CN112066934B - Method for checking intersection or heavy hole problem of via hole discs on same layer of PCB - Google Patents
Method for checking intersection or heavy hole problem of via hole discs on same layer of PCB Download PDFInfo
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- CN112066934B CN112066934B CN202010975722.4A CN202010975722A CN112066934B CN 112066934 B CN112066934 B CN 112066934B CN 202010975722 A CN202010975722 A CN 202010975722A CN 112066934 B CN112066934 B CN 112066934B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/16—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
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Abstract
The invention discloses a method for checking the intersection or heavy hole problem of via hole discs on the same layer of a PCB (printed circuit board). an auxiliary tool acquires via hole elements in all layers of a PCB file, sets a square frame with the side length of 100 mils by taking the via hole elements as the center, compares the distance between the via hole elements and the via hole elements in the square frame with a set value after measurement, thereby judging whether the problem that the via hole discs on the same layer of the PCB intersect exists or not, can quickly position the via hole position with the intersection problem, outputs a check result report, greatly facilitates designers to quickly and accurately lock the problematic via hole, facilitates the subsequent check and modification work, improves the design work efficiency, reduces the workload of the designers, simultaneously ensures the design quality of the PCB, and improves the yield of products.
Description
Technical Field
The invention relates to the technical field of PCB design, in particular to a method for checking the intersection or heavy hole problem of via hole discs on the same layer of a PCB.
Background
HDI is the abbreviation of High Density interconnection (High Density interconnect), for the technique of production printed circuit board (PCB board), HDI board adopts the parallelly connected design of modularization, adopts full digital signal processing technique and little blind buried via technique, designs into the circuit board that line distribution Density is higher, and HDI board possesses full range adaptive load ability and stronger short-time overload ability, can not consider load power factor and crest factor, is the compact product that a special small capacity product designed.
In the design process of a high-density HDI board, due to the fact that a large number of blind buried holes are adopted, when wiring punching and layer changing are conducted, several blind buried holes in the vertical direction need to be connected, wiring on a single board is dense, the distance between two network via holes of the same name is short, intersection errors easily occur, the problem that whether the crossed via holes are the blind buried holes or the via holes are short-circuited cannot be correctly judged through CAM or VALOR inspection, in the condition, manual screening inspection is still needed, workload of designers is increased, inspection efficiency is low, accuracy cannot be guaranteed, efficiency cannot be improved, final product quality cannot be guaranteed, machine screening inspection needs to be conducted in the design process, working strength of the designers is reduced, and accuracy of designed products is improved.
The ALLEGRO software is one of mainstream software for designing the PCB at present, has a good interactive working interface and powerful and complete functions, and provides a good platform for designing a high-speed, high-density and multi-layer complex PCB.
The above disadvantages need to be improved.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a method for checking the intersection or heavy hole problem of the via hole discs on the same layer of the PCB.
The technical scheme of the invention is as follows:
a method for checking intersection or heavy hole problems of via discs on the same layer of a PCB board includes the steps of registering auxiliary tool commands in ALLEGRO software, and creating command windows of the auxiliary tools, wherein the auxiliary tools are checked by the following steps:
s1, obtaining information containing pad elements from a PCB file, screening the information containing the pad elements to obtain information of via hole elements, and recording the via hole elements to a first list;
s2, acquiring the via hole elements of the first list according to requirements, dividing a square selected area by taking the coordinates of the acquired via hole elements as a reference, picking up the coordinate information of the selected area and recording the coordinate information into a second list;
s3, circularly measuring the space and the disk alignment gap between the via hole elements in the first list and the via hole elements in the second list, and recording the via hole elements in the first list and the via hole elements in the second list, of which the measurement results meet the intersection or superposition conditions of the via hole elements, in a third list;
in step S3, the assistant tool measures the center-to-center spacing between the via elements of the first list and the via elements of the second list and records it as a first feedback value, the assistant tool measures the disc-to-disc gap between the via elements of the first list and the via elements of the second list and records it as a second feedback value,
when the first feedback value is not zero and the second feedback value is true, the two via holes are intersected, and the second feedback value is a chord length value of the intersection of the two via holes;
when the first feedback value is not zero and the second feedback value is false, the two via holes do not intersect;
when the first feedback value is zero and the second feedback value is false, the two via holes are coincident without intersecting chord length values,
and when the two through holes are intersected or overlapped, the corresponding through hole elements of the first list and the corresponding through hole elements of the second list are recorded into the third list.
The method for checking the intersection or heavy hole problem of the via hole discs on the same layer of the PCB comprises the following steps:
condition K1: the distance between the via hole elements in the first list and the via hole elements in the second list is smaller than or equal to a set value;
or the like, or, alternatively,
condition K2: a spacing between the via elements in the first list and the via elements in the second list is not zero, and a antipad clearance between the via elements in the first list and the via elements in the second list is a true value;
or the like, or, alternatively,
condition K3: the spacing between the via elements in the first list and the via elements in the second list is equal to zero, and the antipad clearance between the via elements in the first list and the via elements in the second list is a false value.
Further, the assistant tool sets a setting value field, and in step S2, the assistant tool reads a value in the setting value field and writes the setting value.
In step S1, the auxiliary tool opens the allowed routing layer, the top via layer, the bottom via layer, the top pin layer, and the bottom pin layer of the PCB file, and obtains all via element information and pin via element information in the current layer by layer.
According to the method for checking the intersection or heavy hole problem of the via hole discs on the same layer of the PCB, the auxiliary tool is provided with a plurality of selection items, the selection items are provided with initial values, the auxiliary tool generates feedback values according to the comparison between the existing values of the selection items and the initial values, the auxiliary tool judges whether the selection items are in a selection state or not according to the feedback values, and the auxiliary tool acquires the center coordinates of the corresponding via hole elements of the selection items according to the selection state.
According to the method for checking the intersection or heavy hole problem of the via hole discs on the same layer of the PCB, the elements containing the bonding pads comprise the via hole elements and the pin elements, and the auxiliary tool obtains the via hole elements by removing the surface-mounted parts and judging whether the via hole elements are through holes or not.
In the method for checking the intersection or heavy hole problem of the via hole trays in the same layer of the PCB, the auxiliary tool sets a display list and an output button, displays the via hole elements in the third list in the display list according to a set format after step S3, and generates an independent file after receiving a command of the output button.
In the method for checking the intersection or heavy hole problem of the via trays in the same layer of the PCB board, the auxiliary tool is provided with a plurality of command buttons, including a check button, and the check button sends a check command to the auxiliary tool, so that the auxiliary tool executes step S2.
In step S2, the method obtains X coordinate information and Y coordinate information of via elements in the first list, obtains spatial coordinate information within a range of plus or minus 50 mils based on the X coordinate and the Y coordinate, forms a square area with a side length of 100 mils, and the auxiliary tool obtains a measurement result of the third list by measuring a distance between a via element in the first list and a coordinate in the square area.
According to the method for checking the intersection or heavy hole problem of the via hole discs on the same layer of the PCB, the auxiliary tool is provided with the quick browsing module, the quick browsing module acquires the X coordinate information and the Y coordinate information of the via hole elements in the selected state in the third list, and the display window is zoomed by taking the X coordinate information and the Y coordinate information as the center.
In the method for checking the intersection or heavy hole problem of the via hole discs on the same layer of the PCB, the auxiliary tool sets a test count value, the test count value is initially zero, in step S3, when the auxiliary tool obtains a measurement result satisfying the intersection or coincidence condition of the via hole elements, the test count value is incremented by one, and after the auxiliary tool completes the checking, the test count value is displayed in the count field.
The invention according to the scheme has the advantages that the auxiliary tool for checking the intersection problem of the via hole discs on the same layer of the PCB is arranged in the ALLEGRO software, the auxiliary tool acquires the via hole elements in all layers of the PCB file, the square frame with the side length of 100 mils is arranged by taking the via hole elements as the center, and the relation between the distance between the via hole elements and the via hole elements in the square frame and the judgment condition is compared after measurement, so that whether the intersection problem of the via hole discs on the same layer of the PCB exists or not is judged, the position of the via hole with the intersection problem can be quickly positioned, an inspection result report is output, a designer is greatly facilitated to quickly and accurately lock the via hole with the problem, the subsequent checking and modification work can be favorably carried out, the design work efficiency is improved, the workload of the designer is reduced, the design quality of the PCB is guaranteed, and the yield of products is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic view of an interface structure of an auxiliary tool.
FIG. 2 is an interface schematic showing a problem via.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "disposed" on another element, it can be directly or indirectly disposed on the other element. The terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
A method for checking the problem of intersection or heavy hole of via discs on the same layer of a PCB board registers an auxiliary tool command in ALLEGRO software through an axlCmdRegister function, an auxiliary tool command window is created by using an axlFormRegerate function, and the axlFormSeeld function sets window display contents. The ALLEGRO software is opened, and the accessibility window is opened through the register command, and the accessibility window interface is shown in FIG. 1.
As shown in fig. 1, the assistant tool window interface includes five sections, namely, a function section (Options), a setting value section, a count section, a display list, and a command section. The functional area comprises a plurality of selection items which are respectively a Default selection item (Default), a high-density interconnection board selection item (HDI), a VIA Only selection item (Only VIA) and a PIN Only selection item (Only PIN), wherein the Default selection item and the high-density interconnection board selection item are exclusive selection, namely, one of the Default selection item and the high-density interconnection board selection item is selected, and the VIA Only selection item and the PIN Only selection item are exclusive selection, namely, one of the VIA Only selection item and the PIN Only selection item is selected. When the default option is selected, the via hole option and the pin option can be selected randomly, and the auxiliary tool only checks the via hole problem or only checks the pin problem; if the high-density interconnection board option is selected, the auxiliary tool only checks the single board of the high-density interconnection board, only checks the problem of the via hole, and does not check the problem of the pin. The selection items of the function area are all set with initial values, and the auxiliary tool compares whether the values returned by the selection items are consistent with the initial values or not to obtain different feedback values. The auxiliary tool judges the selection state of the selection item according to the feedback value so as to execute different functions.
The interval set value is customized by the user in the set value column, the auxiliary tool reads the value in the column as the check reference, and the measured result is less than or equal to the value, namely the data is judged as the problem data and is recorded in the third list. The setting item is mainly used for a default selection item, and is used for checking the condition that the center distance of through holes (non-blind buried holes) is smaller than a set value, and also for screening a heavy hole problem or a hole too close problem, the high-density interconnection plate selection item does not need to be limited by the setting item, and the checking of the high-density interconnection plate selection item is used for checking a VIA disc layer by layer and recording the condition that the discs intersect, and does not comprise the hole too close problem. Therefore, the setting value in the invention comprises two items, one item is the value of the setting value column in the default option, and the other item is the judgment feedback value in the high-density interconnection board option.
The initial value of the counting field is zero, and the number of the problem data is counted by checking the auxiliary tool and returning the final value of the record in the counting field when detecting one problem data, namely recording once.
The display list displays a list of all the question data, and the set format of the list is a distance between a serial number @ question point name @ question point center coordinate @ and the center coordinate @ of another point where a question occurs.
The command area includes three function buttons, a Check button (Check) and an output button (View), respectively). After the user selects the checking type according to the requirement in the functional area, the auxiliary tool is given a checking command through the checking button, and the auxiliary tool executes the checking function. After the examination is finished, the user forms the examination result into an independent file according to a set format through the output button and pops up the file, so that the user can record the examination result and the transmission of the examination result is facilitated.
A method for checking the intersection or heavy hole problem of via hole discs on the same layer of a PCB board comprises the following working steps of an auxiliary tool:
step S1, opening a setting layer in the PCB file, acquiring element information from the setting layer, and recording the element information to a first list.
In step S1, the assistant tool opens the allowed routing layer (Route Keepin/All), the Top Via layer (Via Class/Top), the Bottom Via layer (Via Class/Bottom), the Top Pin layer (Pin/Top), and the Bottom Pin layer (Pin/Bottom) of the PCB file through the axlVisibleLayer function, and obtains All the Via element information and the Pin element information in the current layer by layer in these setting layers, so as to obtain All the Via elements and the Pin elements in the PCB file as the data base for inspection.
When the Via element is obtained in step S1, since the Via element contains an unreal Via such as a table paste, a table paste component needs to be removed from the Via element obtained by vialisti _ Via _ lst (), the auxiliary tool determines whether the Via element is a through hole by item- > istrough, and removes a table paste component from the first list by using a remd function, so as to reduce the volume of the first list in the cyclic database.
And S2, acquiring elements in the first list according to requirements, picking up coordinate information in a certain range by taking the coordinates of the acquired elements as a reference, and recording the coordinate information into a second list.
In step S2, the checking module is set in the SKILL language to check that the distance between the centers of the two vias is less than or equal to a predetermined value. After the user selects the functional area according to the requirement, the user clicks the check button, and the check module is started. The checking module judges the selected content according to the feedback value of the comparison between the current value of the selected item and the set value, and executes different checking steps according to the selected content.
And S3, circularly measuring the distance between the elements in the first list and the elements in the second list, and recording the elements in the first list and the elements in the second list, of which the measurement results are less than or equal to a set value, in the third list.
If the default option and the only via option are selected, the inspection module selects all via elements from the first list, obtains the X-direction coordinate information and the Y-direction coordinate information of the via elements by using an lcord function, an fCoordX function and an fCoordY function, and obtains the space coordinate information in the range of plus and minus 50 mils by using the X, g, s and s as the center through an a, a frame area with the side length of 100 mils is formed, and the coordinates in the frame area are picked up and recorded into the second list. The checking module circularly measures the distance between two points of the elements in the first list and the elements in the second list through the axlDistance function, records two elements with the distance being less than or equal to a set value in a third list, and records the distance between the two elements.
Generally, the HDI holes are laser holes or laser holes, the hole diameter is small, if an inspection area is not limited, the amount of second list data picked up by the auxiliary tool is huge, the number of cyclic comparison times of an inspection module is increased, the content to be inspected is huge, the amount of calculation exceeds the amount of calculation carried by hardware, and calculation blockage is easily caused. In practical situations, the probability of intersection between the area elements outside 100 mils and the via elements is almost zero, and therefore, only the elements within 100 mils need to be extracted for measurement.
If the default option and the only pin option are selected, the inspection module selects all pin elements from the first list, obtains the X-direction coordinate information and the Y-direction coordinate information of the pin elements by using an lCoord function, an fCoord X function and an fCoord Y function, and obtains the space coordinate information in the range of plus and minus 50 mils by taking the X-direction coordinate information and the Y-direction coordinate information as the center through an axlGetSelSelSelSeSet function and an axlAddSelectBox function to form a box area with the side length of 100 mils, and picks up the coordinates in the box area and records the coordinates in the second list. The checking module circularly measures the distance between two points of the elements in the first list and the elements in the second list through the axlDistance function, records two elements with the distance being less than or equal to a set value in a third list, and records the distance between the two elements.
If the high-density interconnection board option is selected, the inspection module acquires all via hole elements from the first list, acquires X-direction coordinate information and Y-direction coordinate information of the via hole elements by using an lCoord function, an fCoord X function and an fCoord Y function, and takes the X-direction coordinate information and the Y-direction coordinate information as the center, acquires space coordinate information in a range of plus or minus 50 mils by using an axlGetSelSelSet function and an axlAddSelectBbox function to form a selected square area with a side length of 100 mils, extracts the via hole elements in the selected square area and records the via hole elements into the second list, measures the center distance between the via hole elements of the first list and the via hole elements of the second list by using an axlDistance function, records the center distance as a first feedback value, measures the disk clearance between the via hole elements of the first list and the via hole elements of the second list by using an axlAirGap function, and records as a second feedback value. When the first feedback value is not zero and the second feedback value is true, the two via holes are intersected, and the second feedback value is a chord length value of the intersection of the two via holes; when the first feedback value is not zero and the second feedback value is false, the two via holes do not intersect and coincide; when the first feedback value is zero and the second feedback value is false, the two vias coincide without intersecting chord length values. In this way, when two via holes intersect or coincide, the corresponding via hole elements of the first list and the corresponding via hole elements of the second list are recorded in the third list.
And after the checking module executes the function, obtaining a third list of the via holes recording the problems, and displaying the third list in the display list. And if the defective through hole is not obtained after the inspection module is executed, the auxiliary tool performs popup prompting to avoid a through hole with a design error.
As shown in fig. 2, the auxiliary tool is further provided with a fast browsing module, a user selects a plurality of required problem vias in the display list, the axlformlistgetseletitems function extracts the problem vias in a selected state and extracts corresponding information including layer information and coordinate information, the auxiliary tool acquires the selected problem via information through the axlformlistgetseletitems function, the axlsingselectpoint function is used for independently extracting corresponding X coordinate information and Y coordinate information, the obtained X coordinate information and Y coordinate information are used as centers, the axlformobid function is used for zooming the design display window of the PCB file, the display window is enabled to rapidly display the problem vias, and a designer is greatly facilitated to rapidly and accurately find problem points for checking and correcting, so as to improve design efficiency and design quality.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A method for checking intersection or heavy hole problems of via discs on the same layer of a PCB (printed circuit board) is characterized in that auxiliary tool commands are registered in ALLEGRO software, a command window of the auxiliary tool is created, and the checking steps of the auxiliary tool are as follows:
s1, obtaining information containing pad elements from a PCB file, screening the information containing the pad elements to obtain information of via hole elements, and recording the via hole elements to a first list;
s2, acquiring the via hole elements of the first list according to requirements, dividing a square selected area by taking the coordinates of the acquired via hole elements as a reference, picking up the coordinate information of the selected area and recording the coordinate information into a second list;
s3, circularly measuring the space and the disk alignment gap between the via hole elements in the first list and the via hole elements in the second list, and recording the via hole elements in the first list and the via hole elements in the second list, of which the measurement results meet the intersection or superposition conditions of the via hole elements, in a third list;
in step S3, the assistant tool measures the center-to-center spacing between the via elements of the first list and the via elements of the second list and records it as a first feedback value, the assistant tool measures the disc-to-disc gap between the via elements of the first list and the via elements of the second list and records it as a second feedback value,
when the first feedback value is not zero and the second feedback value is true, the two via holes are intersected, and the second feedback value is a chord length value of the intersection of the two via holes;
when the first feedback value is not zero and the second feedback value is false, the two via holes do not intersect;
when the first feedback value is zero and the second feedback value is false, the two via holes are coincident without intersecting chord length values,
and when the two through holes are intersected or overlapped, the corresponding through hole elements of the first list and the corresponding through hole elements of the second list are recorded into the third list.
2. The method for inspecting intersection or heavy hole problem of via hole tray in the same layer of PCB board as claimed in claim 1, wherein the determination condition of intersection or coincidence of via hole elements includes:
condition K1: the distance between the via hole elements in the first list and the via hole elements in the second list is smaller than or equal to a set value;
or the like, or, alternatively,
condition K2: a spacing between the via elements in the first list and the via elements in the second list is not zero, and a antipad clearance between the via elements in the first list and the via elements in the second list is a true value;
or the like, or, alternatively,
condition K3: the spacing between the via elements in the first list and the via elements in the second list is equal to zero, and the antipad clearance between the via elements in the first list and the via elements in the second list is a false value.
3. The method of claim 1, wherein the auxiliary tool sets a setting value column, and in step S2, the auxiliary tool reads the value in the setting value column and writes the setting value.
4. The method for inspecting intersection or heavy hole problem of via tray in the same layer of PCB board as claimed in claim 1, wherein said auxiliary tool sets up a display list and an output button, after step S3, the via elements in said third list are displayed in said display list according to a set format, and a separate file is generated upon receiving the command of said output button.
5. The method for inspecting the via hole tray intersection or heavy hole problem of the same layer of the PCB board as claimed in claim 1, wherein the auxiliary tool sets a plurality of options, the options set initial values, the auxiliary tool generates feedback values according to the comparison between the existing values of the options and the initial values, the auxiliary tool determines whether the options are in the selection state according to the feedback values, and obtains the center coordinates of the corresponding via hole elements of the options according to the selection state.
6. The method for inspecting the problem of intersection or heavy hole of the via hole tray on the same layer of the PCB as the claim 1, wherein the elements containing the bonding pad comprise the via hole elements and the pin elements, and the auxiliary tool obtains the via hole elements by removing the surface-mounted part and judging whether the via hole elements are through holes or not.
7. The method for inspecting intersection or heavy hole problem of via tray in the same layer of PCB board as claimed in claim 1, wherein said auxiliary tool is provided with several command buttons, including an inspection button, said inspection button sends inspection command to said auxiliary tool, making said auxiliary tool execute step S2.
8. The method of claim 1, wherein in step S2, X coordinate information and Y coordinate information of via elements in the first list are obtained, and spatial coordinate information within a range of plus or minus 50 mils is obtained based on the X coordinate and the Y coordinate, so as to form a square area with a side length of 100 mils, and the auxiliary tool obtains the measurement result of the third list by measuring the distance between the via elements in the first list and the coordinates in the square area.
9. The method for inspecting the problem of intersection or heavy hole of the via hole discs on the same layer of the PCB board as recited in claim 1, wherein the auxiliary tool is provided with a fast browsing module, the fast browsing module obtains X coordinate information and Y coordinate information of the via hole elements in the selected state in the third list, and causes the display window to zoom around the X coordinate information and the Y coordinate information.
10. The method as claimed in claim 1, wherein the auxiliary tool sets a test count value, the test count value is initially zero, in step S3, the test count value is incremented every time the auxiliary tool obtains a measurement result satisfying a condition of intersecting or overlapping via elements, and the test count value is displayed in a count field after the auxiliary tool completes the inspection.
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| CN112632900B (en) * | 2020-12-30 | 2024-09-24 | 深圳市百能信息技术有限公司 | Automatic recognition method, device, equipment and storage medium for PCB (printed circuit board) middle hole |
| CN114117998B (en) * | 2022-01-28 | 2022-04-29 | 北京智芯仿真科技有限公司 | Self-adaptive determination method and device for integrated circuit layout bonding pad and isolation gasket |
| CN117369017B (en) * | 2023-12-06 | 2024-02-23 | 苏州元脑智能科技有限公司 | Integrity detection method and device for copper laying of through holes in PCB and electronic equipment |
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