CN210374291U - EPP foam shell semiconductor cooling and heating refrigerator - Google Patents
EPP foam shell semiconductor cooling and heating refrigerator Download PDFInfo
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- CN210374291U CN210374291U CN201921064343.9U CN201921064343U CN210374291U CN 210374291 U CN210374291 U CN 210374291U CN 201921064343 U CN201921064343 U CN 201921064343U CN 210374291 U CN210374291 U CN 210374291U
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- temperature adjusting
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Abstract
The utility model relates to a refrigerator, in particular to an EPP foam shell semiconductor cooling and heating refrigerator, which solves the use problem of the refrigerator and comprises a box body, wherein an accessory bin and a temperature adjusting bin are arranged in the box body, a control panel, a vacuum pump, a heat pipe radiator and a fan are arranged in the accessory bin, a cooling and heating chip is arranged between the accessory bin and the temperature adjusting bin, the cooling and heating chip is respectively communicated with the accessory bin and the temperature adjusting bin, the bin body and the bin cover are connected in a hinged way, a sealing layer is arranged between the bin body and the bin cover, the structure is simple, the characteristic that one end of the semiconductor chip is used for cooling and the other end is used for heating is fully utilized, a cooling agent is not needed, the cooling effect is enhanced through a heat dissipation structure and the vacuum pump, the refrigerator is energy-saving and environment-friendly, the economic cost is reduced, no mechanical transmission part is arranged, no abrasion and no noise exist, has practicability and economical efficiency.
Description
Technical Field
The utility model relates to a refrigerator, in particular to EPP foam case semiconductor changes in temperature refrigerator.
Background
The common refrigerator on the market has complex structure, is not environment-friendly and is difficult to maintain, thereby bringing inconvenience to the life of the common people. The cold and hot semiconductor chip brings a possibility for the development of the refrigerator, namely, the requirement of daily life is met, energy is saved, the environment is protected, and the ozone layer cavity is slowed down. The cold and hot semiconductor chip is a mature technical product, and one end of the semiconductor chip is cooled and the other end of the semiconductor chip is heated when the semiconductor chip is electrified by utilizing the structural characteristics of the semiconductor chip. When the electrode is reversed, the refrigeration and heating ends can be switched, so the method is widely applied to various electrical appliances. However, the design of the electrical appliance using the semiconductor chip is not perfect, the cooling or heating effect is not good, the structure is too complex, and the production cost is too high.
SUMMERY OF THE UTILITY MODEL
Not enough to current technique, the utility model provides an EPP foam case semiconductor changes in temperature refrigerator.
In order to realize the purpose, the utility model adopts the technical scheme that: a semiconductor cooling and heating refrigerator with an EPP foam shell comprises a refrigerator body, wherein a temperature adjusting bin and a circuit bin are arranged in the refrigerator body, an aluminum inner container forming a refrigerating or heating space is arranged in the temperature adjusting bin, and a refrigerating and heating chip, a radiator, a fan and a power supply are arranged in the circuit bin;
the power supply is respectively electrically connected with the refrigerating and heating chip and the fan, one end of the refrigerating and heating chip is in direct or indirect contact with the aluminum liner for heat conduction, and the other end of the refrigerating and heating chip is physically radiated by the radiator and the fan;
the aluminum inner container is coated with an EPP foam layer, the circuit bin forms an air inlet and an air outlet for air circulation on the surface of the box body, and the box body is provided with a plastic rear cover at the position of the circuit bin;
the control panel is electrically connected with the control display screen panel, the refrigerating and heating chip and the fan respectively;
the surface of the box body forms a protective layer through high-temperature high-pressure or spraying treatment, the temperature adjusting bin has an opening state and a closing state, and the temperature adjusting bin keeps the closing state through magnetic attraction.
The temperature adjusting bin is provided with a temperature adjusting bin opening and a temperature adjusting bin cover which can be opened, the temperature adjusting bin opening and the temperature adjusting bin cover are fixedly adsorbed and positioned through a metal sucking disc and a magnet sucking disc, and a sealing strip for filling a gap is further arranged between the magnet sucking disc and the metal sucking disc.
The box body is of a horizontal structure or a vertical structure.
When the box body is of a horizontal structure, the bin bottom of the temperature adjusting bin is provided with an energy storage composite phase-change material box, and an energy storage composite phase-change material is arranged in the energy storage composite phase-change material box.
When the box is horizontal structure, adjust the temperature storehouse and the circuit storehouse is equipped with two sets ofly, and adjusts the temperature storehouse and the circuit storehouse one-to-one, separate through the activity wall picture peg between the storehouse of adjusting the temperature, between the circuit storehouse.
When the box body is of a horizontal structure, the refrigerating and heating chip is in indirect contact heat conduction with the aluminum inner container through the cold and heat conduction plate.
When the box body is of a vertical structure, the top surface and the bottom surface of the temperature adjusting bin are both provided with energy storage composite phase-change material boxes, and energy storage composite phase-change materials are arranged in the energy storage composite phase-change material boxes.
When the box body is of a vertical structure, a cold and heat conduction plate for contact heat conduction is arranged between the refrigerating and heating chip and the aluminum inner container.
When the box is of a vertical structure, an aluminum block for contacting heat conduction is arranged between the refrigerating and heating chip and the aluminum liner, and micropores and PVA (polyvinyl alcohol) absorbent cotton are arranged at the bottom of the aluminum liner.
And a handle notch is arranged on the outer wall of the box body.
The utility model has the advantages that: the utility model provides a EPP foam shell semiconductor changes in temperature refrigerator adopts the new expanded material of EPP and through high temperature high pressure or spraying treatment on the surface, and smooth waterproof, prevention of seepage are passed through, and manufacturing process is simple, reduce cost, thermal insulation performance are good, can also realize pleasing to the eye outward appearance molding, is fit for producing on-vehicle refrigerator and commodity circulation cold chain transportation special case.
Drawings
Fig. 1 is a schematic side view of embodiment 1 of the present invention;
fig. 2 is a schematic front view of embodiment 1 of the present invention;
fig. 3 is a schematic side view of embodiment 2 of the present invention;
fig. 4 is a schematic front view of embodiment 2 of the present invention;
fig. 5 is a schematic front view of embodiment 3 of the present invention;
fig. 6 is a schematic side view of embodiment 3 of the present invention;
fig. 7 is a schematic front view of embodiment 4 of the present invention;
fig. 8 is a schematic side view of embodiment 4 of the present invention;
fig. 9 is a schematic front view of embodiment 5 of the present invention;
fig. 10 is a schematic side view of embodiment 5 of the present invention.
A box body 1; a temperature adjusting bin 2; a circuit bin 3; an aluminum inner container 4; a refrigerating and heating chip 5; a fan 6; a heat sink 7; an EPP foam layer 8; an air inlet 9; an air outlet 10; a plastic rear cover 11; a control panel 12; a control display screen panel 13; a protective layer 14; a metal suction cup 15; a magnetic chuck 16; a seal strip 17; an energy storage composite phase change material cartridge 18; an energy storage composite phase change material 19; a handle notch 20; a movable partition inserting plate 21; a cold heat conduction plate 22; an aluminum block 23; a power supply 24; a micropore 25; PVA polyvinyl alcohol absorbent cotton 26
Detailed Description
Example 1: as shown in fig. 1-2, the EPP foam shell semiconductor cooling and heating refrigerator comprises a box body 1, a temperature adjusting bin 2 and a circuit bin 3 are arranged in the box body 1, an aluminum inner container 4 forming a cooling or heating space is arranged in the temperature adjusting bin 2, and a cooling and heating chip 5, a radiator 7, a fan 6 and a power supply 24 are arranged in the circuit bin 3.
The power supply is respectively electrically connected with the refrigerating and heating chip 5 and the fan 6, one end of the refrigerating and heating chip 5 is in heat conduction with the aluminum liner 4 through direct or indirect contact, and the other end of the refrigerating and heating chip 5 is physically radiated through the radiator 7 and the fan 6. The cooling and heating chip 5 is a semiconductor cooling and heating chip, belongs to a mature technical product, and is not explained or limited herein. Power is supplied internally by power supply 24, while a set-up interface may be provided for charging or external power supply. One end of the cooling and heating chip 5 transfers heat through direct or indirect contact.
When refrigerating, the refrigerating end of the refrigerating and heating chip 5 releases cold, absorbs the heat at the aluminum inner container 4 for neutralization, and the heating end releases heat, and the radiator 7 and the fan 6 absorb or guide and discharge the heat at the heating end together. By increasing the temperature difference between the two ends of the refrigerating and heating chip 5, the energy consumption can be reduced, and the refrigerating or heating effect can be improved. The heat sink 7 may be a metal heat sink 7 with a fin structure, so as to improve the heat conduction effect and enhance the heat dissipation, but is by no means limited thereto.
When heating, the electrode is reversed, one end of the refrigerating and heating chip 5 close to the aluminum inner container 4 becomes a heating end, heat is released, and cold at the aluminum inner container 4 is neutralized. And the opposite refrigerating end releases cold, and the temperature is further reduced through the radiator 7 and the fan 6, so that the temperature difference between the two ends of the refrigerating and heating chip 5 is increased, and the use effect is improved.
The aluminum inner container 4 is coated with the EPP foam layer 8, and as a novel foaming material, the aluminum inner container is popular in the industry field, and the functions of heat preservation and the like are greatly improved.
The circuit bin 3 is provided with an air inlet 9 and an air outlet 10 for air circulation on the surface of the box body 1, and cold or heat can be discharged quickly through the air inlet 9 and the air outlet 10, so that accumulation in the circuit bin 3 is avoided. The box body 1 is provided with a plastic rear cover 11 at the position of the circuit bin 3, the circuit bin 3 is convenient to open or close through the plastic rear cover 11, and the installation of the plastic rear cover can adopt a hinged connection or other connection modes, which are not described in more detail.
The refrigerator further comprises a control panel 12 and a control display screen panel 13, wherein the control panel 12 is electrically connected with the control display screen panel 13, the refrigerating and heating chip 5 and the fan 6 respectively. The control panel 12 controls the electric devices to improve the functions of intellectualization and modernization, and the control panel and the display screen panel 13 are mature technical means and are not limited too much here.
The surface of the box body 1 forms a protective layer 14 through high-temperature high-pressure or spraying treatment, the temperature adjusting bin 2 is in an opening state and a closing state, the temperature adjusting bin 2 is kept in the closing state through magnetic attraction, and the stability of the switch is enhanced through magnetic attraction. The waterproof and reverse osmosis protective layer 14 is formed by spraying or high-temperature high-pressure treatment process, so that the use effect of the refrigerator is improved. The temperature adjusting bin 2 is provided with a temperature adjusting bin opening and a temperature adjusting bin cover which can be opened, the temperature adjusting bin opening and the temperature adjusting bin cover are fixedly adsorbed and positioned through a metal sucker 15 and a magnet sucker 16, a sealing strip 17 for filling a gap is further arranged between the magnet sucker 16 and the metal sucker 15, and the sealing performance is enhanced through the sealing strip 17.
When the box body 1 is of a horizontal structure, the energy storage composite phase-change material box 18 is arranged at the bottom of the temperature adjusting bin 2, and an energy storage composite phase-change material 19 is arranged in the energy storage composite phase-change material box 18. When the box body 1 is in a horizontal structure, the refrigerating and heating chip 5 is in indirect contact heat conduction with the aluminum liner 4 through the cold and heat conduction plate 22. A Phase Change Material (PCM-Phase Change Material) refers to a substance that changes the state of a substance at a constant temperature and can provide latent heat. The process of changing physical properties is called a phase change process, and in this case, the phase change material absorbs or releases a large amount of latent heat. The energy storage performance is further enhanced and the heat preservation effect is improved through the composite phase change material 19.
The outer wall of the box body 1 is provided with a handle notch 20, so that the box is convenient to carry or transport.
Example 2: as shown in fig. 3-4, different from embodiment 1, when the box body 1 is of a horizontal structure, two groups of temperature adjusting bins 2 and two groups of circuit bins 3 are provided, the temperature adjusting bins 2 correspond to the circuit bins 3 one by one, and the temperature adjusting bins 2 and the circuit bins 3 are separated by movable partition insertion plates 21. The movable partition inserting plate 21 in the horizontal double box body 1 can be freely detached and can be simply installed by designing a groove, but the installation is not limited to the only installation. The double-chip design realizes that the left and the right can be adjusted by one cold and one hot, and the cold and the hot can be totally cooled or totally heated without mutual interference.
Example 3: as shown in fig. 5-6, different from embodiments 1 and 2, when the box body 1 is in a vertical structure, the energy storage composite phase change material boxes 18 are disposed on the top surface and the bottom surface of the temperature adjusting bin 2, and the energy storage composite phase change material box 19 is disposed in the energy storage composite phase change material box 18. This embodiment also has a heat and cold conduction plate 22 for transferring heat. Similarly, the composite phase-change material 19 has an energy storage effect, so that the heat preservation effect is improved, and both cold storage and heat storage can be realized.
Example 4: as shown in fig. 7-8, different from embodiments 1-3, when the box 1 is in a vertical structure, an aluminum block 23 for contact heat conduction is provided between the cooling and heating chip 5 and the aluminum inner container 4. The aluminum block 23 and the aluminum inner container 4 are made of the same material, the heat conduction efficiency is high, and the heat distribution is uniform. The use of the cold and heat conducting plate 22 reduces the path length during the transfer process, i.e., reduces the loss of heat or cold, but slows down the unit transfer efficiency. The bottom of the aluminum inner container 4 is provided with micropores 25 and PVA polyvinyl alcohol absorbent cotton 26, and when condensed water flows downwards, the condensed water passes through the micropores 25 and is absorbed by the PVA polyvinyl alcohol absorbent cotton 26 without flowing outwards.
Example 5: as shown in fig. 9 to 10, different from embodiments 1 to 4, when the cabinet 1 has a vertical structure, a cold and heat conduction plate 22 and an aluminum block 23 for contact heat conduction are provided between the cooling and heating chip 5 and the aluminum inner container 4. The characteristics of the cold and heat conduction plate 22 and the aluminum block 23 are combined, so that the loss of heat or cold is reduced on the premise of ensuring certain transmission efficiency.
The utility model has the advantages that: the utility model provides a EPP foam shell semiconductor changes in temperature refrigerator adopts the new expanded material of EPP and through high temperature high pressure or spraying treatment on the surface, and smooth waterproof, prevention of seepage are passed through, and manufacturing process is simple, reduce cost, thermal insulation performance are good, can also realize pleasing to the eye outward appearance molding, is fit for producing on-vehicle refrigerator and commodity circulation cold chain transportation special case.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, and are only for convenience of description, and are not intended to indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and therefore, are not to be considered as limitations of the present invention, and the fundamental principles, main features, and advantages of the present invention have been shown and described above, as would be understood by those skilled in the art.
Claims (10)
1. The EPP foam shell semiconductor cooling and heating refrigerator comprises a refrigerator body and is characterized in that a temperature adjusting bin and a circuit bin are arranged in the refrigerator body, an aluminum inner container forming a refrigerating or heating space is arranged in the temperature adjusting bin, and a refrigerating and heating chip, a radiator, a fan and a power supply are arranged in the circuit bin;
the power supply is respectively electrically connected with the refrigerating and heating chip and the fan, one end of the refrigerating and heating chip is in direct or indirect contact with the aluminum liner for heat conduction, and the other end of the refrigerating and heating chip is physically radiated by the radiator and the fan;
the aluminum inner container is coated with an EPP foam layer, the circuit bin forms an air inlet and an air outlet for air circulation on the surface of the box body, and the box body is provided with a plastic rear cover at the position of the circuit bin;
the control panel is electrically connected with the control display screen panel, the refrigerating and heating chip and the fan respectively;
the surface of the box body forms a protective layer through high-temperature high-pressure or spraying treatment, the temperature adjusting bin has an opening state and a closing state, and the temperature adjusting bin keeps the closing state through magnetic attraction.
2. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 1, wherein the temperature adjusting bin is provided with a temperature adjusting bin opening and a temperature adjusting bin cover which can be opened, the temperature adjusting bin opening and the temperature adjusting bin cover are fixed in a fixed and adsorptive manner through a metal sucking disc and a magnet sucking disc, and a sealing strip for filling gaps is further arranged between the magnet sucking disc and the metal sucking disc.
3. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 1 or 2, wherein the refrigerator body is of a horizontal structure or a vertical structure.
4. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 3, wherein when the refrigerator body is in a horizontal structure, the bottom of the temperature adjusting bin is provided with an energy storage composite phase change material box, and the energy storage composite phase change material box is internally provided with an energy storage composite phase change material.
5. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 3, wherein when the refrigerator body is in a horizontal structure, two groups of temperature adjusting bins and circuit bins are provided, the temperature adjusting bins and the circuit bins are in one-to-one correspondence, and the temperature adjusting bins and the circuit bins are separated by movable partition inserting plates.
6. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 3, wherein when the refrigerator body is in a horizontal structure, the cooling and heating chip is in indirect contact heat conduction with the aluminum inner container through the cold and heat conduction plate.
7. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 3, wherein when the refrigerator body is in a vertical structure, the top and bottom surfaces of the temperature adjusting bin are provided with energy storage composite phase change material boxes, and the energy storage composite phase change material boxes are provided with energy storage composite phase change materials.
8. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 3, wherein a cooling and heating conduction plate for contact heat conduction is provided between the cooling and heating chip and the aluminum inner container when the refrigerator body is in a vertical structure.
9. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 3, wherein when the refrigerator body is in a vertical structure, an aluminum block for contact heat conduction is arranged between the cooling and heating chip and the aluminum inner container, and micropores and PVA polyvinyl alcohol absorbent cotton are arranged at the bottom of the aluminum inner container.
10. The EPP foam shell semiconductor cooling and heating refrigerator as claimed in claim 1, wherein the outer wall of the refrigerator body is provided with a handle notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921064343.9U CN210374291U (en) | 2019-07-09 | 2019-07-09 | EPP foam shell semiconductor cooling and heating refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921064343.9U CN210374291U (en) | 2019-07-09 | 2019-07-09 | EPP foam shell semiconductor cooling and heating refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210374291U true CN210374291U (en) | 2020-04-21 |
Family
ID=70270157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921064343.9U Expired - Fee Related CN210374291U (en) | 2019-07-09 | 2019-07-09 | EPP foam shell semiconductor cooling and heating refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210374291U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112389300A (en) * | 2020-12-02 | 2021-02-23 | 广东英得尔实业发展有限公司 | Ultra-light vehicle-mounted refrigerator |
| CN114857801A (en) * | 2022-05-21 | 2022-08-05 | 臻迪科技股份有限公司 | Semiconductor temperature control auxiliary device applied to aircraft hangar and aircraft hangar |
| CN115431859A (en) * | 2022-09-07 | 2022-12-06 | 一汽奔腾轿车有限公司 | Semiconductor type vehicle-mounted refrigerator |
-
2019
- 2019-07-09 CN CN201921064343.9U patent/CN210374291U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112389300A (en) * | 2020-12-02 | 2021-02-23 | 广东英得尔实业发展有限公司 | Ultra-light vehicle-mounted refrigerator |
| CN114857801A (en) * | 2022-05-21 | 2022-08-05 | 臻迪科技股份有限公司 | Semiconductor temperature control auxiliary device applied to aircraft hangar and aircraft hangar |
| CN115431859A (en) * | 2022-09-07 | 2022-12-06 | 一汽奔腾轿车有限公司 | Semiconductor type vehicle-mounted refrigerator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200421 Termination date: 20210709 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |