CN114857801A - Semiconductor temperature control auxiliary device applied to aircraft hangar and aircraft hangar - Google Patents
Semiconductor temperature control auxiliary device applied to aircraft hangar and aircraft hangar Download PDFInfo
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- CN114857801A CN114857801A CN202210558883.2A CN202210558883A CN114857801A CN 114857801 A CN114857801 A CN 114857801A CN 202210558883 A CN202210558883 A CN 202210558883A CN 114857801 A CN114857801 A CN 114857801A
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- aircraft hangar
- auxiliary device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 239000006096 absorbing agent Substances 0.000 claims abstract description 10
- 238000007664 blowing Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 5
- 239000003973 paint Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 230000003313 weakening effect Effects 0.000 claims description 3
- 238000004378 air conditioning Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000009434 installation Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010622 cold drawing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005676 thermoelectric effect Effects 0.000 description 2
- 208000035473 Communicable disease Diseases 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 208000015181 infectious disease Diseases 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/7675—Insulating linings for the interior face of exterior walls
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
- E04H6/00—Buildings for parking cars, rolling-stock, aircraft, vessels or like vehicles, e.g. garages
- E04H6/44—Buildings for parking cars, rolling-stock, aircraft, vessels or like vehicles, e.g. garages for storing aircraft
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T50/00—Aeronautics or air transport
- Y02T50/50—On board measures aiming to increase energy efficiency
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Acoustics & Sound (AREA)
- Electromagnetism (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The embodiment of the invention discloses a semiconductor temperature control auxiliary device applied to an aircraft hangar, belonging to the technical field of aircraft hangars, and the semiconductor temperature control auxiliary device applied to the aircraft hangar comprises: a galvanic couple having a cold end and a hot end; the heat absorber is arranged at the cold end of the couple pair and is used for forming internal circulation in the aircraft hangar; the radiator is arranged at the hot end of the couple pair and used for forming external circulation outside the aircraft hangar in a fan side blowing mode. According to the scheme, the semiconductor cooler can be installed in a small installation space, so that the weight of the radiator is reduced while the heat dissipation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of aircraft hangars, in particular to a semiconductor temperature control auxiliary device applied to an aircraft hangar.
Background
An unmanned aircraft, abbreviated as "drone", and abbreviated in english as "UAV", is an unmanned aircraft that is operated by a radio remote control device and a self-contained program control device, or is operated autonomously, either completely or intermittently, by an onboard computer.
Unmanned aerial vehicles can be classified into military and civil applications according to the application field. For military use, unmanned aerial vehicles divide into reconnaissance aircraft and target drone. In the civil aspect, the unmanned aerial vehicle + the industry application is really just needed by the unmanned aerial vehicle; the unmanned aerial vehicle is applied to the fields of aerial photography, agriculture, plant protection, miniature self-timer, express transportation, disaster relief, wild animal observation, infectious disease monitoring, surveying and mapping, news reporting, power inspection, disaster relief, movie and television shooting, romantic manufacturing and the like, and the use of the unmanned aerial vehicle is greatly expanded.
Unmanned aerial vehicle is at outdoor operations's in-process, generally need the unmanned aerial vehicle hangar to provide outdoor support, the outdoor automatic hangar of unmanned aerial vehicle possesses the unmanned aerial vehicle storage and releases to fly and withdraw, fill can the function, because unmanned aerial vehicle's battery just can normally charge and discharge at 0 ~ 45 ℃ within range, in order to ensure that the hangar normally works under extreme high temperature condition in summer and the extreme cold condition in winter, need guarantee that the unmanned aerial vehicle hangar can provide more comfortable ambient temperature.
Disclosure of Invention
In view of this, embodiments of the present invention provide a semiconductor temperature control assisting device applied to an aircraft hangar and the aircraft hangar, which at least partially solve the problems in the prior art.
In a first aspect, an embodiment of the present invention provides a semiconductor temperature control assisting device applied to an aircraft hangar, including:
a galvanic couple having a cold end and a hot end;
the heat absorber is arranged at the cold end of the couple pair and is used for forming internal circulation in the aircraft hangar;
the radiator is arranged at the hot end of the couple pair and used for forming external circulation outside the aircraft hangar in a fan side blowing mode.
According to a specific implementation manner of the embodiment of the present disclosure, the couple pairs are composed of two groups of couples connected in series.
According to a specific implementation manner of the embodiment of the disclosure, heat generated by the couple pair is equalized in temperature through the copper plate, and then is discharged out of the external air conditioner cavity by the fan through the heat pipe conduction radiator.
According to a specific implementation manner of the embodiment of the present disclosure, the heat sink includes a copper plate, a plurality of heat pipes, FIN-fastening FINs, and a fan.
According to a specific implementation manner of the embodiment of the disclosure, the outer surface of the hangar is coated with light-colored paint for weakening the heating of the chassis by solar radiation.
According to a specific implementation mode of the embodiment of the disclosure, a heat preservation and insulation layer is installed on the inner wall of the hangar.
According to a concrete implementation mode of this disclosure, the cold wind/hot-blast process unmanned aerial vehicle bottom that the fan of cold-drawing end blew off, unmanned aerial vehicle built-in fan inhales cold wind/hot-blast being used for unmanned aerial vehicle cooling/preheating.
According to a specific implementation manner of the embodiment of the disclosure, the couple pairs are electrified according to a first power supply sequence, and the cold end and the hot end are respectively used for refrigerating and heating.
According to a specific implementation manner of the embodiment of the disclosure, the couple pairs are electrified according to a second power supply sequence opposite to the first power supply sequence, and the cold end and the hot end respectively perform heating and cooling.
In a second aspect, the embodiments of the present disclosure provide an aircraft hangar, which includes the semiconductor temperature control auxiliary device according to the first aspect or any implementation manner of the first aspect.
The embodiment of the invention provides a semiconductor temperature control auxiliary device applied to an aircraft hangar, which comprises: a galvanic couple having a cold end and a hot end; the heat absorber is arranged at the cold end of the couple pair and is used for forming internal circulation in the aircraft hangar; the radiator is arranged at the hot end of the couple pair and used for forming external circulation outside the aircraft hangar in a fan side blowing mode. Through the scheme of this application, can be in little installation space installation semiconductor cooler, alleviateed the weight of radiator when having improved radiating efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a semiconductor temperature control auxiliary device applied to an aircraft hangar in the prior art;
fig. 2 is a schematic structural diagram of a semiconductor temperature control auxiliary device applied to an aircraft hangar according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another semiconductor temperature control auxiliary device applied to an aircraft hangar according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another semiconductor temperature control auxiliary device applied to an aircraft hangar according to an embodiment of the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, 2 and 3, an embodiment of the present invention provides a semiconductor temperature control assisting device applied to an aircraft hangar, including: couple, heat absorber and radiator.
The couple pair is used for cooling or heating and has a cold end and a hot end. The couple pair is used as a semiconductor refrigerating sheet and is a heat transfer tool. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. But the semiconductor itself presents a resistance that generates heat when current passes through the semiconductor, thereby affecting heat transfer. But the heat between the two plates is also transferred through the air and the semiconductor material itself in a reverse direction.
When an N-type semiconductor material and a P-type semiconductor material are connected into a galvanic couple pair, energy transfer can be generated after direct current is switched on in the circuit, and the current flows to the joint of the P-type element from the N-type element to absorb heat to form a cold end; the junction from the P-type element to the N-type element releases heat to become the hot end. The magnitude of the heat absorption and release is determined by the magnitude of the current and the number of pairs of elements of semiconductor material N, P.
The heat absorber is used for absorbing heat, the heat absorber is installed at the cold junction of couple pair, the heat absorber is used for forming the inner loop in the aircraft hangar. The heat absorbing gas can be made of metal (such as aluminum or copper) with good heat conducting effect. The radiator is used for radiating heat, the radiator is installed at the hot end of the couple pair, and the radiator is used for forming external circulation outside the aircraft hangar in a fan side blowing mode.
Specifically, the semiconductor temperature control auxiliary device itself is a semiconductor refrigeration device composed of a couple pair, a radiator and a heat absorber. The heat absorber is arranged at the cold end of the couple pair, the radiator is arranged at the hot end of the couple pair, the radiator at the hot end of the device adopts a fan side blowing mode (see figure 2) different from the top blowing mode (see figure 1) of the conventional air-cooled semiconductor radiator, and the structural design and the air outlet mode of the radiator have the characteristics of high heat dissipation efficiency, small volume and light weight. The working principle is that heat generated by two groups of series-connected couple pairs is equalized in temperature through the copper plate, then is conducted to the radiator through the heat pipe, and is discharged out of the external air-conditioning cavity through the fan.
The main heat dissipation mode of the hangar in the prior art is active air cooling, and heat is directly dissipated to the external environment in a mode of opening air holes in the side wall of the hangar. Which cannot ensure complete protection against wind and water due to the presence of the ventilation holes. In the prior art, a mainstream semiconductor refrigerator used on a hangar adopts a mode of aluminum extrusion and top blowing of a fan, and the refrigerator cannot be used if the requirements on light weight and large heat dissipation capacity are met when the installation space in the vertical direction of a figure is small. The invention aims to solve the problem of how to improve the heat dissipation efficiency of a semiconductor cooler and reduce the weight and reduce the vertical installation size.
The radiator comprises a copper plate, 4 heat pipes, a FIN and a fan, wherein the known heat pipes have ultrahigh heat conductivity coefficient. The manufacturing process and materials of the AL-buckle Fin determine that the Al-buckle Fin has larger heat dissipation area compared with an aluminum extruded or die-cast radiator under the same volume, so that the overall dimension and the weight of the radiator are reduced under the condition of the same heat dissipation area requirement, and the fan side blowing reduces the installation dimension in the vertical direction as shown in figure 2. The heat generated by the couple pairs is evenly heated by the copper plate, then transferred to the far fins by the 4 heat pipes and discharged to the external space by the fan, so that the heat dissipation efficiency of the radiator is improved. As shown in fig. 2, the external circulation system and the radiator part, and the internal circulation system and the cold absorption part of the semiconductor refrigerator.
In order to ensure that the hangar normally works under extreme high temperature conditions in summer and extreme cold conditions in winter, the intelligent temperature control auxiliary device for accelerating the cooling and preheating development of the unmanned aerial vehicle is assisted. The semiconductor temperature control device is manufactured by utilizing the thermo-electric effect of a semiconductor. The thermoelectric effect refers to the phenomenon that when direct current passes through a couple pair composed of two semiconductor materials, one end absorbs heat and the other end releases heat, and if a power supply is reversely connected, the cold end and the hot end are exchanged. The semiconductor refrigerator has the characteristics of small volume, light weight, no need of refrigerant and the like.
The heat preservation and insulation effects of the hangar need to be considered. The outer surface of the hangar is coated with light paint to weaken the heating of the solar radiation to the chassis. The heat preservation and insulation layer is arranged on the inner wall of the hangar, so that the refrigerating capacity/heating capacity generated by the semiconductor refrigerator is prevented from flowing in the air along the outer wall of the hangar, and meanwhile, the external heat/cold capacity is prevented from being transmitted into the hangar. The whole thermal cycle process in the machine base is as follows: the cold air (less than the interior ambient temperature of the machine room)/hot air (greater than the interior ambient temperature of the machine room) blown out by the fan at the cold suction end passes through the bottom of the unmanned aerial vehicle, the built-in fan of the unmanned aerial vehicle sucks the cold air/hot air for cooling/preheating the unmanned aerial vehicle, and a specific heat dissipation path is shown in the fourth drawing. The invention is characterized in that the heat path between the cold absorption end and the unmanned aerial vehicle is short enough, and the heat path can effectively act on the cooling/preheating of the unmanned aerial vehicle with the aid of the fan, and the remote fan on the main board mounting plate can assist the fluid circulation of the whole hangar to reduce the temperature of the hangar, and assist the unmanned aerial vehicle outdoor hangar to normally work under the condition of extreme high temperature or low temperature.
According to a specific implementation manner of the embodiment of the present disclosure, the couple pairs are composed of two groups of couples connected in series.
According to a specific implementation manner of the embodiment of the disclosure, heat generated by the couple pair is equalized in temperature through the copper plate, and then is discharged out of the external air conditioner cavity by the fan through the heat pipe conduction radiator.
According to a specific implementation manner of the embodiment of the present disclosure, the heat sink includes a copper plate, a plurality of heat pipes, FIN-fastening FINs, and a fan.
According to a specific implementation manner of the embodiment of the disclosure, the outer surface of the hangar is coated with light-colored paint for weakening the heating of the chassis by solar radiation.
According to a specific implementation mode of the embodiment of the disclosure, a heat preservation and insulation layer is installed on the inner wall of the hangar.
According to a concrete implementation mode of this disclosure, the cold wind/hot-blast process unmanned aerial vehicle bottom that the fan of cold-drawing end blew off, unmanned aerial vehicle built-in fan inhales cold wind/hot-blast being used for unmanned aerial vehicle cooling/preheating.
According to a specific implementation manner of the embodiment of the disclosure, the couple pairs are electrified according to a first power supply sequence, and the cold end and the hot end are respectively cooled and heated.
According to a specific implementation manner of the embodiment of the disclosure, the couple pairs are electrified according to a second power supply sequence opposite to the first power supply sequence, and the cold end and the hot end respectively perform heating and cooling.
In addition, the embodiment of the present disclosure further provides an aircraft hangar, which includes the semiconductor temperature control auxiliary device according to the above embodiment.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A semiconductor temperature control auxiliary device applied to an aircraft hangar is characterized by comprising:
a galvanic couple having a cold end and a hot end;
the heat absorber is arranged at the cold end of the couple pair and is used for forming internal circulation in the aircraft hangar;
the radiator is arranged at the hot end of the couple pair and used for forming external circulation outside the aircraft hangar in a fan side blowing mode.
2. The semiconductor temperature control auxiliary device applied to the aircraft hangar of claim 1, wherein:
the couple pair consists of two groups of couples connected in series.
3. The semiconductor temperature control auxiliary device applied to the aircraft hangar of claim 2, wherein:
and the heat generated by the couple pair is equalized in temperature through the copper plate, then is conducted to the radiator through the heat pipe, and is discharged out of the external air conditioning cavity through the fan.
4. The semiconductor temperature control auxiliary device applied to the aircraft hangar of claim 3, wherein:
the radiator comprises a copper plate, a plurality of heat pipes, FIN radiating FINs and a fan.
5. The semiconductor temperature control auxiliary device applied to the aircraft hangar of claim 3, wherein:
the outer surface of the hangar is coated with light paint for weakening the heating of the case by solar radiation.
6. The semiconductor temperature control auxiliary device applied to the aircraft hangar of claim 3, wherein:
and a heat preservation and insulation layer is arranged on the inner wall of the hangar.
7. The semiconductor temperature control auxiliary device applied to the aircraft hangar of claim 3, wherein:
the cold wind/hot-blast process unmanned aerial vehicle bottom that the fan of cold junction blew off, unmanned aerial vehicle built-in fan inhale cold wind/hot-blast be used for unmanned aerial vehicle cooling/preheat.
8. The semiconductor temperature control auxiliary device applied to the aircraft hangar of claim 3, wherein:
and electrifying the couple pairs according to a first power supply sequence, and refrigerating and heating the cold end and the hot end respectively.
9. The semiconductor temperature control auxiliary device applied to the aircraft hangar of claim 8, wherein:
and electrifying the couple pair according to a second power supply sequence opposite to the first power supply sequence, and respectively heating and refrigerating the cold end and the hot end.
10. An aircraft hangar characterized in that it comprises a semiconductor temperature control assistance device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210558883.2A CN114857801A (en) | 2022-05-21 | 2022-05-21 | Semiconductor temperature control auxiliary device applied to aircraft hangar and aircraft hangar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210558883.2A CN114857801A (en) | 2022-05-21 | 2022-05-21 | Semiconductor temperature control auxiliary device applied to aircraft hangar and aircraft hangar |
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| Publication Number | Publication Date |
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| CN114857801A true CN114857801A (en) | 2022-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210558883.2A Pending CN114857801A (en) | 2022-05-21 | 2022-05-21 | Semiconductor temperature control auxiliary device applied to aircraft hangar and aircraft hangar |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115633498A (en) * | 2022-12-16 | 2023-01-20 | 南京迈动科技有限公司 | Multi-rotor unmanned aerial vehicle |
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| CN210264104U (en) * | 2019-05-15 | 2020-04-07 | 广东霍德韦信息技术有限公司 | Unmanned aerial vehicle hangar |
| CN210374291U (en) * | 2019-07-09 | 2020-04-21 | 浙江洋光科技有限公司 | EPP foam shell semiconductor cooling and heating refrigerator |
| CN213626885U (en) * | 2020-10-15 | 2021-07-06 | 北京新兴东方航空装备股份有限公司 | Unmanned aerial vehicle honeycomb |
| CN216282138U (en) * | 2020-11-08 | 2022-04-12 | 深圳市予一电子科技有限公司 | Refrigeration structure and beauty instrument |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115633498A (en) * | 2022-12-16 | 2023-01-20 | 南京迈动科技有限公司 | Multi-rotor unmanned aerial vehicle |
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