CN114138085B - Wind-guiding heat abstractor - Google Patents
Wind-guiding heat abstractor Download PDFInfo
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- CN114138085B CN114138085B CN202111340181.9A CN202111340181A CN114138085B CN 114138085 B CN114138085 B CN 114138085B CN 202111340181 A CN202111340181 A CN 202111340181A CN 114138085 B CN114138085 B CN 114138085B
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 180
- 238000001746 injection moulding Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 abstract description 5
- 238000004080 punching Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an air guide heat dissipation device, which comprises a shell, wherein a main board and an air guide cover are arranged on the shell, a heat dissipation device is arranged on the main board, a heat dissipation module is arranged between the air guide cover and the heat dissipation device, an elastic part is arranged on the heat dissipation module, one end of the heat dissipation module is abutted to the air guide cover by the elastic part, and the other end of the heat dissipation module is abutted to the heat dissipation device. According to the wind-guiding heat dissipation device, the heat dissipation module is integrated on the wind-guiding cover and is not required to be fixed on the PCB main board in a mode of drilling and adding spring pins, so that punching on the PCB main board is avoided, wiring layout of the PCB main board is facilitated, and the utilization rate of the PCB main board is improved; in addition, the heat dissipation module is made of heat dissipation plastic, and the top surface of the heat dissipation device can be effectively contacted with the bottom surface of the heat dissipation base through the elastic part, so that the heat dissipation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of servers, in particular to an air guide heat dissipation device.
Background
With the development of technology, the pin count of new generation CPU and memory is increasing, and the density of components on the PCB is increasing, which results in the space on the PCB becoming more and more tight, and the routing of the PCB is more and more difficult to be laid out. The VR power supplies and the cooling fins of various chips positioned in front and behind the CPU are still fixed in the form of drilling holes and spring pins, and the wiring space of the PCB main board is seriously affected by the drilling holes formed by the fixing method.
Disclosure of Invention
In order to solve the technical problems, the invention provides the air guide heat dissipation device, which can avoid punching holes on a PCB main board and improve heat dissipation efficiency.
In order to achieve the above purpose, the invention provides an air guide and heat dissipation device, which comprises a shell, wherein a main board and an air guide cover are arranged on the shell, a heat dissipation device is arranged on the main board, a heat dissipation module is arranged between the air guide cover and the heat dissipation device, an elastic part is arranged on the heat dissipation module, one end of the heat dissipation module is abutted to the air guide cover by the elastic part, and the other end of the heat dissipation module is abutted to the heat dissipation device.
In one embodiment of the present invention, the wind scooper is detachably connected to or integrally formed with the heat dissipation module.
In one embodiment of the invention, when the wind scooper is detachably connected with the heat dissipation module, the wind scooper is provided with a mounting hole, and two ends of the heat dissipation module are inserted into the mounting hole.
In one embodiment of the present invention, the heat dissipation module is made of heat dissipation plastic by injection molding.
In one embodiment of the invention, the heat dissipation module comprises a heat dissipation base, wherein the bottom surface of the heat dissipation base is abutted against the top surface of the heat dissipation device, and a plurality of heat dissipation fins are arranged on the top surface of the heat dissipation base.
In one embodiment of the invention, limiting columns are arranged on the air guide cover and positioned on two sides of the heat dissipation module, and the distance from the bottom surface of the limiting columns to the bottom surface of the heat dissipation base is smaller than the thickness of the heat dissipation device.
In one embodiment of the invention, a plurality of the heat sinks are in a linear array on the heat sink base.
In one embodiment of the present invention, the cross section of the heat sink is in the shape of a cross-sectional triangle or a cross-sectional streamline.
In one embodiment of the present invention, the heat dissipation base is connected to the air guiding cover through the elastic part, and when the air guiding cover is mounted on the housing, the elastic part is in a compressed state.
In one embodiment of the invention, the cross-sectional shape of the resilient portion is in a serpentine arrangement.
Compared with the prior art, the technical scheme of the invention has the following advantages:
according to the wind-guiding heat dissipation device, the heat dissipation module is integrated on the wind-guiding cover, and is not required to be fixed on the PCB main board in a mode of drilling and adding spring pins, so that the punching on the PCB main board is avoided, the wiring layout of the PCB main board is facilitated, and the utilization rate of the PCB main board is improved; in addition, the heat dissipation module is made of heat dissipation plastic, and the top surface of the heat dissipation device can be effectively contacted with the bottom surface of the heat dissipation base through the elastic part, so that the heat dissipation efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an air guiding and dissipating device according to the present invention;
FIG. 2 is a front view of the air guiding and dissipating device of the present invention;
FIG. 3 is a schematic view of a partial enlarged structure at A in FIG. 2;
FIG. 4 is a schematic diagram of an integrally formed structure of a wind scooper and a heat dissipation module in the wind scooper;
FIG. 5 is a schematic view of a partially enlarged structure at B in FIG. 4;
FIG. 6 is a schematic diagram of a detachable connection structure of a wind scooper and a heat dissipation module in the wind scooper;
FIG. 7 is a schematic view of a conventional heat dissipating module of the wind-guiding heat dissipating device according to the present invention;
FIG. 8 is a schematic view of another heat dissipating module of the air guiding heat dissipating device according to the present invention;
FIG. 9 is a schematic diagram of a wind-guiding heat dissipating device according to the present invention with triangular fins;
FIG. 10 is a schematic view of a heat sink with a tangential flow configuration in an air guiding heat dissipating device according to the present invention.
Description of the specification reference numerals:
1. a housing; 2. a main board; 3. a wind scooper; 4. a heat sink; 5. a heat dissipation module; 6. an elastic part; 7. a mounting hole; 8. a heat dissipation base; 9. a heat sink; 10. and a limit column.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 10, the air guiding and radiating device of the present invention includes a housing 1, a main board 2 and an air guiding cover 3 are mounted on the housing 1, a radiating device 4 is disposed on the main board 2, a radiating module 5 is disposed between the air guiding cover 3 and the radiating device 4, an elastic portion 6 is disposed on the radiating module 5, the elastic portion 6 enables one end of the radiating module 5 to abut against the air guiding cover 3, and the other end of the radiating module 5 abuts against the radiating device 4.
The prior art heat dissipating module 5 is typically directly fixed to the motherboard 2 by drilling and spring pins. And a through hole needs to be drilled on the main board 2, and the through hole is used for realizing the installation and the fixed connection of the heat dissipation module 5. The heat dissipation module 5 can be effectively fixed on the motherboard 2 through the through holes, but the through holes can affect the circuit layout on the motherboard 2. The design of the main board 2 needs to consider two factors of signal quality and cost at the same time, and can reduce the cost to the maximum extent on the premise of meeting the signal quality, so that the size and the size of the main board 2 are limited. If a through hole is formed on the motherboard 2 for fixing the heat dissipation module 5, the through hole affects the layout of signals and even affects the routing and signal quality of the motherboard, so the invention provides an air guiding heat dissipation device. According to the air guide radiating device, the radiating module 5 is integrated on the air guide cover 3, a through hole is not required to be formed in the main board 2, and the radiating module 5 can be effectively connected to the radiating device 4 by means of the elastic part 6, so that radiating efficiency is good.
In one embodiment, the wind scooper 3 is detachably connected or integrally formed with the heat dissipation module 5.
The connection mode of the wind scooper 3 and the heat dissipation module 5 can be two options, one is that the wind scooper 3 and the heat dissipation module 5 are detachably connected, as shown in fig. 6; one is that the wind scooper 3 and the heat dissipation module 5 are integrally formed, as shown in fig. 4. The connection mode of the wind scooper 3 and the heat dissipation module 5 needs to be determined according to specific practical requirements. The heat dissipation module 5 needs to be formed by adopting heat dissipation plastic injection molding, if the wind scooper 3 and the heat dissipation module 5 adopt an integrated molding mode, the wind scooper 3 also can be formed by using the heat dissipation plastic and the heat dissipation module 5, so that the heat dissipation efficiency can be better, but the cost of the heat dissipation plastic can be correspondingly improved. If the wind scooper 3 and the heat dissipation module 5 adopt a detachable connection mode, the heat dissipation module 5 adopts heat dissipation plastic injection molding, the wind scooper 3 can adopt conventional material injection molding, so that the cost can be reduced, but the heat dissipation efficiency is not good in an integral molding mode. Therefore, the connection manner between the wind scooper 3 and the heat dissipation module 5 needs to be determined according to specific practical requirements.
In one embodiment, when the wind scooper 3 is detachably connected with the heat dissipation module 5, the wind scooper 3 is provided with a mounting hole 7, and two ends of the heat dissipation module 5 are inserted into the mounting hole 7.
When the wind scooper 3 is detachably connected with the heat dissipation module 5, the heat dissipation module 5 can be replaced according to specific requirements. The heat dissipation module 5 is made in various shapes, as shown in fig. 7 and 8, fig. 7 is a structural view of a conventional form of the heat dissipation module, and fig. 8 is a structural view of other forms of the heat dissipation module. The shape of the heat sink 9 needs to be set according to the layout situation of the specific heat dissipating device 4, and the heat dissipating module 5 may interfere with other components at the position where the heat dissipating module 5 is installed, so the shape of the heat dissipating module 5 is set to avoid the components that interfere; or according to the heat dissipation situation, the size of the heat dissipation fins 9 on the heat dissipation module 5 is set according to the specific heat dissipation requirement of the heat dissipation device 4, when the heat dissipation requirement of the heat dissipation device 4 is high, the heat dissipation module 5 with large heat dissipation fins 9 can be selected, and when the heat dissipation requirement of the heat dissipation device 4 is low, the heat dissipation module 5 with small heat dissipation fins 9 can be selected. Therefore, the appropriate heat dissipation module 5 as shown in fig. 7 and 8 is selected according to specific heat dissipation requirements, and then the appropriate heat dissipation module 5 is replaced on the air guide cover 3, so that the universality of the heat dissipation module 5 is improved.
In one embodiment, the heat dissipating module 5 is made by injection molding of heat dissipating plastic.
The heat dissipation plastic is made of heat conduction plastic, and the matrix material is uniformly filled with the heat conduction filler so as to improve the heat conduction performance of the heat dissipation plastic. The heat conductivity coefficient of the heat dissipation plastic can be 5.0W/mK or higher, and the heat dissipation requirement of the heat dissipation device 4 on the main board 2 can be met. In addition, the heat dissipation plastic has lighter mass and thinner product compared with the conventional aluminum heat dissipation module, and when the heat dissipation module 5 is integrated on the wind scooper 3, the heat dissipation plastic cannot apply too large load to the wind scooper 3.
In one embodiment, the heat dissipation module 5 includes a heat dissipation base 8, a bottom surface of the heat dissipation base 8 abuts against a top surface of the heat dissipation device 4, and a plurality of heat dissipation fins 9 are disposed on the top surface of the heat dissipation base 8.
The heat sink 4 is to perform efficient heat exchange between its internal heat and the outside air. Direct contact is an efficient way of exchanging heat, so that the bottom surface of the heat sink base 8 is in contact with the top surface of the heat sink 4, so that the heat in the heat sink 4 is efficiently transferred to the heat sink base 8, as shown in fig. 3. The heat dissipation base 8 transfers the heat transferred by the heat dissipation device 4 to the heat dissipation fins 9, the area of the heat dissipation fins 9 is large, heat exchange with air can be effectively achieved, and then the heat can be taken away through the fan.
In one embodiment, the air guide cover 3 is provided with a limit post 10 on two sides of the heat dissipation module 5, and the distance from the bottom surface of the limit post 10 to the bottom surface of the heat dissipation base 8 is smaller than the thickness of the heat dissipation device 4.
The middle part of the wind scooper 3 may move towards the direction of the main board 2 under the action of some other external force, if the moving distance of the middle part of the wind scooper 3 is too large, the compression amount of the elastic part 6 may be larger, or the acting force of the bottom surface of the heat dissipation base 8 to the heat dissipation device 4 is too large, the heat dissipation device 4 may be affected, and even the heat dissipation device 4 may be crushed, so that the heat dissipation device 4 cannot work normally, and therefore, limit posts 10 are arranged on two sides of the wind scooper 3, which are located on the heat dissipation module 5, and one limit post 10 is arranged on one side, as shown in fig. 5. In order to effectively contact the bottom surface of the heat dissipation base 8 with the top surface of the heat dissipation device 4, effective heat transfer is achieved, the distance from the bottom surface of the limit post 10 to the bottom surface of the heat dissipation base 8 is smaller than the thickness of the heat dissipation device 4, and therefore when the bottom surface of the heat dissipation base 8 contacts the top surface of the heat dissipation device 4, a certain distance is reserved between the bottom surface of the limit post 10 and the top surface of the PCB main board 2. When the middle part of the wind scooper 3 moves towards the PCB main board 2 under the action of some other external force, the limit post 10 can be propped against the PCB main board 2 after moving for a certain distance, so that the compression amount of the elastic part 6 can not be too large, and the acting force of the bottom surface of the heat dissipation base 8 to the heat dissipation device 4 can not be too large, and the heat dissipation device 4 can not be damaged by the external force.
In one embodiment, the plurality of fins 9 are in a linear array on the heat sink base 8.
The heat dissipation device 4 transfers heat to the heat dissipation base 8, the heat dissipation base 8 transfers heat to the heat dissipation fins 9, then the heat dissipation fins 9 exchange heat with air, and finally the heat is taken away by air flow brought by the fan. The efficiency of heat exchange between one heat sink 9 and air is too low, so that a plurality of heat sinks 9 are arranged in an array on the heat dissipation base 8, as shown in fig. 5, so that the total heat dissipation area of all heat sinks 9 is greatly increased, and the efficiency of heat exchange with air is effectively improved.
In one embodiment, the cross section of the fin 9 is in the form of a cross-sectional triangle or a cross-sectional streamline.
The heat dissipation module 5 is provided with a fan at a position corresponding to the heat dissipation fin 9, the fan is responsible for realizing the flow of air, generating air flow, taking away the hot air which realizes heat exchange with the heat dissipation fin 9 by utilizing the air flow, and realizing heat dissipation. The air flow is caused to flow in the gaps between the heat radiating fins 9, and this resistance reduces the speed of the air flow, thereby reducing the heat radiating efficiency. Therefore, the cross section of the radiating fins 9 is arranged in a tangential triangle or a tangential streamline shape, so that when the air flow passes through the gaps between the adjacent radiating fins 9, the air resistance generated by the gaps is smaller, the flowing speed of the air flow is improved, and the radiating efficiency is improved. The resistance of the air flow flowing in the gaps between the fins 9 is measured by the wind resistance coefficient, the wind resistance coefficient of the gaps between the adjacent fins 9 of the tangential plane triangle design is 0.5, the wind resistance coefficient of the gaps between the adjacent fins 9 of the tangential plane streamline design is 0.04, and the wind resistance coefficients of other tangential planes are generally above 1, so the wind resistance coefficient of the gaps formed between the fins 9 of the tangential plane triangle and tangential plane streamline designs is smaller, and the heat dissipation efficiency of the heat dissipation module 5 is improved. The wind entering directions in two modes are shown in fig. 9 and 10, fig. 9 is a wind-cutting face triangle mode, fig. 10 is a wind-cutting face streamline mode, the wind entering directions are kept in the illustrated directions and cannot be reversed, otherwise, the wind resistance is large, and the heat dissipation efficiency is seriously affected.
In one embodiment, the heat dissipation base 8 is connected to the air guiding cover 3 through an elastic portion 6, and when the air guiding cover 3 is mounted on the housing 1, the elastic portion 6 is in a compressed state.
The heat dissipation base 8 is to be in effective contact with the heat dissipation device 4, so a certain force is applied to the heat dissipation base 8, so that the bottom surface of the heat dissipation base 8 is effectively attached to the top surface of the heat dissipation device 4, and the elastic part 6 realizes the function. When the wind scooper 3 is mounted on the housing 1, the elastic portion 6 is in a compressed state, so that the elastic portion 6 generates an elastic force, so that the upper end of the elastic portion 6 abuts against the wind scooper 3, and the lower end of the elastic portion 6 abuts against the heat dissipating device 4. Thus, the bottom surface of the heat dissipation base 8 and the top surface of the heat dissipation device 4 can be effectively contacted, and the heat dissipation efficiency can be improved. The elastic portion 6 may be configured as shown in fig. 3, or may be any elastic device capable of transmitting elastic force, such as a spring.
In one of the embodiments, the cross-sectional shape of the elastic portion 6 is a serpentine arrangement.
In order to achieve effective elastic force, the structure is simple, heat dissipation plastic integrated molding can be adopted with the heat dissipation module 5, the cross section of the elastic part 6 is in serpentine arrangement, as shown in fig. 3 and 5, the structure is simple and reliable, and elastic force requirements can be met in a mode similar to the differential signal wiring of the PCB main board 2.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (7)
1. An air-guiding heat dissipating device, characterized in that: the novel heat dissipation device comprises a shell (1), wherein a main board (2) and a wind scooper (3) are arranged on the shell (1), a heat dissipation device (4) is arranged on the main board (2), a heat dissipation module (5) is arranged between the wind scooper (3) and the heat dissipation device (4), an elastic part (6) is arranged on the heat dissipation module (5), one end of the heat dissipation module (5) is abutted to the wind scooper (3) through the elastic part (6), and the other end of the heat dissipation module (5) is abutted to the heat dissipation device (4); the wind scooper (3) and the heat dissipation module (5) are detachably connected or integrally formed; when the wind scooper (3) is detachably connected with the heat dissipation module (5), the wind scooper (3) is provided with a mounting hole (7), and two ends of the heat dissipation module (5) are inserted into the mounting hole (7); the heat dissipation module (5) comprises a heat dissipation base (8), and the bottom surface of the heat dissipation base (8) is abutted to the top surface of the heat dissipation device (4); the heat dissipation base (8) is connected with the air guide cover (3) through the elastic part (6), and when the air guide cover (3) is installed on the shell (1), the elastic part (6) is in a compressed state.
2. The air guiding and cooling device according to claim 1, wherein: the heat dissipation module (5) is made of heat dissipation plastic through injection molding.
3. The air guiding and cooling device according to claim 1, wherein: a plurality of radiating fins (9) are arranged on the top surface of the radiating base (8).
4. A wind-guiding heat sink according to claim 3, wherein: limiting columns (10) are arranged on the air guide cover (3) and located on two sides of the heat dissipation module (5), and the distance from the bottom surface of each limiting column (10) to the bottom surface of the heat dissipation base (8) is smaller than the thickness of the heat dissipation device (4).
5. A wind-guiding heat sink according to claim 3, wherein: a plurality of the radiating fins (9) are arranged in a linear array on the radiating base (8).
6. A wind-guiding heat sink according to claim 3, wherein: the cross section of the radiating fin (9) is in a cross section triangle or a cross section streamline type.
7. The air guiding and cooling device according to claim 1, wherein: the cross-sectional shape of the elastic part (6) is arranged in a serpentine shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111340181.9A CN114138085B (en) | 2021-11-12 | 2021-11-12 | Wind-guiding heat abstractor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111340181.9A CN114138085B (en) | 2021-11-12 | 2021-11-12 | Wind-guiding heat abstractor |
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| Publication Number | Publication Date |
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| CN114138085A CN114138085A (en) | 2022-03-04 |
| CN114138085B true CN114138085B (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111340181.9A Active CN114138085B (en) | 2021-11-12 | 2021-11-12 | Wind-guiding heat abstractor |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1624909A (en) * | 2004-12-02 | 2005-06-08 | 奇宏电子(深圳)有限公司 | Method and device of air exhausting guide of CPU heat sink |
| CN210924470U (en) * | 2019-12-31 | 2020-07-03 | 南京苏购电子有限公司 | Heat radiation module |
| CN111708410A (en) * | 2020-06-17 | 2020-09-25 | 西安易朴通讯技术有限公司 | Heat dissipation device and case |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM259219U (en) * | 2004-06-04 | 2005-03-11 | Enlight Corp | Heat dissipation structure of computer host interior |
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2021
- 2021-11-12 CN CN202111340181.9A patent/CN114138085B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1624909A (en) * | 2004-12-02 | 2005-06-08 | 奇宏电子(深圳)有限公司 | Method and device of air exhausting guide of CPU heat sink |
| CN210924470U (en) * | 2019-12-31 | 2020-07-03 | 南京苏购电子有限公司 | Heat radiation module |
| CN111708410A (en) * | 2020-06-17 | 2020-09-25 | 西安易朴通讯技术有限公司 | Heat dissipation device and case |
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| Publication number | Publication date |
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| CN114138085A (en) | 2022-03-04 |
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