CN114184933A - Backflow ground hole detection method, system, device and computer readable storage medium - Google Patents
Backflow ground hole detection method, system, device and computer readable storage medium Download PDFInfo
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Abstract
The application discloses a backflow ground hole detection method, a system, a device and a computer readable storage medium, which are applied to a processor, wherein the backflow ground hole detection method comprises the following steps: identifying a signal to be detected with a layer changing through hole on a PCB; performing a detection operation on each signal to be detected, the detection operation comprising: determining the design distance between the layer changing via hole and the backflow ground hole according to the impedance value of the layer changing via hole of the signal to be detected, identifying the backflow ground hole within the design distance by taking the layer changing via hole as the center, and judging the signal to be detected as a target signal to be detected with unqualified design of the backflow ground hole if the backflow ground hole is not identified or the identified backflow ground hole is abnormal; and outputting the information of the target signal to be measured. The problem of missing detection and error detection of manual detection is solved fundamentally, the comprehensiveness of detecting coverage is guaranteed, the design quality of a backflow ground hole in a signal layer changing position on a PCB is guaranteed, the checking workload of designers is reduced, the detection efficiency is improved, and the detection is more reliable.
Description
Technical Field
The present disclosure relates to the field of PCB design, and more particularly, to a method, a system, a device and a computer readable storage medium for detecting a reflow hole.
Background
In the field of server system interconnection PCB (Printed Circuit Board) design, as signal rates become faster and faster, the requirements for signal integrity become higher and higher. The signal transmission path is composed of a signal current path and a return current path, and any factor influencing the signal current path or the return current path influences the impedance of the signal, so that the signal is distorted, and the integrity of the signal is seriously damaged. Therefore, the return path is also routed at the same time as the signal path on the PCB board is routed. At present, a method for designing a return path at a high-speed signal layer change position on a PCB is to add a backflow ground hole with the same attribute as that of a reference layer at a high-speed signal layer change through hole position, so that the same network attribute of the reference layer before and after layer change can ensure that the impedance of the whole signal is matched.
And no backflow ground hole is arranged at the position of the high-speed signal layer changing, or the attribute of the backflow ground hole is lost, so that the backflow path of the signal returns around a far ground searching path, the signal path is not matched with the return path of the signal path, impedance mutation is caused, reflection is caused, and the problems of signal distortion, data loss and the like are caused. For guaranteeing PCB board design quality, usually after PCB board design is accomplished, quality testing person all can carry out artifical inspection to the backward flow geosyncline of high-speed signal, prevents that high-speed signal trades layer department and does not set up the backward flow geosyncline, perhaps backward flow geosyncline attribute from losing, because artifical visual inspection degree of difficulty is big and hardly guarantee the comprehensiveness that the inspection covered, and efficiency is extremely low, can't guarantee product signal design quality.
Therefore, how to provide a solution to the above technical problem is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The application aims to provide a backflow ground hole detection method, a backflow ground hole detection system, a backflow ground hole detection device and a computer readable storage medium, so that the problem of missed detection and wrong detection of manual detection is fundamentally solved, the comprehensiveness of inspection coverage is ensured, the design quality of a backflow ground hole at a signal layer changing position on a PCB is ensured, the inspection workload of designers is reduced, the detection efficiency is improved, and the method is more reliable.
In order to solve the above technical problem, the present application provides a backflow ground hole detection method, which is applied to a processor, and the backflow ground hole detection method includes:
identifying a signal to be detected with a layer changing through hole on a PCB;
performing a detection operation on each signal to be detected, wherein the detection operation comprises: determining the design distance between the layer changing via hole and the backflow ground hole according to the impedance value of the layer changing via hole of the signal to be detected, identifying the backflow ground hole within the design distance by taking the layer changing via hole as the center, and judging the signal to be detected to be a target signal to be detected with unqualified backflow ground hole design if the backflow ground hole is not identified or the identified backflow ground hole is abnormal;
and outputting the information of the target signal to be detected.
Optionally, the process of identifying the to-be-detected signal with the layer-changing via hole on the PCB includes:
identifying a high-speed differential signal from all signals on the PCB according to the signal name;
and extracting layer changing via hole information of each high-speed differential signal, and identifying the to-be-detected signal with the layer changing via hole on the PCB according to the layer changing via hole information.
Optionally, the detecting operation further includes:
determining the spacing of the layer changing through holes based on the coordinate information of the layer changing through holes of the signal to be detected;
and determining the impedance value of the layer-changing through hole according to the distance.
Optionally, the process of outputting the information of the target signal to be measured includes:
and outputting the signal name of the target signal to be detected and the coordinate information of the layer-changing through hole.
Optionally, the backflow hole abnormality includes an attribute abnormality of the backflow hole and/or a punching mode abnormality of the backflow hole.
Optionally, the method for detecting a backflow hole further includes:
judging whether the attribute of the backflow ground hole is GND attribute;
if not, judging that the attributes of the backflow holes are abnormal.
Optionally, the method for detecting a backflow hole further includes:
acquiring coordinate information of the backflow ground hole;
judging the actual punching mode of the backflow ground hole according to the coordinate information;
judging whether the actual punching mode is any preset punching mode or not;
if not, judging that the punching mode of the backflow holes is abnormal.
In order to solve the above technical problem, the present application further provides a backflow ground hole detection system, which is applied to a processor, and the backflow ground hole detection system includes:
the identification module is used for identifying a signal to be detected with a layer changing through hole on the PCB;
a detection module, configured to perform a detection operation on each signal to be detected, where the detection operation includes: determining the design distance between the layer changing via hole and the backflow ground hole according to the impedance value of the layer changing via hole of the signal to be detected, identifying the backflow ground hole within the design distance by taking the layer changing via hole as the center, and judging the signal to be detected to be a target signal to be detected with unqualified backflow ground hole design if the backflow ground hole is not identified or the identified backflow ground hole is abnormal;
and the output module is used for outputting the information of the target signal to be detected.
In order to solve the above technical problem, the present application further provides a backflow ground hole detection device, including:
a memory for storing a computer program;
a processor for implementing the steps of the reflow earth hole detection method as described in any one of the above when executing the computer program.
To solve the above technical problem, the present application further provides a computer-readable storage medium, having a computer program stored thereon, where the computer program is executed by a processor to implement the steps of the reflow ground hole detection method according to any one of the above items.
The application provides a backflow ground hole detection method, considering that a backflow ground hole exists at a layer changing via hole, identifying a signal to be detected with the layer changing via hole on a PCB through a processor, then determining the design range of the backflow ground hole relative to the layer changing via hole according to the impedance value of the layer changing via hole, identifying whether the backflow ground hole is designed and whether the backflow ground hole is qualified or not in the design range, outputting the information of a target signal to be detected with unqualified backflow ground hole design, so that an engineer modifies the information, fundamentally solving the problem of missed detection and false detection of manual detection, ensuring the comprehensiveness of inspection coverage, ensuring the design quality of the backflow ground hole at the signal layer changing position on the PCB, reducing the inspection workload of designers, improving the detection efficiency and being more reliable. The application also provides a backflow ground hole detection system, a backflow ground hole detection device and a computer readable storage medium, and the backflow ground hole detection system, the backflow ground hole detection device and the computer readable storage medium have the same beneficial effects as the backflow ground hole detection method.
Drawings
In order to more clearly illustrate the embodiments of the present application, the drawings needed for the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
FIG. 1 is a flow chart illustrating steps of a method for detecting a backflow hole provided in the present application;
fig. 2 is a schematic view illustrating a drilling manner of a horizontal via hole for layer change according to the present disclosure;
fig. 3 is a schematic view illustrating a punching manner of a vertical layer-changing via hole provided in the present application;
FIG. 4 is a schematic view of a horizontal type reflow hole drilling method provided in the present application;
FIG. 5 is a schematic diagram illustrating a vertical-type hole punching method for a reflow soldering site according to the present disclosure;
FIG. 6 is a schematic view of another horizontal-type hole-punching method for reflow according to the present application;
FIG. 7 is a schematic view of another vertical reflow hole drilling method provided in the present application;
FIG. 8 is a flow chart illustrating steps of another method for detecting backflow holes provided herein;
fig. 9 is a schematic structural diagram of a backflow ground hole detection system provided in the present application.
Detailed Description
The core of the application is to provide a backflow ground hole detection method, a system, a device and a computer readable storage medium, which fundamentally solve the problem of missed detection and false detection of manual detection, ensure the comprehensiveness of inspection coverage, ensure the design quality of the backflow ground hole at a signal layer change position on a PCB, reduce the inspection workload of designers, improve the detection efficiency and are more reliable.
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a flowchart illustrating steps of a reflow hole inspection method provided in the present application, the reflow hole inspection method includes:
s101: identifying a signal to be detected with a layer changing through hole on a PCB;
it can be understood that there are multiple types of signals on the PCB, and the signal to be tested in this embodiment specifically refers to a high-speed differential signal on the PCB, and considering that the names of the differential signals in the industry are all ended by _ DP/_ DN and appear in pairs, therefore, the high-speed differential signal can be identified from all signals of the PCB according to the signal name, then layer-changing via hole information of the high-speed differential signal is extracted in all the high-speed differential signals through traversing in the allergo secondary development language, and the high-speed differential signal with the layer-changing via hole is screened out as the signal to be tested in this step according to the layer-changing via hole information. Of course, other languages may be used to traverse and extract the layer-change via information of the high-speed differential signal, and this embodiment is not limited in this embodiment.
S102: performing a detection operation on each signal to be detected, the detection operation comprising: determining the design distance between the layer changing via hole and the backflow ground hole according to the impedance value of the layer changing via hole of the signal to be detected, identifying the backflow ground hole within the design distance by taking the layer changing via hole as the center, and judging the signal to be detected as a target signal to be detected with unqualified design of the backflow ground hole if the backflow ground hole is not identified or the identified backflow ground hole is abnormal;
specifically, considering that there may be a plurality of signals to be detected on the PCB, the detection operation may be sequentially performed on each signal to be detected. In the following, the operation of detecting one signal to be detected is taken as an example, and the detection operations of all other signals to be detected are similar.
It can be understood that a certain corresponding relationship exists between the impedance value of the layer-changing via hole and the design distance of the backflow ground hole relative to the layer-changing via hole, and therefore, after the impedance value of the layer-changing via hole is determined, the design range of the backflow ground hole can be known, the design distance is taken as a radius by taking the layer-changing via hole as a center, whether the backflow ground hole exists in the design range is identified, if the backflow ground hole does not exist, it is determined that the backflow ground hole is not designed at the layer-changing position of the high-speed differential signal, the backflow ground hole of the signal to be detected is unqualified in design, and if the backflow ground hole is identified, but the identified backflow ground hole is abnormal, it is also determined that the backflow ground hole of the signal to be detected is unqualified in design, and the signal to be detected is determined as the target signal to be detected. When the design of the backflow ground hole is judged, the design distance of the backflow ground hole relative to the layer changing ground hole is considered, the impedance value of the layer changing via hole is also comprehensively considered, and the problems that the impedance mismatch causes signal distortion and the like are avoided.
S103: and outputting the information of the target signal to be measured.
Specifically, in this step, after the detection operation is performed on all signals to be detected on the PCB once, information of all target signals to be detected may be output, or information of a target signal to be detected may be output after a target signal to be detected is obtained. The information of the target signal to be tested includes, but is not limited to, the signal name of the output target signal to be tested and the coordinate information of the layer-change via hole thereof, so as to be conveniently viewed by a designer.
It can be seen that, in this embodiment, considering that there is a backflow ground hole at the layer change via hole, the processor identifies the signal to be detected having the layer change via hole on the PCB, and then determines the design range of the backflow ground hole relative to the layer change via hole according to the impedance value of the layer change via hole, identifies whether there is a backflow ground hole in the design range and whether the backflow ground hole is qualified in design, and outputs the information of the target signal to be detected that the backflow ground hole is unqualified in design, so that an engineer modifies the target signal to be detected, thereby fundamentally solving the problem of missed detection and false detection of manual detection, ensuring the comprehensiveness of inspection coverage, ensuring the design quality of the backflow ground hole at the signal layer change location on the PCB, reducing the inspection workload of the designer, improving the detection efficiency, and being more reliable.
On the basis of the above-described embodiment:
as an alternative embodiment, the detecting operation further comprises:
determining the spacing of the layer changing through holes based on the coordinate information of the layer changing through holes of the signal to be detected;
and determining the impedance value of the layer-changing through hole according to the distance.
Specifically, coordinate information of the layer-change via holes is obtained, as shown in fig. 2, M1 and M2 are layer-change via holes of the signal to be measured, coordinate information of M1 is (X1, Y1), coordinate information of M2 is (X2, Y2), and a pitch of the layer-change via holes is | X2-X1 |. In the current server design field, the differential impedance value on the PCB is specific, which may be generally 85ohm or 100ohm, according to the requirement of the PCB, there is a certain corresponding relationship between the impedance value of the high-speed differential signal and the pitch of the layer-change via holes, in the server field, the pitch of the layer-change via holes corresponding to 85ohm is generally designed to be 36mil, and the pitch of the layer-change via holes corresponding to 100ohm is generally designed to be 40mil, of course, the above values are only exemplified. High-speed differential signals on a PCB card may have different impedance values and corresponding different pitches of the layer-change vias, and generally, the pitch of the layer-change vias corresponding to low-value impedance is necessarily smaller than the pitch of the layer-change vias corresponding to high-value impedance.
After the pitch of the layer-changing via holes is determined, the impedance value matched with the pitch is used as the impedance value of the layer-changing via holes, for example, if | X2-X1| is calculated to be 36mil, the matched impedance value is 85ohm, if no impedance value corresponding to the pitch is found, the layer-changing via hole design is abnormal, and related prompt information can be output.
It can be understood that, for the via holes with different impedance values, there are different requirements for the design distance of the reflow ground via relative to the via holes, for example, the high-speed differential signal category is divided by the impedance value, and assuming that the high-speed differential signal category a and the high-speed differential signal category B are included, the distance between the via holes with the high-speed differential signal category a is set to a1, the distance between the reflow ground via and the via holes with the high-speed differential signal category B is set to a2, the distance between the via holes with the high-speed differential signal category B is set to B1, and the distance between the reflow ground via and the via holes with the high-speed differential signal category B is set to B2, and certainly, in addition to including the category A, B, the category N may also be included, and the corresponding distances N1 and N2 are correspondingly set. Obtaining the value of the actual distance | X2-X1| of the via holes in the switching layers, judging | X2-X1| -A1 or | X2-X1| -B1, if | X2-X1| -A1, indicating that the impedance corresponding to the via holes in the switching layers is A, thereby determining that the design distance of the via holes in the reflow layer relative to the via holes in the switching layers is A2, and if | X2-X1| -B1, indicating that the impedance corresponding to the via holes in the switching layers is B, thereby determining that the design distance of the via holes in the reflow layer relative to the via holes in the switching layers is B2. And (3) acquiring the impedance (such as A) of the signal to be detected and the design distance (such as A2) of the backflow ground hole according to the steps, and identifying the backflow ground hole in the corresponding specific distance value (such as A2) range space by taking the center coordinate of the layer-changing via hole as the center of a circle. And if only 1 backflow ground hole is inquired in the inquiry range of the two layer-changing through holes, judging that the design of the backflow ground hole is abnormal. If 1 backflow ground hole is inquired in the inquiry range of the two layer-changing via holes and the two backflow ground holes are not the same via hole (different coordinates), judging whether the design of the two backflow ground holes is abnormal or not, wherein the abnormal backflow ground holes comprise abnormal attributes of the backflow ground holes and/or abnormal punching modes of the backflow ground holes.
Specifically, the punching rules of the high-speed differential signal layer change and the backflow holes on the PCB in the prior art are summarized through analysis, the following information is summarized, the backflow holes at the high-speed signal layer change are all in pairs, and the high-speed signal punching generally has two modes, as shown in fig. 2 and 3, fig. 2 is a horizontal punching mode, and fig. 3 is a vertical punching mode, on the basis, 5 punching modes are shown in fig. 4 for the backflow holes in the horizontal punching mode, and 5 punching modes are shown in fig. 5 for the vertical punching mode.
Specifically, in the first punching manner, the return ground holes appear in pairs inside the layer-change via holes of the high-speed differential signal, as shown in fig. 5 as a and b; in the second punching mode, reflow holes are formed in pairs in parallel in the high-speed signal layer-changing through holes, such as c and d in fig. 5; in the third punching mode, the reflow holes appear in pairs outside the high-speed signal layer-changing through hole, as shown in e and f in fig. 5; in the fourth punching mode, the backflow holes are respectively arranged in pairs in a left-oblique mode on the inner side and the outer side of the high-speed signal layer-changing through hole, such as a and f in fig. 5; in the fifth punching mode, the return holes are respectively arranged in pairs in a right-oblique mode on the inner side and the outer side of the high-speed signal layer-changing through hole, as shown in b and e in fig. 5.
If 1 backward flow ground hole is all inquired in the inquiry scope of two trading layer via holes, judge this moment whether the actual mode of punching of these two backward flow ground holes satisfies above-mentioned arbitrary one and predetermine the mode of punching, if satisfy, then judge that backward flow ground hole design is qualified, if unsatisfied, then judge that the mode of punching of backward flow ground hole is unusual. Specifically, the coordinates of the layer change via holes are extracted, and it is determined whether the punching mode of the layer change via holes is a vertical type or a horizontal type, and as shown in fig. 2 and 3, it is determined that the layer change via holes are horizontal type when the ordinate of the layer change via holes is subtracted by zero, that is, Y1-Y2 is 0, and it is determined that the layer change via holes are vertical type when the abscissa of the layer change via holes is subtracted by zero, that is, X3-X4 is 0. If the punching mode of the layer changing through hole is a horizontal type, whether the actual punching mode of the backflow ground hole meets any one preset punching mode shown in the figure 4 is judged, and if the punching mode of the layer changing through hole is a vertical type, whether the actual punching mode of the backflow ground hole meets any one preset punching mode shown in the figure 5 is judged.
The two identified return holes necessarily appear in the dashed lines of fig. 6 for the horizontal perforation pattern shown in fig. 4 and in a left-right pair, and in the dashed lines of fig. 7 for the vertical perforation pattern shown in fig. 5 and in a top-bottom pair.
The coordinate information of the reflow holes in the vertical punching mode is respectively marked as (X5, Y5),
(X6, Y6); the coordinate information of the reflow hole in the horizontal punching mode is marked as (X7, Y7) left, (X8, Y8) right; besides the 2 nd punching mode, other punching modes of the reflow holes can be similar to the layer changing holes to form right-angled triangles, so that the following results can be obtained:
for the vertical type:
in the case of X5-X6 ═ 0:
if X5-X4 is 0, corresponding to the second punching mode;
if | X5-X4-2+|Y5-Y4|2＝AN 2In the present embodiment, A is used corresponding to the first punching method or the third punching methodNRepresents the linear distance of the reflow via from the re-level via, as described above as a 2;
in the case of X5-X6 ≠ 0:
if | X5-X4-2+|Y5-Y4|2＝AN 2And | X6-X3-2+|Y6-Y3|2＝AN 2The method corresponds to the fourth puncturing method or the fifth puncturing method.
For the horizontal type:
in the case where Y7-Y8 ═ 0:
if Y7-Y1 is 0, corresponding to the second punching mode;
if | X7-X1-2+|Y7-Y1|2＝AN 2Corresponding to the first punching mode or the third punching mode;
in the case of Y7-Y8 ≠ 0:
if | X7-X1-2+|Y7-Y1|2＝AN 2And | X8-X2-2+|Y8-Y2|2＝AN 2And the time is corresponding to the fourth punching mode or the fifth punching mode.
And taking the signal to be detected which does not meet the preset punching mode as a target signal to be detected, then continuously acquiring the attribute of the backflow ground hole in the signal to be detected which meets one of the 5 punching modes, judging the signal to be detected to be qualified if the attributes are GND, otherwise taking the signal to be detected which does not meet the attributes as the target signal to be detected, and outputting the information of the target signal to be detected to a final report.
In summary, referring to fig. 8, fig. 8 is a flowchart illustrating steps of a preferred backflow ground hole detection method provided in the present application, where the backflow ground hole detection method includes:
s201: identifying a high-speed differential signal on the PCB, judging whether the high-speed differential signal has a layer-changing via hole, if so, executing S202, and if not, repeating the step;
s202: distinguishing a punching mode of the layer changing through hole;
s203: calculating the distance between the layer-changing through holes, and performing impedance matching according to the distance to determine the design distance of the backflow ground hole;
s204: judging whether two through holes exist in the design range of the backflow ground hole, if so, executing S205, and if not, executing S208;
s205: judging whether the two through holes are in 5 types of reflow ground hole patterns, if so, executing S206, and if not, executing S208;
s206: judging whether the two through holes are both GND attributes, if so, executing S207, and if not, executing S208;
s207: judging that the design of the backflow ground hole of the high-speed differential signal is qualified;
s208: and outputting the report.
The method for automatically detecting the signal reflow ground via hole on the PCB provided by the embodiment is different from the traditional manual detection, a software program is operated to achieve automatic detection, the impedance which the PCB should belong to is automatically calculated and matched according to the information of the high-speed signal layer-changing via hole of the PCB, the design range of the reflow ground hole which the PCB should belong to is automatically matched according to the impedance value, the reflow ground hole is automatically identified in the corresponding design range, whether the actual punching mode of the identified reflow ground hole meets the preset punching mode or not is judged, signals which do not meet the design requirements are eliminated, finally, whether the via hole attribute is the GND attribute or not is automatically detected in the signals which meet the requirements, the signals which do not meet the requirements are eliminated again, and finally, all the signals which do not meet the requirements are collected and output to report so as to be modified. The full-automatic detection is realized, the phenomenon that the number and the attribute of GND (ground) via holes along with the high-speed signal layer change via holes on the PCB are lost is avoided, and the problems that the detection quality is difficult to ensure and the efficiency is low in manual detection are solved.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a backflow ground hole detection system applied to a processor, the backflow ground hole detection system including:
the identification module 1 is used for identifying a signal to be detected with a layer-changing through hole on the PCB;
the detection module 2 is configured to perform a detection operation on each signal to be detected, where the detection operation includes: determining the design distance between the layer changing via hole and the backflow ground hole according to the impedance value of the layer changing via hole of the signal to be detected, identifying the backflow ground hole within the design distance by taking the layer changing via hole as the center, and judging the signal to be detected as a target signal to be detected with unqualified design of the backflow ground hole if the backflow ground hole is not identified or the identified backflow ground hole is abnormal;
and the output module 3 is used for outputting the information of the target signal to be detected.
It can be seen that, in this embodiment, considering that there is a backflow ground hole at the layer change via hole, the processor identifies the signal to be detected having the layer change via hole on the PCB, and then determines the design range of the backflow ground hole relative to the layer change via hole according to the impedance value of the layer change via hole, identifies whether there is a backflow ground hole in the design range and whether the backflow ground hole is qualified in design, and outputs the information of the target signal to be detected that the backflow ground hole is unqualified in design, so that an engineer modifies the target signal to be detected, thereby fundamentally solving the problem of missed detection and false detection of manual detection, ensuring the comprehensiveness of inspection coverage, ensuring the design quality of the backflow ground hole at the signal layer change location on the PCB, reducing the inspection workload of the designer, improving the detection efficiency, and being more reliable.
As an alternative embodiment, the process of identifying a signal to be tested having a via hole for layer change on a PCB includes:
identifying a high-speed differential signal from all signals on the PCB according to the signal name;
and extracting layer changing via hole information of each high-speed differential signal, and identifying the to-be-detected signal with the layer changing via hole on the PCB according to the layer changing via hole information.
As an alternative embodiment, the detecting operation further comprises:
determining the spacing of the layer changing through holes based on the coordinate information of the layer changing through holes of the signal to be detected;
and determining the impedance value of the layer-changing through hole according to the distance.
As an alternative embodiment, the process of outputting the information of the target signal under test includes:
and outputting the signal name of the target signal to be detected and the coordinate information of the layer-changing through hole.
As an alternative embodiment, the reflow earth hole abnormality includes an attribute abnormality of the reflow earth hole and/or a punching mode abnormality of the reflow earth hole.
As an alternative embodiment, the detection module 2 is further configured to:
judging whether the attribute of the backflow ground hole is GND attribute;
if not, judging that the attribute of the backflow holes is abnormal.
As an alternative embodiment, the detection module 2 is further configured to:
acquiring coordinate information of a backflow ground hole;
judging the actual punching mode of the backflow ground hole according to the coordinate information;
judging whether the actual punching mode is any preset punching mode or not;
if not, judging that the punching mode of the backflow holes is abnormal.
On the other hand, this application still provides a backward flow ground hole detection device, includes:
a memory for storing a computer program;
a processor for implementing the steps of the reflow ground hole detection method as described in any one of the above embodiments when executing the computer program.
Please refer to the above embodiments for the introduction of a backflow ground hole detection device provided in the present application, which is not described herein again.
The backflow ground hole detection device has the same beneficial effect as the backflow ground hole detection method.
In another aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the steps of the reflow ground hole detection method as described in any one of the above embodiments.
For the introduction of a computer-readable storage medium provided in the present application, please refer to the above embodiments, which are not described herein again.
The computer-readable storage medium provided by the application has the same beneficial effects as the reflow ground hole detection method.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A backflow hole detection method is applied to a processor and comprises the following steps:
identifying a signal to be detected with a layer changing through hole on a PCB;
performing a detection operation on each signal to be detected, wherein the detection operation comprises: determining the design distance between the layer changing via hole and the backflow ground hole according to the impedance value of the layer changing via hole of the signal to be detected, identifying the backflow ground hole within the design distance by taking the layer changing via hole as the center, and judging the signal to be detected to be a target signal to be detected with unqualified backflow ground hole design if the backflow ground hole is not identified or the identified backflow ground hole is abnormal;
and outputting the information of the target signal to be detected.
2. The method for detecting the reflow ground hole according to claim 1, wherein the process of identifying the signal to be detected with the layer-changing via hole on the PCB board comprises:
identifying a high-speed differential signal from all signals on the PCB according to the signal name;
and extracting layer changing via hole information of each high-speed differential signal, and identifying the to-be-detected signal with the layer changing via hole on the PCB according to the layer changing via hole information.
3. The method of claim 1, wherein the detecting operation further comprises:
determining the spacing of the layer changing through holes based on the coordinate information of the layer changing through holes of the signal to be detected;
and determining the impedance value of the layer-changing through hole according to the distance.
4. The method according to claim 1, wherein the outputting the information of the target signal under test comprises:
and outputting the signal name of the target signal to be detected and the coordinate information of the layer-changing through hole.
5. The return ground hole detection method according to any one of claims 1 to 4, wherein the return ground hole abnormality includes an attribute abnormality of the return ground hole and/or a punching mode abnormality of the return ground hole.
6. The method of claim 5, further comprising:
judging whether the attribute of the backflow ground hole is GND attribute;
if not, judging that the attributes of the backflow holes are abnormal.
7. The method of claim 5, further comprising:
acquiring coordinate information of the backflow ground hole;
judging the actual punching mode of the backflow ground hole according to the coordinate information;
judging whether the actual punching mode is any preset punching mode or not;
if not, judging that the punching mode of the backflow holes is abnormal.
8. A return ground hole detection system, applied to a processor, comprising:
the identification module is used for identifying a signal to be detected with a layer changing through hole on the PCB;
a detection module, configured to perform a detection operation on each signal to be detected, where the detection operation includes: determining the design distance between the layer changing via hole and the backflow ground hole according to the impedance value of the layer changing via hole of the signal to be detected, identifying the backflow ground hole within the design distance by taking the layer changing via hole as the center, and judging the signal to be detected to be a target signal to be detected with unqualified backflow ground hole design if the backflow ground hole is not identified or the identified backflow ground hole is abnormal;
and the output module is used for outputting the information of the target signal to be detected.
9. A backflow ground hole detection device, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the reflow ground hole detection method according to any one of claims 1-7 when executing the computer program.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program which, when being executed by a processor, carries out the steps of the reflow ground hole detection method according to any one of claims 1 to 7.
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| CN114184933B (en) | 2024-04-05 |
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