CN111257723B - Back drilling inspection method, system, equipment and medium - Google Patents
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- 238000005553 drilling Methods 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 35
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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Abstract
The invention discloses a back drilling inspection method, which comprises the following steps: loading a back drill design file; obtaining the coordinates and setting information of the back drill identification points in the back drill design file; judging whether a through hole exists in the coordinates of the back drilling identification point and whether the coordinates of the through hole are consistent with the coordinates of the back drilling identification point; in response to the through hole and the consistency of the coordinates of the through hole and the coordinates of the back drilling identification point, acquiring an electrical layer meeting a preset condition; judging whether the setting information of the back drill identification points is correct or not according to the electrical layer set in the back drill design file and the electrical layers meeting the preset conditions; and marking the back drill identification points in response to incorrect setting information of the back drill identification points. The invention also discloses a system, a computer device and a readable storage medium. The scheme provided by the invention can automatically check all the identification points on all the back drilling optical painting layers on the PCB one by one, thereby greatly improving the working efficiency.
Description
Technical Field
The invention relates to the field of software detection, in particular to a back drilling checking method, a back drilling checking system, back drilling checking equipment and a back drilling checking storage medium.
Background
Typically, some protocols for high-speed signal interconnection require the above elements of the link that may affect signal integrity to allow the passive link to achieve the corresponding rate requirements. Among them, optimization of via holes is the most important one, and via back drilling is the most effective and most direct method for improving signal integrity, so back drilling of high-speed signals on the existing high-speed PCB, such as switches and servers, has become a necessary option.
Because the back drilling is just carrying out "secondary drilling" on original drilling's basis, so, like the design of through-hole, the board factory needs PCB designer to provide the drilling picture of back drilling in the back drilling, and back drilling light draws the layer promptly, contains back drilling setting information above that promptly back drilling initial layer and reach layer and back drilling identification point. How to identify which signal networks and which vias need to be backdrilled and generate corresponding, compliant drill hole patterns becomes a problem that must be addressed by PCB design platforms and PCB designers.
After the back drilling setting is completed, in order to avoid design failure caused by errors such as missing setting or wrong back drilling setting, designers often need to spend several times of working labor and time during setting for checking the generated back drilling photoplotting layer, the designers need to manually check each via hole on each high-speed line of the back drilling repeatedly, the checking items include but are not limited to properties such as a back drilling starting layer and a back drilling stopping layer, and reserved stub length, so if there are 1000 nets to be backdrilled, there are at least two via-holes per net, the designer has at least 1000 x 2 x 3=6000 checkitems to be aware of, this is a huge effort, even a skilled engineer may spend at least several hours to perform the inspection, and the repetitive heavy workload may affect the attention of the inspector and the quality of the inspection, and such a mistake may result in the failure and repetition of the product. Therefore, how to conveniently inspect the back drill or use a machine to replace the human automation to complete the inspection becomes an urgent problem to be solved.
Disclosure of Invention
In view of the above, in order to overcome at least one aspect of the above problems, an embodiment of the present invention provides a back drilling inspection method, including the following steps:
loading a back drill design file;
acquiring coordinates and setting information of the back drill identification points in the back drill design file;
judging whether a through hole exists in the coordinates of the back drilling identification point and whether the coordinates of the through hole are consistent with the coordinates of the back drilling identification point;
responding to the through hole and the consistency of the coordinate of the through hole and the coordinate of the back drilling identification point, and acquiring an electrical layer meeting a preset condition;
judging whether the setting information of the back drill identification point is correct or not according to the electrical layer set in the back drill design file and the electrical layer meeting preset conditions;
and marking the back drilling identification points in response to incorrect setting information of the back drilling identification points.
In some embodiments, obtaining the coordinates and the setting information of the back drill identification point in the back drill design file further includes:
judging whether a back drilling photoplotting layer exists in the back drilling design file or not;
in response to the existence of the back drill light-drawing layer, acquiring coordinates and setting information of back drill identification points;
in response to the absence of the back drill photo-drawing layer, returning a prompt that the back drill design file has not been back drill designed.
In some embodiments, further comprising:
marking the back drill identification point in response to the absence of the through hole and/or the coordinate of the through hole not being consistent with the coordinate of the back drill identification point.
In some embodiments, obtaining the electrical layer satisfying the preset condition further comprises:
acquiring all components electrically connected with the through holes;
determining an attribute of the component;
and responding to the property of the part as path, and acquiring the electrical layer where the part is located.
In some embodiments, further comprising:
judging whether the through hole is a PIN PIN or not;
and responding to the fact that the through hole is a PIN PIN, and obtaining an electric layer of the through hole in the PIN welding direction.
In some embodiments, in response to the setting information of the back drill identification point being incorrect, marking the back drill identification point further comprises:
determining the electric layer which can not be back drilled theoretically by the back drilling identification point by using the electric layer set and the electric layer meeting the preset condition;
judging whether the setting information accords with an electric layer which can not be back drilled theoretically;
marking the back drill identification point in response to the setting information not being in accordance with a theoretically non-back drill electrical layer.
In some embodiments, loading the back drill design file further comprises:
and loading the back drilling design file in response to receiving a preset starting instruction.
Based on the same inventive concept, according to another aspect of the present invention, an embodiment of the present invention further provides a back-drilling inspection system, including:
a loading module configured to load a back drill design file;
a first obtaining module configured to obtain coordinates and setting information of a back drill identification point in the back drill design file;
the first judgment module is configured to judge whether a through hole exists in the coordinates of the back drilling identification point and whether the coordinates of the through hole are consistent with the coordinates of the back drilling identification point;
a second obtaining module configured to obtain an electrical layer satisfying a preset condition in response to the through hole being present and the coordinate of the through hole being consistent with the coordinate of the back drill identification point;
the second judgment module is configured to judge whether the setting information of the back drill identification point is correct or not according to the electrical layer set in the back drill design file and the electrical layer meeting preset conditions;
a marking module configured to mark the back-drill identification point in response to setting information of the back-drill identification point being incorrect.
Based on the same inventive concept, according to another aspect of the present invention, an embodiment of the present invention further provides a computer apparatus, including:
at least one processor; and
a memory storing a computer program operable on the processor, wherein the processor executes the program to perform any of the steps of the backdrilling inspection method described above.
Based on the same inventive concept, according to another aspect of the present invention, an embodiment of the present invention further provides a computer-readable storage medium storing a computer program which, when executed by a processor, performs the steps of any of the back-drilling inspection methods described above.
The invention has one of the following beneficial technical effects: the scheme provided by the invention can automatically and one-by-one check all the identification points on all the back drill light-painted layers on the PCB, and a designer can efficiently and correctly complete the back drill check, thereby greatly improving the working efficiency, changing the working time of hours into a few seconds, avoiding a large number of errors possibly brought by manual repeated operation and ensuring the success of product research and development.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
Fig. 1 is a flowchart of a backdrilling inspection method according to an embodiment of the present invention;
fig. 2 is a block flow diagram of a back drilling inspection method according to an embodiment of the present invention;
FIG. 3 is a schematic block diagram of a system for backdrilling inspection according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a computer device provided in an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a computer-readable storage medium according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
According to an aspect of the present invention, an embodiment of the present invention provides a back drill inspection method, as shown in fig. 1, which may include the steps of: s1, loading back drilling design files; s2, obtaining the coordinates and setting information of the back drill identification points in the back drill design file; s3, judging whether a through hole exists in the coordinates of the back drilling identification point and whether the coordinates of the through hole are consistent with the coordinates of the back drilling identification point; s4, responding to the through hole and the consistency of the coordinates of the through hole and the coordinates of the back drilling identification point, and acquiring an electrical layer meeting preset conditions; s5, judging whether the setting information of the back drill identification point is correct or not according to the electrical layer set in the back drill design file and the electrical layer meeting preset conditions; s6, in response to the setting information of the back drill identification point is incorrect, marking the back drill identification point.
The scheme provided by the invention can automatically and one-by-one check all the identification points on all the back drill light-painted layers on the PCB, and a designer can efficiently and correctly complete the back drill check, thereby greatly improving the working efficiency, changing the working time of hours into a few seconds, avoiding a large number of errors possibly brought by manual repeated operation and ensuring the success of product research and development.
The method for inspecting back drilling proposed by the present invention is described in detail below with reference to the flow chart of the method for inspecting back drilling shown in fig. 2.
In some embodiments, in step S2, obtaining the coordinates and setting information of the back drill identification point in the back drill design file further includes:
judging whether a back drilling photoplotting layer exists in the back drilling design file or not;
in response to the existence of the back drill light-drawing layer, acquiring coordinates and setting information of back drill identification points;
in response to the absence of the back-drill photoplotting layer, returning a prompt that the back-drill design file has not been back-drill designed.
Specifically, as shown in fig. 2, after the program starts, it is checked whether a back drilling optical drawing layer exists in the started back drilling design file, if so, the coordinates and setting information of the back drilling identification point are acquired, and if not, a prompt box of "the design file has not been set for back drilling" is popped up.
It should be noted that, in the scheme provided by the present invention, generated back-drilled optical drawing layers are checked one by one, and for any generated back-drilled optical drawing layer, back-drilled information of the optical drawing layer is obtained, which layer includes information set by the back-drilled layer, i.e., which layer is drilled from which layer to which layer and all back-drilled identification points on the optical drawing layer, and coordinates on the back-drilled identification points are obtained one by one, and through holes (including via hole via and pin) on the coordinates are obtained.
As shown in fig. 2, when the information of the back drill identification point is acquired, the determination of step S3 is performed.
In some embodiments, step S3 may further include:
marking the back drill identification point in response to the absence of the through hole and/or the coordinate of the through hole not being consistent with the coordinate of the back drill identification point.
Specifically, as shown in fig. 2, in step S3, two determinations are made: judging whether the coordinate point has a through hole for the first time; judging whether the central coordinate point of the through hole is consistent with the back drilling identification coordinate point or not for the second time; marking the back drilling identification point as long as any one of the two judgments fails; and if the two judgments are passed, performing subsequent steps.
As shown in fig. 2, if both the two determinations are passed, step S4 is performed to obtain an electrical layer that satisfies a preset condition in response to the through hole being present and the coordinate of the through hole being consistent with the coordinate of the back drill identification point.
In some embodiments, obtaining the electrical layer satisfying the preset condition further comprises:
acquiring all components electrically connected with the through holes;
determining an attribute of the component;
and responding to the property of the part as path, and acquiring the electrical layer where the part is located.
In some embodiments, further comprising:
judging whether the through hole is a PIN PIN or not;
and responding to the fact that the through hole is a PIN PIN, and obtaining an electric layer of the through hole in the PIN welding direction.
Specifically, all the components electrically connected with the through hole are obtained, the components are judged one by one, and the electrical layer where the components are located is obtained for the components which are judged to be of the path attribute, namely the routing. If the through hole is a pin, a contact layer in the pin welding direction is obtained at the same time. All electrical layers thus obtained in this step are layers that have electrical connection properties with the via, i.e. are not drillable by backdrilling.
Then, step S5 is performed to determine whether the setting information of the back drill identification point is correct according to the electrical layer set in the back drill design file and the electrical layer meeting the preset condition. And step S6, in response to the setting information of the back drill identification point being incorrect, marking the back drill identification point.
In some embodiments, in response to the setting information of the back drill identification point being incorrect, marking the back drill identification point further comprises:
determining the electric layer which can not be back drilled theoretically by the back drilling identification point by using the electric layer set and the electric layer meeting the preset condition;
judging whether the setting information accords with an electric layer which can not be back drilled theoretically;
marking the back drill identification point in response to the setting information not being in accordance with a theoretically non-back drill electrical layer.
Specifically, as shown in fig. 2, after acquiring all the electrical layer sets in the design file, removing the electrical layers that have been acquired before and have an electrical connection relationship with the through holes at the coordinates of the back drill identification points and other electrical layers that have a connection relationship with the through holes sandwiched between the electrical layers, for example, if the electrical layer set acquired in the design file is [ Top, Gnd02, Art03, Art04, Gnd05, Bot ], and the electrical layers that have a connection relationship with the through holes are Top and Art03, removing Top, Art03 and the Gnd02 layers sandwiched therebetween from the set; then, according to the head and tail layers of the electrical layer set left after the elimination, whether the back drill setting information obtained in the step S2 is consistent with the head and tail layers is judged, if not, the back drill identification point is marked; after the judgment is finished, the step returns to the step S2 to check the next back drilling identification point; and after the inspection of all the back drilling identification points on all the back drilling layers is finished, finishing the program and popping up a finishing prompt message.
In some embodiments, it may be determined whether the back drill setup start layer is faulty through the welding direction, and it may be determined whether the back drill identification point is faulty, for example, if the welding starts from the TOP layer and the back drill setup start layer also starts from the TOP layer, then the back drill identification point fault is indicated.
In some embodiments, loading the back drill design file further comprises:
and loading the back drilling design file in response to receiving a preset starting instruction.
Specifically, before the back drilling inspection, the program needs to be imported into the Allegro, the user can add "load" (back drill check) to the kill configuration file "Allegro. In addition, after the user starts the Allegro, the program can be started after the user inputs 'bdc' (a preset starting instruction) enter in an interactive window of the Allegro, and the program automatically completes the back drilling check for the network according to the back drilling information file.
The scheme provided by the method is mainly aimed at completing back drilling inspection in Allegro, the back drilling inspection needs to be manually performed by back drilling layer by layer and back drilling identification point by back drilling identification point, the defects of huge workload and easy error are overcome, the scheme with higher stability is provided to replace manual operation, all identification points on all back drilling optical drawing layers on a PCB are automatically inspected one by one, and the inspection items can comprise 'whether back drilling identification points exist' and 'whether a back drilling setting starting layer has errors' and wrong information is screened and then is referred to by a designer for modification. By the method, after the back drilling setting is completed by a PCB designer, the PCB designer does not need to manually check errors including 'invalid back drilling', 'drilling through layer', 'drilling depth is insufficient', even tens of back drilling light-painted layers and thousands of back drilling identification points need to be checked, the program can complete all back drilling settings within ten seconds, compared with the workload of few hours before manual operation, the working efficiency is greatly improved, meanwhile, the stability of program operation and setting is incomparable to manual operation, the errors of missing setting and wrong setting which often occur before the huge workload are checked manually, the errors can not occur in the process, the method has extremely high stability and accuracy, and the possibility of product success is greatly guaranteed.
Based on the same inventive concept, according to another aspect of the present invention, as shown in fig. 3, an embodiment of the present invention further provides a back-drilling inspection system 400, comprising:
a loading module 401, wherein the loading module 401 is configured to load a back drill design file;
a first obtaining module 402, where the first obtaining module 402 is configured to obtain coordinates and setting information of a back drill identification point in the back drill design file;
a first judging module 403, where the first judging module 403 is configured to judge whether a through hole exists in the coordinates of the back drill identification point and whether the coordinates of the through hole are consistent with the coordinates of the back drill identification point;
a second obtaining module 404, where the second obtaining module 404 is configured to obtain an electrical layer that meets a preset condition in response to the through hole being present and the coordinate of the through hole being consistent with the coordinate of the back drill identification point;
a second judging module 405, where the second judging module 405 is configured to judge whether the setting information of the back drill identification point is correct according to the electrical layer set in the back drill design file and the electrical layer meeting a preset condition;
a marking module 406, the marking module 406 configured to mark the back drill identification point in response to the setting information of the back drill identification point being incorrect.
Based on the same inventive concept, according to another aspect of the present invention, as shown in fig. 4, an embodiment of the present invention further provides a computer apparatus 501, comprising:
at least one processor 520; and
the memory 510, the memory 510 stores a computer program 511 that is executable on the processor, and the processor 520 executes the program to perform the steps of any of the above backdrilling inspection methods.
Based on the same inventive concept, according to another aspect of the present invention, as shown in fig. 5, an embodiment of the present invention further provides a computer-readable storage medium 601, the computer-readable storage medium 601 stores a computer program 610, and the computer program 610, when executed by a processor, performs the steps of any one of the above back-drilling inspection methods.
Finally, it should be noted that, as will be understood by those skilled in the art, all or part of the processes of the methods of the above embodiments may be implemented by a computer program to instruct related hardware to implement the methods. The storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), a Random Access Memory (RAM), or the like. The embodiments of the computer program may achieve the same or similar effects as any of the above-described method embodiments.
In addition, the apparatuses, devices, and the like disclosed in the embodiments of the present invention may be various electronic terminal devices, such as a mobile phone, a Personal Digital Assistant (PDA), a tablet computer (PAD), a smart television, and the like, or may be a large terminal device, such as a server, and the like, and therefore the scope of protection disclosed in the embodiments of the present invention should not be limited to a specific type of apparatus, device. The client disclosed by the embodiment of the invention can be applied to any one of the electronic terminal devices in the form of electronic hardware, computer software or a combination of the electronic hardware and the computer software.
Furthermore, the method disclosed according to an embodiment of the present invention may also be implemented as a computer program executed by a CPU, and the computer program may be stored in a computer-readable storage medium. The computer program, when executed by the CPU, performs the above-described functions defined in the method disclosed in the embodiments of the present invention.
Further, the above method steps and system elements may also be implemented using a controller and a computer readable storage medium for storing a computer program for causing the controller to implement the functions of the above steps or elements.
Further, it should be appreciated that the computer-readable storage media (e.g., memory) herein can be either volatile memory or nonvolatile memory, or can include both volatile and nonvolatile memory. By way of example, and not limitation, nonvolatile memory can include Read Only Memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM), which can act as external cache memory. By way of example and not limitation, RAM is available in a variety of forms such as synchronous RAM (DRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DRRAM). The storage devices of the disclosed aspects are intended to comprise, without being limited to, these and other suitable types of memory.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the disclosure herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as software or hardware depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments of the present invention.
The various illustrative logical blocks, modules, and circuits described in connection with the disclosure herein may be implemented or performed with the following components designed to perform the functions herein: a general purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination of these components. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP, and/or any other such configuration.
The steps of a method or algorithm described in connection with the disclosure herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In the alternative, the processor and the storage medium may reside as discrete components in a user terminal.
In one or more exemplary designs, the functions may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that can be accessed by a general purpose or special purpose computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a general-purpose or special-purpose computer, or a general-purpose or special-purpose processor. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, Digital Subscriber Line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, includes Compact Disc (CD), laser disc, optical disc, Digital Versatile Disc (DVD), floppy disk, blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
It will be understood by those skilled in the art that all or part of the steps of implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (8)
1. A backdrilling inspection method is characterized by comprising the following steps:
loading a back drill design file;
acquiring coordinates and setting information of the back drill identification points in the back drill design file;
judging whether a through hole exists in the coordinates of the back drilling identification point and whether the coordinates of the through hole are consistent with the coordinates of the back drilling identification point;
responding to the through hole and the consistency of the coordinate of the through hole and the coordinate of the back drilling identification point, and acquiring an electrical layer meeting a preset condition;
judging whether the setting information of the back drill identification point is correct or not according to the electrical layer set in the back drill design file and the electrical layer meeting preset conditions;
in response to that the setting information of the back drilling identification points is incorrect, marking the back drilling identification points;
acquiring an electrical layer satisfying a preset condition, further comprising:
acquiring all components electrically connected with the through holes;
determining an attribute of the component;
responding to the property of the component being path, and acquiring an electrical layer where the component is located;
judging whether the through hole is a PIN PIN or not;
and responding to the fact that the through hole is a PIN PIN, and obtaining an electric layer of the through hole in the PIN welding direction.
2. The method of claim 1, wherein obtaining coordinates and setting information of the back drill identification points in the back drill design file further comprises:
judging whether a back drilling photoplotting layer exists in the back drilling design file or not;
responding to the existence of the back drilling light-drawing layer, and acquiring coordinates and setting information of back drilling identification points;
in response to the absence of the back-drill photoplotting layer, returning a prompt that the back-drill design file has not been back-drill designed.
3. The method of claim 1, further comprising:
marking the back drill identification point in response to the absence of the through hole and/or the coordinate of the through hole not being consistent with the coordinate of the back drill identification point.
4. The method of claim 1, wherein marking the back drill identification point in response to setting information of the back drill identification point being incorrect, further comprising:
determining the electric layer which can not be back drilled theoretically by the back drilling identification point by using the electric layer set and the electric layer meeting the preset condition;
judging whether the setting information conforms to an electric layer which can not be back drilled theoretically;
in response to the setting information not coinciding with a theoretically non-backdrillable electrical layer, marking the backdrillable identification point.
5. The method of claim 1, wherein loading a back drill design file further comprises:
and loading the back drilling design file in response to receiving a preset starting instruction.
6. A backdrilling inspection system, comprising:
a loading module configured to load a back drill design file;
a first obtaining module configured to obtain coordinates and setting information of a back drill identification point in the back drill design file;
the first judgment module is configured to judge whether a through hole exists in the coordinates of the back drilling identification point and whether the coordinates of the through hole are consistent with the coordinates of the back drilling identification point;
a second obtaining module configured to obtain an electrical layer satisfying a preset condition in response to the through hole being present and the coordinate of the through hole being consistent with the coordinate of the back drill identification point;
the second judgment module is configured to judge whether the setting information of the back drill identification point is correct or not according to the electrical layer set in the back drill design file and the electrical layer meeting preset conditions;
a marking module configured to mark the back drill identification point in response to setting information of the back drill identification point being incorrect;
wherein, acquire the electric layer that satisfies preset condition, further include:
acquiring all components electrically connected with the through holes;
determining an attribute of the component;
responding to the property of the component as path, and acquiring an electrical layer where the component is located;
judging whether the through hole is a PIN PIN or not;
and responding to the fact that the through hole is a PIN PIN, and obtaining an electric layer of the through hole in the PIN welding direction.
7. A computer device, comprising:
at least one processor; and
memory storing a computer program operable on the processor, characterized in that the processor executes the program to perform the steps of the method according to any of claims 1-5.
8. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1-5.
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| CN202010028985.4A CN111257723B (en) | 2020-01-12 | 2020-01-12 | Back drilling inspection method, system, equipment and medium |
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| CN202010028985.4A CN111257723B (en) | 2020-01-12 | 2020-01-12 | Back drilling inspection method, system, equipment and medium |
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| CN112328554B (en) * | 2020-11-23 | 2022-09-13 | 迈普通信技术股份有限公司 | Method and device for generating secondary drilling file, electronic equipment and storage medium |
| CN112862867B (en) * | 2021-04-26 | 2021-07-09 | 苏州维嘉科技股份有限公司 | Method and device for acquiring PCB back drilling detection file and optical detection equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109933931A (en) * | 2019-03-21 | 2019-06-25 | 浪潮商用机器有限公司 | A method of whether detection back drill destination layer is correctly arranged |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109933931A (en) * | 2019-03-21 | 2019-06-25 | 浪潮商用机器有限公司 | A method of whether detection back drill destination layer is correctly arranged |
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