CN114217648A - Intelligent temperature control device with high cooling efficiency - Google Patents
Intelligent temperature control device with high cooling efficiency Download PDFInfo
- Publication number
- CN114217648A CN114217648A CN202111465392.5A CN202111465392A CN114217648A CN 114217648 A CN114217648 A CN 114217648A CN 202111465392 A CN202111465392 A CN 202111465392A CN 114217648 A CN114217648 A CN 114217648A
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- temperature control
- box body
- cooling
- control device
- control box
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- 238000001816 cooling Methods 0.000 title claims abstract description 44
- 239000004065 semiconductor Substances 0.000 claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 239000000498 cooling water Substances 0.000 claims abstract description 30
- 238000005057 refrigeration Methods 0.000 claims abstract description 19
- 239000002826 coolant Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 16
- 229920002379 silicone rubber Polymers 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 229920001971 elastomer Polymers 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 4
- 230000005679 Peltier effect Effects 0.000 abstract description 2
- 230000007423 decrease Effects 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 239000000110 cooling liquid Substances 0.000 description 13
- 230000009286 beneficial effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000012774 insulation material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
Abstract
The invention discloses an intelligent temperature control device with high cooling efficiency, which comprises a temperature control box body, a PLC (programmable logic controller), a box cover, a cooling water tank and a semiconductor refrigeration assembly, wherein the box cover is arranged at the top of the temperature control box body, the cooling water tank is arranged on one side of the temperature control box body, the semiconductor refrigeration assembly is arranged on one side of the cooling water tank, conductive metal is arranged on one side of a hot-end ceramic plate, N-type semiconductors and P-type semiconductors are alternately arranged on one side of the conductive metal, and one sides of the N-type semiconductors and the P-type semiconductors are connected with a cold-end ceramic plate through the conductive metal. This efficient intelligent temperature control device of cooling is provided with semiconductor refrigeration subassembly, and coolant tank is after cooling a period, and the cooling effect's decline is led to in inside coolant liquid temperature rising, utilizes N type semiconductor and the P type semiconductor of back semiconductor refrigeration subassembly to produce the Peltier effect behind the circular telegram for cold junction ceramic plate temperature descends, improves the efficiency of coolant liquid heat transfer.
Description
Technical Field
The invention relates to the technical field of temperature control devices, in particular to an intelligent temperature control device with high cooling efficiency.
Background
It is known that many household appliances such as refrigerators, air conditioners, vending machines, etc. require temperature control devices, the existing temperature control devices generally comprise a temperature controller and a thermal fuse protector, which are connected to a corresponding control circuit to play the role of controlling and adjusting the temperature, the heating circuit is also provided with the temperature control device, the temperature rise of the heated material mainly depends on the power of a radiator and the type of the heated material, in addition, the heating temperature required by different materials is different, the fluctuation of voltage also affects the heating temperature, in order to ensure the quality of products and improve the efficiency.
However, in the conventional temperature control device, the cooling structure is mostly air-cooled or water-cooled, the air-cooled temperature reduction efficiency is low in a high-temperature environment, and the water-cooled temperature is not obvious enough after the water temperature rises in the whole pipeline, so that the conventional temperature control device needs to be improved.
Disclosure of Invention
The invention aims to provide an intelligent temperature control device with high cooling efficiency, and aims to solve the problems that most of the cooling structure designs in the conventional temperature control devices in the background technology are air cooling or water cooling, the air cooling has low cooling efficiency in a high-temperature environment, and the water cooling has low cooling efficiency after the water temperature in the whole pipeline rises.
In order to achieve the purpose, the invention provides the following technical scheme: an intelligent temperature control device with high cooling efficiency comprises a temperature control box body, a PLC, a box cover, a cooling water tank and a semiconductor refrigeration component,
the temperature control box body comprises an outer shell, an inner shell, silicon rubber heating plates, first temperature sensors, cooling pipelines, a slot, a spring, an anti-slip plate and a magnetic metal plate, the temperature control box body is formed by combining the outer shell and the inner shell, the silicon rubber heating plates are arranged on the periphery of the inner wall of the inner shell of the temperature control box body, a plurality of first temperature sensors are arranged in the temperature control box body, and the cooling pipelines are embedded in the inner shell of the temperature control box body;
the box cover comprises a sealing rubber strip, a magnet and a hinge, the box cover is arranged at the top of the temperature control box body, and the sealing rubber strip is embedded and installed at the bottom of the box cover;
the cooling water tank comprises a circulating pump, a water outlet pipe, a water return pipe and a second temperature sensor, the cooling water tank is arranged on one side of the temperature control tank body, the water outlet pipe and the water return pipe penetrate through the cooling water tank, the circulating pump is arranged on the water outlet pipe and is installed at the top of the cooling water tank, and the second temperature sensor is installed inside the cooling water tank;
semiconductor refrigeration subassembly includes hot junction ceramic plate, conductive metal, N type semiconductor, P type semiconductor, cold junction ceramic plate and heat dissipation fan, semiconductor refrigeration subassembly sets up the one side at coolant tank, one side of hot junction ceramic plate is equipped with conductive metal, N type semiconductor and P type semiconductor are installed in turn to one side of conductive metal, one side of N type semiconductor and P type semiconductor is passed through conductive metal and is connected with the cold junction ceramic plate, a plurality of heat dissipation fans are installed to the opposite side of hot junction ceramic plate.
Preferably, the outer housing is made of a heat insulating material, and the inner housing is made of a heat conductive material.
Through adopting above-mentioned technical scheme, be convenient for completely cut off outside temperature simultaneously, improve inside heat exchange efficiency.
Preferably, the bottom of the inner shell is provided with a slot, and an anti-skid plate is arranged in the slot through a spring.
Through adopting above-mentioned technical scheme, be convenient for protect the object of placing in the temperature control box.
Preferably, the box cover is rotatably connected with the top of the temperature control box body through a hinge.
By adopting the technical scheme, the box cover can be conveniently opened and closed.
Preferably, the top of the temperature control box body is embedded with a magnetic metal plate, and the bottom of the box cover is also embedded with a magnet.
By adopting the technical scheme, the opening and closing of the box cover are convenient to realize.
Preferably, the water outlet pipe and the water return pipe are respectively connected with two ends of a cooling pipeline in the temperature control box body.
Through adopting above-mentioned technical scheme, be convenient for carry the coolant liquid in to the cooling line.
Preferably, the conductive metal arranged on the hot-end ceramic plate is connected with a power circuit, and an electric control switch is arranged in the circuit.
Through adopting above-mentioned technical scheme, be convenient for control semiconductor refrigeration subassembly.
Preferably, the cold-end ceramic plate is located inside the cooling water tank, and the surfaces of the conductive metal, the N-type semiconductor and the P-type semiconductor are all subjected to waterproof treatment.
By adopting the technical scheme, the leakage condition is prevented conveniently.
Preferably, a PLC controller is further installed on one side of the temperature control box body, and the PLC controller is electrically connected with the silicon rubber heating plate, the first temperature sensor, the circulating pump, the second temperature sensor, the heat dissipation fan and the electric control switch.
Through adopting above-mentioned technical scheme, be convenient for improve the intelligent control degree of device.
Compared with the prior art, the invention has the beneficial effects that: the intelligent temperature control device with high temperature reduction efficiency,
(1) the semiconductor refrigeration assembly is arranged, after the cooling water tank is cooled for a period of time, the temperature of the internal cooling liquid rises to reduce the cooling effect, the N-type semiconductor and the P-type semiconductor of the semiconductor refrigeration assembly after being electrified are utilized to generate the Peltier effect, so that the temperature of the cold end ceramic plate is reduced, the cooling liquid in the cooling water tank is cooled through the cold end ceramic plate, and the heat exchange efficiency of the cooling liquid is improved;
(2) the device is provided with a first temperature sensor, a second temperature sensor and a PLC (programmable logic controller), the temperature is set by the PLC in advance when the device is used, the internal temperature is detected by the first temperature sensor, when the temperature is higher than the set temperature, the circulating pump drives the cooling liquid to flow, the liquid cooling is carried out, otherwise, the temperature is raised by the silicon rubber heating plate, after the cooling speed of the device is slowed down, the second temperature sensor transmits the temperature of the cooling liquid to the PLC, and the PLC starts the semiconductor refrigeration assembly to cool the cooling liquid, so that the intelligent control of the device is facilitated;
(3) the box cover is provided with the magnetic metal plate, the sealing rubber strip and the magnet, the magnetic metal plate and the magnet are mutually attracted to enable the box cover to be conveniently covered, the sealing of a connecting gap can be realized through the action of the sealing rubber strip, the temperature exchange between the temperature control box body and the outside is reduced, the internal temperature is prevented from being influenced by the outside, and a certain energy-saving effect is achieved;
(4) be provided with fluting, spring and antiskid ribbed tile, the antiskid ribbed tile through spring mounting in the fluting contacts with the bottom of placing the internal object of temperature control box, when avoiding the object gliding, can slow down the impact that receives through the spring, improves the stability of device.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic cross-sectional view of the temperature control box according to the present invention;
FIG. 3 is an enlarged schematic view of the structure at the position A of the present invention;
FIG. 4 is a schematic top view of the temperature controlled cabinet and the cover of the present invention;
FIG. 5 is a schematic sectional view of the cooling water tank of the present invention;
fig. 6 is a flow chart of the present invention.
In the figure: 1. temperature control box, 101, outer shell, 102, inner shell, 103, silicon rubber heating board, 104, first temperature sensor, 105, cooling pipeline, 106, fluting, 107, spring, 108, antiskid board, 109, magnetic metal sheet, 2, PLC controller, 3, case lid, 301, joint strip, 302, magnet, 303, hinge, 4, coolant tank, 401, circulating pump, 402, outlet pipe, 403, wet return, 404, second temperature sensor, 5, semiconductor refrigeration component, 501, hot junction ceramic plate, 502, conductive metal, 503, N type semiconductor, 504, P type semiconductor, 505, cold junction ceramic plate, 506, heat dissipation fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: an intelligent temperature control device with high cooling efficiency is disclosed, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, a temperature control box body 1 comprises an outer shell 101, an inner shell 102, a silicon rubber heating plate 103, a first temperature sensor 104, a cooling pipeline 105, a slot 106, a spring 107, an anti-slip plate 108 and a magnetic metal plate 109, the temperature control box body 1 is formed by combining the outer shell 101 and the inner shell 102, the outer shell 101 is made of a heat insulation material, the inner shell 102 is made of a heat conduction material, which is beneficial to preventing the heat exchange between the internal temperature and the external air through the heat insulation material, so that the internal temperature is dissipated, the heat exchange efficiency in the temperature control box body 1 is improved through the design of the heat conduction material, further, the internal rapid heating and cooling of the device are realized, the silicon rubber heating plate 103 is installed around the inner wall of the inner shell 102 of the temperature control box body 1, the plurality of first temperature sensors 104 are installed inside the temperature control box body 1, a cooling pipeline 105 is embedded in the inner shell 102 of the temperature control box body 1, a slot 106 is arranged at the bottom of the inner shell 102, an anti-slip plate 108 is arranged in the slot 106 through a spring 107, which is beneficial to buffering objects placed in the temperature control box body 1 through the spring 107, the design of the anti-slip plate 108 improves the stability of the objects placed in the inner part, the box cover 3 comprises a sealing rubber strip 301, a magnet 302 and a hinge 303, the box cover 3 is arranged at the top of the temperature control box body 1, the sealing rubber strip 301 is embedded at the bottom of the box cover 3, the box cover 3 is rotatably connected with the top of the temperature control box body 1 through the hinge 303, which is beneficial to opening and closing the box cover 3, a magnetic metal plate 109 is embedded at the top of the temperature control box body 1, the magnet 302 is further embedded at the bottom of the box cover 3, which is beneficial to improving the sealing performance between the temperature control box body 1 and the box cover 3, meanwhile, the mutual attraction of the magnetic metal plate 109 and the magnet 302 enables the opening and closing of the device to be more convenient.
As shown in fig. 1, 5 and 6, the cooling water tank 4 includes a circulation pump 401, a water outlet pipe 402, a water return pipe 403 and a second temperature sensor 404, the cooling water tank 4 is disposed at one side of the temperature control box 1, the cooling water tank 4 is internally penetrated by the water outlet pipe 402 and the water return pipe 403, the water outlet pipe 402 and the water return pipe 403 are respectively connected with two ends of the cooling pipeline 105 in the temperature control box 1, which is favorable for circulating the cooling liquid, the circulation pump 401 is disposed on the water outlet pipe 402, the circulation pump 401 is mounted at the top of the cooling water tank 4, the second temperature sensor 404 is mounted inside the cooling water tank 4, the semiconductor refrigeration assembly 5 includes a hot-end ceramic plate 501, a conductive metal 502, an N-type semiconductor 503, a P-type semiconductor 504, a cold-end ceramic plate 505 and a heat dissipation fan 506, the semiconductor refrigeration assembly 5 is disposed at one side of the cooling water tank 4, one side of the hot-end ceramic plate 501 is provided with the conductive metal 502, conductive metal 502 arranged on the hot-end ceramic plate 501 is connected with a power circuit, an electric control switch is arranged in the circuit, and the semiconductor refrigeration assembly 5 is conveniently and rapidly controlled through a PLC (programmable logic controller) 2, an N-type semiconductor 503 and a P-type semiconductor 504 are alternately arranged on one side of the conductive metal 502, one sides of the N-type semiconductor 503 and the P-type semiconductor 504 are connected with a cold-end ceramic plate 505 through the conductive metal 502, the cold-end ceramic plate 505 is positioned inside a cooling water tank 4, the surfaces of the conductive metal 502, the N-type semiconductor 503 and the P-type semiconductor 504 are all subjected to waterproof treatment, heat exchange is favorably realized when the cold-end ceramic plate 505 is contacted with cooling liquid, the cooling liquid is cooled, a plurality of heat dissipation fans 506 are arranged on the other side of the hot-end ceramic plate 501, the PLC 2 is further arranged on one side of the temperature control box body 1, the PLC 2 is connected with a silicon rubber heating plate 103 and a first temperature sensor 104, The circulating pump 401, the second temperature sensor 404, the heat dissipation fan 506 and the electric control switch are electrically connected, so that each electric element in the device can be conveniently and uniformly regulated and controlled through the temperature control box body 1.
The working principle is as follows: the model of the first temperature sensor 104 and the second temperature sensor 404 is PT-100, when the intelligent temperature control device with high cooling efficiency is used, firstly the box cover 3 is opened through the hinge 303, then the stored object is placed on the anti-slip plate 108 in the temperature control box body 1, the anti-slip plate 108 has an anti-slip effect, meanwhile, the impact generated when the temperature control box body 1 is impacted can be buffered through the spring 107, a certain protection effect is achieved on the placed object, after the box cover 3 is covered, the temperature is set through the PLC 2, the temperature in the temperature control box body 1 is detected by the first temperature sensor 104, when the temperature is lower than the set temperature, the PLC 2 starts the silicon rubber heating plate 103, the silicon rubber heating plate 103 rapidly heats the temperature in the temperature control box body 1, when the temperature is higher than the set temperature, the PLC 2 controls the circulating pump 401 on the cooling water tank 4 to start, the cooling liquid in the cooling water tank 4 is conveyed into the cooling pipeline 105 through the water outlet pipe 402, the temperature of the inside of the temperature control box body 1 is rapidly reduced by matching with the inner shell 102, after the cooling liquid flows for a plurality of cycles, the integral temperature of the cooling liquid in the cooling water tank 4 can be increased, at this time, the second temperature sensor 404 detects that a signal is sent to the PLC controller 2, the PLC controller 2 starts an electric control switch in a power circuit of the semiconductor refrigeration assembly 5 to be closed, a loop is powered on, the cooling liquid in the cooling water tank 4 is reduced by utilizing the cold-end ceramic plate 505, the hot-end ceramic plate 501 is reduced by the heat dissipation fan 506 on the right side of the hot-end ceramic plate 501, and thus the using process of the whole device is completed.
The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for simplicity of description only and are not intended to indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operative in a particular orientation, and are not to be considered limiting of the claimed invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (9)
1. The utility model provides an efficient intelligent temperature control device of cooling, includes control by temperature change box (1), PLC controller (2), case lid (3), coolant tank (4) and semiconductor refrigeration subassembly (5), its characterized in that:
the temperature control box body (1) comprises an outer shell (101), an inner shell (102), silicon rubber heating plates (103), first temperature sensors (104), cooling pipelines (105), a slot (106), a spring (107), an anti-skid plate (108) and a magnetic metal plate (109), wherein the temperature control box body (1) is formed by combining the outer shell (101) and the inner shell (102), the silicon rubber heating plates (103) are arranged on the periphery of the inner wall of the inner shell (102) of the temperature control box body (1), the plurality of first temperature sensors (104) are arranged in the temperature control box body (1), and the cooling pipelines (105) are embedded in the inner shell (102) of the temperature control box body (1);
the box cover (3) comprises a sealing rubber strip (301), a magnet (302) and a hinge (303), the box cover (3) is arranged at the top of the temperature control box body (1), and the sealing rubber strip (301) is embedded and installed at the bottom of the box cover (3);
the cooling water tank (4) comprises a circulating pump (401), a water outlet pipe (402), a water return pipe (403) and a second temperature sensor (404), the cooling water tank (4) is arranged on one side of the temperature control box body (1), the water outlet pipe (402) and the water return pipe (403) penetrate through the cooling water tank (4), the circulating pump (401) is arranged on the water outlet pipe (402), the circulating pump (401) is arranged at the top of the cooling water tank (4), and the second temperature sensor (404) is arranged inside the cooling water tank (4);
semiconductor refrigeration subassembly (5) include hot junction ceramic plate (501), conductive metal (502), N type semiconductor (503), P type semiconductor (504), cold junction ceramic plate (505) and heat dissipation fan (506), semiconductor refrigeration subassembly (5) set up the one side in coolant tank (4), one side of hot junction ceramic plate (501) is equipped with conductive metal (502), N type semiconductor (503) and P type semiconductor (504) are installed in turn to one side of conductive metal (502), one side of N type semiconductor (503) and P type semiconductor (504) is passed through conductive metal (502) and is connected with cold junction ceramic plate (505), a plurality of heat dissipation fans (506) are installed to the opposite side of hot junction ceramic plate (501).
2. The intelligent temperature control device with high cooling efficiency according to claim 1, characterized in that: the outer shell (101) is made of a heat insulating material, and the inner shell (102) is made of a heat conducting material.
3. The intelligent temperature control device with high cooling efficiency according to claim 1, characterized in that: a slot (106) is formed in the bottom of the inner portion of the inner shell (102), and an anti-skid plate (108) is installed in the slot (106) through a spring (107).
4. The intelligent temperature control device with high cooling efficiency according to claim 1, characterized in that: the box cover (3) is rotatably connected with the top of the temperature control box body (1) through a hinge (303).
5. The intelligent temperature control device with high cooling efficiency according to claim 1, characterized in that: the top of control by temperature change box (1) is inlayed and is installed magnetic metal sheet (109), embedded magnet (302) of installing still in case lid (3) bottom.
6. The intelligent temperature control device with high cooling efficiency according to claim 1, characterized in that: the water outlet pipe (402) and the water return pipe (403) are respectively connected with two ends of the cooling pipeline (105) in the temperature control box body (1).
7. The intelligent temperature control device with high cooling efficiency according to claim 1, characterized in that: the conductive metal (502) arranged on the hot-end ceramic plate (501) is connected with a power circuit, and an electric control switch is arranged in the circuit.
8. The intelligent temperature control device with high cooling efficiency according to claim 1, characterized in that: the cold end ceramic plate (505) is located inside the cooling water tank (4), and the surfaces of the conductive metal (502), the N-type semiconductor (503) and the P-type semiconductor (504) are all subjected to waterproof treatment.
9. The intelligent temperature control device with high cooling efficiency according to claim 1, characterized in that: PLC controller (2) are still installed to one side of control by temperature change box (1), PLC controller (2) and silicon rubber hot plate (103), first temperature sensor (104), circulating pump (401), second temperature sensor (404), heat dissipation fan (506) and electric control switch electric connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111465392.5A CN114217648A (en) | 2021-11-30 | 2021-11-30 | Intelligent temperature control device with high cooling efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111465392.5A CN114217648A (en) | 2021-11-30 | 2021-11-30 | Intelligent temperature control device with high cooling efficiency |
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| Publication Number | Publication Date |
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| CN114217648A true CN114217648A (en) | 2022-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111465392.5A Pending CN114217648A (en) | 2021-11-30 | 2021-11-30 | Intelligent temperature control device with high cooling efficiency |
Country Status (1)
| Country | Link |
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| CN (1) | CN114217648A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114923551A (en) * | 2022-04-22 | 2022-08-19 | 广州晶石传感技术有限公司 | Weighing sensor with water-cooling function and control system thereof |
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| CN210985395U (en) * | 2019-12-20 | 2020-07-10 | 江苏俱进投资有限公司 | Water-cooling power distribution cabinet |
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2021
- 2021-11-30 CN CN202111465392.5A patent/CN114217648A/en active Pending
Patent Citations (7)
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| US20100101237A1 (en) * | 2008-10-24 | 2010-04-29 | Quanta Computer Inc. | Temperature variation apparatus |
| CN107461978A (en) * | 2016-06-02 | 2017-12-12 | 中国科学院沈阳自动化研究所 | A kind of semiconductor refrigeration temperature control case |
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| Publication number | Priority date | Publication date | Assignee | Title |
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Application publication date: 20220322 |