CN114138085A - Wind-guiding heat abstractor - Google Patents
Wind-guiding heat abstractor Download PDFInfo
- Publication number
- CN114138085A CN114138085A CN202111340181.9A CN202111340181A CN114138085A CN 114138085 A CN114138085 A CN 114138085A CN 202111340181 A CN202111340181 A CN 202111340181A CN 114138085 A CN114138085 A CN 114138085A
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- heat dissipation
- heat
- wind
- air guide
- module
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 201
- 238000001746 injection moulding Methods 0.000 claims description 6
- 241000270295 Serpentes Species 0.000 claims 1
- 238000005553 drilling Methods 0.000 abstract description 5
- 238000004080 punching Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an air guide heat dissipation device which comprises a shell, wherein a main board and an air guide cover are installed on the shell, a heat dissipation device is arranged on the main board, a heat dissipation module is arranged between the air guide cover and the heat dissipation device, an elastic part is arranged on the heat dissipation module, one end of the heat dissipation module is abutted against the air guide cover through the elastic part, and the other end of the heat dissipation module is abutted against the heat dissipation device. According to the air guide heat dissipation device, the heat dissipation module is integrated on the air guide cover and is not required to be fixed on the PCB mainboard in a drilling and spring stitch mode, so that punching on the PCB mainboard is avoided, wiring layout of the PCB mainboard is facilitated, and the utilization rate of the PCB mainboard is improved; in addition, the heat dissipation module is made of heat dissipation plastic, the top surface of the heat dissipation device can be effectively contacted with the bottom surface of the heat dissipation base through the elastic part, and the heat dissipation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of servers, in particular to an air guide heat dissipation device.
Background
With the development of technology, the pin count of the CPU and the memory of the new generation is continuously increased, and the density of the components on the PCB main board is increased, which leads to the daily shortage of space on the PCB main board and the difficulty in the layout of the wiring on the PCB main board. The VR power supply and the radiating fins of various wafers positioned in front of and behind the CPU are fixed in a drilling mode and spring pins, and the wiring space of the PCB mainboard is seriously influenced by the drilling hole in the fixing mode.
Disclosure of Invention
In order to solve the technical problems, the invention provides an air guide heat dissipation device which can avoid punching on a PCB main board and improve heat dissipation efficiency.
In order to achieve the purpose, the invention provides an air guide heat dissipation device which comprises a shell, wherein a mainboard and an air guide cover are installed on the shell, a heat dissipation device is arranged on the mainboard, a heat dissipation module is arranged between the air guide cover and the heat dissipation device, an elastic part is arranged on the heat dissipation module, one end of the heat dissipation module is abutted against the air guide cover through the elastic part, and the other end of the heat dissipation module is abutted against the heat dissipation device.
In an embodiment of the invention, the wind scooper is detachably connected with or integrally formed with the heat dissipation module.
In an embodiment of the invention, when the wind scooper is detachably connected with the heat dissipation module, the wind scooper is provided with a mounting hole, and two ends of the heat dissipation module are inserted into the mounting hole.
In an embodiment of the invention, the heat dissipation module is made of heat dissipation plastic by injection molding.
In an embodiment of the present invention, the heat dissipation module includes a heat dissipation base, a bottom surface of the heat dissipation base abuts against a top surface of the heat dissipation device, and a plurality of heat dissipation fins are disposed on the top surface of the heat dissipation base.
In an embodiment of the present invention, the wind guide cover is provided with a limiting post at both sides of the heat dissipation module, and a distance from a bottom surface of the limiting post to a bottom surface of the heat dissipation base is smaller than a thickness of the heat dissipation device.
In one embodiment of the present invention, a plurality of the heat dissipation fins are in a linear array on the heat dissipation base.
In one embodiment of the invention, the cross section of the radiating fin is in a tangential triangle or tangential streamline shape.
In an embodiment of the invention, the heat dissipation base is connected with the wind scooper through the elastic part, and when the wind scooper is mounted on the housing, the elastic part is in a compressed state.
In one embodiment of the invention, the cross-sectional shape of the resilient portion is arranged in a serpentine shape.
Compared with the prior art, the technical scheme of the invention has the following advantages:
according to the air guide heat dissipation device, the heat dissipation module is integrated on the air guide cover and is not required to be fixed on the PCB mainboard in a drilling and spring stitch mode, so that punching on the PCB mainboard is avoided, wiring layout of the PCB mainboard is facilitated, and the utilization rate of the PCB mainboard is improved; in addition, the heat dissipation module is made of heat dissipation plastic, the top surface of the heat dissipation device can be effectively contacted with the bottom surface of the heat dissipation base through the elastic part, and the heat dissipation efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an air guiding and heat dissipating device according to the present invention;
fig. 2 is a front view of the wind-guiding heat sink of the present invention;
FIG. 3 is an enlarged partial schematic view of FIG. 2 at A;
FIG. 4 is a schematic view of an integrated structure of a wind scooper and a heat dissipation module in the wind-guiding heat dissipation device of the present invention;
FIG. 5 is a partial enlarged structural view at B in FIG. 4;
FIG. 6 is a schematic view of a detachable connection structure of an air guiding cover and a heat dissipating module in the air guiding heat dissipating device of the present invention;
FIG. 7 is a schematic structural diagram of a conventional heat dissipation module in the air conduction heat dissipation device of the present invention;
FIG. 8 is a schematic structural diagram of another type of heat dissipation module in the air conduction heat dissipation device of the present invention;
fig. 9 is a schematic structural view of a cooling fin of the wind-guiding heat dissipation device of the present invention, which is in a tangential plane triangle shape;
fig. 10 is a schematic structural view of a cooling fin of the wind guiding and cooling device of the present invention in a tangential wind surface streamline form.
The specification reference numbers indicate:
1. a housing; 2. a main board; 3. a wind scooper; 4. a heat dissipating device; 5. a heat dissipation module; 6. an elastic portion; 7. mounting holes; 8. a heat dissipation base; 9. a heat sink; 10. a limiting column.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 10, the air-guiding heat dissipation device of the present invention includes a housing 1, a main board 2 and an air-guiding cover 3 are mounted on the housing 1, a heat dissipation device 4 is disposed on the main board 2, a heat dissipation module 5 is disposed between the air-guiding cover 3 and the heat dissipation device 4, an elastic portion 6 is disposed on the heat dissipation module 5, one end of the heat dissipation module 5 is abutted against the air-guiding cover 3 by the elastic portion 6, and the other end of the heat dissipation module 5 is abutted against the heat dissipation device 4.
The prior art heat sink module 5 is typically directly fixed to the motherboard 2 by drilling holes and spring pins. And a through hole needs to be drilled on the main board 2, and the installation and the fixed connection of the heat dissipation module 5 are realized by using the through hole. The heat dissipation module 5 can be effectively fixed on the motherboard 2 through the through hole, but the through hole may affect the circuit layout on the motherboard 2. Two factors of signal quality and cost need to be considered simultaneously in the design of a general mainboard 2, and the cost can be reduced to the maximum extent on the premise of meeting the signal quality, so that the size and the stool of the mainboard 2 are limited to a certain extent. If the through holes are formed in the main board 2 for fixing the heat dissipation module 5, the through holes affect the layout of signals and even the wiring and signal quality of the main board, so that the invention provides the air guide heat dissipation device. The air guide heat dissipation device integrates the heat dissipation module 5 on the air guide cover 3, a through hole does not need to be formed on the mainboard 2, the heat dissipation module 5 can be effectively connected to the heat dissipation device 4 by the elastic part 6, and the heat dissipation efficiency is good.
In one embodiment, the air guiding cover 3 is detachably connected with or integrally formed with the heat dissipation module 5.
The connection mode of the wind scooper 3 and the heat dissipation module 5 can be selected in two ways, one is that the wind scooper 3 and the heat dissipation module 5 are detachably connected, as shown in fig. 6; one is that the wind scooper 3 and the heat dissipation module 5 are integrally formed, as shown in fig. 4. The connection mode between the wind scooper 3 and the heat dissipation module 5 needs to be determined according to specific actual requirements. The heat dissipation module 5 needs to be formed by injection molding of heat dissipation plastic, and if the air guide cover 3 and the heat dissipation module 5 are integrally formed, the air guide cover 3 and the heat dissipation module 5 are also integrally formed by the heat dissipation plastic, so that the heat dissipation efficiency is better, but the cost of the heat dissipation plastic is correspondingly improved. If the wind scooper 3 and the heat dissipation module 5 adopt a detachable connection mode, the heat dissipation module 5 adopts heat dissipation plastic injection molding, and the wind scooper 3 can adopt conventional material injection molding, so that the cost is reduced, but the heat dissipation efficiency is not good in an integrated molding mode. Therefore, the connection mode between the wind scooper 3 and the heat dissipation module 5 needs to be determined according to specific actual requirements.
In one embodiment, when the wind scooper 3 is detachably connected with the heat dissipation module 5, the wind scooper 3 is provided with a mounting hole 7, and two ends of the heat dissipation module 5 are inserted into the mounting hole 7.
When the wind scooper 3 is detachably connected with the heat dissipation module 5, the heat dissipation module 5 can be replaced according to specific requirements. The heat dissipation module 5 is formed in various shapes, as shown in fig. 7 and 8, fig. 7 is a structural view of a conventional heat dissipation module, and fig. 8 is a structural view of another heat dissipation module. The shape of the heat sink 9 needs to be set according to the specific layout of the heat dissipation device 4, and there is a possibility that the heat dissipation module 5 interferes with other components at the position where the heat dissipation module 5 is installed, so the shape of the heat dissipation module 5 is set to avoid the components that interfere; or according to the heat dissipation situation, the size of the heat dissipation fins 9 on the heat dissipation module 5 is set according to the specific heat dissipation requirements of the heat dissipation device 4, when the heat dissipation requirements of the heat dissipation device 4 are high, the heat dissipation module 5 with the large heat dissipation fins 9 can be selected, and when the heat dissipation requirements of the heat dissipation device 4 are low, the heat dissipation module 5 with the small heat dissipation fins 9 can be selected. Therefore, an appropriate heat dissipation module 5 such as shown in fig. 7 and 8 is selected according to a specific heat dissipation requirement, and then the appropriate heat dissipation module 5 is replaced on the wind scooper 3, so that the universality of the heat dissipation module 5 is improved.
In one embodiment, the heat dissipation module 5 is made of heat dissipation plastic by injection molding.
The heat dissipation plastic is made of heat conduction plastic, and the base material is uniformly filled with the heat conduction filler so as to improve the heat conduction performance of the base material. The heat conductivity coefficient of the heat dissipation plastic can be 5.0W/m.K or higher, and the heat dissipation requirement of the heat dissipation device 4 on the mainboard 2 can be met. In addition, the mass of the heat dissipation plastic is lighter compared with that of a conventional aluminum heat dissipation module, the product is thinner, and when the heat dissipation module 5 is integrated on the air guide cover 3, too large load cannot be applied to the air guide cover 3.
In one embodiment, the heat dissipation module 5 includes a heat dissipation base 8, a bottom surface of the heat dissipation base 8 abuts against a top surface of the heat dissipation device 4, and a plurality of heat dissipation fins 9 are disposed on the top surface of the heat dissipation base 8.
The heat sink device 4 is intended to achieve an efficient heat exchange between its internal heat and the outside air. Direct contact is an effective way of heat exchange, and therefore the bottom surface of the heat sink base 8 is in contact with the top surface of the heat sink device 4, so that the heat in the heat sink device 4 is efficiently transferred to the heat sink base 8, as shown in fig. 3. The heat dissipation base 8 transfers the heat transferred by the heat dissipation device 4 to the heat dissipation fins 9, the heat dissipation fins 9 are large in area, heat exchange with air can be effectively achieved, and then the heat can be taken away through the fan.
In one embodiment, the wind scooper 3 is provided with limiting columns 10 on two sides of the heat dissipation module 5, and the distance from the bottom surfaces of the limiting columns 10 to the bottom surface of the heat dissipation base 8 is smaller than the thickness of the heat dissipation device 4.
The middle part of the wind scooper 3 may move towards the mainboard 2 under the action of some other external forces, if the middle moving distance of the wind scooper 3 is too large, the compression amount of the elastic part 6 may be caused to be large, or the acting force of the bottom surface of the heat dissipation base 8 on the heat dissipation device 4 is too large, the heat dissipation device 4 may be affected, or even the heat dissipation device 4 may be crushed, so that the heat dissipation device 4 cannot work normally, therefore, the limiting columns 10 are arranged on the two sides of the heat dissipation module 5 on the wind scooper 3, and one limiting column 10 is arranged on one side of the wind scooper 3, as shown in fig. 5. In order to effectively contact the bottom surface of the heat dissipation base 8 with the top surface of the heat dissipation device 4 and achieve effective heat transfer, the distance from the bottom surface of the limiting column 10 to the bottom surface of the heat dissipation base 8 is smaller than the thickness of the heat dissipation device 4, and thus when the bottom surface of the heat dissipation base 8 is in contact with the top surface of the heat dissipation device 4, the bottom surface of the limiting column 10 is further away from the top surface of the PCB mainboard 2. When the middle part of the wind scooper 3 moves towards the PCB mainboard 2 under the action of other external forces, the limiting column 10 moves a certain distance and then supports against the PCB mainboard 2, so that the compression amount of the elastic part 6 is not too large, the acting force of the bottom surface of the heat dissipation base 8 on the heat dissipation device 4 is not too large, and the risk that the heat dissipation device 4 is crushed by the external force is avoided.
In one embodiment, a plurality of fins 9 are in a linear array on the heat sink base 8.
The heat dissipation device 4 transfers heat to the heat dissipation base 8, the heat dissipation base 8 transfers the heat to the heat dissipation fins 9, then the heat dissipation fins 9 exchange heat with air, and finally the heat is taken away through air flow brought by the fan. Since one heat sink 9 has too low efficiency of heat exchange with air, a plurality of heat sinks 9 are arranged in an array on the heat sink base 8 as shown in fig. 5, so that the total heat dissipation area of all the heat sinks 9 is increased greatly, and the efficiency of heat exchange with air is effectively improved.
In one embodiment, the cross-section of the fins 9 is in the shape of a tangential triangle or a tangential streamline.
The heat dissipation module 5 is provided with a fan at a position corresponding to the heat dissipation fins 9, the fan is responsible for realizing air flow, generating air flow, and taking away hot air which realizes heat exchange with the heat dissipation fins 9 by utilizing the air flow to realize heat dissipation. The air flow may generate resistance when flowing in the gaps between the fins 9, which may reduce the speed of the air flow, thereby reducing the heat dissipation efficiency. Therefore, the cross section of the radiating fins 9 is set to be a tangential surface triangle or a tangential surface streamline, so that when air flows through the gaps between the adjacent radiating fins 9, the wind resistance generated by the gaps is small, the flowing speed of the air flow is improved, and the radiating efficiency is improved. The resistance of the airflow flowing in the gaps between the radiating fins 9 is measured by the wind resistance coefficient, the wind resistance coefficient of the gap between the adjacent radiating fins 9 designed in a tangential wind surface triangle shape is 0.5, the wind resistance coefficient of the gap between the adjacent radiating fins 9 designed in a tangential wind surface streamline shape is 0.04, and the wind resistance coefficients of other tangential wind surface forms are generally more than 1, so that the wind resistance coefficient of the gap formed between the radiating fins 9 designed in the tangential wind surface triangle shape and the tangential wind surface streamline shape is smaller, and the radiating efficiency of the radiating module 5 is improved. The wind direction of the two modes is shown in fig. 9 and 10, fig. 9 is a tangential surface triangle mode, fig. 10 is a tangential surface streamline mode, the wind direction needs to be kept in the direction shown in the figure and cannot be reversed, otherwise, the wind resistance is large, and the heat dissipation efficiency is seriously influenced.
In one embodiment, the heat dissipation base 8 and the wind scooper 3 are connected by the elastic portion 6, and when the wind scooper 3 is mounted on the housing 1, the elastic portion 6 is in a compressed state.
The heat sink base 8 is to be in effective contact with the heat sink device 4, and therefore a certain force is applied to the heat sink base 8, so that the bottom surface of the heat sink base 8 is effectively attached to the top surface of the heat sink device 4, and the elastic portion 6 performs this function. When the wind scooper 3 is mounted on the housing 1, the elastic portion 6 is in a compressed state, so that the elastic portion 6 generates an elastic force, the upper end of the elastic portion 6 abuts against the wind scooper 3, and the lower end of the elastic portion 6 abuts against the heat dissipating device 4. Thus, the bottom surface of the heat sink base 8 and the top surface of the heat sink device 4 are effectively contacted, and the heat dissipation efficiency is improved. The elastic portion 6 may have a structure as shown in fig. 3, or may be any elastic device capable of transmitting elastic force, such as a spring.
In one embodiment, the cross-sectional shape of the resilient portion 6 is a serpentine arrangement.
In order to realize effective elasticity and simple structure, the heat dissipation module 5 and the elastic part 6 are integrally formed by heat dissipation plastic, the cross section of the elastic part is in a snake-shaped arrangement, as shown in fig. 3 and 5, the structure is similar to the differential signal wiring mode of the PCB mainboard 2, and the structure is simple and reliable and can meet the requirement of elasticity.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. The utility model provides a wind-guiding heat abstractor which characterized in that: the heat dissipation device comprises a shell (1), wherein a mainboard (2) and an air guide cover (3) are installed on the shell (1), a heat dissipation device (4) is arranged on the mainboard (2), a heat dissipation module (5) is arranged between the air guide cover (3) and the heat dissipation device (4), an elastic part (6) is arranged on the heat dissipation module (5), one end of the heat dissipation module (5) is abutted to the air guide cover (3) through the elastic part (6), and the other end of the heat dissipation module (5) is abutted to the heat dissipation device (4).
2. The air guiding and heat dissipating device as claimed in claim 1, wherein: the wind scooper (3) and the heat dissipation module (5) are detachably connected or integrally formed.
3. The air guiding and heat dissipating device as claimed in claim 2, wherein: when the air guide cover (3) is detachably connected with the heat dissipation module (5), the air guide cover (3) is provided with a mounting hole (7), and two ends of the heat dissipation module (5) are inserted into the mounting hole (7).
4. The air guiding and heat dissipating device as claimed in claim 1, wherein: the heat dissipation module (5) is made of heat dissipation plastic through injection molding.
5. The air guiding and heat dissipating device as claimed in claim 1, wherein: the heat dissipation module (5) comprises a heat dissipation base (8), the bottom surface of the heat dissipation base (8) is abutted to the top surface of the heat dissipation device (4), and a plurality of heat dissipation fins (9) are arranged on the top surface of the heat dissipation base (8).
6. The wind-guiding heat dissipation device of claim 5, wherein: limiting columns (10) are arranged on the two sides, located on the heat dissipation module (5), of the air guide cover (3), and the distance from the bottom surfaces of the limiting columns (10) to the bottom surface of the heat dissipation base (8) is smaller than the thickness of the heat dissipation device (4).
7. The wind-guiding heat dissipation device of claim 5, wherein: the plurality of radiating fins (9) are arranged on the radiating base (8) in a linear array.
8. The wind-guiding heat dissipation device of claim 5, wherein: the cross section of the radiating fin (9) is in a tangential wind surface triangle shape or a tangential wind surface streamline shape.
9. The wind-guiding heat dissipation device of claim 5, wherein: the heat dissipation base (8) is connected with the air guide cover (3) through the elastic part (6), and when the air guide cover (3) is installed on the shell (1), the elastic part (6) is in a compressed state.
10. The air guiding and heat dissipating device as claimed in claim 9, wherein: the cross-sectional shape of the elastic part (6) is arranged in a snake shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111340181.9A CN114138085B (en) | 2021-11-12 | 2021-11-12 | Wind-guiding heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111340181.9A CN114138085B (en) | 2021-11-12 | 2021-11-12 | Wind-guiding heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114138085A true CN114138085A (en) | 2022-03-04 |
| CN114138085B CN114138085B (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111340181.9A Active CN114138085B (en) | 2021-11-12 | 2021-11-12 | Wind-guiding heat abstractor |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1624909A (en) * | 2004-12-02 | 2005-06-08 | 奇宏电子(深圳)有限公司 | Method and device of air exhausting guide of CPU heat sink |
| US20050270740A1 (en) * | 2004-06-04 | 2005-12-08 | Enlight Corporation | Heat-dissipating structure inside the computer mainframe |
| CN210924470U (en) * | 2019-12-31 | 2020-07-03 | 南京苏购电子有限公司 | Heat radiation module |
| CN111708410A (en) * | 2020-06-17 | 2020-09-25 | 西安易朴通讯技术有限公司 | Heat dissipation device and case |
-
2021
- 2021-11-12 CN CN202111340181.9A patent/CN114138085B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050270740A1 (en) * | 2004-06-04 | 2005-12-08 | Enlight Corporation | Heat-dissipating structure inside the computer mainframe |
| CN1624909A (en) * | 2004-12-02 | 2005-06-08 | 奇宏电子(深圳)有限公司 | Method and device of air exhausting guide of CPU heat sink |
| CN210924470U (en) * | 2019-12-31 | 2020-07-03 | 南京苏购电子有限公司 | Heat radiation module |
| CN111708410A (en) * | 2020-06-17 | 2020-09-25 | 西安易朴通讯技术有限公司 | Heat dissipation device and case |
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| Publication number | Publication date |
|---|---|
| CN114138085B (en) | 2023-07-14 |
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