CN212573090U - PCB structure for optimizing high-speed signal backflow ground hole - Google Patents
PCB structure for optimizing high-speed signal backflow ground hole Download PDFInfo
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- CN212573090U CN212573090U CN202021442843.4U CN202021442843U CN212573090U CN 212573090 U CN212573090 U CN 212573090U CN 202021442843 U CN202021442843 U CN 202021442843U CN 212573090 U CN212573090 U CN 212573090U
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Abstract
The utility model discloses an optimize PCB structure in high-speed signal backward flow ground hole, including the PCB board, be provided with a plurality of high-speed signal on the PCB board and trade a layer hole, each the periphery that the high-speed signal traded a layer hole all is provided with a high-speed signal backward flow ground hole, high-speed signal backward flow ground hole coats and is stamped ground copper skin. The utility model discloses a high-speed signal backward flow ground hole coats and is stamped the copper sheet of ground attribute, because there is the existence of this copper sheet, high-speed signal backward flow ground hole can effectively avoid being adsorbed the attribute by other network signal via holes to guarantee that high-speed signal flows back nearby, reduce electromagnetic radiation, improve the transmission integrality of signal greatly.
Description
Technical Field
The utility model relates to a PCB technical field, specific theory relates to a optimize PCB structure in high-speed signal backward flow ground hole.
Background
A Printed Circuit Board (PCB) is also called a PCB, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. Packaging refers to the routing of circuit pins on a silicon die to external connections for connection to other devices. The circuit of the schematic diagram is reflected in the PCB board by packaging and wiring, and one package corresponds to one component.
In the application process of the high-speed circuit PCB, along with the increasing of the speed of an integrated circuit switch and the density of the PCB, whether a signal can be completely transmitted from a transmitting end to a receiving end becomes a key link which must be faced and considered by the high-speed circuit PCB, wherein the backflow of the high-speed signal is a key factor influencing the integrity of the signal, the backflow of the high-speed signal is not good, the backflow signal is influenced by electromagnetic radiation, and the higher the electromagnetic radiation rate is, the more serious the backflow signal is, and finally the signal cannot be completely transmitted.
Usually in high speed circuit PCB board design process, the high speed signal can add backward flow ground hole in the place of trading the layer and walk the line, for the backward flow avoids introducing electromagnetic radiation as soon as possible at a high speed, need add backward flow ground hole alone, the signal can backward flow nearby, because can not share with other ground holes, it is very easy by other network signal adsorption attribute to add backward flow ground hole alone, becomes other network signal via holes. Therefore, how to maximally reduce the influence of the adsorption property of the reflow ground hole by other network signals on the signals in the design process is worthy of study.
Disclosure of Invention
In order to overcome the not enough of traditional technique, the utility model provides an optimize PCB structure in high-speed signal backward flow ground hole.
The utility model discloses technical scheme as follows:
the utility model provides an optimize PCB structure in high-speed signal backward flow ground hole, includes the PCB board, its characterized in that, be provided with a plurality of high-speed signal on the PCB board and trade a layer hole, each the periphery in high-speed signal trades a layer hole all is provided with a high-speed signal backward flow ground hole, high-speed signal backward flow ground hole coats and is stamped the ground copper skin.
According to the above scheme the utility model discloses, its characterized in that, the copper sheet is circular.
Furthermore, the diameter of the ground copper sheet is at least 1-3 mil larger than that of the high-speed signal reflow ground hole.
Furthermore, the diameter of the ground copper sheet is 1mil larger than that of the high-speed signal return ground hole.
Furthermore, the diameter of the ground copper sheet is 2mil larger than that of the high-speed signal return ground hole.
Furthermore, the diameter of the ground copper sheet is 3mil larger than that of the high-speed signal return ground hole.
Further, the diameter of the high-speed signal return ground hole is 6-10 mil.
Further, the high-speed signal return hole is 8mil in diameter.
Further, the diameter of the copper sheet is 10 mil.
Further characterized in that the diameter of the ground copper sheet is smaller than the diameter of the bonding pad of the high-speed signal reflow ground hole.
According to the above scheme the utility model discloses, the beneficial effects of the utility model reside in that:
the copper sheet of the ground attribute covers the high-speed signal backflow ground hole, and due to the existence of the copper sheet, the high-speed signal backflow ground hole can effectively avoid the attribute of being absorbed by other network signal through holes, thereby ensuring that a high-speed signal flows back nearby, reducing electromagnetic radiation and greatly improving the transmission integrity of the signal; the utility model discloses processing is simple convenient, and is with low costs, can promote on a large scale.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a PCB structure of a conventional high-speed signal return ground via;
FIG. 3 is a graph comparing the electromagnetic radiation curves of the PCB structure of the present invention and the existing high-speed signal return ground hole;
in the figures, the reference numerals are as follows:
1. a PCB board; 2. high-speed signal layer changing holes; 3. high-speed signal backflow ground hole; 4. and (4) a copper sheet.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail.
As shown in fig. 1, a PCB structure for optimizing a high-speed signal backflow ground hole comprises a PCB board 1, wherein the PCB board 1 is provided with a plurality of high-speed signal layer changing holes 2, a high-speed signal backflow ground hole 3 is formed in the periphery of each high-speed signal layer changing hole 2, and a circular ground copper sheet 4 covers the high-speed signal backflow ground hole 3. The utility model discloses a high-speed signal backward flow ground hole 3 coats the copper sheet that is stamped ground attribute, because there is the existence of this copper sheet, high-speed signal backward flow ground hole 3 can effectively avoid being adsorbed the attribute by other network signal via holes to guarantee that high-speed signal flows back nearby, reduce electromagnetic radiation, improve the transmission integrality of signal greatly.
In one embodiment, the diameter of the ground copper sheet 4 is at least 1mil to 3 mils larger than the diameter of the high-speed signal reflow ground hole 3, the diameter of the ground copper sheet 4 is smaller than the diameter of a pad of the high-speed signal reflow ground hole 3, the arrangement of the diameter of the ground copper sheet 4 can ensure that a high-speed signal reflows nearby, electromagnetic radiation is reduced, and the transmission integrity of the signal is high.
Preferably, the diameter of ground copper sheet 4 is 2mil bigger than the diameter of high-speed signal backward flow ground hole 3, and the diameter of ground copper sheet 4 is less than the diameter of the pad of high-speed signal backward flow ground hole 3, and the setting of this ground copper sheet 4 diameter can guarantee that high-speed signal flows backward nearby, reduces electromagnetic radiation, and the transmission integrality of signal is highest.
Better, the diameter of earth's copper skin 4 is 1mil greater than the diameter of high-speed signal backward flow ground hole 3, and the diameter of earth's copper skin 4 is less than the diameter of the pad of high-speed signal backward flow ground hole 3, and the setting of this earth's copper skin 4 diameter can guarantee that high-speed signal flows backward nearby, reduces electromagnetic radiation, and the transmission integrality of signal is higher.
Better, the diameter of earth's copper skin 4 is greater than 3 mils than the diameter of high-speed signal backward flow ground hole 3, and the diameter of earth's copper skin 4 is less than the diameter of the pad of high-speed signal backward flow ground hole 3, and the setting of this earth's copper skin 4 diameter can guarantee that high-speed signal flows back nearby, reduces electromagnetic radiation, and the transmission integrality of signal is highest.
In one embodiment, the diameter of the high-speed signal return ground hole 3 is 6-10 mil. Preferably, the diameter of high-speed signal backward flow ground hole 3 is 8 mils, and the diameter of ground copper skin 4 is 10 mils, and the setting of this high-speed signal backward flow ground hole 3 and the diameter of ground copper skin 4 can guarantee that high-speed signal flows backward nearby, reduces electromagnetic radiation, and the transmission integrality of signal is the highest.
As shown in fig. 2, the high-speed signal return ground via 3 of the existing PCB structure of the high-speed signal return ground via is not covered with the ground copper sheet 4, and the high-speed signal return ground via 3 is easily absorbed by other network signal via to become other network signal via, so that the return signal is affected by electromagnetic radiation, and the higher the electromagnetic radiation rate is, the more serious the electromagnetic radiation rate is, and finally the signal cannot be completely transmitted.
As shown in fig. 3, the utility model discloses compare with the PCB structure of current high-speed signal backward flow ground hole 3, this real novel electromagnetic radiation curve that receives of high-speed signal backward flow ground hole 3 who takes copper sheet 4 is obviously than the electromagnetic radiation curve that receives of high-speed signal backward flow ground hole 3 who does not take copper sheet 4 will be low. In order to avoid high-speed signal backward flow ground hole 3 not by the adsorption property and become other network signal via holes to lose the effect of backward flow via hole, the utility model discloses a cover circular shape earth copper skin 4 on high-speed backward flow ground hole, simple processing, the effectual problem of not being changed by other network signal via hole adsorption properties of having solved high-speed backward flow ground hole, thereby guarantee the high-speed signal and flow backward nearby, reduce electromagnetic radiation, improve the transmission integrality of signal greatly.
It will be understood that modifications and variations can be effected by a person skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the appended claims.
The above exemplary description of the present invention is made in conjunction with the accompanying drawings, and it is obvious that the present invention is not limited by the above manner, and various improvements made by the method concept and technical solution of the present invention or by directly applying the concept and technical solution of the present invention to other occasions without improvement are all within the protection scope of the present invention.
Claims (10)
1. The utility model provides an optimize PCB structure in high-speed signal backward flow ground hole, includes the PCB board, its characterized in that, be provided with a plurality of high-speed signal on the PCB board and trade a layer hole, each the periphery in high-speed signal trades a layer hole all is provided with a high-speed signal backward flow ground hole, high-speed signal backward flow ground hole coats and is stamped the ground copper skin.
2. The PCB structure for optimizing high speed signal return ground vias of claim 1, wherein said ground plane is circular.
3. The PCB structure for optimizing a high speed signal return ground via of claim 2, wherein a diameter of said ground copper strap is at least 1mil to 3 mils larger than a diameter of said high speed signal return ground via.
4. The PCB structure for optimizing a high speed signal return ground via of claim 3, wherein a diameter of said ground copper strap is 1mil larger than a diameter of said high speed signal return ground via.
5. The PCB structure for optimizing a high speed signal return ground via of claim 3, wherein a diameter of said ground copper strap is 2mil larger than a diameter of said high speed signal return ground via.
6. The PCB structure for optimizing a high speed signal return ground via of claim 3, wherein a diameter of said ground copper strap is 3mil larger than a diameter of said high speed signal return ground via.
7. The PCB structure for optimizing high speed signal return ground vias of claim 3, wherein the diameter of the high speed signal return ground vias is between 6mil and 10 mil.
8. The PCB structure for optimizing high speed signal return ground vias of claim 7, wherein said high speed signal return ground vias have a diameter of 8 mils.
9. The PCB structure for optimizing high speed signal return ground vias of claim 8, wherein said copper ground strap has a diameter of 10 mils.
10. The PCB structure for optimizing a high speed signal return ground via of claim 2, wherein a diameter of the ground copper skin is smaller than a diameter of a pad of the high speed signal return ground via.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021442843.4U CN212573090U (en) | 2020-07-21 | 2020-07-21 | PCB structure for optimizing high-speed signal backflow ground hole |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021442843.4U CN212573090U (en) | 2020-07-21 | 2020-07-21 | PCB structure for optimizing high-speed signal backflow ground hole |
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| CN212573090U true CN212573090U (en) | 2021-02-19 |
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| CN202021442843.4U Active CN212573090U (en) | 2020-07-21 | 2020-07-21 | PCB structure for optimizing high-speed signal backflow ground hole |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114184933A (en) * | 2021-11-26 | 2022-03-15 | 浪潮(北京)电子信息产业有限公司 | Backflow ground hole detection method, system, device and computer readable storage medium |
-
2020
- 2020-07-21 CN CN202021442843.4U patent/CN212573090U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114184933A (en) * | 2021-11-26 | 2022-03-15 | 浪潮(北京)电子信息产业有限公司 | Backflow ground hole detection method, system, device and computer readable storage medium |
| CN114184933B (en) * | 2021-11-26 | 2024-04-05 | 浪潮(北京)电子信息产业有限公司 | Method, system, device and computer readable storage medium for detecting backflow ground hole |
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