CN110333469B - Target point calculation method for flying probe test - Google Patents
Target point calculation method for flying probe test Download PDFInfo
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- CN110333469B CN110333469B CN201910649043.5A CN201910649043A CN110333469B CN 110333469 B CN110333469 B CN 110333469B CN 201910649043 A CN201910649043 A CN 201910649043A CN 110333469 B CN110333469 B CN 110333469B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
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Abstract
The invention discloses a target point calculation method for a flying probe test, which comprises the following steps of S1: loading a photoplotting file and acquiring the design coordinates of the central point of a pad of the PCBA board; s2: calculating a target test point and a plane coordinate thereof according to the design coordinate, the pricking type and the device packaging type of the central point of the PCBA pad, and calculating a difference value of the plane coordinate of the target test point relative to the design coordinate of the central point of the PCBA pad; s3: calculating a deviation value of the target test point in height; s4: performing distance compensation by combining the deviation distribution condition of the target test point; s5: and acquiring the three-dimensional coordinates of the final target test point. The invention overcomes the problem of inaccurate probe pricking test in the prior art by adopting the technical means of compensating the difference value between the target test point and the central point of the pad and compensating the height deviation to obtain the coordinate of the final target test point, and achieves the aim of improving the accuracy of the probe pricking test component electrode.
Description
Technical Field
The invention relates to the technical field of automatic test equipment, in particular to a target point calculation method for a flying probe test.
Background
The flying probe tester is an instrument for testing a PCBA board (printed circuit board) with high density of element arrangement, multiple layers, large wiring density and small measuring point distance, and is connected to a driver (a signal generator, a power supply and the like) and a sensor (a digital multimeter, a frequency counter and the like) through a multiplex transmission system to test elements on the circuit board.
With the development of semiconductor process technology, the density of electronic components on a PCBA board and the complexity of the components have increased, and the size of the mounted components has decreased, which makes the requirement for the probing method higher and higher.
In the prior art, the optical drawing file provides coordinates of the designed values of the coordinates of the bonding pad, but because the actual pin point is an electrode or soldering tin, and a machining process error exists, a real target pin point needs to be calculated, the accuracy of the target pin point is influenced to a certain extent, and the accuracy of the probe pin point is further influenced.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, the technical problems in the related art. Therefore, the invention aims to provide a target point calculation method for a flying probe test, which can improve the accuracy of the probe dropping point in the flying probe test.
The technical scheme adopted by the invention is as follows:
the invention provides a target point calculation method for a flying probe test, which comprises the following steps:
s1: loading a photoplotting file and acquiring the design coordinates of the central point of a pad of the PCBA board;
s2: calculating a target test point and a plane coordinate thereof according to the design coordinate, the pricking type and the device packaging type of the central point of the PCBA pad, and calculating a difference value of the plane coordinate of the target test point relative to the design coordinate of the central point of the PCBA pad;
s3: calculating a deviation value of the target test point in height;
s4: performing distance compensation by combining the deviation condition of the target test point;
s5: and acquiring the three-dimensional coordinates of the final target test point.
Further, in S2, the type of the puncturing point is determined according to the specific parameters of the device package.
Further, the design coordinates acquired in S1 are plane coordinates.
Further, the S2 includes the following steps:
s21: setting the central points of the left PCBA board pad and the right PCBA board pad as zero points, and setting the coordinates of the target test point to be +/-L-a/2, wherein L is the appearance length of the component, and a is the width of the electrode;
s22: calculating the design coordinate of the center point of the PCBA pad, wherein the calculation formula of the design coordinate of the center point of the PCBA pad is +/- (L1+2L2)/2, L1 is the distance between the PCBA pads, and L2 is the distance from the center to the edge of the PCBA pad;
s23: and calculating the offset value of the target test point and the central point of the PCBA pad, wherein the calculation formula is (L1+2L2-L + a)/2.
Further, the S3 includes the following steps: s31: calculating a compensation distance C between the height of the central point of the PCBA pad and the height of the target test point, wherein the calculation formula is that C is T and tan Q is (T + T1) and tan Q, Q is a probe fixed included angle, T is the height corresponding to various packaged components, and T is a standard value; t1 is the floating height of the component during soldering.
Further, the specific parameters include: type, size and height.
Further, the S4 includes:
the S4 includes:
s41, performing corresponding distance compensation according to the difference value between the plane coordinate of the target test point and the central point coordinate of the PCBA pad;
and S42, performing corresponding distance compensation according to the calculated height deviation value of the target test point.
The invention has the beneficial effects that:
the invention adopts the technical means of acquiring the theoretical coordinate of the center point of the pad from the optical drawing file, calculating the deviation value of the center point of the pad and the target test point on the XY plane for compensation, calculating the deviation value of the target test point on the height in the Z direction for compensation, and finally obtaining the three-dimensional coordinate of the final target test point, thereby overcoming the problem of low probe pricking point precision in the probe pricking point test in the prior art, realizing the calculation of the real target lower probe point and improving the accuracy and precision of the probe pricking point.
Drawings
FIG. 1 is a block diagram of components and PCBA boards in accordance with embodiments of the present invention;
FIG. 2 is a diagram of the outline of a component according to an embodiment of the present invention;
FIG. 3 is a plan view of a 01005 package format component and PCBA board pads in accordance with an embodiment of the present invention;
FIG. 4 is a plan view of 0201 and 0402 package format components and PCBA board pads of an embodiment of the present invention;
FIG. 5 is a plan view of a 0603 package format component and PCBA board pad of an embodiment of the present invention;
FIG. 6 is a plan view of a 0604 package format component and PCBA board pad of an embodiment of the present invention;
FIG. 7 is a plan view of a 0805 package-form component and PCBA board pad of an embodiment of the present invention;
figure 8 is a side view of a component and PCBA board pad of an embodiment of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Referring to fig. 1, fig. 1 is a structural diagram of a component and a PCBA board according to an embodiment of the present invention, and the present invention discloses a target point calculation method for a flying probe test, including:
s1: loading a photoplotting file and acquiring the design coordinates of the central point of a pad of the PCBA board;
s2: obtaining a target test point and a plane coordinate thereof according to the design coordinate, the pricking type and the device packaging type of the central point of the PCBA pad, and calculating the difference value between the design coordinate of the central point of the PCBA pad and the plane coordinate of the target test point;
s3: calculating a deviation value of the target test point in height;
s4: performing distance compensation by combining the deviation condition of the target test point;
s5: and acquiring the three-dimensional coordinates of the final target test point, calculating the difference between the target test points of the electrodes to be tested actually by acquiring the coordinates of the central point of the PCBA pad in the optical drawing file, and performing distance compensation according to the difference between the target test points, thereby being beneficial to improving the accuracy of probe placement during the probe pointing test.
The coordinates obtained in S1 are planar coordinates, and the coordinates of the target test point calculated in S2 are planar coordinates.
For a flying probe test system, the extraction method of the coordinates of the target test point is to acquire the design coordinates of the central point of the pad of the PCBA from the optical drawing file, wherein the acquired coordinates are plane coordinates. Because the design coordinate of the central point of the PCBA pad is not the coordinate of the component testing electrode, the coordinate is divided into a position relation on an XY plane and a height relation on a Z height according to the relation between the central point of the PCBA pad and the component testing electrode. Through loading the optical drawing file, obtain the design coordinate of PCBA board pad central point, this coordinate is the fixed value of a certain PCBA board pad, but actual test needs prick the probe on the components and parts electrode of this pad top, thereby need calculate the difference between the design coordinate of PCBA board pad central point and the coordinate of target test point, thereby need divide into the position relation and the high relation in the Z height on the XY plane with the design coordinate of PCBA board pad central point, so that different axial compares and then calculates the difference between the two, thereby improve the accuracy of difference calculation between the two.
As shown in fig. 1 and 2, fig. 2 is a diagram of the external configuration of the component according to the embodiment of the present invention, where B1 and B2 are center points of electrodes of the component on the left and right sides, B1 and B2 are coordinates of actual pricking points and also coordinates of target test points, and D is a zero point which is a center point of two pads of the PCBA board. A1 and A2 are central points of two PCBA board pads below the component, and A1 and A2 are central points of the two PCBA board pads of the component in FIG. 2. As can be seen from fig. 1, the coordinates of the central point of the pad of the PCBA board and the target test point are different, so the target test point needs to be calculated through the central point of the pad of the PCBA board so as to facilitate the accurate needle insertion point.
The specific parameters include type, size and height, and the type of the binding point, such as device electrode, pad or solder, is determined according to the type, size and height of the device package, in this embodiment, the pad is a single board of a mobile phone, and the device package includes a 0603 package form, a 0402 package form, a 0201 package form, a 01005 package form, and the like, which all belong to small devices.
S2 includes: s21: setting the central points of the left PCBA board pad and the right PCBA board pad as zero points, and setting the coordinates of the target test point to be +/-L-a/2, wherein L is the appearance length of the component, and a is the width of the electrode;
s22: calculating the design coordinate of the center point of the PCBA pad, wherein the calculation formula of the design coordinate of the center point of the PCBA pad is +/- (L1+2L2)/2, L1 is the distance between the PCBA pads, and L2 is the distance from the center to the edge of the PCBA pad;
s23: calculating an offset value between zero and the central point of the PCBA pad, wherein the calculation formula is (L1+2L2-L + a)/2;
since the package format is an international industry standard, L and a are fixed values, and L1 and L2 are product design standards of each company, so that the same type of packages L1 and L2 in a company are the same, L1 and L2 are standard values (slightly different from different companies), and the center offset of the PCBA board pads and the component electrodes is a fixed value, and can be developed into a database for test call.
As shown in fig. 3, fig. 3 is a plan view of a 01005 package type component and PCBA board pad of the present invention; in this embodiment, the outer dimension of the 01005 package type is L16 mil (0.1mm 4mil), where 1mil is 0.0255mm, the edge distance between two PCBA board pads is L1 2mil, the width of a PCBA board pad is 2L2 10mil, and M is the farthest distance between two pads, the farthest edge distance between two PCBA board pads is M (2+10 × 2) — 22mil, the width of a component electrode is a 0.1mm 4mil, and then (L1+2L2-L + a)/2 offset is 0mil, that is, the PCBA board pad center of the 01005 package type and the component electrode center (target test point) are overlapped without an offset.
As shown in fig. 4, fig. 4 is a plan view of a 0201 and 0402 package type component and a PCBA board pad according to an embodiment of the present invention, where L1 of 0402 package type is 10mil, L2 is 10mil, L is 40mil, and a is 0.2mil, and L1 of 0201 is 8mil, L2 is 5mil, L is 24mil, a is 0.1mil, and M is 50mil, so that (L1+2L2-L + a)/2 offset-1 mil are calculated by S33, that is, the PCBA board pad center point of the package type and the component electrode center point (target test point) do not coincide with each other, and need to be offset by 1mil, and the direction is the SMD center point.
As shown in fig. 5 and 6, fig. 5 is a plan view of a 0603 package component and a PCBA board pad according to an embodiment of the present invention, and fig. 6 is a plan view of a 0604 package component and a PCBA board pad according to an embodiment of the present invention, where L1 of the 0603 package is 24 mils, L2 is 12.5 mils, L is 63 mils, a is 0.3 mils, and M is 74 mils, and where (L1+2L2-L + a)/2 of the 0603 package is-1 mil, which is calculated in step S33, an offset of 1 is required, where L1 of the 0604 is 29 mils, L2 is 11 mils, L is 63, a is 0.3 mils, M is 73, and an offset of (L1+2L 8678 + L) is not required, and an offset of 3 is not required.
As shown in fig. 7, fig. 7 is a plan view of a 0805 package component and a PCBA board pad according to an embodiment of the present invention, where L1, L2, L80, a 0.4, and M60 of the 0805 package form are (L1+2L2-L + a)/2 according to a calculation formula in S33, an offset value (L1+2L2-L + a)/2 is 5 mils, and the offset value needs to be shifted by 5 mils.
As shown in fig. 8, fig. 8 is a side view of a component and a PCBA board pad according to an embodiment of the present invention, and the S3 includes the following steps: s31: calculating a compensation distance C between the height of the central point of the PCBA pad and the height of the target test point, wherein C1 and C2 are central points of electrodes of the components (namely the central points of the target test points), and the calculation formula is that C is T is tan Q (T + T1) is tan Q, wherein Q is a probe fixed included angle, T is the height corresponding to various packaged components, and T is a standard value; t1 is the floating height of the component during soldering. t is the height of the element, t1 is the distance between the SMD component and the PCBA board after welding, the general industry standard t1 is 0.1-0.2, and t1 is commonly called as 'floating height'; t + t1 is the distance between the SMD upper surface and the PCBA; b1 and B2 are the center positions of the left and right component electrodes. The Q angle is an included angle (generally 5-15 degrees) between the Z-axis probe of the flying probe device and a vertical axis when the Z-axis probe advances. When the probe is fixed, it will be directed along this angle toward device electrode center points B1 and B2. Since the Z-axis of the flying probe test is tilted rather than vertical (there is a Q-angle), the point where the probe and component actually make contact is D1, D2 (at which point the probe tip has already been at D1 and D2 and cannot pass through the SMD component to the center point) rather than B1, B2 due to the effect of the T-height. In order to ensure that the probe tip is pricked at the electrode centers B1 and B2, the compensation of the distance difference C1 or C2 is carried out to eliminate the influence of the T height on the probe tip.
S4 includes: the S4 includes: s41, performing corresponding distance compensation according to the difference value between the plane coordinate of the target test point and the central point coordinate of the PCBA pad; and S42, performing corresponding distance compensation according to the calculated height deviation value of the target test point. And (4) compensating the deviation value of the target test point on the plane and the height according to the deviation values of the target test point calculated in the S2 and the S3, so that the final target test point is obtained after distance compensation, and the accuracy of the target test point binding is improved, and the accuracy of the device electrical appliance test is improved.
The implementation principle of the embodiment is as follows: firstly loading a photoplotting file, acquiring design coordinates of a central point of a pad of a PCBA board from the photoplotting file, determining a pricking point type according to parameters such as a component packaging type, a size and a height, wherein the PCBA board is a single board of a mobile phone in the embodiment, the pricking point type is a device electrode, classifying the acquired design coordinates of the central point of the pad of the PCBA board into a position relation on an XY plane and a height relation on a Z height, firstly calculating the central points of two pads according to the position relation on the XY plane, then calculating a target test point, finally calculating offset values of the target test point and the central point of the pad of the PCBA board, wherein the calculation formula is (L1+2L2-L + a)/2, then calculating the height offset value, and the calculation formula of the height offset value is C1 ═ C2 ═ T ═ tan Q ═ T + 0.1-0.2), namely, the coordinates of the target test point on the X, Y, Z plane can be obtained, and finally, compensating according to the deviation value of the components on the plane and the height, so as to obtain the final coordinates of the target test point and improve the accuracy of the flying probe test.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A target point calculation method for a flying probe test, comprising:
s1: loading a photoplotting file and acquiring the design coordinates of the central point of a pad of the PCBA board;
s2: calculating a target test point and a plane coordinate thereof according to the design coordinate, the pricking type and the device packaging type of the central point of the PCBA pad, and calculating a difference value of the plane coordinate of the target test point relative to the design coordinate of the central point of the PCBA pad;
s3: calculating a deviation value of the target test point in height;
s4: performing distance compensation by combining the deviation condition of the target test point;
s5: acquiring a three-dimensional coordinate of a final target test point;
the S2 includes the steps of:
s21: setting the central points of the left PCBA board pad and the right PCBA board pad as zero points, and setting the coordinates of the target test point to be +/-L-a/2, wherein L is the appearance length of the component, and a is the width of the electrode;
s22: calculating the design coordinate of the center point of the PCBA pad, wherein the calculation formula of the design coordinate of the center point of the PCBA pad is +/- (L1+2L2)/2, L1 is the distance between the PCBA pads, and L2 is the distance from the center to the edge of the PCBA pad;
s23: and calculating the offset value of the target test point and the central point of the PCBA pad, wherein the calculation formula is (L1+2L2-L + a)/2.
2. The target point calculation method for a flying probe test as claimed in claim 1, wherein in S2, the pricking point type is determined according to the specific parameters of the device package.
3. The target point calculation method for a flying needle test according to claim 1, wherein the design coordinates acquired in S1 are planar coordinates.
4. The target point calculation method for a flying needle test according to claim 1, wherein the S3 comprises the steps of: s31: calculating a compensation distance C between the height of the central point of the PCBA pad and the height of the target test point, wherein the calculation formula is C = T tan Q = (T + T1) = tan Q, Q is a probe fixed included angle, T is the distance between the upper surface of the packaging component and the PCBA, T is the height corresponding to various packaging components, and T is a standard value; t1 is the floating height of the component during soldering.
5. The target point calculation method for a flying needle test according to claim 2, wherein the specific parameters include: type, size and height.
6. The target point calculation method for a flying needle test according to claim 1, wherein the S4 includes:
s41, performing corresponding distance compensation according to the difference value between the plane coordinate of the target test point and the design coordinate of the central point of the PCBA pad;
and S42, performing corresponding distance compensation according to the calculated height deviation value of the target test point.
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| CN111141954B (en) * | 2020-01-02 | 2022-05-06 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Test file generation method and device of resistor network and electronic equipment |
| CN112066934B (en) * | 2020-09-16 | 2022-04-01 | 深圳市一博科技股份有限公司 | Method for checking intersection or heavy hole problem of via hole discs on same layer of PCB |
| CN112908895A (en) * | 2021-01-20 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | Substrate plane correction method and system and laminating equipment |
| CN114152860B (en) * | 2021-11-05 | 2023-11-10 | 深圳橙子自动化有限公司 | Probe calibration method and device, electronic equipment and storage medium |
| CN114184931A (en) * | 2021-11-08 | 2022-03-15 | 深圳橙子自动化有限公司 | Probe adjustment method, probe adjustment device, electronic device, and storage medium |
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