CN114174457B - 粘接剂组合物、热固性粘接片以及印刷线路板 - Google Patents

粘接剂组合物、热固性粘接片以及印刷线路板 Download PDF

Info

Publication number
CN114174457B
CN114174457B CN201980098858.7A CN201980098858A CN114174457B CN 114174457 B CN114174457 B CN 114174457B CN 201980098858 A CN201980098858 A CN 201980098858A CN 114174457 B CN114174457 B CN 114174457B
Authority
CN
China
Prior art keywords
adhesive composition
styrene
mass
parts
polyphenylene ether
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980098858.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN114174457A (zh
Inventor
山本润
铃木彬
峯岸利之
伊达和宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN114174457A publication Critical patent/CN114174457A/zh
Application granted granted Critical
Publication of CN114174457B publication Critical patent/CN114174457B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/14—Layered products comprising a layer of natural or synthetic rubber comprising synthetic rubber copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387—Block-copolymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • General Chemical & Material Sciences (AREA)
CN201980098858.7A 2019-08-06 2019-08-06 粘接剂组合物、热固性粘接片以及印刷线路板 Active CN114174457B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/030802 WO2021024364A1 (ja) 2019-08-06 2019-08-06 接着剤組成物、熱硬化性接着シート及びプリント配線板

Publications (2)

Publication Number Publication Date
CN114174457A CN114174457A (zh) 2022-03-11
CN114174457B true CN114174457B (zh) 2023-08-25

Family

ID=74502900

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980098858.7A Active CN114174457B (zh) 2019-08-06 2019-08-06 粘接剂组合物、热固性粘接片以及印刷线路板

Country Status (5)

Country Link
US (1) US12454634B2 (https=)
JP (1) JP7351912B2 (https=)
KR (1) KR102723829B1 (https=)
CN (1) CN114174457B (https=)
WO (1) WO2021024364A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114174459B (zh) * 2019-08-02 2023-05-26 迪睿合株式会社 粘接剂组合物、热固性粘接片以及印刷线路板
JP7736567B2 (ja) * 2019-12-23 2025-09-09 信越ポリマー株式会社 接着剤組成物
CN114080088B (zh) * 2020-08-10 2024-05-31 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法
JP7342917B2 (ja) * 2021-07-26 2023-09-12 東洋インキＳｃホールディングス株式会社 接着性樹脂シート、プリント配線板および、電子機器。
WO2023053749A1 (ja) * 2021-09-30 2023-04-06 ナミックス株式会社 樹脂組成物、接着フィルム、層間接着用ボンディングシート、アンテナ付き半導体パッケージ用樹脂組成物及びアンテナ付き半導体パッケージ
JPWO2024014432A1 (https=) * 2022-07-12 2024-01-18
KR20250055502A (ko) * 2022-08-31 2025-04-24 나믹스 가부시끼가이샤 수지 조성물, 접착 필름, 층간 접착용 본딩 시트, 및 안테나가 형성된 반도체 패키지용 수지 조성물
TW202502994A (zh) * 2023-04-06 2025-01-16 日商Ｄｉｃ股份有限公司 熱硬化型黏著片及印刷配線板
WO2025105009A1 (ja) * 2023-11-17 2025-05-22 ナミックス株式会社 接着フィルム、半導体装置および半導体装置の製造方法
WO2025187605A1 (ja) * 2024-03-07 2025-09-12 株式会社Adeka 組成物、硬化物及び接着剤
JP7569954B1 (ja) * 2024-03-29 2024-10-18 デクセリアルズ株式会社 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板
JP2026066923A (ja) * 2024-10-07 2026-04-17 デクセリアルズ株式会社 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008248001A (ja) * 2007-03-29 2008-10-16 Nippon Steel Chem Co Ltd 硬化性樹脂組成物
JP2016027131A (ja) * 2014-06-26 2016-02-18 住友電気工業株式会社 接着剤組成物、プリント配線板用カバーレイ、プリント配線板用ボンディングフィルム及びプリント配線板
CN106536658A (zh) * 2014-07-31 2017-03-22 东亚合成株式会社 带粘合剂层的层叠体以及使用其的柔性覆铜层叠板及柔性扁平线缆
CN106574110A (zh) * 2014-10-22 2017-04-19 纳美仕有限公司 树脂组合物、使用其的绝缘膜及半导体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007302817A (ja) * 2006-05-12 2007-11-22 Mitsubishi Engineering Plastics Corp 自動車外装部品製造用熱可塑性樹脂組成物
JP2013151638A (ja) 2011-12-27 2013-08-08 Yamaichi Electronics Co Ltd カバーレイフィルム、フレキシブル配線板およびその製造方法
CN104663007B (zh) * 2012-09-20 2017-10-24 株式会社可乐丽 电路基板及其制造方法
JP6328938B2 (ja) * 2014-01-09 2018-05-23 ナミックス株式会社 エラストマー組成物、フィルムおよび半導体装置
JP6896993B2 (ja) 2015-09-18 2021-06-30 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP6776577B2 (ja) 2016-03-28 2020-10-28 味の素株式会社 樹脂組成物
JP7090428B2 (ja) * 2018-02-05 2022-06-24 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008248001A (ja) * 2007-03-29 2008-10-16 Nippon Steel Chem Co Ltd 硬化性樹脂組成物
JP2016027131A (ja) * 2014-06-26 2016-02-18 住友電気工業株式会社 接着剤組成物、プリント配線板用カバーレイ、プリント配線板用ボンディングフィルム及びプリント配線板
CN106536658A (zh) * 2014-07-31 2017-03-22 东亚合成株式会社 带粘合剂层的层叠体以及使用其的柔性覆铜层叠板及柔性扁平线缆
CN106574110A (zh) * 2014-10-22 2017-04-19 纳美仕有限公司 树脂组合物、使用其的绝缘膜及半导体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
冯孝中主编.《高分子材料》.哈尔滨工业大学出版社,2007,第155页. *

Also Published As

Publication number Publication date
CN114174457A (zh) 2022-03-11
JP7351912B2 (ja) 2023-09-27
KR102723829B1 (ko) 2024-10-30
US20220267650A1 (en) 2022-08-25
JPWO2021024364A1 (https=) 2021-02-11
WO2021024364A1 (ja) 2021-02-11
KR20220025000A (ko) 2022-03-03
US12454634B2 (en) 2025-10-28

Similar Documents

Publication Publication Date Title
CN114174457B (zh) 粘接剂组合物、热固性粘接片以及印刷线路板
CN111742029B (zh) 粘接剂组合物、热固性粘接片以及印刷电路板
CN114174459B (zh) 粘接剂组合物、热固性粘接片以及印刷线路板
TW202003760A (zh) 低介電黏接劑組成物
TWI853123B (zh) 黏接劑組成物、黏接片、疊層體、以及印刷配線板
JP2009007424A (ja) 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム
JP3419436B2 (ja) 異方性導電接着フィルム
EP1005509B1 (en) Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods
TWI851851B (zh) 黏接薄膜、疊層體、以及印刷配線板
JP3727155B2 (ja) 導電性エポキシ樹脂組成物、異方性導電接着フィルムおよび導体間の電気的接続方法
TWI846969B (zh) 聚烯烴系黏接劑組成物
JP7569954B1 (ja) 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板
TW202607107A (zh) 熱硬化性接著劑組合物、熱硬化性接著片及印刷佈線板
JP2026066923A (ja) 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板
JP2008222906A (ja) フレキシブル配線板用接着剤組成物、ならびに、それを用いたカバーレイ、接着剤フィルム、フレキシブル銅張積層板、フレキシブル配線板および補強板付配線板
JP2005248004A (ja) 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム及び接着剤シート並びに銅張りポリイミドフィルム
KR20200012505A (ko) 열경화성 접착제 조성물, 그의 경화물을 포함하는 적층필름, 및 상기 적층필름을 채용한 프린트 배선판

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant