CN114127221A - 有机硅压敏粘合剂组合物及其制备方法和用途 - Google Patents

有机硅压敏粘合剂组合物及其制备方法和用途 Download PDF

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Publication number
CN114127221A
CN114127221A CN201980098183.6A CN201980098183A CN114127221A CN 114127221 A CN114127221 A CN 114127221A CN 201980098183 A CN201980098183 A CN 201980098183A CN 114127221 A CN114127221 A CN 114127221A
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China
Prior art keywords
composition
weight
starting materials
group
sensitive adhesive
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Pending
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CN201980098183.6A
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English (en)
Chinese (zh)
Inventor
江金贵
刘志华
黄福明
陈文杰
朱成蓉
朱家寅
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Dow Silicones Corp
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Dow Corning Corp
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Publication of CN114127221A publication Critical patent/CN114127221A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201980098183.6A 2019-07-03 2019-07-03 有机硅压敏粘合剂组合物及其制备方法和用途 Pending CN114127221A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/094498 WO2021000279A1 (en) 2019-07-03 2019-07-03 Silicone pressure sensitive adhesive composition and methods for preparation and use thereof

Publications (1)

Publication Number Publication Date
CN114127221A true CN114127221A (zh) 2022-03-01

Family

ID=74100436

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980098183.6A Pending CN114127221A (zh) 2019-07-03 2019-07-03 有机硅压敏粘合剂组合物及其制备方法和用途

Country Status (6)

Country Link
US (1) US12351744B2 (enExample)
EP (1) EP3994228B1 (enExample)
JP (1) JP7334279B2 (enExample)
KR (1) KR102724169B1 (enExample)
CN (1) CN114127221A (enExample)
WO (1) WO2021000279A1 (enExample)

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KR102757571B1 (ko) 2019-10-31 2025-01-22 다우 실리콘즈 코포레이션 실리콘 감압 접착제 조성물 및 이의 제조 및 사용 방법
EP4330340B1 (en) * 2021-04-27 2026-02-25 Dow Silicones Corporation Hydrosilylation reaction cured silicone pressure sensitive adhesive, composition and method for its preparation, and use in flexible display device
KR102650741B1 (ko) 2021-04-27 2024-03-26 다우 실리콘즈 코포레이션 라디칼 경화된 실리콘 감압성 접착제 및 조성물 및 이의 제조 방법 및 가요성 디스플레이 장치에서의 용도
WO2022246681A1 (en) 2021-05-26 2022-12-01 Dow Silicones Corporation Silicone pressure sensitive adhesive composition containing a fluorosilicone additive and methods for the preparation and use thereof
CN117412860A (zh) 2021-06-16 2024-01-16 美国陶氏有机硅公司 含有多氟聚醚硅烷添加剂的有机硅压敏粘合剂组合物以及所述组合物的制备方法和用途
US12384948B2 (en) 2021-06-16 2025-08-12 Dow Silicones Corporation Silicone pressure sensitive adhesive composition containing a fluoro-containing polyorganohydrogensiloxane crosslinker and methods for the preparation and use of said composition
WO2023076871A1 (en) 2021-11-01 2023-05-04 Dow Silicones Corporation Method for preparation of a laminate article including a silicone pressure sensitive adhesive adhered to silicone rubber
CN114196374B (zh) * 2022-01-13 2023-05-30 万华化学集团股份有限公司 适用于tpu膜通用型固化的高af屏粘合力有机硅压敏胶、制备方法及其应用
EP4602347A1 (en) 2022-10-12 2025-08-20 TotalEnergies OneTech Device for analyzing samples of microorganisms in liquids
EP4612250A1 (en) * 2022-12-23 2025-09-10 Dow Silicones Corporation Silicone-based pressure sensitive adhesive layer-forming composition and use thereof

Citations (3)

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US20160289499A1 (en) * 2015-03-30 2016-10-06 Dow Corning Toray Co., Ltd. Silicone Material, Curable Silicone Composition, And Optical Device
CN106753195A (zh) * 2016-11-23 2017-05-31 成都拓利科技股份有限公司 一种有机硅压敏胶及压敏胶胶带或膜
WO2018048243A1 (ko) * 2016-09-09 2018-03-15 주식회사 엘지화학 폴더블 디스플레이용 점착제 조성물

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JPH0684494B2 (ja) * 1986-11-28 1994-10-26 東レ・ダウコーニング・シリコーン株式会社 シリコーン感圧接着剤組成物
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US5366809A (en) * 1993-09-02 1994-11-22 Dow Corning Corporation Silicone pressure-sensitive adhesives
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JP5825738B2 (ja) * 2011-12-29 2015-12-02 東レ・ダウコーニング株式会社 シリコーン系感圧接着剤組成物、積層体およびシリコーン粘着テープ
EP2817145B1 (en) 2012-02-23 2020-04-01 Dow Chemical Taiwan Limited Pressure sensitive adhesive sheet and method of producing thereof
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JP6569105B2 (ja) 2014-07-10 2019-09-04 ダウ・東レ株式会社 剥離コントロール剤、それを含むシリコーン剥離剤組成物、剥離シート、及び積層体
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CN108329861A (zh) 2018-02-11 2018-07-27 江苏斯迪克新材料科技股份有限公司 一种应用于曲面显示屏的热定型保护膜
CN109880584A (zh) 2019-02-22 2019-06-14 深圳市康利邦科技有限公司 一种用于af抗指纹屏的有机硅压敏胶
JP7197008B2 (ja) 2019-06-27 2022-12-27 株式会社村田製作所 ポンプ装置
CN113474437B (zh) * 2020-01-15 2022-10-28 美国陶氏有机硅公司 有机硅压敏粘合剂组合物及其制备方法和用途

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US20160289499A1 (en) * 2015-03-30 2016-10-06 Dow Corning Toray Co., Ltd. Silicone Material, Curable Silicone Composition, And Optical Device
WO2018048243A1 (ko) * 2016-09-09 2018-03-15 주식회사 엘지화학 폴더블 디스플레이용 점착제 조성물
CN106753195A (zh) * 2016-11-23 2017-05-31 成都拓利科技股份有限公司 一种有机硅压敏胶及压敏胶胶带或膜

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JP7334279B2 (ja) 2023-08-28
KR20220031643A (ko) 2022-03-11
EP3994228B1 (en) 2026-01-28
KR102724169B1 (ko) 2024-11-01
JP2022545154A (ja) 2022-10-26
US12351744B2 (en) 2025-07-08
WO2021000279A1 (en) 2021-01-07
US20220235251A1 (en) 2022-07-28
EP3994228A1 (en) 2022-05-11
EP3994228A4 (en) 2023-05-03

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