CN114188444A - 异质结电池tco膜的清洗方法及应用、电池片、异质结电池的制备方法 - Google Patents

异质结电池tco膜的清洗方法及应用、电池片、异质结电池的制备方法 Download PDF

Info

Publication number
CN114188444A
CN114188444A CN202111490434.0A CN202111490434A CN114188444A CN 114188444 A CN114188444 A CN 114188444A CN 202111490434 A CN202111490434 A CN 202111490434A CN 114188444 A CN114188444 A CN 114188444A
Authority
CN
China
Prior art keywords
cell
amorphous silicon
cleaning
heterojunction
cleaning method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202111490434.0A
Other languages
English (en)
Other versions
CN114188444B (zh
Inventor
潘国鑫
师海峰
杨文亮
冀杨洲
白焱辉
黄金
李文敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jinneng Photovoltaic Technology Co Ltd
Original Assignee
Jinneng Photovoltaic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jinneng Photovoltaic Technology Co Ltd filed Critical Jinneng Photovoltaic Technology Co Ltd
Priority to CN202111490434.0A priority Critical patent/CN114188444B/zh
Publication of CN114188444A publication Critical patent/CN114188444A/zh
Application granted granted Critical
Publication of CN114188444B publication Critical patent/CN114188444B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/02068Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
    • H01L31/0745Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells
    • H01L31/0747Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells comprising a heterojunction of crystalline and amorphous materials, e.g. heterojunction with intrinsic thin layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/202Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Sustainable Energy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Photovoltaic Devices (AREA)

Abstract

本发明提供一种异质结电池TCO膜的清洗方法及应用、电池片、异质结电池的制备方法,对异质结电池在TCO制备过程中产出的不合格的电池片,通过将浓度14.00‑17.00mol/L的硝酸溶液以及浓度26.00‑29.00mol/L的氢氟酸溶液以2:1的比例配置酸洗液注入水进行稀释后,对电池片进行酸洗,然后通过水洗、热脱水以及烘干获得合格的电池片。本发明可以高效、快速清洗掉TCO膜层。并且通过本发明,可以解决异质结量产过程中清洗的交叉污染等问题。采用本发明清洗过后的电池片进行制备得到的电池对电性能基本没有影响,大大降低了企业的生产成本,真正做到了变废为宝。

Description

异质结电池TCO膜的清洗方法及应用、电池片、异质结电池的 制备方法
技术领域
本发明涉及太阳能电池制造领域,特别涉及一种异质结电池TCO膜的清洗方法及应用、电池片、异质结电池的制备方法。
背景技术
在如今的光伏产业中,降低生产成本和提高转换效率是太阳能电池生产企业的首要任务。异质结电池因其结构对称,能够对其表面进行良好的钝化,并且制备的工艺简单、工艺温度低于250℃、具有高的转换效率等优点而备受关注。透明导电薄膜(TCO)是异质结电池生产过程中的关键工序,该薄膜具有良好的透光性、导电性、能够减少光的反射等特点。
异质结电池在TCO制备过程中因其机器自动化偏差或者异常产生掩膜偏移、TCO镀膜色差、划伤等电池片,该类型的电池片转换效率低而不能进入下一段工序进行生产,因此清洗TCO膜是本领域技术人员亟需解决的问题。
基于此,现有技术确实有待于改进。
发明内容
本发明需解决的技术问题是如何高效、快速清洗掉TCO膜层。
为了解决上述问题,本发明提供一种异质结电池TCO膜的清洗方法及应用、电池片、异质结电池的制备方法,其采用的技术方案如下:
根据本发明的第一技术方案,提供了一种晶体硅/非晶硅超异质结电池 TCO膜的清洗方法,所述方法包括以下步骤:
S1、酸洗:将浓度14.00-17.00mol/L的硝酸溶液以及浓度26.00-29.00 mol/L的氢氟酸溶液以2:1的比例配置酸洗液,控制温度在22℃-26℃,往所述酸洗液注入水进行稀释后,对电池片进行酸洗,每酸洗一定量的TCO 膜后,补充一定量的酸洗液。
S2、水洗:利用22℃-26℃的纯净水对所述步骤S1酸洗后的电池片进行水洗,以清洗掉酸洗过程中的酸和酸洗后的电池片残留的TCO膜。
S3、热脱水:利用60℃-85℃的纯净水对所述步骤S2水洗后的电池片进行清洗;通过该步骤,可使得水能够保持亲水性,并且方便下一步骤的烘干。
S4、烘干:控制温度在70℃-85℃,对所述步骤S3热脱水后的电池片进行烘干。通过该步骤,清洗完成后的电池片能够快速烘干,方便收集起来。
在其中的一个优选技术方案中,所述步骤S1中,控制酸洗清洗的时间为600s-1000s。
在其中的一个优选技术方案中,所述S2中,控制水洗时间为 100s-220s。
在其中的一个优选技术方案中,所述步骤S3中,利用60℃-85℃的纯净水对所述步骤S2水洗后的电池片进行清洗,清洗时间为100s-200s。
在其中的一个优选技术方案中,所述步骤S4中,烘干时间为 450s-600s。
在其中的一个优选技术方案中,所述步骤S1中,每酸洗一定量的 TCO膜后,补充一定量的酸洗液,包括:每清洗100片电池片后自动配液 200mL氢氟酸和400mL硝酸。
在其中的一个优选技术方案中,所述步骤S2中,在水洗过程打开鼓泡增加清洁度。
根据本发明的第二技术方案,提供了一种如上任一所述的晶体硅/非晶硅超异质结电池TCO膜的清洗方法清洗得到的电池片。
根据本发明的第三技术方案,提供了一种如上任一所述的晶体硅/非晶硅超异质结电池TCO膜的清洗方法在制备高效晶体硅非晶硅超异质结电池中的应用。
根据本发明的第四技术方案,提供了一种高效晶体硅/非晶硅超异质结电池的制备方法,包括以下步骤:
对如上任一所述的晶体硅/非晶硅超异质结电池TCO膜的清洗方法清洗得到的电池片进行制绒处理,形成金字塔绒面、去除杂质离子并且对其表面进行清洁;
通过等离子体化学气相沉积制备正背面的双本征非晶硅层及掺杂非晶硅层,其中,正背面本征非晶硅厚度为12nm,P型非晶硅厚度为16nm,N 型非晶硅厚度为22nm;
通过磁控溅射方法沉积上下TCO导电膜,厚度为80-120nm;
通过丝网印刷形成正背面银金属电极,其中,主栅宽度为0.1-2mm,主栅数目为2-20,正背面银副栅线宽度为20-70um,线数为80-250;
烧结使金属与硅之间形成良好的欧姆接触。
本发明的有益效果是:本发明可以高效、快速清洗掉TCO膜层。并且通过本发明,可以解决异质结量产过程中清洗的交叉污染等问题。采用本发明清洗过后的电池片进行制备得到的电池对电性能基本没有影响。本发明可以对异质结电池在TCO制备过程中因其机器自动化偏差或者异常产生掩膜偏移、TCO镀膜色差、划伤等的电池片进行再加工处理,大大地节约资源,降低了制造成本。
具体实施方式
下面结合实施例,对本发明的具体实施方式作进一步详细描述。
实施例:
本发明实施例,以一次配液清洗8000—11000片TCO返工片为例,在清洗过程中,每次清洗100片TCO返工片。需要注意的是,本发明实施例所述的TCO返工片具体指的是异质结电池在TCO制备过程中因其机器自动化偏差或者异常产生掩膜偏移、TCO镀膜色差、划伤等制备出的不合格的电池片,该类型的电池片转换效率低而不能进入下一段工序进行生产。
通过如下步骤对TCO返工片进行清洗:
步骤S1、酸洗;酸洗槽中首先配20L和40L的浓度为16mol/L氢氟酸和27.45mol/L硝酸,然后再加入140L水,每清洗100片后需要自动配液 200mL和400mL氢氟酸和硝酸。该步骤温度为25℃,控制时间为700s。
步骤S2、水洗:水槽中配备温度25℃、体积200L的纯净水,该步骤的清洗时间为320s。
步骤S3、热脱水:热脱水槽配备温度80℃、体积200L的纯净水。
步骤S4、烘干:烘干槽设定温度85℃、烘干时间450s。
清洗完成的返工片厚度为140um左右,利用该电池片通过如下步骤进行正常的生产:
A、TCO返工片的电池片进行制绒处理,形成金字塔绒面、去除杂质离子并且对表面进行清洁;
B、通过等离子体化学气相沉积制备正背面的双本征非晶硅层及掺杂非晶硅层,正背面本征非晶硅厚度为12nm,P型非晶硅厚度为16nm,N型非晶硅厚度为22nm;
C、通过磁控溅射方法沉积上下TCO导电膜,厚度为80-120nm;
D、通过丝网印刷形成正背面银金属电极,主栅宽度为0.1-2mm,主栅数目为2-20,正背面银副栅线宽度为20-70um,线数为80-250;
E、烧结使金属与硅之间形成良好的欧姆接触;
F、测试电池的电性能。
对比例:
A、对N型厚度为170um进行制绒处理,形成金字塔绒面、去除杂质离子并且对表面进行清洁;
B、通过等离子体化学气相沉积制备正背面的双本征非晶硅层及掺杂非晶硅层,正背面本征非晶硅厚度为12nm,P型非晶硅厚度为16nm,N型非晶硅厚度为22nm;
C、通过磁控溅射方法沉积上下TCO导电膜,厚度为80-120nm;
D、通过丝网印刷形成正背面银金属电极,主栅宽度为0.1-2mm,主栅数目为2-20,正背面银副栅线宽度为20-70um,线数为80-250;
E、烧结使金属与硅之间形成良好的欧姆接触;
F、测试电池的电性能。
表1示出了根据本发明实施例以及本发明对比例制备出的电池电性能对比表。如下表1所示,可以看出:通过本发明实施例制备出的电池,其效率、电流和填充因子分别提高0.01%、0.03和0.01%,和通过合格的电池片制备出的电池基本上无差异;主要差异表现在其电压可以提高20mV,并联电阻降低200Ω。
表1.电性能对比表
Figure RE-GDA0003430810410000051
综上所述,本发明可以对异质结电池在TCO制备过程中因其机器自动化偏差或者异常产生掩膜偏移、TCO镀膜色差、划伤等的电池片进行再加工处理,大大地节约资源,降低了制造成本,真正的做到变废为宝。
以上实施方式仅用于说明本发明,而并非对本发明的限制,有关技术领域的普通技术人员,在不脱离本发明的精神和范围的情况下,还可以做出各种变化和变型,因此所有等同的技术方案也属于本发明的范畴,本发明的专利保护范围应由权利要求限定。

Claims (10)

1.一种晶体硅/非晶硅超异质结电池TCO膜的清洗方法,其特征在于,所述方法包括以下步骤:
S1、酸洗:将浓度14.00-17.00mol/L的硝酸溶液以及浓度26.00-29.00mol/L的氢氟酸溶液以2:1的比例配置酸洗液,控制温度在22℃-26℃,往所述酸洗液注入水进行稀释后,对电池片进行酸洗,每酸洗一定量的TCO膜后,补充一定量的酸洗液;
S2、水洗:利用22℃-26℃的纯净水对所述步骤S1酸洗后的电池片进行水洗,以清洗掉酸洗过程中的酸和酸洗后的电池片残留的TCO膜;
S3、热脱水:利用60℃-85℃的纯净水对所述步骤S2水洗后的电池片进行清洗;
S4、烘干:控制温度在70℃-85℃,对所述步骤S3热脱水后的电池片进行烘干。
2.如权利要求1所述的清洗方法,其特征在于,所述步骤S1中,控制酸洗清洗的时间为600s-1000s。
3.如权利要求1所述的清洗方法,其特征在于,所述S2中,控制水洗时间为100s-220s。
4.如权利要求1所述的清洗方法,其特征在于,所述步骤S3中,利用60℃-85℃的纯净水对所述步骤S2水洗后的电池片进行清洗,清洗时间为100s-200s。
5.如权利要求1所述的清洗方法,其特征在于,所述步骤S4中,烘干时间为450s-600s。
6.如权利要求1所述的清洗方法,其特征在于,所述步骤S1中,每酸洗一定量的TCO膜后,补充一定量的酸洗液,包括:
每清洗100片电池片后自动配液200mL氢氟酸和400mL硝酸。
7.如权利要求1所述的清洗方法,其特征在于,所述步骤S2中,在水洗过程打开鼓泡增加清洁度。
8.如权利要求1-7任一项所述的晶体硅/非晶硅超异质结电池TCO膜的清洗方法清洗得到的电池片。
9.如权利要求1-7任一项所述的晶体硅/非晶硅超异质结电池TCO膜的清洗方法在制备高效晶体硅非晶硅超异质结电池中的应用。
10.一种高效晶体硅/非晶硅超异质结电池的制备方法,其特征在于,包括以下步骤:
对如权利要求1-7任一项所述的晶体硅/非晶硅超异质结电池TCO膜的清洗方法清洗得到的电池片进行制绒处理,形成金字塔绒面、去除杂质离子并且对其表面进行清洁;
通过等离子体化学气相沉积制备正背面的双本征非晶硅层及掺杂非晶硅层,其中,正背面本征非晶硅厚度为12nm,P型非晶硅厚度为16nm,N型非晶硅厚度为22nm;
通过磁控溅射方法沉积上下TCO导电膜,厚度为80-120nm;
通过丝网印刷形成正背面银金属电极,其中,主栅宽度为0.1-2mm,主栅数目为2-20,正背面银副栅线宽度为20-70um,线数为80-250;
烧结使金属与硅之间形成良好的欧姆接触。
CN202111490434.0A 2021-12-08 2021-12-08 异质结电池tco膜的清洗方法及应用、电池片、异质结电池的制备方法 Active CN114188444B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111490434.0A CN114188444B (zh) 2021-12-08 2021-12-08 异质结电池tco膜的清洗方法及应用、电池片、异质结电池的制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111490434.0A CN114188444B (zh) 2021-12-08 2021-12-08 异质结电池tco膜的清洗方法及应用、电池片、异质结电池的制备方法

Publications (2)

Publication Number Publication Date
CN114188444A true CN114188444A (zh) 2022-03-15
CN114188444B CN114188444B (zh) 2023-05-16

Family

ID=80603803

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111490434.0A Active CN114188444B (zh) 2021-12-08 2021-12-08 异质结电池tco膜的清洗方法及应用、电池片、异质结电池的制备方法

Country Status (1)

Country Link
CN (1) CN114188444B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115472714A (zh) * 2022-09-05 2022-12-13 通威太阳能(安徽)有限公司 不良太阳电池返工方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01259184A (ja) * 1987-10-01 1989-10-16 Gunze Ltd 透明導電膜のエッチング方法及びその装置
JP2005228952A (ja) * 2004-02-13 2005-08-25 Canon Inc 光起電力素子用基板とその形成方法および半導体素子
CN102732254A (zh) * 2011-04-11 2012-10-17 关东化学株式会社 透明导电膜用蚀刻液组合物
CN103390686A (zh) * 2012-05-07 2013-11-13 吉富新能源科技(上海)有限公司 一种酸性溶液清洁异质结单晶硅薄膜太阳能电池
CN103390687A (zh) * 2012-05-10 2013-11-13 吉富新能源科技(上海)有限公司 一种化学抛光法制作异质结单晶硅薄膜太阳能电池
CN109950132A (zh) * 2019-03-01 2019-06-28 晋能光伏技术有限责任公司 一种管式pecvd设备双面沉积太阳能电池非晶硅层的方法
CN111900232A (zh) * 2020-08-03 2020-11-06 中威新能源(成都)有限公司 一种shj电池生产中不良返工方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01259184A (ja) * 1987-10-01 1989-10-16 Gunze Ltd 透明導電膜のエッチング方法及びその装置
JP2005228952A (ja) * 2004-02-13 2005-08-25 Canon Inc 光起電力素子用基板とその形成方法および半導体素子
CN102732254A (zh) * 2011-04-11 2012-10-17 关东化学株式会社 透明导电膜用蚀刻液组合物
CN103390686A (zh) * 2012-05-07 2013-11-13 吉富新能源科技(上海)有限公司 一种酸性溶液清洁异质结单晶硅薄膜太阳能电池
CN103390687A (zh) * 2012-05-10 2013-11-13 吉富新能源科技(上海)有限公司 一种化学抛光法制作异质结单晶硅薄膜太阳能电池
CN109950132A (zh) * 2019-03-01 2019-06-28 晋能光伏技术有限责任公司 一种管式pecvd设备双面沉积太阳能电池非晶硅层的方法
CN111900232A (zh) * 2020-08-03 2020-11-06 中威新能源(成都)有限公司 一种shj电池生产中不良返工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115472714A (zh) * 2022-09-05 2022-12-13 通威太阳能(安徽)有限公司 不良太阳电池返工方法

Also Published As

Publication number Publication date
CN114188444B (zh) 2023-05-16

Similar Documents

Publication Publication Date Title
CN102115915B (zh) 一种单晶硅制绒添加剂以及单晶硅制绒工艺
CN110993700A (zh) 一种异质结太阳电池及其制备工艺
CN112542531B (zh) 一种硅片预处理及异质结电池制备方法
CN111403503A (zh) 一种具有圆角金字塔结构的单晶硅片及制备方法
CN111668345A (zh) 一种太阳能电池及其制备方法
WO2022033004A1 (zh) 一种单晶硅片的单面制绒工艺及太阳能电池片的制备方法
CN114551636A (zh) 一种高效异质结太阳能电池及制备方法
CN216749927U (zh) 异质结电池不良品的返工处理系统
CN112466990A (zh) 一种高效异质结太阳能电池的制备工艺
CN109473487B (zh) 基于复合陷光结构的晶体硅太阳电池及其制备方法
CN103606595B (zh) 烧结后不合格单晶硅电池片的再利用及其栅线回收方法
CN111710748A (zh) 一种用热处理的n型单晶硅片制作shj太阳电池的方法
CN113113510A (zh) 一种p型双面perc太阳电池及其制备方法和应用
CN114188444A (zh) 异质结电池tco膜的清洗方法及应用、电池片、异质结电池的制备方法
WO2012162905A1 (zh) 背接触晶体硅太阳能电池片制造方法
CN113130712A (zh) 一种太阳能电池及其制备方法
CN105529380A (zh) 一种背面抛光的单晶硅太阳能电池片制备方法
CN112382678A (zh) 一种铸造单晶硅异质结太阳电池的制备方法
WO2024045595A1 (zh) 太阳电池及其制备方法
CN104393104A (zh) 一种用于hit太阳电池织构的处理技术
CN116469948A (zh) 一种TOPCon电池及其制备方法
CN113889551B (zh) 光伏电池印刷不良片的回收方法及返工方法
CN113013293A (zh) 一种异质结电池的制备方法
CN221057443U (zh) 一种单面钝化接触异质结电池及光伏组件
CN206697494U (zh) 一种太阳能电池板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant