CN115201574A - Resistance detection and sensor preparation method and device, electronic equipment and storage medium - Google Patents

Abstract

The application provides a resistance detection and sensor preparation method, a resistance detection and sensor preparation device, electronic equipment and a storage medium, which are applied to a resistance detection system and used for detecting the resistance attribute of an element to be detected; the resistance detection system includes: the device comprises a first conductive base material, a second conductive base material, a pressure applying element and a detection element; the method comprises the following steps: applying pressure to one or both of the first conductive substrate and the second conductive substrate through a pressure applying element so as to form an electric communication path among the first conductive substrate, the element to be tested and the second conductive substrate; detecting a resistance value of the electrical communication path through the detection element; and determining the resistance property of the element to be tested according to the resistance value of the electric communication path. This application is through placing the component to be measured between two electrically conductive substrate to through exerting pressure to the component of exerting pressure so that form the route between this component to be measured and these two electrically conductive substrate, and then can detect the circuit of route through detecting element, realize the resistance detection to the component to be measured's on the vertical direction.

Description

Resistance detection and sensor preparation method and device, electronic equipment and storage medium

Technical Field

The embodiment of the application relates to the field of resistance detection, in particular to a resistance detection and sensor preparation method, a resistance detection and sensor preparation device, electronic equipment and a storage medium.

Background

Conventional ink resistance sensing typically measures horizontal resistance. For example, the traditional way of measuring the resistance of screen printing ink is: after drying, a multimeter is used to contact two ends of the horizontal electrode to read the resistance of the electrode, which is the horizontal resistance of the screen printing ink. In addition to the resistance in the horizontal direction, the ink also has a certain resistance in the vertical direction, but at present, there is no one that can be used for measuring the resistance in the vertical direction of the ink.

Disclosure of Invention

In view of the above, an object of the embodiments of the present application is to provide a method and an apparatus for manufacturing a resistance detection and sensor, an electronic device, and a storage medium. The resistance in the ink vertical direction can be detected.

In a first aspect, an embodiment of the present application provides a resistance detection method, which is applied to a resistance detection system and used for detecting a resistance attribute of an element to be detected; the resistance detection system includes: the device comprises a first conductive base material, a second conductive base material, a pressure applying element and a detection element; the pressing element is arranged on the outer side surface of one or both of the first conductive substrate and the second conductive substrate, the first conductive substrate and the second conductive substrate are arranged at intervals, so that the element to be detected is arranged between the inner side surfaces of the first conductive substrate and the second conductive substrate and is in contact with the inner side surface of one or both of the first conductive substrate and the second conductive substrate during detection, and the detection element is respectively connected with the first conductive substrate and the second conductive substrate; the method comprises the following steps: applying pressure to one or both of the first conductive substrate and the second conductive substrate through the pressure applying element to form an electrical communication path among the first conductive substrate, the detecting element, the element to be tested and the second conductive substrate; detecting a resistance value of the electrical communication path through the detection element; and determining the resistance attribute of the element to be tested according to the resistance value of the electric communication path.

In the implementation process, the element to be tested is placed between the first conductive substrate and the second conductive substrate, and pressure is applied to one or both of the first conductive substrate and the second conductive substrate, so that an electric communication path is formed among the element to be tested, the first conductive substrate and the second conductive substrate, and the resistance value of the electric communication path is detected through the detection element. Because the resistance value of first electrically conductive substrate and second electrically conductive substrate is certain, and then can confirm the resistance value of element to be measured according to this electric communication path's resistance value, and then realize confirming the resistance value of element to be measured in the vertical direction, increased the resistance value survey's of element to be measured dimension, improved the resistance value detection's of element to be measured precision.

With reference to the first aspect, an embodiment of the present application provides a first possible implementation manner of the first aspect, where: the pressure applied by the pressing element to either or both of the first and second conductive substrates comprises a varying pressure; the electrical resistance of the electrical communication path is related to the varying pressure.

In the implementation process, because the surface of the element to be detected is uneven, the change rule of the resistance value of the element to be detected along with the change of the pressure value applied by the pressure applying element can be detected by changing the pressure value applied by the pressure applying element, and the resistance attribute of the element to be detected is further determined. The resistance value of the element to be detected is detected through the changed pressure, and the accuracy of detecting the resistance value of the element to be detected is improved.

With reference to the first possible implementation manner of the first aspect, an embodiment of the present application provides a second possible implementation manner of the first aspect, where: the pressure applied by the pressure applying element to one or both of the first conductive substrate and the second conductive substrate comprises a regularly changing pressure.

In the implementation process, the pressure applying element applies regularly changed pressure to one or both of the first conductive base material and the second conductive base material, and the resistance value of the element to be detected, which changes along with the regularly changed pressure, can be detected according to the regularly changed pressure, so that the change rule of the resistance value of the element to be detected is obtained, and the accuracy of detecting the resistance value of the element to be detected is improved.

In combination with the second possible implementation manner of the first aspect, the present application provides a third possible implementation manner of the first aspect, wherein a resistance variation curve of the element to be tested is determined according to the varied pressure and the resistance value of the electrical communication path; the determining the resistance property of the element to be tested according to the resistance value of the electric communication path comprises the following steps: and determining the resistance attribute of the element to be tested according to the resistance change curve.

In the implementation process, the resistance change curve of the element to be tested is determined according to the change of the resistance value of the element to be tested along with the pressure value of the pressure applying element, and then the resistance attribute of the element to be tested is determined according to the change curve, so that the resistance change of the element to be tested is more visual, and the more visual and accurate resistance attribute is obtained, and the accuracy of the resistance attribute of the element to be tested is improved.

With reference to the third possible implementation manner of the first aspect, the present application provides an example of a fourth possible implementation manner of the first aspect, where the element to be tested is ink.

In the implementation process, the contact resistance value of the ink on the ink surface in the vertical direction can be detected by the resistance detection method, the dimension of ink resistance detection is increased, the defects of the traditional ink resistance measurement method are overcome, and the accuracy of ink resistance measurement is improved.

In a second aspect, an embodiment of the present application further provides a resistance detection apparatus, including the apparatus, which is applied to a resistance detection system, and is used to detect a resistance attribute of an element to be detected; the resistance detection system includes: the device comprises a first conductive base material, a second conductive base material, a pressure applying element and a detection element; the pressing element is arranged on the outer side surface of one or both of the first conductive substrate and the second conductive substrate, the first conductive substrate and the second conductive substrate are arranged at intervals, so that the element to be detected is arranged between the inner side surfaces of the first conductive substrate and the second conductive substrate and is in contact with the inner side surface of one or both of the first conductive substrate and the second conductive substrate during detection, and the detection element is respectively connected with the first conductive substrate and the second conductive substrate; the device comprises: a pressure application module: the pressing element is used for applying pressure to one or both of the first conductive substrate and the second conductive substrate so as to form an electric communication path among the first conductive substrate, the detection element, the element to be detected and the second conductive substrate; a detection module: a resistance value for detecting the electrical communication path through the detection element; and a determination module: the resistance property of the element to be tested is determined according to the resistance value of the electric communication path.

In a third aspect, an embodiment of the present application provides a sensor manufacturing method, where an attribute segment that satisfies a resistance attribute of a target sensor is determined according to a resistance attribute of an element to be measured; preparing the target sensor through the attribute section of the element to be detected; wherein the resistance property of the element to be tested is obtained by the resistance detection method of any one of the first aspect.

In the implementation process, the attribute section meeting the requirement of the target sensor in the resistance attribute of the element to be detected is determined according to the preparation condition of the target sensor, and then the target sensor is prepared according to the element to be detected, so that the resistance attribute of the target sensor can be determined according to the resistance attribute of the element to be detected, and the preparation of the target sensor is simplified.

In a fourth aspect, an embodiment of the present application provides a sensor preparation apparatus, where the first determination module: the attribute section is used for determining the attribute section meeting the resistance attribute of the target sensor according to the resistance attribute of the element to be detected; preparing a module: the method is used for preparing the target sensor through the property section of the element to be detected, wherein the resistance property of the element to be detected is obtained through detection by the resistance detection method in any one of the first aspect.

In a fifth aspect, an embodiment of the present application further provides a control system, including: a processor, a memory storing machine-readable instructions executable by the processor, the machine-readable instructions, when executed by the processor, performing the steps of the method of the first aspect described above, or any possible implementation of the first aspect, when the electronic device is run.

In a sixth aspect, this application provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, where the computer program is executed by a processor to perform the steps of the steering control method for a multi-wheel independent drive motor according to the first aspect, or any one of the possible implementations of the first aspect.

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a resistance detection system provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of an element to be tested in an embodiment of the present application during testing;

fig. 3 is a flowchart of a resistance detection method according to an embodiment of the present application;

FIG. 4 is a resistance variation curve showing the variation of the resistance of the DUT with the gradual pressure variation in the embodiment of the present application;

FIG. 5 is a flow chart of a method for manufacturing a sensor provided in an embodiment of the present application;

fig. 6 is a schematic functional block diagram of a resistance detection apparatus according to an embodiment of the present application;

fig. 7 is a schematic functional block diagram of a sensor preparation apparatus provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures. Meanwhile, in the description of the embodiments of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not construed as indicating or implying relative importance.

In the description of the embodiments of the present application, it should be noted that the terms "upper", "lower", "inside", "outside", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the product usually visits when in use, and are only for convenience of describing and simplifying the embodiments of the present application, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting in the embodiments of the present application.

In the description of the embodiments of the present application, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood in specific cases by those of ordinary skill in the art.

At present, a display panel with a touch function is widely applied to various display products such as mobile phones, tablet computers, information query machines in public halls and the like as an information input tool. Therefore, the user can operate the electronic equipment by only touching the mark on the display panel with fingers, dependence of the user on other equipment (such as a keyboard, a mouse and the like) is eliminated, and man-machine interaction is simpler. In order to better meet the requirements of users, a pressure sensor for detecting the magnitude of a touch pressure value when a user touches a display panel is usually arranged in the display panel, so that the display panel can not only collect touch position information, but also collect the magnitude of the touch pressure value, and the application range of the touch display technology is expanded.

The inventor of the application discovers through long-term research that in the existing screen printing process, the ink permeates to the substrate through meshes, the surface of the dried ink is uneven, and the ink can be printed on the metal substrate through the screen printing, and the metal on the upper surface of the ink is horizontally placed and contacted to form a loop through pressing. Through applying different pressure and then obtaining the resistance attribute of printing ink in this pressing return circuit to based on the resistance attribute preparation sensor of printing ink, so that should be according to gathering the corresponding signal of telecommunication of pressure value size feedback at pressure sensor, with abundant pressure sensor's range of application.

Fig. 1 is a schematic structural diagram of a resistance detection system provided in an embodiment of the present application. As shown in fig. 1, the resistance sensing system 100 includes: a first conductive substrate 110, a second conductive substrate 120, a pressing member 130, and a detecting member 140.

The pressing element 130 is disposed on the outer surface of one or both of the first conductive substrate 110 and the second conductive substrate 120, the first conductive substrate 110 and the second conductive substrate 120 are disposed at an interval, so that the device 200 to be tested is disposed between the inner surfaces of the first conductive substrate 110 and the second conductive substrate 120 and is in contact with the inner surface of one or both of the first conductive substrate 110 and the second conductive substrate 120 during testing, and the testing element 140 is connected to the first conductive substrate 110 and the second conductive substrate 120 respectively.

Here, the first conductive substrate 110 or the second conductive substrate 120 may be formed of any conductive material such as a metal conductive substrate, an ion conductive substrate, a graphite conductive substrate, and the like. For example, the first conductive substrate 110 or the second conductive substrate 120 can be one or more materials such as silver, aluminum, copper, graphite, molten electrolyte, and the like. The first conductive substrate 110 and the second conductive substrate 120 may be the same conductive substrate or different conductive substrates. The material selection of the first conductive substrate 110 and the second conductive substrate 120 can be adjusted according to practical situations, and the application is not particularly limited.

The above-mentioned pressing member 130 may be a weight, a pressure applying device, or the like. The pressing element 130 may directly adjust the element pressure output value to the pressure value applied to one or both of the first conductive substrate 110 and the second conductive substrate 120 by adjusting the element pressure output value to the pressing element 130, or may adjust the element pressure output value to the pressure value applied to one or both of the first conductive substrate 110 and the second conductive substrate 120 by adding a corresponding number of weights to the pressing element 130. The method of applying the pressure by the pressure applying element 130 to one or both of the first conductive substrate 110 and the second conductive substrate 120 can be adjusted according to the actual situation, and the application is not limited in any way.

The device under test 200 of the present application includes, but is not limited to, ink, conductive film, and the like.

It is understood that the dut may be placed on the inner surface of the first conductive substrate 110 when the dut is to be tested. During detection, by applying pressure to the pressing element 130, the pressing element 130 compresses the conductive substrate on which the pressing element 130 is located, so that the separation distance between the first conductive substrate 110 and the second conductive substrate 120 is gradually reduced, and the device to be detected simultaneously contacts the inner surfaces of the first conductive substrate 110 and the second conductive substrate 120, so that an electrical communication path is formed between the first conductive substrate 110, the detection element 140, the second conductive substrate 120 and the device to be detected.

The detection element 140 may be a multimeter, a resistance tester, or the like.

As shown in fig. 2, fig. 2 is a schematic structural diagram of an element to be tested according to an embodiment of the present application during testing. When the device 200 to be tested is tested, the detecting element 140 is connected to the first conductive substrate 110 and the second conductive substrate 120, respectively, and when the pressing element 130 applies pressure, the detecting element 140 forms an electrical communication path with the first conductive substrate 110, the second conductive substrate 120 and the device 200 to be tested. The sensing element 140 is used to sense the resistance of the electrical communication path.

Please refer to fig. 3, which is a flowchart illustrating a resistance detection method according to an embodiment of the present disclosure. The specific flow shown in fig. 3 will be described in detail below.

Step 201, applying pressure to one or both of the first conductive substrate and the second conductive substrate through a pressure applying element to form an electrical communication path among the first conductive substrate, the device to be tested and the second conductive substrate.

The pressing element can be connected with a terminal control device, and when the element to be detected is detected, a worker can input a pressure value to be applied to the terminal control device so as to control the pressing element to apply corresponding pressure to one or both of the first conductive base material and the second conductive base material. The pressure applying element here may also be a weight, and when detecting the component to be detected, the operator may control the pressure applying element to apply a corresponding pressure to one or both of the first conductive substrate and the second conductive substrate by controlling the number and weight of the weights.

The operation process of the resistance detection system in this embodiment can be illustrated by the following examples:

illustratively, when the pressing member is disposed on the first conductive substrate, the pressing member applies a pressure to the first conductive substrate, and the first conductive substrate deforms under the pressure and approaches the second conductive substrate. At this time, if the device to be tested is disposed on the first conductive substrate, the first conductive substrate drives the device to be tested to approach the second conductive substrate, and the device to be tested touches the second conductive substrate. Because the detection element is respectively connected with the first conductive base material and the second conductive base material, an electric communication path is formed among the first conductive base material, the element to be detected of the second conductive base material and the detection element.

When the pressing element is arranged on the first conductive base material, the pressing element applies pressure to the first conductive base material, and the first conductive base material deforms under the action of the pressure and approaches the second conductive base material. At this time, if the device to be tested is disposed on the second conductive substrate, the first conductive substrate gradually touches the device to be tested under the pressure. Because the detection element is respectively connected with the first conductive base material and the second conductive base material, an electric communication path is formed among the first conductive base material, the element to be detected of the second conductive base material and the detection element.

When the pressing element is arranged on the second conductive base material, the pressing element applies pressure to the second conductive base material, and the second conductive base material deforms under the action of the pressure and approaches the first conductive base material. At this time, if the device to be tested is disposed on the first conductive substrate, the second conductive substrate gradually touches the device to be tested under the action of pressure. Because the detection element is respectively connected with the first conductive base material and the second conductive base material, an electric communication path is formed among the first conductive base material, the element to be detected of the second conductive base material and the detection element.

When the pressing element is arranged on the second conductive base material, the pressing element applies pressure to the second conductive base material, and the second conductive base material deforms under the action of the pressure and approaches the first conductive base material. At this time, if the device to be tested is disposed on the second conductive substrate, the second conductive substrate drives the device to be tested to approach the first conductive substrate, and the device to be tested touches the first conductive substrate. Because the detection element is respectively connected with the first conductive base material and the second conductive base material, an electric communication path is formed among the first conductive base material, the element to be detected on the second conductive base material and the detection element.

In some embodiments, the pressing member may be further provided in plurality, and the plurality of pressing members may be provided on an outer surface of one or both of the first conductive substrate and the second conductive substrate. For example, if there are 2 pressing members, the 2 pressing members may be respectively disposed on the outer surfaces of the first conductive substrate and the second conductive substrate, and the 2 pressing members may be both disposed on the outer surface of one of the first conductive substrate and the second conductive substrate.

In step 202, the resistance value of the electrical communication path is detected by the detection element.

It is understood that the detection element is disposed in the electrical communication path, and when the electrical communication path is connected, the detection element displays a resistance value, that is, a resistance value of the electrical communication path.

The resistance value of the electrical communication path may include resistance values of the first conductive substrate, the second conductive substrate, and the device under test.

And step 203, determining the resistance attribute of the element to be tested according to the resistance value of the electric communication path.

It can be understood that, the first conductive substrate and the second conductive substrate are fixedly disposed elements, and the resistance values of the first conductive substrate and the second conductive substrate are fixed values, and after the resistance value of the electrical communication path is detected, the resistance values of the element to be tested are obtained by removing the resistance values of the first conductive substrate and the second conductive substrate in the resistance value of the electrical communication path, and then the resistance property of the element to be tested can be determined according to the resistance value of the element to be tested.

In some embodiments, the first conductive substrate and the second conductive substrate may be regarded as wires, the resistance values of the first conductive substrate and the second conductive substrate may be negligible, the resistance value of the device to be tested is the resistance value of the electrical communication path, and the resistance property of the resistance value of the electrical communication path may be directly determined as the resistance property of the device to be tested.

The resistance property here includes, but is not limited to, the resistance value of the element to be measured, the relationship between the resistance value of the element to be measured and the pressure value applied by the pressure applying element, and the like.

In the implementation process, the element to be tested is placed between the first conductive substrate and the second conductive substrate, and pressure is applied to one or both of the first conductive substrate and the second conductive substrate, so that an electric communication path is formed among the element to be tested, the first conductive substrate and the second conductive substrate, and the resistance value of the electric communication path is detected through the detection element. Because the resistance value of first electrically conductive substrate and the electrically conductive substrate of second is certain, and then can confirm the resistance value of the component that awaits measuring according to the resistance value of this electricity intercommunication route, and then realize confirming the resistance value in the vertical direction of the component that awaits measuring, increased the dimensionality of the resistance value survey of the component that awaits measuring, improved the resistance value detection's of the component that awaits measuring precision.

In one possible implementation, the pressure applied by the pressure applying element to one or both of the first conductive substrate and the second conductive substrate comprises a varying pressure; the electrical resistance of the electrical communication path is associated with the varying pressure.

It is understood that the surface of the device under test may be uneven, and the device under test may not be completely in contact with the inner surfaces of the first conductive substrate and the second conductive substrate when the pressing member applies pressure to one or both of the first conductive substrate and the second conductive substrate. Under different pressures, the contact degree between the element to be tested and the first conductive substrate and the second conductive substrate is different, and the generated resistance values are also different.

Illustratively, the element to be tested is ink, and the surface of the ink is uneven. The ink is disposed between and in contact with the inner surfaces of the first and second conductive substrates, respectively. If the pressure value applied by the device under test is a, the protruding portion of the device under test is in contact with the inner surfaces of the first conductive substrate and the second conductive substrate, respectively, and the resistance value of the device under test may be a. If the pressure value applied by the dut is B, the protruding portion of the dut and some of the recessed shallower portions of the recessed portion are in contact with the inner surfaces of the first conductive substrate and the second conductive substrate, respectively, and the resistance value of the dut may be B. If the pressure value applied by the device under test is C, the convex portion and the concave portion of the device under test are respectively in contact with the inner surfaces of the first conductive substrate and the second conductive substrate, and the resistance value of the device under test can be C. Where a < B < C, a > B > C, it is understood that the variation of the resistance value of the element under test with the pressure value of the pressure applying element is merely exemplary.

In the implementation process, because the surface of the element to be detected is uneven, the change rule of the resistance value of the element to be detected along with the change of the pressure value applied by the pressure applying element can be detected by changing the pressure value applied by the pressure applying element, and the resistance attribute of the element to be detected is further determined. The resistance value of the element to be detected is detected through the changed pressure, and the accuracy of detecting the resistance value of the element to be detected is improved.

In one possible implementation, the pressure applied by the pressure applying element to one or both of the first conductive substrate and the second conductive substrate includes a regularly varying pressure.

When the resistance value of the element to be tested is electrically measured, the resistance value of the element to be tested along with the change pressure can be measured by applying the change pressure to one or both of the first conductive base material and the second conductive base material. In the actual detection process, the change of the pressure can be regular, and further, the rule that the original year to be detected changes along with the change of the pressure can be determined according to the pressure change rule.

It is understood that the pressure may be varied from small to large or from large to small. For example, if the pressure of the regular change can be from small to large, the pressure applied by the pressing element to one or both of the first conductive substrate and the second conductive substrate can be gradually adjusted from 0N to 10N, and then the resistance value of the device under test is detected as the pressure is gradually adjusted from 0N to 10N. If the pressure of the regular change can be from large to small, the pressure applied by the pressure applying element to one or both of the first conductive substrate and the second conductive substrate can be gradually adjusted from 10N to 0N, and then the resistance value of the element to be detected is detected when the pressure is gradually adjusted from 10N to 0N.

In some embodiments, the regularly changing pressures may be changed at the same pressure interval or at different pressure intervals. For example, if the pressure is changed at the same pressure interval and the pressure is gradually adjusted from 0N to 10N, the pressure interval is 1N, the pressure may be adjusted at 0N, 1N, 2N, 3N, 4N, 5N, 6N, 7N, 8N, 9N, 10N, respectively. The pressure which changes regularly is changed according to different pressure intervals, the pressure is gradually adjusted from 0N to 10N, the pressure intervals can be randomly adjusted, and then the pressure can be respectively adjusted by 0N, 3N, 4N, 7N, 8N, 10N and the like. It is understood that the pressure interval is only exemplary, and the pressure interval can be adjusted according to actual conditions, and the application is not limited in particular.

In some embodiments, the regularly changing pressure may be a continuously changing pressure.

In the implementation process, the pressure applying element applies regularly changed pressure to one or both of the first conductive base material and the second conductive base material, and the resistance value of the element to be detected, which changes along with the regularly changed pressure, can be detected according to the regularly changed pressure, so that the change rule of the resistance value of the element to be detected is obtained, and the accuracy of detecting the resistance value of the element to be detected is improved.

In a possible implementation manner, before step 203, the method further includes: and determining the resistance change curve of the element to be tested according to the changed pressure and the resistance value of the electric communication channel.

Because the surface of the element to be measured is uneven, when the pressing element applies pressure to two or one of the first conductive substrate and the second conductive substrate, the contact area between the element to be measured and the inner surfaces of the first conductive substrate and the second conductive substrate can be gradually changed, and further the resistance value of the electric communication path can be changed along with the change, and when the contact area between the element to be measured and the inner surfaces of the first conductive substrate and the second conductive substrate reaches the maximum, the resistance value of the element to be measured does not change along with the increase of the pressure. The resistance change curve can be determined according to the pressure value applied by the pressure applying element and the change rule of the resistance value of the element to be measured. As shown in fig. 4, fig. 4 is a resistance variation curve of the resistance value of the device under test according to the embodiment of the present application changing with the gradual change of the pressure.

Step 203 comprises: and determining the resistance attribute of the element to be measured according to the resistance change curve.

It can be understood that the resistance variation of the dut can be divided into a plurality of variation segments, and each variation segment corresponds to a different resistance property.

For example, as shown in fig. 4, the resistance value variation of the device under test can be divided into a variation section and a stable section. Wherein the resistance value of the variable section changes with the pressure value of the pressure applying element, and the resistance value of the stable section does not change with the pressure value of the pressure applying element. The resistance attribute of the element to be measured in the variation section can be determined according to the variation rule of the variation section, and the resistance attribute of the element to be measured in the stable section can be determined according to the variation rule of the resistance value of the stable section.

In the implementation process, the resistance change curve of the element to be tested is determined according to the change of the resistance value of the element to be tested along with the pressure value of the pressure applying element, and then the resistance attribute of the element to be tested is determined according to the change curve, so that the resistance change of the element to be tested is more visual, and the more visual and accurate resistance attribute is obtained, and the accuracy of the resistance attribute of the element to be tested is improved.

In one possible implementation, the component to be tested is ink.

Inks herein include, but are not limited to, screen printing inks, letterpress printing inks, gravure printing inks, lithographic printing inks.

In the implementation process, the contact resistance value of the ink on the ink surface in the vertical direction can be detected by the resistance detection method, the dimension of ink resistance detection is increased, the defects of the traditional ink resistance measurement method are overcome, and the accuracy of ink resistance measurement is improved.

Please refer to fig. 5, which is a flowchart illustrating a method for manufacturing a sensor according to an embodiment of the present disclosure. The specific flow shown in fig. 5 will be described in detail below.

Step 301, determining an attribute segment meeting the resistance attribute of the target sensor according to the resistance attribute of the element to be measured.

The resistance property of the element to be measured is obtained by the resistance detection method.

The target sensor may be a pressure sensor.

If the target sensor is a pressure sensor, the resistance property of the property section of the resistance property of the pressure sensor can be determined, and the resistance property of the change section of the element to be measured can be determined.

Step 302, a target sensor is prepared through the attribute section of the element to be measured.

It will be appreciated that the pressure sensor may be used to convert a pressure signal into an electrical signal for use in determining a value of pressure applied to a component of the pressure sensor based on a resistance value fed back by the pressure sensor. Based on the pressure sensor effect, the components used to make the pressure sensor need to meet the requirement that the electrical signal can vary as the pressure value varies. Therefore, if a pressure sensor is manufactured using the device under test, the device under test of the changed section can be selected to perform the manufacturing of the pressure sensor. For example, as shown in fig. 4, 0-k segments of the dut can be selected for the fabrication of the pressure sensor.

In some embodiments, the electrical signal need not vary with the pressure value if the components used to make the subject sensor. Therefore, if the pressure sensor is manufactured by using the device under test, the device under test of the plateau section can be selected for manufacturing the pressure sensor.

In the implementation process, the attribute section meeting the requirement of the target sensor in the resistance attribute of the element to be detected is determined according to the preparation condition of the target sensor, and then the target sensor is prepared according to the element to be detected, so that the resistance attribute of the target sensor can be determined according to the resistance attribute of the element to be detected, and the preparation of the target sensor is simplified.

Based on the same application concept, a resistance detection device corresponding to the resistance detection method is further provided in the embodiments of the present application, and since the principle of solving the problem of the device in the embodiments of the present application is similar to that in the embodiments of the resistance detection method, the implementation of the device in the embodiments of the present application may refer to the description in the embodiments of the method, and repeated details are not repeated.

Fig. 6 is a schematic diagram of functional modules of a resistance detection apparatus according to an embodiment of the present disclosure. Each module in the resistance detection apparatus in this embodiment is configured to perform each step in the above method embodiment. The device is applied to a resistance detection system and used for detecting the resistance attribute of the element to be detected; the resistance detection system includes: the device comprises a first conductive base material, a second conductive base material, a pressure applying element and a detection element; the first conductive substrate and the second conductive substrate are arranged at intervals, so that the element to be tested is arranged between the inner side surfaces of the first conductive substrate and the second conductive substrate and is in contact with the inner side surface of one or both of the first conductive substrate and the second conductive substrate during detection; the pressure applying element is arranged on the outer side surface of one or both of the first conductive substrate and the second conductive substrate; the resistance detection device comprises a pressure applying module 401, a detection module 402 and a first determining module 403; wherein the content of the first and second substances,

the pressure applying module 401 is configured to apply pressure to one or both of the first conductive substrate and the second conductive substrate through the pressing element, so as to form an electrical communication path between the first conductive substrate, the detecting element, the device under test, and the second conductive substrate.

The detection module 402 is used for detecting the resistance value of the electric communication path through the detection element.

The first determining module 403 is configured to determine a resistance property of the device under test according to the resistance value of the electrical communication path.

In a possible implementation, the first determining module 403 is further configured to: determining a resistance change curve of the element to be tested according to the changed pressure and the resistance value of the electric communication channel; the determining the resistance property of the element to be tested according to the resistance value of the electric communication path comprises the following steps: and determining the resistance attribute of the element to be tested according to the resistance change curve.

Based on the same application concept, a sensor preparation device corresponding to the sensor preparation method is further provided in the embodiments of the present application, and since the principle of solving the problem of the device in the embodiments of the present application is similar to that in the embodiments of the sensor preparation method, the implementation of the device in the embodiments of the present application can refer to the description in the embodiments of the method, and repeated details are not repeated.

Please refer to fig. 7, which is a schematic diagram of a functional module of a sensor manufacturing apparatus according to an embodiment of the present disclosure. The various modules in the sensor preparation apparatus in this embodiment are used to perform the various steps in the method embodiments described above. The sensor preparation device comprises a second determination module 501 and a preparation module 502; wherein the content of the first and second substances,

the second determining module 501 is configured to determine an attribute segment that satisfies the resistance attribute of the target sensor according to the resistance attribute of the device under test.

The preparation module 502 is configured to prepare the target sensor according to the property segment of the device under test, where the resistance property of the device under test is obtained by the resistance detection method.

In addition, the present application also provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the computer program performs the steps of the resistance detection method and/or the sensor preparation method described in the above method embodiments.

The computer program product of the resistance detection method and/or the sensor manufacturing method provided in the embodiments of the present application includes a computer-readable storage medium storing a program code, where instructions included in the program code may be used to execute steps of the resistance detection method and/or the sensor manufacturing method described in the above method embodiments, which may be specifically referred to in the above method embodiments and are not repeated here.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method can be implemented in other ways. The apparatus embodiments described above are merely illustrative and, for example, the flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

In addition, functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

The functions may be stored in a computer-readable storage medium if they are implemented in the form of software functional modules and sold or used as separate products. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes. It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The resistance detection method is applied to a resistance detection system and used for detecting the resistance attribute of an element to be detected; the resistance detection system includes: the device comprises a first conductive base material, a second conductive base material, a pressure applying element and a detection element; the pressing element is arranged on the outer side surface of one or both of the first conductive substrate and the second conductive substrate, the first conductive substrate and the second conductive substrate are arranged at intervals, so that the element to be detected is arranged between the inner side surfaces of the first conductive substrate and the second conductive substrate and is in contact with the inner side surface of one or both of the first conductive substrate and the second conductive substrate during detection, and the detection element is respectively connected with the first conductive substrate and the second conductive substrate;

the method comprises the following steps:

applying pressure to one or both of the first conductive substrate and the second conductive substrate through the pressure applying element so as to form an electric communication path among the first conductive substrate, the detection element, the element to be detected and the second conductive substrate;

detecting a resistance value of the electrical communication path through the detection element; and

and determining the resistance attribute of the element to be tested according to the resistance value of the electric communication channel.

2. The method of claim 1, wherein the pressure applied by the pressure applying element to one or both of the first and second conductive substrates comprises a varying pressure; the electrical resistance value of the electrical communication path is correlated to the varying pressure.

3. The method of claim 2, wherein the pressure applied by the pressure applicator element to one or both of the first and second conductive substrates comprises a regularly varying pressure.

4. The method of claim 2, wherein prior to determining the resistive property of the component to be tested based on the resistance value of the electrical communication path, the method further comprises:

determining a resistance change curve of the element to be tested according to the changed pressure and the resistance value of the electric communication channel;

the determining the resistance property of the element to be tested according to the resistance value of the electric communication path comprises the following steps: and determining the resistance attribute of the element to be tested according to the resistance change curve.

5. The method according to any one of claims 1 to 4, wherein the component to be tested is ink.

6. A resistance sensing device, comprising: the device is applied to a resistance detection system and used for detecting the resistance attribute of the element to be detected;

the resistance detection system includes: the device comprises a first conductive base material, a second conductive base material, a pressure applying element and a detection element; the pressing element is arranged on the outer side surface of one or both of the first conductive substrate and the second conductive substrate, the first conductive substrate and the second conductive substrate are arranged at intervals, so that the element to be detected is arranged between the inner side surfaces of the first conductive substrate and the second conductive substrate and is in contact with the inner side surface of one or both of the first conductive substrate and the second conductive substrate during detection, and the detection element is respectively connected with the first conductive substrate and the second conductive substrate;

the device comprises:

a pressure application module: the pressing element is used for applying pressure to one or both of the first conductive substrate and the second conductive substrate so as to form an electric communication path among the first conductive substrate, the detection element, the element to be detected and the second conductive substrate;

a detection module: a resistance value for detecting the electrical communication path through the detection element; and

a first determination module: the resistance property of the element to be tested is determined according to the resistance value of the electric communication path.

7. A method for manufacturing a sensor is characterized in that,

determining an attribute section meeting the resistance attribute of the target sensor according to the resistance attribute of the element to be detected;

preparing the target sensor through the attribute section of the element to be detected;

wherein the resistance property of the device under test is detected by the resistance detection method according to any one of claims 1 to 5.

8. A sensor manufacturing device is characterized in that,

a second determination module: the attribute section is used for determining the attribute section meeting the resistance attribute of the target sensor according to the resistance attribute of the element to be detected;

preparing a module: the method is used for preparing the target sensor through the property section of the element to be detected, wherein the resistance property of the element to be detected is detected by the resistance detection method of any one of claims 1 to 5.

9. An electronic device, comprising: a processor, a memory storing machine-readable instructions executable by the processor, the machine-readable instructions when executed by the processor performing the steps of the method of any of claims 1 to 5 or 7 when the electronic device is run.

10. A computer-readable storage medium, having stored thereon a computer program which, when being executed by a processor, is adapted to carry out the steps of the method according to any one of claims 1 to 5 or 7.

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