test module, by comparing each test module
Whether the deviation distance of inner core plates beyond the test module deviation monitor value judges the numberical range of the deviation distance of core plate.
4. the monitoring method according to deviation between pcb layer described in claim 1, it is characterised in that：The first through hole, second
Through-hole, the aperture of instrument connection are consistent with minimum-value aperture in PCB units, and as minimum-value aperture >=0.5mm, test aperture is set as
0.5mm, the first pad, the second pad, testing weld pad a diameter of 1mm.
5. the monitoring method according to deviation between pcb layer described in claim 1, it is characterised in that：The difference test module
Deviation monitor value 1mil incremented by successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810501382.4A CN108650809B (en) | 2018-05-23 | 2018-05-23 | Method for monitoring interlayer deviation of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810501382.4A CN108650809B (en) | 2018-05-23 | 2018-05-23 | Method for monitoring interlayer deviation of circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN108650809A true CN108650809A (en) | 2018-10-12 |
| CN108650809B CN108650809B (en) | 2019-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810501382.4A Active CN108650809B (en) | 2018-05-23 | 2018-05-23 | Method for monitoring interlayer deviation of circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109287082A (en) * | 2018-11-28 | 2019-01-29 | 郑州云海信息技术有限公司 | A kind of test method and device of easy short circuit line plate |
| CN110430679A (en) * | 2019-07-26 | 2019-11-08 | 重庆伟鼎电子科技有限公司 | A kind of method that PCB circuit board internal layer plate angle increases PAD test coupon module |
| CN113597145A (en) * | 2021-08-09 | 2021-11-02 | 皆利士多层线路版(中山)有限公司 | Circuit board interlayer alignment detection device and method and storage medium |
| CN114222418A (en) * | 2021-12-06 | 2022-03-22 | 深圳市鑫达辉软性电路科技有限公司 | Multilayer board deviation identification structure |
| CN114295964A (en) * | 2021-12-31 | 2022-04-08 | 浪潮商用机器有限公司 | System for verifying signal interconnection reliability in PCB |
| CN114585166A (en) * | 2022-04-29 | 2022-06-03 | 苏州东山精密制造股份有限公司 | Layer deviation detection method for flexible antenna multilayer board |
| CN117320329A (en) * | 2023-09-26 | 2023-12-29 | 江门全合精密电子有限公司 | Method for testing inner layer deviation of multilayer PCB |
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|---|---|---|---|---|
| US4898636A (en) * | 1989-05-04 | 1990-02-06 | Rigling Walter S | Multilayer printed wiring registration method and apparatus |
| CN101697001A (en) * | 2009-01-22 | 2010-04-21 | 依利安达(广州)电子有限公司 | Method for detecting positional deviation among layers of multilayer printed circuit board |
| CN106550556A (en) * | 2016-10-12 | 2017-03-29 | 深圳市五株科技股份有限公司 | Aligning degree of multi-layer circuit board detecting system and its detection method |
-
2018
- 2018-05-23 CN CN201810501382.4A patent/CN108650809B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4898636A (en) * | 1989-05-04 | 1990-02-06 | Rigling Walter S | Multilayer printed wiring registration method and apparatus |
| CN101697001A (en) * | 2009-01-22 | 2010-04-21 | 依利安达(广州)电子有限公司 | Method for detecting positional deviation among layers of multilayer printed circuit board |
| CN106550556A (en) * | 2016-10-12 | 2017-03-29 | 深圳市五株科技股份有限公司 | Aligning degree of multi-layer circuit board detecting system and its detection method |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109287082A (en) * | 2018-11-28 | 2019-01-29 | 郑州云海信息技术有限公司 | A kind of test method and device of easy short circuit line plate |
| CN109287082B (en) * | 2018-11-28 | 2022-02-18 | 郑州云海信息技术有限公司 | Testing method and device for circuit board easy to short circuit |
| CN110430679A (en) * | 2019-07-26 | 2019-11-08 | 重庆伟鼎电子科技有限公司 | A kind of method that PCB circuit board internal layer plate angle increases PAD test coupon module |
| CN113597145A (en) * | 2021-08-09 | 2021-11-02 | 皆利士多层线路版(中山)有限公司 | Circuit board interlayer alignment detection device and method and storage medium |
| CN114222418A (en) * | 2021-12-06 | 2022-03-22 | 深圳市鑫达辉软性电路科技有限公司 | Multilayer board deviation identification structure |
| CN114295964A (en) * | 2021-12-31 | 2022-04-08 | 浪潮商用机器有限公司 | System for verifying signal interconnection reliability in PCB |
| CN114585166A (en) * | 2022-04-29 | 2022-06-03 | 苏州东山精密制造股份有限公司 | Layer deviation detection method for flexible antenna multilayer board |
| CN117320329A (en) * | 2023-09-26 | 2023-12-29 | 江门全合精密电子有限公司 | Method for testing inner layer deviation of multilayer PCB |
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| Publication number | Publication date |
|---|---|
| CN108650809B (en) | 2019-12-27 |
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