CN114152860B - Probe calibration method and device, electronic equipment and storage medium - Google Patents
Probe calibration method and device, electronic equipment and storage medium Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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- G06T7/80—Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration
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Abstract
The application discloses a probe calibration method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring a first probe resistance value and an initial probe height of a probe at a first preset calibration position; obtaining a probe calibration height according to the first probe resistance value and the initial probe height; acquiring a first probe coordinate of the probe in a second preset calibration position, acquiring a first camera coordinate and a second camera coordinate of the camera in the first probe coordinate, and acquiring a center point coordinate of the camera; obtaining a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate; obtaining calibration coordinates of the probe according to the probe calibration height and the second probe coordinates; and performing calibration processing on the probe according to the calibration coordinates. According to the embodiment of the application, the calibration coordinates of the probe are calculated by combining the position relation between the probe and the camera, and the probe can be precisely moved and pricked to the test position of the equipment through the calibration coordinates, so that the test accuracy is improved.
Description
Technical Field
The present application relates to the field of probes, and in particular, to a method and apparatus for calibrating a probe, an electronic device, and a storage medium.
Background
In the process of manufacturing related electronic devices, in order to ensure the stability of each PCB board and PCBA board circuits and functions, a probe test device is generally used to test the devices on the PCB board or PCBA board. The needling precision of the probe testing equipment in the testing process is determined based on the coordinate relation between the probe tip and the module, but the current moving coordinate of the module is inaccurate, so that the probe cannot move accurately and be pricked to the testing position of the equipment, and the testing result is deviated.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides a probe calibration method and device, electronic equipment and a storage medium, which can ensure that a probe accurately moves and is pricked to a test position of the equipment, thereby improving the accuracy of the test.
A probe calibration method according to an embodiment of the first aspect of the present application includes:
acquiring a first probe resistance value and an initial probe height of a probe at a first preset calibration position;
obtaining a probe calibration height according to the first probe resistance and the initial probe height;
acquiring a first probe coordinate of the probe in a second preset calibration position, acquiring a first camera coordinate and a second camera coordinate of the camera in the first probe coordinate, and acquiring a center point coordinate of the camera;
obtaining a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate;
obtaining the calibration coordinates of the probe according to the probe calibration height and the second probe coordinates;
and carrying out calibration processing on the probe according to the calibration coordinates.
The probe calibration method provided by the embodiment of the application has at least the following beneficial effects:
acquiring a first probe resistance value and an initial probe height of a probe at a first preset calibration position; obtaining a probe calibration height according to the first probe resistance value and the initial probe height; acquiring a first probe coordinate of the probe in a second preset calibration position, acquiring a first camera coordinate and a second camera coordinate of the camera in the first probe coordinate, and acquiring a center point coordinate of the camera; obtaining a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate; obtaining calibration coordinates of the probe according to the probe calibration height and the second probe coordinates; and performing calibration processing on the probe according to the calibration coordinates. According to the embodiment of the application, the calibration coordinates of the probe are calculated by combining the position relation between the probe and the camera, and the probe can be precisely moved and pricked to the test position of the equipment through the calibration coordinates, so that the test accuracy is improved.
According to some embodiments of the application, the adjusting the height of the probe according to the first probe resistance value and the initial probe height to obtain a probe calibration height includes:
acquiring a first preset resistance value;
comparing the magnitude relation between the first probe resistance and the second preset resistance;
and obtaining the probe calibration height according to the size relation and the initial probe height.
According to some embodiments of the application, the obtaining the probe calibration height according to the size relation and the initial probe height includes:
if the first probe resistance is larger than or equal to the first preset resistance, a first calibration height is obtained according to the initial probe height and a preset first adjustment height;
acquiring a second probe resistance value of the probe at the first calibration height;
and according to the first calibration height and the second probe resistance value, the probe calibration height is obtained.
According to some embodiments of the application, the obtaining the probe calibration height according to the size relation and the initial probe height further includes:
if the first probe resistance is smaller than the first preset resistance, obtaining a second calibration height according to the first calibration height and a preset second adjustment height;
acquiring a second preset resistance value, and acquiring a third probe resistance value of the probe at the second calibration height;
comparing the magnitude relation between the third probe resistance and the second preset resistance;
and obtaining the probe calibration height according to the size relation and the second calibration height.
According to some embodiments of the application, the obtaining the probe calibration height according to the size relation and the second calibration height includes:
if the third probe resistance is smaller than the second preset resistance, a third calibration height is obtained according to the second calibration height and the second adjustment height;
acquiring a fourth probe resistance value of the probe at the third calibration height;
and obtaining the probe standard height according to the third calibration height and the fourth probe resistance.
According to some embodiments of the application, the obtaining the probe calibration height according to the size relation and the second calibration height includes:
and if the third probe resistance value is larger than or equal to the second preset resistance value, determining the third calibration height as the probe calibration height.
According to some embodiments of the application, the obtaining the second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate includes:
obtaining a first coordinate difference according to the first probe coordinate and the first camera coordinate;
obtaining a second coordinate difference according to the second camera coordinate and the center point coordinate;
and obtaining a second probe coordinate according to the first coordinate difference and the second coordinate difference.
A probe calibration device according to an embodiment of the second aspect of the present application includes:
a first acquisition module: the probe detection device is used for acquiring a first probe resistance value and an initial probe height of a probe at a first preset calibration position;
and a height adjustment module: the probe calibration height is obtained by adjusting the height of the probe according to the first probe resistance and the initial probe height;
and a second acquisition module: the method comprises the steps of obtaining a first probe coordinate of the probe in a second preset calibration position, obtaining a first camera coordinate and a second camera coordinate of a camera in the first probe coordinate, and obtaining a center point coordinate of the camera;
a first calculation module: the method comprises the steps of obtaining a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate;
a second calculation module: the probe calibration method comprises the steps of obtaining calibration coordinates of the probe according to the probe calibration height and the second probe coordinates;
and a probe calibration module: and the probe is used for carrying out calibration processing on the probe according to the calibration coordinates.
The probe calibration device provided by the embodiment of the application has at least the following beneficial effects:
the first acquisition module acquires a first probe resistance value and an initial probe height of the probe at a first preset calibration position; the second acquisition module obtains a probe calibration height according to the first probe resistance value and the initial probe height; the third acquisition module acquires a first probe coordinate of the probe in a second preset calibration position, acquires a first camera coordinate and a second camera coordinate of the camera in the first probe coordinate, and acquires a center point coordinate of the camera; the first calculation module obtains a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate; secondly, obtaining calibration coordinates of the probe according to the probe calibration height and the second probe coordinates; and performing calibration processing on the probe according to the calibration coordinates. According to the embodiment of the application, the calibration coordinates of the probe are calculated by combining the position relation between the probe and the camera, and the probe can be precisely moved and pricked to the test position of the equipment through the calibration coordinates, so that the test accuracy is improved.
An electronic device according to an embodiment of a third aspect of the present application includes: the device comprises a memory and a processor, wherein the memory stores a program, and the processor is used for executing the program when the program is executed by the processor:
the method of the embodiment of the first aspect of the application.
A storage medium according to an embodiment of the fourth aspect of the present application is a computer-readable storage medium, characterized in that a computer program is stored in a computer readable storage medium, and when the computer program is executed by a computer, the computer is configured to execute:
the method of the embodiment of the first aspect of the application.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The application is further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a flowchart of a probe calibration method according to an embodiment of the present application;
FIG. 2 is a first schematic diagram of a probe positional relationship according to an embodiment of the present application;
FIG. 3 is a second schematic diagram of a probe positional relationship according to an embodiment of the present application;
FIG. 4 is a flowchart of a specific method of step S200 in FIG. 1;
FIG. 5 is a first flowchart illustrating a specific method of step S230 in FIG. 4;
FIG. 6 is a second flowchart of the specific method of step S230 in FIG. 4;
FIG. 7 is a flowchart of a specific method of step S326 in FIG. 6;
FIG. 8 is a flowchart of a specific method of step S500 in FIG. 1;
FIG. 9 is a flow chart of a practical application of the probe calibration method according to the embodiment of the present application;
FIG. 10 is a block diagram of a probe calibration apparatus according to an embodiment of the present application;
fig. 11 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present application.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
In the description of the present application, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present application can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
In the description of the present application, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
First, the proper nouns possibly related to the application are analyzed:
printed circuit board (Printed Circuit Board Assembly, PCBA): the PCBA board is an important electronic component, a support for electronic components, and a provider for wiring electronic components.
And (3) probe: the test interface is mainly used for testing bare chips, and testing chip parameters through a transmission signal by connecting a tester with a chip.
Universal meter: the meter is also called a multiplexing meter, a multipurpose meter, a three-purpose meter, a propagation meter and the like, is an indispensable measuring instrument for power electronics and other departments, and generally aims to measure voltage, current and resistance. The multimeter is divided into a pointer multimeter and a digital multimeter according to a display mode. The multifunctional measuring instrument with multiple measuring ranges is a common universal meter which can measure direct current, direct current voltage, alternating current, alternating voltage, resistance, audio level and the like, and can also measure alternating current, capacitance, inductance, some parameters (such as beta) of a semiconductor and the like.
The meter pen comprises the following steps: refers to a pen-like object on the test meter for contacting the object to be tested.
In the process of manufacturing related electronic devices, in order to ensure the stability of each PCB board and PCBA board circuits and functions, a probe test device is generally used to test the devices on the PCB board or PCBA board. The needling precision of the probe testing equipment in the testing process is determined based on the coordinate relation between the probe tip and the module, but the current moving coordinate of the module is inaccurate, so that the probe cannot move accurately and be pricked to the testing position of the equipment, and the testing result is deviated.
Based on the above, the application provides a probe calibration method and device, electronic equipment and a storage medium, which can ensure that a probe accurately moves and is pricked to a test position of the equipment, thereby improving the accuracy of the test.
Embodiments of the present application are further described below with reference to the accompanying drawings.
Referring to fig. 1, in a first aspect, some embodiments of the present application provide a probe calibration method including, but not limited to, step S100, step S200, step S300, step S400, step S500, and step S600. These seven steps are described in detail below.
Step S100, a first probe resistance value and an initial probe height of the probe at a first preset calibration position are obtained.
In step S100, a first probe resistance value of the probe located at a first preset calibration position is obtained, wherein a conductive contact, such as a copper contact, for measuring the first probe resistance value is provided on the first calibration board, the first preset calibration position can be set according to actual requirements, and the first preset calibration position can be set at a position 1mm above the copper contact, generally, the farther the first probe resistance value is from the copper contact, the longer the calibration time is. In practical application, the multimeter can be used for testing the first probe resistance value of the probe, firstly, the multimeter is required to be set to be in a resistance test gear, as shown in fig. 2, a stylus HI of the multimeter is connected with the probe, a stylus LO is connected with a copper contact of a calibration board, the probe is moved to be above the copper contact, then the probe is pressed down to a first preset calibration position, at the moment, the resistance value measured by the multimeter, namely the first probe resistance value, is obtained, and the height of the probe in the Z-axis direction of the calibration board is obtained and is used as the initial probe height.
Step S200, according to the first probe resistance value and the initial probe height, the probe calibration height is obtained.
In step S200, the Z-axis height of the probe is continuously adjusted based on the initial probe height according to the first probe resistance value, so as to obtain a probe calibration height satisfying the condition.
Step S300, a first probe coordinate of the probe in a second preset calibration position is obtained, a first camera coordinate and a second camera coordinate of the camera in the first probe coordinate are obtained, and a center point coordinate of the camera is obtained.
After the probe calibration height is obtained in step S200, in step S300, the probe needs to be moved to a second preset calibration position, and the first probe coordinates of the probe at the second calibration position are obtained, where the second calibration position is located on the surface of the calibration plate. In practical application, the specific operation steps are as follows: and a layer of soft sheet is stuck on the calibration plate, so that the probe can conveniently prick needle marks on the sheet, wherein the sheet can be aluminum foil paper, copper foil paper, gold foil paper, silver foil paper and the like, after the sheet is stuck, the probe moves to the sheet to prick one needle mark, and the needle mark coordinates, namely the first probe coordinates (X1, Y1), are obtained on a module coordinate system where the calibration plate is positioned. The camera is moved to the needle mark, i.e. the first probe coordinate, and the probe coordinates at this time, i.e. the first camera coordinates (X2, Y2) are obtained on the module coordinate system, and at the same time the camera is moved to the needle mark, the coordinates of the needle mark, i.e. the second camera coordinates (X3, Y3), are obtained on the camera's visual coordinate system, and the camera center point coordinates (X4, Y4) are obtained on the camera's visual coordinate system.
Step S400, obtaining a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate.
And S500, obtaining the calibration coordinates of the probe according to the probe calibration height and the second probe coordinates.
In step S500, the probe calibration height is used as the Z-axis coordinate of the probe, the second probe coordinate is used as the X-axis and Y-axis coordinates of the probe, and the X-axis, Y-axis, and Z-axis coordinates are combined to obtain the calibration coordinates of the probe.
Step S600, performing calibration processing on the probe according to the calibration coordinates.
In some embodiments, referring to fig. 2 and 3, after the initial probe height of the probe is measured by fig. 2, the probe height needs to be calibrated, specifically along the direction of probe travel in fig. 3, until the condition is met, as in the following examples.
In some embodiments, referring to fig. 4, step S200 includes, but is not limited to, step S210, step S220, and step S230.
Step S210, a first preset resistance value is obtained.
In step S210, a first preset resistance is obtained, where the first preset resistance is used as a condition for determining whether the probe needs to be lowered, and in practical application, the first preset resistance may be set to 10Ω.
Step S220, comparing the magnitude relation between the first probe resistance and the second preset resistance.
Step S230, obtaining the probe calibration height according to the size relation and the initial probe height.
In some embodiments, referring to fig. 5, step S230 includes, but is not limited to, step S231, step S232, and step S233.
In step S231, if the first probe resistance is greater than or equal to the first preset resistance, a first calibration height is obtained according to the initial probe height and the preset first adjustment height.
In step S231, if the first probe resistance is greater than or equal to the first preset resistance, the first calibration height is obtained according to the initial probe height and the preset first adjustment height, specifically, assuming that the first preset resistance is 10Ω, the preset first adjustment height is 0.1mm, and if the first probe resistance is greater than or equal to 10Ω, the probe is controlled to descend by 0.1mm along the Z-axis, so as to obtain the first calibration height.
Step S232, a second probe resistance value of the probe at the first calibration height is obtained.
In step S232, the resistance value of the probe at the first calibration height is read as the second probe resistance value by using the multimeter.
Step S233, according to the first calibration height and the second probe resistance value, the probe calibration height is obtained.
In step S233, according to the first calibration height and the second probe resistance value, the second probe resistance value is further determined to adjust the height of the probe, so as to obtain the probe calibration height, specifically, whether the second probe resistance value is less than 10Ω is further determined, if the second probe resistance value is greater than or equal to 10Ω, the probe is further required to be lowered by 0.1mm along the Z-axis, and the process is repeated until the resistance value corresponding to the height position of the probe is less than 10Ω, and then the process jumps to step S234 to further determine.
In some embodiments, referring to fig. 6, step S230 further includes, but is not limited to, step S234, step S235, step S236, and step S237.
Step S234, if the first probe resistance is smaller than the first preset resistance, obtaining a second calibration height according to the first calibration height and a preset second adjustment height.
In step S234, if the first probe resistance is less than 10Ω, the second calibration height is obtained according to the first calibration height and the second adjustment height, and if the first probe resistance is less than 10Ω, the probe is raised by 0.01mm along the Z-axis, so as to obtain the second calibration height of the probe at this time.
Step S235, a second preset resistance value is obtained, and a third probe resistance value of the probe at the second calibration height is obtained.
In step S235, a second preset resistance value is obtained, where the second preset resistance value may be adjusted according to practical situations, and in the embodiment of the present application, the second preset resistance value may be infinity, and the resistance value when the probe is located at the second calibration height is measured by the multimeter and is used as the third probe resistance value.
Step S236, comparing the magnitude relation between the third probe resistance and the second preset resistance.
And step S237, obtaining the probe calibration height according to the size relation and the second calibration height.
In some embodiments, referring to fig. 7, step S237 specifically includes, but is not limited to, step S3271, step S3272, and step S3273.
Step S3271, if the third probe resistance is smaller than the second preset resistance, obtaining a third calibration height according to the second calibration height and the second adjustment height.
In step S3271, if the third probe resistance is smaller than the second preset resistance, i.e. the third probe resistance is not infinite, and the second calibration height is 0.01mm, the probe is raised by 0.01mm along the Z axis at this time, so as to obtain the height of the probe at this time, i.e. the third calibration height.
Step S3272, obtaining a fourth probe resistance value of the probe at the third calibration height.
In step S3272, the resistance value of the probe at the third calibration height, i.e., the fourth probe resistance value, is read using a multimeter.
And step S3273, obtaining the standard height of the probe according to the third calibration height and the fourth probe resistance.
In step S3273, the height of the probe needs to be further adjusted by determining the resistance of the fourth probe, specifically, whether the resistance of the second probe is infinity is also determined, if the resistance of the second probe is not infinity, the probe needs to be raised by 0.01mm along the Z axis, and the steps are repeated until the resistance corresponding to the height position of the probe is infinity, and when the resistance corresponding to the height position of the probe is infinity, the current Z axis coordinate is the standard height of the probe.
In some embodiments, if the resistance of the third probe is greater than or equal to the second preset resistance, determining the third calibration height as the probe calibration height, that is, the resistance of the third probe is infinity, that is, the probe leaves the calibration board, and when the resistance is infinity, stopping the motion of the Z-axis, recording the Z-axis coordinate, wherein the current Z-axis coordinate is the standard height coordinate of the probe, and is denoted as H.
In some embodiments, referring to fig. 8, step S500 specifically includes, but is not limited to, step S510, step S520, and step S530.
Step S510, obtaining a first coordinate difference according to the first probe coordinate and the first camera coordinate.
In step S510, the difference between the coordinates of the first probe coordinates (X1, Y1) and the first camera coordinates (X2, Y2) is calculated to obtain a first coordinate difference (X1-X2, Y1-Y2).
Step S520, obtaining a second coordinate difference according to the second camera coordinate and the center point coordinate.
In step S520, the difference between the coordinates of the second camera coordinates (X3, Y3) and the coordinates of the center point coordinates (X4, Y4) is calculated, resulting in a second coordinate difference (X3-X4, Y3-Y4).
Step S530, obtaining the second probe coordinates according to the first coordinate difference and the second coordinate difference.
In step S530, the calibration position coordinates of the probe are obtained from the first coordinate differences (X1-X2, Y1-Y2) and the second coordinate differences (X3-X4, Y3-Y4), i.e., the second probe coordinates are (X, Y) = (X1-x2+x3-X4, Y1-y2+y3-Y4).
In some embodiments, referring to fig. 9, a practical application procedure of the probe calibration method is described, specifically: firstly, moving a probe to the upper part of a calibration position, controlling the probe to prick downwards by 0.1mm, judging whether the resistance value corresponding to the probe height at the moment is smaller than 10Ω, if the resistance value corresponding to the probe height at the moment is larger than or equal to 10Ω, then the probe needs to prick downwards by 0.1mm until the resistance value corresponding to the probe height is smaller than 10Ω, if the resistance value corresponding to the probe height is smaller than 10Ω, then controlling the probe to lift by 0.01mm, judging whether the resistance value corresponding to the probe height at the moment is infinity, if the resistance value corresponding to the probe height at the moment is not infinity, then the probe needs to lift by 0.01mm until the resistance value corresponding to the probe height is infinity, and if the resistance value corresponding to the probe height is infinity, then recording the current height of the Z axis of the probe, namely the probe calibration height.
In some embodiments, it should be noted that, after the probe is calibrated, the coordinates (X1, Y1) of the probe 1 after calibration are obtained on the module coordinate system when the probe 1 is calibrated, the coordinates (X2, Y2) of the probe at this time are obtained on the module coordinate system when the probe N is calibrated, the coordinates (XN 2, YN 2) of the probe at this time are obtained on the module coordinate system when the probe N is calibrated, and the relationship between the probe 1 and the probe N can be calculated according to the embodiments of the present application, for example, the probe distance between the probe 1 and the probe N is: (X, Y) = (X1-XN 1-X2-XN2, Y1-YN1-Y2-YN 2). The embodiment of the application solves the problem that the positional relationship between the probes and between the cameras can not be obtained at present, and can obtain the positional relationship between the probes and between the cameras through one-key calibration, so that the stability of each PCB and PCBA circuit and function can be more accurately detected when the device is used. In addition, the embodiment of the application also solves the domestic shortage of the one-key automatic calibration technology of the probe, greatly reduces the calibration steps, shortens the production time of the flying probe test equipment, reduces the workload of production debugging personnel and accelerates the working efficiency.
Referring to fig. 10, some embodiments of the present application further provide a probe calibration apparatus, the probe calibration apparatus includes a first acquiring module 710, a second acquiring module 720, a third acquiring module 730, a first calculating module 740, a second calculating module 750, and a probe calibration module 760, wherein the first acquiring module 710 is configured to acquire a first probe resistance value and an initial probe height of a probe at a first preset calibration position; the second obtaining module 720 is configured to obtain a probe calibration height according to the first probe resistance value and the initial probe height; the third obtaining module 730 is configured to obtain a first probe coordinate of the probe in a second preset calibration position, obtain a first camera coordinate and a second camera coordinate of the camera in the first probe coordinate, and obtain a center point coordinate of the camera; the first calculation module 740 is configured to obtain a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate, and the center point coordinate; the second calculation module 750 is configured to obtain calibration coordinates of the probe according to the probe calibration height and the second probe coordinates; the probe calibration module 760 is used for performing calibration processing on the probe according to the calibration coordinates.
The embodiment of the application also provides electronic equipment, which comprises: the probe calibration device comprises a memory and a processor, wherein the memory stores a program, and the processor is used for executing the probe calibration method according to the embodiment of the first aspect of the application when the program is executed by the processor. The electronic device can be any intelligent terminal including a mobile phone, a tablet personal computer, a personal digital assistant (Personal Digital Assistant, PDA), a vehicle-mounted computer and the like.
An electronic device according to an embodiment of the present application is described in detail below with reference to fig. 11, where the electronic device includes:
the processor 810 may be implemented by a general purpose central processing unit (Central Processing Unit, CPU), a microprocessor, an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, etc., for executing related programs to implement the technical scheme provided by the embodiments of the present application;
the Memory 820 may be implemented in the form of a Read Only Memory (ROM), a static storage device, a dynamic storage device, or a random access Memory (Random Access Memory, RAM). Memory 820 may store an operating system and other application programs, and when implementing the technical solutions provided in the embodiments of the present disclosure by software or firmware, relevant program codes are stored in memory 820 and invoked by processor 810 to perform the probe calibration method of the embodiments of the present disclosure;
an input/output interface 830 for implementing information input and output;
the communication interface 840 is configured to implement communication interaction between the device and other devices, and may implement communication in a wired manner (e.g. USB, network cable, etc.), or may implement communication in a wireless manner (e.g. mobile network, WIFI, bluetooth, etc.); and
bus 850 transfers information between the various components of the device (e.g., processor 810, memory 820, input/output interface 830, and communication interface 840);
wherein processor 810, memory 820, input/output interface 830, and communication interface 840 enable communication connections among each other within the device via bus 850.
The embodiment of the application also provides a storage medium which is a computer readable storage medium, wherein the computer readable storage medium stores computer executable instructions for causing a computer to execute the probe calibration method.
The memory, as a non-transitory computer readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory optionally includes memory remotely located relative to the processor, the remote memory being connectable to the processor through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The embodiments described in the embodiments of the present application are for more clearly describing the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application, and those skilled in the art can know that, with the evolution of technology and the appearance of new application scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.
It will be appreciated by persons skilled in the art that the embodiments of the application are not limited by the illustrations, and that more or fewer steps than those shown may be included, or certain steps may be combined, or different steps may be included.
The above described apparatus embodiments are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, i.e. may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
Those of ordinary skill in the art will appreciate that all or some of the steps of the methods, systems, functional modules/units in the devices disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof.
The terms "first," "second," "third," "fourth," and the like in the description of the application and in the above figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be understood that in the present application, "at least one (item)" means one or more, and "a plurality" means two or more. "and/or" for describing the association relationship of the association object, the representation may have three relationships, for example, "a and/or B" may represent: only a, only B and both a and B are present, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b or c may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.
In the several embodiments provided by the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of elements is merely a logical functional division, and there may be additional divisions of actual implementation, e.g., multiple elements or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be embodied in essence or a part contributing to the prior art or all or part of the technical solution in the form of a software product stored in a storage medium, including multiple instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, an optical disk, or other various media capable of storing a program.
The preferred embodiments of the present application have been described above with reference to the accompanying drawings, and are not thereby limiting the scope of the claims of the embodiments of the present application. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and spirit of the embodiments of the present application shall fall within the scope of the claims of the embodiments of the present application.
Claims (8)
1. A method of calibrating a probe, comprising:
acquiring a first probe resistance value and an initial probe height of a probe at a first preset calibration position;
obtaining a probe calibration height according to the first probe resistance and the initial probe height;
acquiring a first probe coordinate of the probe in a second preset calibration position, acquiring a first camera coordinate and a second camera coordinate of the camera in the first probe coordinate, and acquiring a center point coordinate of the camera;
obtaining a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate;
obtaining the calibration coordinates of the probe according to the probe calibration height and the second probe coordinates;
performing calibration processing on the probe according to the calibration coordinates;
wherein, according to the first probe resistance value and the initial probe height, obtaining a probe calibration height includes:
acquiring a first preset resistance value;
comparing the magnitude relation between the first probe resistance and a second preset resistance;
obtaining a probe calibration height according to the size relation and the initial probe height;
the obtaining a second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate includes:
obtaining a first coordinate difference according to the first probe coordinate and the first camera coordinate, wherein the first probe coordinate is (X1, Y1), the first camera coordinate is (X2, Y2), and the first coordinate difference is (X1-X2, Y1-Y2);
obtaining a second coordinate difference according to the second camera coordinate and the center point coordinate, wherein the second camera coordinate is (X3, Y3), the center point coordinate is (X4, Y4), and the second coordinate difference is (X3-X4, Y3-Y4);
and obtaining a second probe coordinate according to the first coordinate difference and the second coordinate difference, wherein the second probe coordinate is (X, Y) = (X1-X2 + X3-X4, Y1-Y2+ Y3-Y4).
2. The method of claim 1, wherein said deriving a probe calibration height from said magnitude relation and said initial probe height comprises:
if the first probe resistance is larger than or equal to the first preset resistance, a first calibration height is obtained according to the initial probe height and a preset first adjustment height;
acquiring a second probe resistance value of the probe at the first calibration height;
and according to the first calibration height and the second probe resistance value, the probe calibration height is obtained.
3. The method of claim 2, wherein the deriving a probe calibration height from the size relationship and the initial probe height further comprises:
if the first probe resistance is smaller than the first preset resistance, obtaining a second calibration height according to the first calibration height and a preset second adjustment height;
acquiring a second preset resistance value, and acquiring a third probe resistance value of the probe at the second calibration height;
comparing the magnitude relation between the third probe resistance and the second preset resistance;
and obtaining the probe calibration height according to the size relation and the second calibration height.
4. A method according to claim 3, wherein said deriving a probe calibration height from said magnitude relation and said second calibration height comprises:
if the third probe resistance is smaller than the second preset resistance, a third calibration height is obtained according to the second calibration height and the second adjustment height;
acquiring a fourth probe resistance value of the probe at the third calibration height;
and obtaining the probe standard height according to the third calibration height and the fourth probe resistance.
5. The method of claim 4, wherein said deriving a probe calibration height from said magnitude relation and said second calibration height comprises:
and if the third probe resistance value is larger than or equal to the second preset resistance value, determining the third calibration height as the probe calibration height.
6. A probe calibration device, comprising:
a first acquisition module: the probe detection device is used for acquiring a first probe resistance value and an initial probe height of a probe at a first preset calibration position;
and a second acquisition module: the method is used for obtaining a probe calibration height according to the first probe resistance and the initial probe height, wherein the probe calibration height is obtained according to the first probe resistance and the initial probe height, and comprises the following steps: acquiring a first preset resistance value; comparing the magnitude relation between the first probe resistance and a second preset resistance; obtaining a probe calibration height according to the size relation and the initial probe height;
and a third acquisition module: the method comprises the steps of obtaining a first probe coordinate of the probe in a second preset calibration position, obtaining a first camera coordinate and a second camera coordinate of a camera in the first probe coordinate, and obtaining a center point coordinate of the camera;
a first calculation module: the method for obtaining the second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate, and obtaining the second probe coordinate according to the first probe coordinate, the first camera coordinate, the second camera coordinate and the center point coordinate comprises the following steps: obtaining a first coordinate difference according to the first probe coordinate and the first camera coordinate, wherein the first probe coordinate is (X1, Y1), the first camera coordinate is (X2, Y2), and the first coordinate difference is (X1-X2, Y1-Y2); obtaining a second coordinate difference according to the second camera coordinate and the center point coordinate, wherein the second camera coordinate is (X3, Y3), the center point coordinate is (X4, Y4), and the second coordinate difference is (X3-X4, Y3-Y4); obtaining a second probe coordinate according to the first coordinate difference and the second coordinate difference, wherein the second probe coordinate is (X, Y) = (X1-X2 + X3-X4, Y1-Y2+ Y3-Y4);
a second calculation module: the probe calibration method comprises the steps of obtaining calibration coordinates of the probe according to the probe calibration height and the second probe coordinates;
and a probe calibration module: and the probe is used for carrying out calibration processing on the probe according to the calibration coordinates.
7. An electronic device comprising a memory and a processor, wherein the memory stores a program that when executed by the processor is configured to perform:
the method of any one of claims 1 to 5.
8. A storage medium that is a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program that, when executed by a computer, is operable to perform:
the method of any one of claims 1 to 5.
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