CN114217205B - Full-automatic test equipment for packaging semiconductor chip - Google Patents
Full-automatic test equipment for packaging semiconductor chip Download PDFInfo
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- CN114217205B CN114217205B CN202111448100.7A CN202111448100A CN114217205B CN 114217205 B CN114217205 B CN 114217205B CN 202111448100 A CN202111448100 A CN 202111448100A CN 114217205 B CN114217205 B CN 114217205B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- Microelectronics & Electronic Packaging (AREA)
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses full-automatic test equipment for packaging semiconductor chips, which comprises a first conveyor, a test bench, a transverse guide mechanism, a test mechanism, a turnover exporter and a second conveyor, wherein the tail end of the first conveyor is connected with the test bench, the test bench comprises a pedestal and a PLC (programmable logic controller) arranged in the pedestal, a data display screen is arranged above the pedestal, a guide opening is arranged below the pedestal, the transverse guide mechanism is arranged at the joint of the first conveyor and the pedestal, the test mechanism comprises a test inner cavity arranged on the surface of the guide opening and a test plate arranged right above the test inner cavity, the upper end of the test plate is horizontally provided with a top plate, and two groups of electric push rods are symmetrically arranged between the top plate and the test plate. The chip testing equipment designed by the invention can detect the specification of the chip and the general degree of the circuit, improves the testing variety of the chip, adopts an automatic testing mode and greatly improves the testing efficiency.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to full-automatic testing equipment for packaging semiconductor chips.
Background
And (3) a semiconductor chip: etching and wiring are performed on a semiconductor sheet to produce a semiconductor device capable of realizing a certain function. Not only silicon chips, but also gallium arsenide (gallium arsenide is toxic, so some bad circuit boards do not have to decompose it) and germanium. Semiconductors also like automobiles have a trend, and in order to meet the demand for mass production, the electrical properties of semiconductors must be predictable and stable, and therefore, both the purity of dopants and the quality of semiconductor lattice structures must be strictly required. Common quality problems include dislocations, twins, or stacking faults of the crystal lattice that affect the properties of the semiconductor material. For a semiconductor device, defects in the material lattice are often the main contributors to device performance, and the semiconductor chip requires testing by specialized testing equipment after production is complete.
However, the existing test apparatus for semiconductor chips has the following problems in use: (1) The existing test equipment for the semiconductor chip is single in test category, and the test equipment can only test certain data of the chip, has less functionality and cannot meet actual requirements; (2) The degree of automation of the existing test equipment for semiconductor chips is low, the chips need to be put in and taken out manually, the operation is complex, and the test efficiency is affected. For this purpose, a corresponding technical solution is required to be designed to solve the existing technical problems.
Disclosure of Invention
The invention aims to provide full-automatic test equipment for packaging semiconductor chips, which solves the technical problems that the existing test equipment for semiconductor chips is single in test category, and the test equipment can only test certain data of the chips, has less functionality and cannot meet actual needs.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a full-automatic test equipment of encapsulation semiconductor chip, includes semiconductor chip test equipment, semiconductor chip test equipment includes conveyer one, testboard, horizontal guide mechanism, test mechanism, upset derivation ware and conveyer two, the end and the testboard of conveyer one are connected, the testboard includes pedestal and built-in PLC controller in the pedestal, the guiding mouth has been seted up to data display screen and below to the top of pedestal, horizontal guide mechanism installs in the junction of conveyer one and pedestal, test mechanism is including seting up in the test inner chamber of guiding mouth surface and setting up in the test board directly over the test inner chamber, the upper end level of test board is provided with the roof, the symmetry is provided with two sets of electric putter between roof and the test board, electric putter's power take-off end is connected with the test board, the opening has been seted up to the outer end of test board, alternate thickness test pole in the opening, the bottom of thickness test pole is fixed in conveyer one, the left end of installing in the test inner chamber is led out in the upset, the left end of conveyer two is installed in the left end of pedestal.
As a preferred implementation mode of the invention, the transverse material guiding mechanism consists of two groups of pushers, two groups of pushers and guide balls, wherein the pushers are symmetrically arranged on the inner wall of the guide opening, the pushers are positioned between the two groups of pushers, and the guide balls are uniformly embedded at the top of the pushers in a plurality of groups.
As a preferred implementation mode of the invention, the pusher comprises a driving motor arranged on the inner wall of the guide opening and a screw rod arranged at the power output end of the driving motor, wherein the screw rod is sleeved with sliding blocks, and the pushing plate is positioned between the two groups of sliding blocks.
As a preferred implementation mode of the invention, the test cavity is of a concave structure, a plurality of groups of buffer spacers are uniformly arranged on the inner wall of the test cavity, and the buffer spacers are made of insulating materials and are of a hemispherical structure.
As a preferred implementation mode of the invention, the test board comprises a main board and a contact board arranged below the main board, wherein a plurality of groups of mounting holes are uniformly formed in the bottom of the contact board, contact protruding points are embedded in the mounting holes, the contact protruding points are externally connected with a power supply through a circuit, and the contact protruding points are in one-to-one correspondence with the buffer spacers below.
As a preferred embodiment of the present invention, the thickness test bar includes a vertical plate vertically installed on the test cavity and a contact sensor installed at one side of the opening, and the contact sensor is connected with the PLC controller through a line.
As a preferred implementation mode of the invention, the overturning exporter consists of a servo motor, a rotating rod and an overturning plate, wherein the servo motor is arranged on one side of a pedestal, a power output end of the servo motor is connected with the rotating rod, the rotating rod is movably arranged on the pedestal, the overturning plate is provided with a plurality of groups and is equidistantly arranged on the rotating rod, and the left end of the testing cavity is provided with a storage notch matched with the overturning plate.
As a preferred embodiment of the invention, the turnover poking plate comprises a sleeve fixed on the rotating rod and a poking piece fixed at the outer end of the sleeve, and the outer end of the poking piece is in a tilting structure.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention designs a device special for testing a semiconductor chip, which comprises a first conveyor, a test table, a transverse guide mechanism, a test mechanism, a turnover guide-out device and a second conveyor, wherein the chip to be tested is conveyed onto the test table through the first conveyor, is guided into a test cavity of the test mechanism through the transverse guide mechanism and is matched with a test board above the test cavity, the circuit and the specification of the chip can be tested, the test type of the chip is improved, after the test is finished, the chip can be subjected to turnover guide-out treatment through the turnover guide-out device arranged on one side of the test cavity, so that the tested chip is guided onto the second conveyor, the tested chip is conveyed through the second conveyor, and the purpose of rapidly testing the chip can be achieved through the test.
2. The chip testing equipment designed by the invention can detect the specification of the chip and the usual degree of the circuit, improves the testing variety of the chip, adopts an automatic testing mode and greatly improves the testing efficiency and effect.
Drawings
FIG. 1 is an overall block diagram of the present invention;
FIG. 2 is a partial A block diagram of the present invention;
FIG. 3 is a schematic diagram of a test lumen according to the present invention;
FIG. 4 is a schematic view of the bottom of the test plate according to the present invention;
FIG. 5 is a diagram of the structure of the flip dial according to the present invention.
In the figure, 1, a first conveyor; 2. a test bench; 3. a transverse guide mechanism; 4. a testing mechanism; 5. a flip-flop exporter; 6. a second conveyor; 7. a pedestal; 8. a PLC controller; 9. a data display screen; 10. a guide opening; 11. testing the inner cavity; 12. a test board; 13. a top plate; 14. an electric push rod; 15. an opening; 16. a thickness test bar; 17. a pusher; 18. a push plate; 19. a guide ball; 20. a driving motor; 21. a screw; 22. a slide block; 23. buffering spacers; 24. a main board; 25. a contact plate; 26. a mounting hole; 27. contacting the convex points; 28. a vertical plate; 29. a contact sensor; 30. a servo motor; 31. a rotating lever; 32. a turning plate; 33. a receiving slot; 34. a sleeve; 35. a pulling piece.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1: referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a full-automatic test equipment of encapsulation semiconductor chip, including semiconductor chip test equipment, semiconductor chip test equipment includes conveyer 1, testboard 2, horizontal guide mechanism 3, test mechanism 4, upset derivation ware 5 and conveyer two 6, the end and the testboard 2 of conveyer 1 are connected, testboard 2 includes pedestal 7 and built-in PLC controller 8 in pedestal 7, data display 9 is installed to pedestal 7's top and guiding mouth 10 has been seted up to the below, horizontal guide mechanism 3 installs in the junction of conveyer 1 and pedestal 7, test mechanism 4 is including setting up in the test inner chamber 11 on guiding mouth 10 surface and setting up in test board 12 directly over test inner chamber 11, the upper end level of test board 12 is provided with roof 13, the symmetry is provided with two sets of electric putter 14 between roof 13 and the test board 12, electric putter 14's power output end is connected with test board 12, opening 15 has been seted up to the outer end of test board 12, alternate thickness test lever 16 in the opening 15, thickness test lever 16's bottom is fixed in conveyer 1, install in the left end of installing at pedestal 7 on the left end of installation of pedestal 7 of conveyer 5.
Example 2: as shown in fig. 2: the horizontal material guiding mechanism 3 consists of a pusher 17, a push plate 18 and guide balls 19, wherein the pusher 17 is provided with two groups which are symmetrically arranged on the inner wall of the guide opening 10, the push plate 18 is positioned between the two groups of pushers 17, the guide balls 19 are provided with a plurality of groups which are uniformly embedded in the top of the push plate 18, and the pusher 17 is used for pushing the push plate 18 to move horizontally and the guide balls 19 are used for assisting the chip to slide.
The pusher 17 comprises a driving motor 20 arranged on the inner wall of the guide port 10 and a screw rod 21 arranged at the power output end of the driving motor 20, a sliding block 22 is sleeved on the screw rod 21, the push plate 18 is positioned between the two groups of sliding blocks 22, the driving motor 20 drives the screw rod 21 to rotate, and the screw rod 21 drives the sliding block 22 and the push plate 18 to transversely move in the rotating process, so that the purpose of pushing a chip is achieved.
Example 3: as shown in fig. 3: the test cavity 11 is of a concave structure, a plurality of groups of buffer spacers 23 are uniformly arranged on the inner wall, and the buffer spacers 23 are made of insulating materials and are of a hemispherical structure, so that the purpose of buffering and protecting chips can be achieved.
Example 4: as shown in fig. 4: the test board 12 comprises a main board 24 and a contact board 25 arranged below the main board 24, a plurality of groups of mounting holes 26 are uniformly formed in the bottom of the contact board 25, contact protruding points 27 are embedded in the mounting holes 26, the contact protruding points 27 are externally connected with a power supply through a circuit, the contact protruding points 27 correspond to the buffer spacers 23 below one by one, the contact protruding points 27 corresponding to a chip to be tested can be arranged on the mounting holes 26 according to requirements, and when whether a certain circuit or a component of the chip is required to be detected, the contact protruding points 27 at the position can be electrified.
The thickness test rod 16 comprises a vertical plate 28 vertically arranged on the test cavity 11 and a contact sensor 29 arranged on one side of the opening 15, wherein the contact sensor 29 is connected with the PLC 8 through a circuit, and the contact sensor 29 is contacted with the upper surface of the chip, so that the purpose of testing the thickness is achieved.
And (3) notes: the riser 28 is carved with thickness graduation marks.
Example 5: fig. 1 and 5 show: the upset derivation ware 5 comprises servo motor 30, dwang 31 and upset poking plate 32, servo motor 30 installs in one side of pedestal 7 and power take off end is connected with dwang 31, dwang 31 movable mounting is on pedestal 7, upset poking plate 32 divide and are equipped with a plurality of groups and the equidistance is installed on dwang 31, accomodate notch 33 that cooperation upset poking plate 32 used is seted up to the left end of test inner chamber 11, it rotates to drive dwang 31 through servo motor 30, dwang 31 is in the pivoted in-process drive upset poking plate 32 to drive the chip and derive from in the test inner chamber 11.
Specifically, the turnover poking plate 32 comprises a sleeve 34 fixed on the rotating rod 31 and a poking piece 35 fixed at the outer end of the sleeve 34, and the outer end of the poking piece 35 is of a tilting structure, so that the end part of the chip positioned in the testing inner cavity 11 is conveniently lifted, and the outer guiding treatment is conveniently carried out.
When in use: the invention designs a special device for testing semiconductor chips, which comprises a first conveyor 1, a test table 2, a transverse guide mechanism 3, a test mechanism 4, a turnover exporter 5 and a second conveyor 6, wherein the chips to be tested are conveyed onto the first conveyor 1, are guided into a test cavity 11 of the test mechanism 4 through the transverse guide mechanism 3 and are matched with a test board 12 above, so that the circuits and the specifications of the chips can be tested, the types of the chips are improved, after the test is finished, the chips can be subjected to turnover exterior guiding treatment through the turnover exporter 5 arranged on one side of the test cavity 11, the tested chips are conveyed onto the second conveyor 6, and the chips can be quickly tested through the test.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The utility model provides a full-automatic test equipment of encapsulation semiconductor chip, includes semiconductor chip test equipment, its characterized in that: the semiconductor chip test equipment comprises a first conveyor (1), a test bench (2), a transverse guide mechanism (3), a test mechanism (4), a turnover guide-out device (5) and a second conveyor (6), wherein the tail end of the first conveyor (1) is connected with the test bench (2), the test bench (2) comprises a pedestal (7) and a PLC (programmable logic controller) (8) arranged in the pedestal (7), a data display screen (9) is arranged above the pedestal (7) and a guide opening (10) is formed below the pedestal, the transverse guide mechanism (3) is arranged at the joint of the first conveyor (1) and the pedestal (7), the test mechanism (4) comprises a test cavity (11) formed on the surface of the guide opening (10) and a test plate (12) arranged right above the test cavity (11), a top plate (13) is horizontally arranged at the upper end of the test plate (12), two groups of electric push rods (14) are symmetrically arranged between the top plate (13) and the test plate (12), the power output end of the electric push rods (14) is fixedly arranged at the bottom of the test plate (12) and the test rod (16) is fixedly provided with a thickness (16) at the bottom of the test rod (16) which is fixedly arranged at the bottom of the test rod (16), the turnover guide device (5) is arranged at the left end of the test cavity (11), the second conveyor (6) is arranged at the left end of the pedestal (7), the transverse guide mechanism (3) is composed of a pusher (17), a push plate (18) and guide balls (19), the pusher (17) is divided into two groups and symmetrically arranged on the inner wall of the guide opening (10), the push plate (18) is arranged between the two groups of pushers (17), the guide balls (19) are divided into a plurality of groups and uniformly embedded at the top of the push plate (18), the pusher (17) comprises a driving motor (20) arranged on the inner wall of the guide opening (10) and a screw (21) arranged at the power output end of the driving motor (20), the screw (21) is sleeved with sliding blocks (22), the push plate (18) is arranged between the two groups of sliding blocks (22), the thickness test rod (16) comprises a vertical plate (28) vertically arranged on the test cavity (11) and a contact sensor (29) arranged on one side of the opening (15), the contact sensor (29) is connected with the turnover guide device (8) through a turnover control circuit (31) and the turnover guide device (32), the servo motor (30) is arranged on one side of the pedestal (7) and the power output end is connected with the rotating rod (31), the rotating rod (31) is movably arranged on the pedestal (7), the overturning poking plates (32) are respectively provided with a plurality of groups and are equidistantly arranged on the rotating rod (31), the left end of the testing inner cavity (11) is provided with a containing notch (33) matched with the overturning poking plates (32), the overturning poking plates (32) comprise a sleeve (34) fixed on the rotating rod (31) and a poking plate (35) fixed on the outer end of the sleeve (34), and the outer end of each poking plate (35) is of a warping structure.
2. The fully automated test equipment for packaging semiconductor chips as defined in claim 1, wherein: the testing cavity (11) is of a concave structure, a plurality of groups of buffer spacers (23) are uniformly arranged on the inner wall of the testing cavity, and the buffer spacers (23) are made of insulating materials and are of a hemispherical structure.
3. The fully automated test equipment for packaging semiconductor chips as defined in claim 1, wherein: the test board (12) comprises a main board (24) and a contact board (25) arranged below the main board (24), a plurality of groups of mounting holes (26) are uniformly formed in the bottom of the contact board (25), contact protruding points (27) are embedded in the mounting holes (26), the contact protruding points (27) are externally connected with a power supply through a circuit, and the contact protruding points (27) are in one-to-one correspondence with the buffer spacers (23) below.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111448100.7A CN114217205B (en) | 2021-11-29 | 2021-11-29 | Full-automatic test equipment for packaging semiconductor chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111448100.7A CN114217205B (en) | 2021-11-29 | 2021-11-29 | Full-automatic test equipment for packaging semiconductor chip |
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| CN114217205A CN114217205A (en) | 2022-03-22 |
| CN114217205B true CN114217205B (en) | 2023-06-02 |
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