CN221058483U - Wiring structure for reducing signal crosstalk in PCB - Google Patents
Wiring structure for reducing signal crosstalk in PCB Download PDFInfo
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- CN221058483U CN221058483U CN202322379756.9U CN202322379756U CN221058483U CN 221058483 U CN221058483 U CN 221058483U CN 202322379756 U CN202322379756 U CN 202322379756U CN 221058483 U CN221058483 U CN 221058483U
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Abstract
The utility model relates to a wiring structure for reducing signal crosstalk in a PCB. The PCB comprises a first differential signal via transmission line group and a second differential signal via transmission line group which are arranged in the PCB, wherein the first differential signal via transmission line group comprises a first differential signal via transmission line body and a first differential signal via second transmission line body; the second differential signal via transmission line group comprises a second differential signal via first transmission line body and a second differential signal via second transmission line body; in the PCB, a first differential signal transmission path formed based on the first differential signal via transmission line group and a second differential signal transmission path formed based on the second differential signal via transmission line group are mutually orthogonal. The utility model can effectively reduce signal crosstalk and improve the stability and reliability of signal transmission.
Description
Technical Field
The present utility model relates to a wiring structure, and more particularly, to a wiring structure for reducing signal crosstalk in a PCB.
Background
With the rapid rise of data transmission rates in modern electronic devices and systems, the problems of signal integrity and electromagnetic compatibility are also becoming more and more prominent, with crosstalk being one of the most significant problems in high-speed channels. In the trace region PCB (Printed Circuit Board), crosstalk may be shielded by placing ground holes along the trace; crosstalk in the pin area of a BGA (Ball GRID ARRAY PACKAGE) can be reduced by adding ground holes between signal holes or increasing the spacing between signal holes.
However, the BGA pin area has a limited space and cannot be drilled at high density using current PCB fabrication techniques. Thus, a challenge to overcome is how to reduce crosstalk without increasing the number of existing pins and without changing the BGA package.
In the traditional process, through hole wiring of two pairs of differential signals adopts a through hole mode, through holes are vertical and pass through from the top layer of the PCB to the bottom layer of the PCB, when the signals are transmitted in a cross-layer manner in the process of passing through a vertical section, transmission paths between the signals are parallel, but the crosstalk influence between the signals can be aggravated by the transmission paths.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide a wiring structure for reducing signal crosstalk in a PCB, which can effectively reduce the signal crosstalk and improve the stability and reliability of signal transmission.
According to the technical proposal provided by the utility model, the wiring structure for reducing signal crosstalk in the PCB comprises a first differential signal via transmission line group and a second differential signal via transmission line group which are configured in the PCB, wherein,
The first differential signal via transmission line group comprises a first differential signal via first transmission line body and a first differential signal via second transmission line body, and the first differential signal via first transmission line body and the first differential signal via second transmission line body are obliquely distributed in the PCB;
the second differential signal via transmission line group comprises a second differential signal via first transmission line body and a second differential signal via second transmission line body, and the second differential signal via first transmission line body and the second differential signal via second transmission line body are obliquely distributed in the PCB;
In the PCB, a first differential signal transmission path formed based on the first differential signal via transmission line group and a second differential signal transmission path formed based on the second differential signal via transmission line group are mutually orthogonal.
The first differential signal via hole first transmission line body and the first differential signal via hole second transmission line body are through hole line bodies in the PCB, and the first differential signal via hole first transmission line body and the first differential signal via hole second transmission line body are parallel to each other in the PCB.
The first transmission line body of the second differential signal via hole and the second transmission line body of the second differential signal via hole are through hole line bodies in the PCB, and the first transmission line body of the second differential signal via hole and the second transmission line body of the second differential signal via hole are parallel to each other in the PCB.
Forming a first plane based on the first differential signal via first transmission line body and the first differential signal via second transmission line body;
forming a second plane based on the first transmission line body and the second differential signal via;
in the PCB, the first plane and the second plane are parallel to each other.
The first transmission line body of the second differential signal via hole, the second transmission line body of the second differential signal via hole and the surface of the PCB are all 45 degrees.
The first transmission line body of the first differential signal via hole and the second transmission line body of the first differential signal via hole are all 45 degrees with the surface of the PCB.
The corresponding ends of the first transmission line body of the first differential signal via hole, the second transmission line body of the first differential signal via hole, the first transmission line body of the second differential signal via hole and the second transmission line body of the second differential signal via hole are provided with bonding pads.
The utility model has the advantages that: arranging first differential signal via hole first transmission line bodies and first differential signal via hole second transmission line bodies in the first differential signal via hole transmission line group in a PCB in an inclined mode; meanwhile, the first transmission line body of the second differential signal via hole in the second differential signal via hole transmission line group and the second transmission line body of the second differential signal via hole are also configured to be distributed in an inclined mode in the PCB, so that the first differential signal transmission path formed based on the first differential signal via hole transmission line group and the second differential signal transmission path formed based on the second differential signal via hole transmission line group are mutually orthogonal, signal crosstalk can be effectively reduced by utilizing the first differential signal transmission path and the second differential signal transmission path which are mutually orthogonal, and stability and reliability of signal transmission are improved.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present utility model.
Fig. 2 is a top view of fig. 1.
Reference numerals illustrate: the PCB comprises a 1-PCB board, a 2-first differential signal via hole first transmission line body, a 3-first differential signal via hole second transmission line body, a 4-second differential signal via hole first transmission line body, a 5-second differential signal via hole second transmission line body, a 6-line body front first bonding pad, a 7-line body front second bonding pad, an 8-line body front third bonding pad, a 9-line body front fourth bonding pad, a 10-line body back first bonding pad, a 11-line body back second bonding pad, a 12-line body back third bonding pad and a 13-line body back fourth bonding pad.
Detailed Description
The utility model will be further described with reference to the following specific drawings and examples.
In order to effectively reduce signal crosstalk and improve stability and reliability of signal transmission, in one embodiment of the present utility model, a wiring structure for reducing signal crosstalk in a PCB board includes a first differential signal via transmission line group and a second differential signal via transmission line group disposed in the PCB board 1, wherein,
The first differential signal via transmission line group comprises a first differential signal via first transmission line body 2 and a first differential signal via second transmission line body 3, and the first differential signal via first transmission line body 2 and the first differential signal via second transmission line body 3 are obliquely distributed in the PCB 1;
the second differential signal via transmission line group comprises a second differential signal via first transmission line body 4 and a second differential signal via second transmission line body 5, and the second differential signal via first transmission line body 4 and the second differential signal via second transmission line body 5 are obliquely distributed in the PCB;
In the PCB board 1, a first differential signal transmission path formed based on the first differential signal via transmission line group and a second differential signal transmission path formed based on the second differential signal via transmission line group are orthogonal to each other.
Specifically, the PCB board 1 may be in a conventional manner, at least two paths of differential signals exist in the PCB board 1, and the two paths of differential signals may be a first differential signal and a second differential signal, and specific conditions of the first differential signal and the second differential signal are determined according to actual application scenarios of the PCB board 1, and may be specifically consistent with the conventional manner. In specific implementation, the first differential signal is transmitted by using the first differential signal via transmission line group in the PCB board 1, and simultaneously, the second differential signal is transmitted by using the second differential signal via transmission line group in the PCB board 1.
Fig. 1 shows an embodiment of a first differential signal via transmission line group and a second differential signal via transmission line group in a PCB board 1, where the first differential signal via transmission line group includes a first differential signal via first transmission line body 2 and a first differential signal via second transmission line body 3, where the first differential signal via first transmission line body 2 and the first differential signal via second transmission line body 3 are all obliquely distributed in the PCB board 1, and the first differential signal via first transmission line body 2 and the first differential signal via second transmission line body 3 are parallel to each other in the PCB board 1. In fig. 1, the first transmission line body 2 of the first differential signal via hole and the second transmission line body 3 of the first differential signal via hole are through-hole line bodies in the PCB board 1, that is, the first transmission line body 2 of the first differential signal via hole and the second transmission line body 3 of the first differential signal via hole are all through-hole through the PCB board 1, and two corresponding ends of the first transmission line body 2 of the first differential signal via hole and the second transmission line body 3 of the first differential signal via hole respectively correspond to two surfaces of the PCB board 1, and two end surfaces of the PCB board 1 are generally the front surface of the PCB board 1 and the back surface of the front surface of the PCB board 1.
For the second differential signal via transmission line group, in fig. 1, the first transmission line body 4 of the second differential signal via and the second transmission line body 5 of the second differential signal via are all through-hole line bodies in the PCB board 1, and the first transmission line body 4 of the second differential signal via and the second transmission line body 5 of the second differential signal via are parallel to each other in the PCB board 1. For the second differential signal via first transmission line body 4 and the second differential signal via second transmission line body 5, reference may be made to the description of the first differential signal via first transmission line body 2 and the first differential signal via second transmission line body 3 in the first differential signal via transmission line group.
Specifically, when the first differential signal is transmitted by using the first differential signal via hole first transmission line body 2 and the first differential signal via hole second transmission line body 3, a first differential signal transmission path is formed in the PCB board 1; similarly, when the second differential signal is transmitted by the first transmission line body 4 and the second transmission line body 5 with the second differential signal via hole, a second differential signal transmission path is formed in the PCB board 1.
In order to reduce signal crosstalk, in one embodiment of the present utility model, the first differential signal transmission path and the second differential signal transmission path are orthogonal to each other, where the orthogonal refers to a state where the first differential signal transmission path and the second differential signal transmission path form a space.
In order to achieve mutual orthogonality between the first differential signal transmission path and the second differential signal transmission path, in one embodiment of the present utility model, the included angles between the second differential signal via first transmission line body 4 and the second differential signal via second transmission line body 5 and the surface of the PCB board 1 are all 45 °. Meanwhile, the included angles of the first transmission line body 2 of the first differential signal via hole and the second transmission line body 3 of the first differential signal via hole and the surface of the PCB 1 are 45 degrees, as shown in fig. 1.
In one embodiment of the present utility model, a first plane is formed based on the first differential signal via first transmission line body 2 and the first differential signal via second transmission line body 3;
Forming a second plane based on the second differential signal via first transmission line body 4 and the second differential signal via second transmission line body 5;
In the PCB board 1, the first plane and the second plane are parallel to each other.
Fig. 2 is a top view of fig. 1, as can be seen from fig. 2, in the PCB board 1, the first plane is parallel to the second plane, that is, the first plane and the second plane do not cross each other, that is, there is no cross connection state between the first differential signal via first transmission line body 2, the first differential signal via second transmission line body 3, the second differential signal via first transmission line body 4, and the second differential signal via second transmission line body 5.
In order to be able to transmit the first differential signal and the second differential signal, the corresponding ends of the first differential signal via hole first transmission line body 2, the first differential signal via hole second transmission line body 3, the second differential signal via hole first transmission line body 4 and the second differential signal via hole second transmission line body 5 are provided with bonding pads.
Specifically, the functions and connection states of the bonding pads are consistent with the existing technology, an embodiment of bonding pad setting is shown in fig. 1, in which a first bonding pad 6 on the front surface of a wire body is set at a first end of a first differential signal via hole first transmission wire body 2, a second bonding pad 7 on the front surface of a wire body is set at a first end of a first differential signal via hole second transmission wire body 3, a third bonding pad 8 on the front surface of a wire body is set at a first end of a second differential signal via hole first transmission wire body 4, and a fourth bonding pad 9 on the front surface of a wire body is set at a first end of a second differential signal via hole second transmission wire body 5, wherein the first bonding pad 6 on the front surface of a wire body, the second bonding pad 7 on the front surface of a wire body, the third bonding pad 8 on the front surface of a wire body and the fourth bonding pad 9 are all located on the front surface of a PCB board 1.
Meanwhile, a third bonding pad 12 on the back of the wire body is arranged at the second end of the first transmission wire body 2 of the first differential signal via hole, a fourth bonding pad 13 on the back of the wire body is arranged at the second end of the second transmission wire body 3 of the first differential signal via hole, a first bonding pad 10 on the back of the wire body is arranged at the second end of the first transmission wire body 4 of the second differential signal via hole, a second bonding pad 11 on the back of the wire body is arranged at the second end of the second transmission wire body 5 of the second differential signal via hole, wherein the first bonding pad 10 on the back of the wire body, the second bonding pad 11 on the back of the wire body, the third bonding pad 12 on the back of the wire body and the fourth bonding pad 13 on the back of the wire body are all positioned on the back of the PCB board 1.
Claims (7)
1. A wiring structure for reducing signal crosstalk in a PCB is characterized by comprising a first differential signal via transmission line group and a second differential signal via transmission line group which are arranged in the PCB, wherein,
The first differential signal via transmission line group comprises a first differential signal via first transmission line body and a first differential signal via second transmission line body, and the first differential signal via first transmission line body and the first differential signal via second transmission line body are obliquely distributed in the PCB;
the second differential signal via transmission line group comprises a second differential signal via first transmission line body and a second differential signal via second transmission line body, and the second differential signal via first transmission line body and the second differential signal via second transmission line body are obliquely distributed in the PCB;
In the PCB, a first differential signal transmission path formed based on the first differential signal via transmission line group and a second differential signal transmission path formed based on the second differential signal via transmission line group are mutually orthogonal.
2. The wiring structure for reducing signal crosstalk in a PCB of claim 1, wherein: the first differential signal via hole first transmission line body and the first differential signal via hole second transmission line body are through hole line bodies in the PCB, and the first differential signal via hole first transmission line body and the first differential signal via hole second transmission line body are parallel to each other in the PCB.
3. The wiring structure for reducing signal crosstalk in a PCB according to claim 2, characterized in that: the first transmission line body of the second differential signal via hole and the second transmission line body of the second differential signal via hole are through hole line bodies in the PCB, and the first transmission line body of the second differential signal via hole and the second transmission line body of the second differential signal via hole are parallel to each other in the PCB.
4. A wiring structure for reducing signal crosstalk in a PCB according to claim 3, characterized in that: forming a first plane based on the first differential signal via first transmission line body and the first differential signal via second transmission line body;
forming a second plane based on the first transmission line body and the second differential signal via;
in the PCB, the first plane and the second plane are parallel to each other.
5. A wiring structure for reducing signal crosstalk in a PCB according to claim 3, characterized in that: the first transmission line body of the second differential signal via hole, the second transmission line body of the second differential signal via hole and the surface of the PCB are all 45 degrees.
6. A wiring structure for reducing signal crosstalk in a PCB according to claim 3, characterized in that: the first transmission line body of the first differential signal via hole and the second transmission line body of the first differential signal via hole are all 45 degrees with the surface of the PCB.
7. The wiring structure for reducing signal crosstalk in a PCB according to any one of claims 1 to 6, characterized in that: the corresponding ends of the first transmission line body of the first differential signal via hole, the second transmission line body of the first differential signal via hole, the first transmission line body of the second differential signal via hole and the second transmission line body of the second differential signal via hole are provided with bonding pads.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221058483U true CN221058483U (en) | 2024-05-31 |
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