JP7351912B2 - 接着剤組成物、熱硬化性接着シート及びプリント配線板 - Google Patents

接着剤組成物、熱硬化性接着シート及びプリント配線板 Download PDF

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JP7351912B2
JP7351912B2 JP2021538577A JP2021538577A JP7351912B2 JP 7351912 B2 JP7351912 B2 JP 7351912B2 JP 2021538577 A JP2021538577 A JP 2021538577A JP 2021538577 A JP2021538577 A JP 2021538577A JP 7351912 B2 JP7351912 B2 JP 7351912B2
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adhesive composition
mass
parts
composition according
epoxy resin
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JPWO2021024364A5 (https=
JPWO2021024364A1 (https=
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潤 山本
彬 鈴木
利之 峯岸
和宏 伊達
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Dexerials Corp
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Dexerials Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/14—Layered products comprising a layer of natural or synthetic rubber comprising synthetic rubber copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387—Block-copolymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • General Chemical & Material Sciences (AREA)
JP2021538577A 2019-08-06 2019-08-06 接着剤組成物、熱硬化性接着シート及びプリント配線板 Active JP7351912B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/030802 WO2021024364A1 (ja) 2019-08-06 2019-08-06 接着剤組成物、熱硬化性接着シート及びプリント配線板

Publications (3)

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JPWO2021024364A1 JPWO2021024364A1 (https=) 2021-02-11
JPWO2021024364A5 JPWO2021024364A5 (https=) 2022-05-16
JP7351912B2 true JP7351912B2 (ja) 2023-09-27

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US (1) US12454634B2 (https=)
JP (1) JP7351912B2 (https=)
KR (1) KR102723829B1 (https=)
CN (1) CN114174457B (https=)
WO (1) WO2021024364A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114174459B (zh) * 2019-08-02 2023-05-26 迪睿合株式会社 粘接剂组合物、热固性粘接片以及印刷线路板
JP7736567B2 (ja) * 2019-12-23 2025-09-09 信越ポリマー株式会社 接着剤組成物
CN114080088B (zh) * 2020-08-10 2024-05-31 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法
JP7342917B2 (ja) * 2021-07-26 2023-09-12 東洋インキＳｃホールディングス株式会社 接着性樹脂シート、プリント配線板および、電子機器。
WO2023053749A1 (ja) * 2021-09-30 2023-04-06 ナミックス株式会社 樹脂組成物、接着フィルム、層間接着用ボンディングシート、アンテナ付き半導体パッケージ用樹脂組成物及びアンテナ付き半導体パッケージ
JPWO2024014432A1 (https=) * 2022-07-12 2024-01-18
KR20250055502A (ko) * 2022-08-31 2025-04-24 나믹스 가부시끼가이샤 수지 조성물, 접착 필름, 층간 접착용 본딩 시트, 및 안테나가 형성된 반도체 패키지용 수지 조성물
TW202502994A (zh) * 2023-04-06 2025-01-16 日商Ｄｉｃ股份有限公司 熱硬化型黏著片及印刷配線板
WO2025105009A1 (ja) * 2023-11-17 2025-05-22 ナミックス株式会社 接着フィルム、半導体装置および半導体装置の製造方法
WO2025187605A1 (ja) * 2024-03-07 2025-09-12 株式会社Adeka 組成物、硬化物及び接着剤
JP7569954B1 (ja) * 2024-03-29 2024-10-18 デクセリアルズ株式会社 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板
JP2026066923A (ja) * 2024-10-07 2026-04-17 デクセリアルズ株式会社 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013151638A (ja) 2011-12-27 2013-08-08 Yamaichi Electronics Co Ltd カバーレイフィルム、フレキシブル配線板およびその製造方法
WO2016017473A1 (ja) 2014-07-31 2016-02-04 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP2016027131A (ja) 2014-06-26 2016-02-18 住友電気工業株式会社 接着剤組成物、プリント配線板用カバーレイ、プリント配線板用ボンディングフィルム及びプリント配線板
JP2017179014A (ja) 2016-03-28 2017-10-05 味の素株式会社 樹脂組成物

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JP2007302817A (ja) * 2006-05-12 2007-11-22 Mitsubishi Engineering Plastics Corp 自動車外装部品製造用熱可塑性樹脂組成物
JP2008248001A (ja) * 2007-03-29 2008-10-16 Nippon Steel Chem Co Ltd 硬化性樹脂組成物
CN104663007B (zh) * 2012-09-20 2017-10-24 株式会社可乐丽 电路基板及其制造方法
JP6328938B2 (ja) * 2014-01-09 2018-05-23 ナミックス株式会社 エラストマー組成物、フィルムおよび半導体装置
JP6458985B2 (ja) * 2014-10-22 2019-01-30 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
JP6896993B2 (ja) 2015-09-18 2021-06-30 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP7090428B2 (ja) * 2018-02-05 2022-06-24 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013151638A (ja) 2011-12-27 2013-08-08 Yamaichi Electronics Co Ltd カバーレイフィルム、フレキシブル配線板およびその製造方法
JP2016027131A (ja) 2014-06-26 2016-02-18 住友電気工業株式会社 接着剤組成物、プリント配線板用カバーレイ、プリント配線板用ボンディングフィルム及びプリント配線板
WO2016017473A1 (ja) 2014-07-31 2016-02-04 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP2017179014A (ja) 2016-03-28 2017-10-05 味の素株式会社 樹脂組成物

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CN114174457A (zh) 2022-03-11
KR102723829B1 (ko) 2024-10-30
US20220267650A1 (en) 2022-08-25
CN114174457B (zh) 2023-08-25
JPWO2021024364A1 (https=) 2021-02-11
WO2021024364A1 (ja) 2021-02-11
KR20220025000A (ko) 2022-03-03
US12454634B2 (en) 2025-10-28

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