CN114126206A - 印制电路板及其制作方法、板级架构和电子设备 - Google Patents
印制电路板及其制作方法、板级架构和电子设备 Download PDFInfo
- Publication number
- CN114126206A CN114126206A CN202111426426.XA CN202111426426A CN114126206A CN 114126206 A CN114126206 A CN 114126206A CN 202111426426 A CN202111426426 A CN 202111426426A CN 114126206 A CN114126206 A CN 114126206A
- Authority
- CN
- China
- Prior art keywords
- medium
- printed circuit
- circuit board
- dielectric
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 116
- 238000000034 method Methods 0.000 claims description 39
- 238000001029 thermal curing Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 60
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 239000002184 metal Substances 0.000 description 33
- 229910052751 metal Inorganic materials 0.000 description 33
- 238000010586 diagram Methods 0.000 description 22
- 229910000679 solder Inorganic materials 0.000 description 22
- 239000002131 composite material Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 238000005336 cracking Methods 0.000 description 6
- 230000000737 periodic effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111426426.XA CN114126206A (zh) | 2021-11-27 | 2021-11-27 | 印制电路板及其制作方法、板级架构和电子设备 |
PCT/CN2022/133264 WO2023093680A1 (fr) | 2021-11-27 | 2022-11-21 | Carte de circuit imprimé et son procédé de fabrication, architecture au niveau de la carte et dispositif électronique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111426426.XA CN114126206A (zh) | 2021-11-27 | 2021-11-27 | 印制电路板及其制作方法、板级架构和电子设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114126206A true CN114126206A (zh) | 2022-03-01 |
Family
ID=80370721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111426426.XA Pending CN114126206A (zh) | 2021-11-27 | 2021-11-27 | 印制电路板及其制作方法、板级架构和电子设备 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN114126206A (fr) |
WO (1) | WO2023093680A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023093680A1 (fr) * | 2021-11-27 | 2023-06-01 | 华为技术有限公司 | Carte de circuit imprimé et son procédé de fabrication, architecture au niveau de la carte et dispositif électronique |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1558710A (zh) * | 2003-02-28 | 2004-12-29 | ���ְ�˹��ʽ���� | 具有阻止变形部件的电路板及电路板的形成方法 |
JP2007095727A (ja) * | 2005-09-27 | 2007-04-12 | Sanyo Electric Co Ltd | セラミック基板およびこれを用いた電子デバイス |
KR20110012332A (ko) * | 2009-07-30 | 2011-02-09 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP2012064868A (ja) * | 2010-09-17 | 2012-03-29 | Mitsubishi Electric Corp | 電子部品 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114126206A (zh) * | 2021-11-27 | 2022-03-01 | 华为技术有限公司 | 印制电路板及其制作方法、板级架构和电子设备 |
-
2021
- 2021-11-27 CN CN202111426426.XA patent/CN114126206A/zh active Pending
-
2022
- 2022-11-21 WO PCT/CN2022/133264 patent/WO2023093680A1/fr unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1558710A (zh) * | 2003-02-28 | 2004-12-29 | ���ְ�˹��ʽ���� | 具有阻止变形部件的电路板及电路板的形成方法 |
JP2007095727A (ja) * | 2005-09-27 | 2007-04-12 | Sanyo Electric Co Ltd | セラミック基板およびこれを用いた電子デバイス |
KR20110012332A (ko) * | 2009-07-30 | 2011-02-09 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP2012064868A (ja) * | 2010-09-17 | 2012-03-29 | Mitsubishi Electric Corp | 電子部品 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023093680A1 (fr) * | 2021-11-27 | 2023-06-01 | 华为技术有限公司 | Carte de circuit imprimé et son procédé de fabrication, architecture au niveau de la carte et dispositif électronique |
Also Published As
Publication number | Publication date |
---|---|
WO2023093680A1 (fr) | 2023-06-01 |
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PB01 | Publication | ||
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