CN214205948U - PCB structure for improving high-frequency signal via hole resonance - Google Patents
PCB structure for improving high-frequency signal via hole resonance Download PDFInfo
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- CN214205948U CN214205948U CN202023118052.9U CN202023118052U CN214205948U CN 214205948 U CN214205948 U CN 214205948U CN 202023118052 U CN202023118052 U CN 202023118052U CN 214205948 U CN214205948 U CN 214205948U
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- via hole
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Abstract
The utility model discloses a PCB structure for improving high frequency signal via hole resonance, including locating the high frequency signal via hole on the circuit board, the adjacent horizontal and adjacent longitudinal position that are located the high frequency signal via hole distributes and has ground via hole. The coupling strength of the high-frequency signal via hole and the ground via hole is increased by optimizing the arrangement of different network via holes near the high-frequency signal, so that the distribution of the return current of the high-frequency signal on a power supply via hole or another signal via hole with a poor backflow path is reduced, more return currents of the high-frequency signal are distributed on the ground via hole with a good backflow path, the resonance of the high-frequency signal via hole is improved, and the signal quality is improved.
Description
Technical Field
The utility model relates to a PCB designs technical field, especially relates to a PCB structure for improving high frequency signal via hole resonance.
Background
The printed circuit board is also called as a printed circuit board, and is an important component of physical support and signal transmission of electronic products. BGA (ball grid array) is a common package for large-scale integrated circuits due to its high density, high performance, multi-function and high I/O pin package.
In recent years, electronic technology has been rapidly developed, and signal rates have been increased from 100Mbps and 1Gbps before to 25Gbps and 56Gbps at present and to 112 Gbps in the future. The increase in signal rate presents new challenges to PCB design. When the high-frequency digital signal is transmitted, the flow direction of the signal is from the driver to the load along the PCB transmission line, and then the signal returns to the driver end along GND or the power supply through the shortest path by the load. This return signal at GND or the power supply is called the return current.
The vias also appear like an array due to the PIN-aligned nature of the BGA. The BGA densely concentrates high frequency signals, low speed signals, and various types of power sources in one area, and completes electrical connection by connecting the various types of signals to different layers through holes. Thus, power vias or other signal vias must be present around the high frequency signal vias. In the conventional method, the distance between the power supply via hole and the high-frequency signal via hole is equal to the distance between the ground via hole and the high-frequency signal via hole. Because the coupling strengths are the same, the power and ground vias will distribute the same magnitude of high frequency signal return current. The return current distributed over the ground via can complete the return along the GND loop back to the drive side. The return current distributed on the power supply via hole needs to be coupled with the ground via hole or the ground plane, so that the return current distributed on the power supply via hole or other signal via holes returns to the driving end through the GND loop to complete the backflow. The high-frequency signal can generate resonance due to the fact that the power supply through hole or other signal through holes are used as the tortuous return flow path, and the signal quality is affected.
Therefore, how to improve the resonance problem of the high-frequency signal via hole in the fan-out area of the chip without increasing the cost becomes an urgent problem to be solved.
Disclosure of Invention
In order to overcome the deficiencies of the prior art, the utility model provides a PCB structure for improving high frequency signal via hole resonance.
The utility model discloses technical scheme as follows:
a PCB structure for improving high-frequency signal via hole resonance comprises high-frequency signal via holes arranged on a circuit board, and ground via holes distributed at adjacent transverse and adjacent longitudinal positions of the high-frequency signal via holes.
According to above-mentioned scheme the utility model discloses, its characterized in that, the high frequency signal via hole is the difference signal via hole.
According to above-mentioned scheme the utility model discloses, its characterized in that is located the slant position distribution of high frequency signal via hole has power via hole or another signal via hole, the high frequency signal via hole with the interval of ground via hole equals the ground via hole with the interval of power via hole or another signal via hole.
According to above-mentioned scheme the utility model discloses, its characterized in that, the high frequency signal via hole with the interval of power via hole or another signal via hole is greater than the high frequency signal via hole with the interval of ground via hole.
According to above-mentioned scheme the utility model discloses, its characterized in that, the interaxial distance of two adjacent via holes equals 1 mm.
According to the above scheme the utility model discloses, its beneficial effect lies in, through optimizing arranging of near high frequency signal's different network via holes, increases the coupling strength of high frequency signal via hole and ground via hole, reduces the coupling strength of high frequency signal via hole and power via hole or other signal via holes. Therefore, the distribution of the high-frequency signal return current on the power supply through hole or other signal through holes with poor backflow paths is reduced, and more high-frequency signal return currents are distributed on the ground through holes with good backflow paths. Therefore, the resonance of the high-frequency signal via hole is improved, and the signal quality is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of a via hole arrangement structure of the present invention;
FIG. 2 is a schematic view of a BGA fan-out structure of the present invention;
fig. 3 is a comparison graph of the insertion loss of the high-frequency signal via hole of the present invention.
In the figures, the various reference numbers:
10. a high-frequency signal via hole distribution region 11, a high-frequency signal via hole,
20. a ground via distribution area, 21, a ground via,
30. a power via or another signal via distribution area, 31, a power via or another signal via,
40. BGA pads, 50, traces.
Detailed Description
The invention is further described with reference to the following figures and embodiments:
it should be noted that the terms "upper", "lower", "left", "right", and the like indicate orientations or positions based on the positions shown in the drawings, which are only for convenience of description and should not be construed as limiting the technical solution.
As shown in fig. 1, a PCB structure for improving high frequency signal via resonance includes a high frequency signal via 11 disposed on a circuit board, and ground vias 21 disposed at adjacent lateral and longitudinal positions of the high frequency signal via 11.
Preferably, the high-frequency signal via 11 is a differential signal via.
As shown in fig. 2 to 3, in one embodiment, a 1mm pitch BGA fan-out via is taken as an example.
The utility model provides a PCB structure for improving high frequency signal via hole resonance, is including locating the BGA pad on the circuit board, and a via hole distributes in the centre of four BGA pads, and a via hole equals 0.707mm with BGA pad 40's interval, and the centre spacing of two adjacent via holes equals 1mm, and the via hole is the row of triplex row four rows and arranges on the circuit board.
The via hole includes high frequency signal via hole 11, ground via hole 21 and power supply via hole or another signal via hole 31, high frequency signal via hole 11 distributes in high frequency signal via hole distribution district 10, four directions all have laid ground via hole distribution district 20 about being located high frequency signal via hole distribution district 10, ground via hole 21 distributes in ground via hole distribution district 20, the slant position that is located high frequency signal via hole distribution district 10 has laid power supply via hole or another signal via hole, power supply via hole or another signal via hole 31 distributes in power supply via hole or another signal via hole distribution district 30. In other embodiments, other signal vias may be disposed at the oblique position of the high-frequency signal via distribution area 10, and the specific type of the vias depends on the PCB design.
In the present embodiment, the number of ground vias 21 in both the left and right directions is equal to the number of rows of high-frequency signal vias 11. The high-frequency signal via holes 11 are arranged in a row, and therefore, there is one ground via hole 21 in both left and right directions.
In the present embodiment, the number of ground vias 21 in the two vertical directions is equal to the number of columns of high-frequency signal vias 11, and two rows of high-frequency signal vias 11 are arranged, so that there are two ground vias 21 in the two vertical directions.
In the present embodiment, the pitch between the high-frequency signal via 11 and the ground via 21 is equal to 1 mm.
In the present embodiment, the pitch between the ground via 21 and the power via or another signal via 31 is equal to 1 mm.
In the present embodiment, the pitch between the high-frequency signal via 11 and the power via or another signal via 31 is equal to 1.414 mm.
In the present embodiment, the pitch of two adjacent ground vias 21 is equal to 1 mm.
In the present embodiment, the direction of the trace 50 of the ground via 21 positioned in the left-right direction is opposite to the direction of the trace 50 of the high-frequency signal via 11, and the direction of the trace 50 of the ground via 21 positioned in the up-down direction is the same as the direction of the trace 50 of the high-frequency signal via 11. The trace 50 of the power via or the other signal via 31 is opposite in direction to the trace 50 of the high-frequency signal via 11 and the same in direction as the trace 50 of the ground via 21 in the left-right direction. In other embodiments, the routing direction of the vias depends on the distribution of the vias.
The utility model discloses in, the aperture of via hole is unrestricted, and the aperture of via hole can be for the commonly used via hole size such as 0.1mil, 0.15mil, 0.2mil, 0.25mil, 0.3 mil.
In other embodiments, other package types and BGA packages with different pitch sizes can be used with the present invention. The technical scheme can also be applied to high-frequency signal via hole layer changing of other non-device fan-out areas so as to achieve the purposes of improving high-frequency signal via hole resonance and improving signal quality.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.
The above exemplary description of the present invention is made in conjunction with the accompanying drawings, and it is obvious that the present invention is not limited by the above manner, and various improvements made by the method concept and technical solution of the present invention or by directly applying the concept and technical solution of the present invention to other occasions without improvement are all within the protection scope of the present invention.
Claims (5)
1. The PCB structure for improving the resonance of the high-frequency signal via hole is characterized by comprising the high-frequency signal via hole arranged on a circuit board, and ground via holes are distributed at the adjacent transverse and longitudinal positions of the high-frequency signal via hole.
2. The PCB structure for improving resonance of high frequency signal vias of claim 1, wherein the high frequency signal vias are differential signal vias.
3. The PCB structure for improving the resonance of the via hole for the high-frequency signal according to claim 1, wherein a power via hole or another signal via hole is distributed at an oblique position of the via hole for the high-frequency signal, and the distance between the via hole for the high-frequency signal and the ground via hole is equal to the distance between the via hole for the ground and the power via hole or the another signal via hole.
4. The PCB structure for improving resonance of high-frequency signal vias of claim 3, wherein a pitch of the high-frequency signal via and the power via or another signal via is greater than a pitch of the high-frequency signal via and the ground via.
5. The PCB structure for improving resonance of vias of high frequency signals according to claim 1, wherein the center-to-center distance between two adjacent vias is equal to 1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023118052.9U CN214205948U (en) | 2020-12-22 | 2020-12-22 | PCB structure for improving high-frequency signal via hole resonance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023118052.9U CN214205948U (en) | 2020-12-22 | 2020-12-22 | PCB structure for improving high-frequency signal via hole resonance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214205948U true CN214205948U (en) | 2021-09-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023118052.9U Active CN214205948U (en) | 2020-12-22 | 2020-12-22 | PCB structure for improving high-frequency signal via hole resonance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214205948U (en) |
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2020
- 2020-12-22 CN CN202023118052.9U patent/CN214205948U/en active Active
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