CN217444359U - Wafer calibrator - Google Patents
Wafer calibrator Download PDFInfo
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- CN217444359U CN217444359U CN202221313283.1U CN202221313283U CN217444359U CN 217444359 U CN217444359 U CN 217444359U CN 202221313283 U CN202221313283 U CN 202221313283U CN 217444359 U CN217444359 U CN 217444359U
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Abstract
The utility model provides a wafer calibrator belongs to semiconductor technical field. The utility model discloses a platform dish, slider board and detection sensor, platform dish surface set up the vacuum groove that is used for adsorbing the wafer, and the platform dish passes through rotary mechanism and sets up on slider board, and rotary mechanism adopts the rotating electrical machines, and the fixed setting of rotating electrical machines is on slider board, and the platform dish is connected to the rotating electrical machines output, and the slider board below sets up longitudinal movement mechanism and lateral shifting mechanism, detects the sensor setting in platform dish one side, and the one side of being close to the platform dish on the detection sensor has seted up the detection mouth, the utility model discloses effectively improved the work efficiency of wafer processing, and installed simple structure, it is easy and simple to handle.
Description
Technical Field
The utility model relates to a wafer calibrator belongs to semiconductor technical field.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are dominated by 8 inches and 12 inches.
The main processing modes of the wafer are sheet processing and batch processing, i.e. 1 or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more and more advanced, so that new data characteristics appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and the reliability of the processed wafer is increased during wafer processing, and the particle number has new data characteristics along with the improvement of cleanness.
In the process of producing the wafer, the wafer needs to be conveyed to a fixed accurate position from the wafer box, the position of the wafer in the wafer box has deviation, so that the wafer is conveyed to the last position, and the position of the wafer needs to be adjusted manually at the moment, so that the wafer processing efficiency is low, and the production and processing requirements cannot be met.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings in the prior art, an object of the present invention is to provide a wafer calibrator for solving the problems that the wafer position needs to be adjusted manually in the existing wafer production process in the prior art, so that the wafer machining efficiency is low and the production and machining requirements cannot be satisfied.
In order to achieve the above objects and other related objects, the utility model provides a wafer calibrator, including platform dish, slider board and detection sensor, the platform dish passes through rotary mechanism and sets up on the slider board, slider board below sets up longitudinal movement mechanism and lateral shifting mechanism, the detection sensor sets up in platform dish one side, and the detection mouth has been seted up to one side that is close to the platform dish on the detection sensor.
In an embodiment of the present invention, the rotating mechanism adopts a rotating electrical machine, the rotating electrical machine is fixed on the slider plate, and the output end of the rotating electrical machine is connected to the platform tray.
By adopting the technical scheme: the rotary motor drives the table disc to rotate, so that the angle of the wafer is adjusted.
In an embodiment of the present invention, the surface of the platen is provided with a vacuum groove for adsorbing the wafer.
By adopting the technical scheme: the surface of the table plate is provided with a vacuum groove for facilitating the adsorption and fixation of the wafer.
In an embodiment of the utility model, longitudinal movement mechanism includes module slide block board, slide block board longitudinal sliding sets up on module slide block board, and slide block board one side sets up the lead screw, and the activity sets up the slider on the lead screw, and slide block board is connected to the slider, and lead screw motor is connected to lead screw one end.
By adopting the technical scheme: when the longitudinal adjustment is carried out, the lead screw motor drives the lead screw to rotate, and the sliding block on the lead screw drives the sliding block plate to move longitudinally, so that the longitudinal position of the wafer is adjusted
In an embodiment of the present invention, the bottom of the slider plate is connected to the module slider plate through a guide rail.
By adopting the technical scheme: the bottom of the slider plate is connected with the module slider plate through a guide rail, so that the slider plate can move on the module slider plate conveniently.
In an embodiment of the present invention, the lateral moving mechanism includes a lateral moving module disposed on the bottom surface of the module slider plate, and the lateral moving module drives the module slider plate to move laterally.
By adopting the technical scheme: when the transverse adjustment is carried out, the transverse moving module drives the module sliding block plate to move transversely, so that the transverse position of the wafer is adjusted.
In an embodiment of the present invention, the module motor is disposed at one end of the lateral moving module.
By adopting the technical scheme: the module motor drives the transverse moving module to operate.
In an embodiment of the present invention, the detection sensor adopts a CCD to detect the sensor
As described above, the utility model discloses a wafer calibrator has following beneficial effect:
the utility model discloses a central point that vertical movement mechanism, lateral shifting mechanism and rotary mechanism can accurately imitate accurate wafer fast puts and the angle position of wafer platband or breach, need not artifical manual regulation, has effectively improved the work efficiency of wafer processing, and installs simple structure, and is easy and simple to handle.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a wafer aligner according to an embodiment of the present invention.
Wherein, 1, detecting sensor; 2. a transverse moving module; 3. a modular motor; 4. a module slider plate; 5. a slider plate; 6. a guide rail; 7. a lead screw; 8. a lead screw motor; 9. a rotating electric machine; 10. a wafer; 11. a table plate; 12. a slide block.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
Referring to fig. 1, the present invention provides a wafer aligner, which includes a stage disk 11, a slider plate 5 and a detection sensor 1, the detection sensor 1 employs a CCD detection sensor, a vacuum groove for adsorbing a wafer is disposed on the surface of the stage disk 11, the stage disk 1 is disposed on the slider plate 5 through a rotation mechanism, the rotation mechanism employs a rotation motor 9, the rotation motor 9 is fixedly disposed on the slider plate 5, the output end of the rotation motor 9 is connected to the stage disk 11, a longitudinal movement mechanism and a transverse movement mechanism are disposed below the slider plate 5, the longitudinal movement mechanism includes a module slider plate 4, the slider plate 5 is longitudinally slidably disposed on the module slider plate 4, the bottom of the slider plate 5 is connected to the module slider plate 4 through a guide rail 6, a lead screw 7 is disposed on one side of the slider plate 5, a slider 12 is movably disposed on the lead screw 7, the slider 12 is connected to the slider plate 5, one end of the lead screw 7 is connected to a lead screw motor 8, lateral shifting mechanism is including setting up lateral shifting module 2 in 4 bottom surfaces of module slide block board, and lateral shifting module 2 drives 4 lateral motion of module slide block board, and 2 one end of lateral shifting module set up module motor 3, and detection sensor 1 sets up in platform dish 11 one side, and the one side that is close to platform dish 11 on the detection sensor 1 has seted up the detection mouth.
The working principle of the wafer calibrator is as follows: when a wafer 10 is placed on a table plate 11, a rotating motor 9 rotates the table plate 11 for a circle, the CCD detection sensor 1 detects angle values of each point of the outer contour of the wafer 10, the deviation between the center position of the wafer 10 and a set original position and the angle position of a flat edge or a notch of the wafer are calculated through a system algorithm according to the angle values of each point of the outer contour, then the table plate 11 continues to rotate, the flat edge or the notch of the wafer 10 is rotated to a set required angle position, the position of the table plate 11 is adjusted through the combined motion of a longitudinal moving mechanism and a transverse moving mechanism to carry out position replenishment, so that the center of the wafer 10 is adjusted to the set original position, when the longitudinal adjustment is carried out, a lead screw motor 8 drives a lead screw 7 to rotate, a slide block 12 on the lead screw 7 drives a slide block plate 5 to longitudinally move along a guide rail 6, thereby realizing the adjustment of the longitudinal position of the wafer, when the transverse adjustment is carried out, the module motor 3 drives the transverse moving module 2 to operate, and the transverse moving module 2 drives the module sliding block plate 4 to move transversely, so that the transverse position of the wafer is adjusted.
To sum up, the utility model discloses a central point that vertical movement mechanism, lateral shifting mechanism and rotary mechanism can accurately imitate accurate wafer fast puts and the angle position of wafer flat side or breach, need not artifical manual regulation, has effectively improved the work efficiency of wafer processing, and installs simple structure, easy and simple to handle. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (8)
1. The wafer calibrator is characterized by comprising a table disc (11), a sliding block plate (5) and a detection sensor (1), wherein the table disc (11) is arranged on the sliding block plate (5) through a rotating mechanism, a longitudinal moving mechanism and a transverse moving mechanism are arranged below the sliding block plate (5), the detection sensor (1) is arranged on one side of the table disc (11), and a detection port is formed in one side, close to the table disc (11), of the detection sensor (1).
2. The wafer aligner of claim 1, wherein: the rotating mechanism adopts a rotating motor (9), the rotating motor (9) is fixedly arranged on the sliding block plate (5), and the output end of the rotating motor (9) is connected with the table plate (11).
3. The wafer aligner of claim 1, wherein: the surface of the table plate (11) is provided with a vacuum groove for adsorbing the wafer.
4. The wafer aligner of claim 1, wherein: the longitudinal moving mechanism comprises a module sliding block plate (4), the sliding block plate (5) is longitudinally arranged on the module sliding block plate (4) in a sliding mode, a lead screw (7) is arranged on one side of the sliding block plate (5), a sliding block (12) is movably arranged on the lead screw (7), the sliding block (12) is connected with the sliding block plate (5), and one end of the lead screw (7) is connected with a lead screw motor (8).
5. The wafer aligner of claim 4, wherein: the bottom of the slider plate (5) is connected with the module slider plate (4) through a guide rail (6).
6. The wafer aligner of claim 1, wherein: the transverse moving mechanism comprises a transverse moving module (2) arranged on the bottom surface of the module sliding block plate (4), and the transverse moving module (2) drives the module sliding block plate (4) to move transversely.
7. The wafer aligner of claim 6, wherein: and one end of the transverse moving module (2) is provided with a module motor (3).
8. The wafer aligner of claim 1, wherein: the detection sensor (1) adopts a CCD detection sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221313283.1U CN217444359U (en) | 2022-05-17 | 2022-05-17 | Wafer calibrator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221313283.1U CN217444359U (en) | 2022-05-17 | 2022-05-17 | Wafer calibrator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217444359U true CN217444359U (en) | 2022-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221313283.1U Active CN217444359U (en) | 2022-05-17 | 2022-05-17 | Wafer calibrator |
Country Status (1)
| Country | Link |
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| CN (1) | CN217444359U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115638757A (en) * | 2022-11-11 | 2023-01-24 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
| CN116344395A (en) * | 2023-03-07 | 2023-06-27 | 东莞市智赢智能装备有限公司 | Edge finder |
-
2022
- 2022-05-17 CN CN202221313283.1U patent/CN217444359U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115638757A (en) * | 2022-11-11 | 2023-01-24 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
| CN115638757B (en) * | 2022-11-11 | 2023-11-28 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
| CN116344395A (en) * | 2023-03-07 | 2023-06-27 | 东莞市智赢智能装备有限公司 | Edge finder |
| CN116344395B (en) * | 2023-03-07 | 2023-10-20 | 东莞市智赢智能装备有限公司 | Edge finder |
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