CN114126206A - 印制电路板及其制作方法、板级架构和电子设备 - Google Patents

印制电路板及其制作方法、板级架构和电子设备 Download PDF

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Publication number
CN114126206A
CN114126206A CN202111426426.XA CN202111426426A CN114126206A CN 114126206 A CN114126206 A CN 114126206A CN 202111426426 A CN202111426426 A CN 202111426426A CN 114126206 A CN114126206 A CN 114126206A
Authority
CN
China
Prior art keywords
medium
printed circuit
circuit board
dielectric
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111426426.XA
Other languages
English (en)
Chinese (zh)
Inventor
程柳军
蔡黎
高峰
张林川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202111426426.XA priority Critical patent/CN114126206A/zh
Publication of CN114126206A publication Critical patent/CN114126206A/zh
Priority to PCT/CN2022/133264 priority patent/WO2023093680A1/fr
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
CN202111426426.XA 2021-11-27 2021-11-27 印制电路板及其制作方法、板级架构和电子设备 Pending CN114126206A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202111426426.XA CN114126206A (zh) 2021-11-27 2021-11-27 印制电路板及其制作方法、板级架构和电子设备
PCT/CN2022/133264 WO2023093680A1 (fr) 2021-11-27 2022-11-21 Carte de circuit imprimé et son procédé de fabrication, architecture au niveau de la carte et dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111426426.XA CN114126206A (zh) 2021-11-27 2021-11-27 印制电路板及其制作方法、板级架构和电子设备

Publications (1)

Publication Number Publication Date
CN114126206A true CN114126206A (zh) 2022-03-01

Family

ID=80370721

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111426426.XA Pending CN114126206A (zh) 2021-11-27 2021-11-27 印制电路板及其制作方法、板级架构和电子设备

Country Status (2)

Country Link
CN (1) CN114126206A (fr)
WO (1) WO2023093680A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023093680A1 (fr) * 2021-11-27 2023-06-01 华为技术有限公司 Carte de circuit imprimé et son procédé de fabrication, architecture au niveau de la carte et dispositif électronique

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1558710A (zh) * 2003-02-28 2004-12-29 ���ְ�˹��ʽ���� 具有阻止变形部件的电路板及电路板的形成方法
JP2007095727A (ja) * 2005-09-27 2007-04-12 Sanyo Electric Co Ltd セラミック基板およびこれを用いた電子デバイス
KR20110012332A (ko) * 2009-07-30 2011-02-09 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2012064868A (ja) * 2010-09-17 2012-03-29 Mitsubishi Electric Corp 電子部品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114126206A (zh) * 2021-11-27 2022-03-01 华为技术有限公司 印制电路板及其制作方法、板级架构和电子设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1558710A (zh) * 2003-02-28 2004-12-29 ���ְ�˹��ʽ���� 具有阻止变形部件的电路板及电路板的形成方法
JP2007095727A (ja) * 2005-09-27 2007-04-12 Sanyo Electric Co Ltd セラミック基板およびこれを用いた電子デバイス
KR20110012332A (ko) * 2009-07-30 2011-02-09 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2012064868A (ja) * 2010-09-17 2012-03-29 Mitsubishi Electric Corp 電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023093680A1 (fr) * 2021-11-27 2023-06-01 华为技术有限公司 Carte de circuit imprimé et son procédé de fabrication, architecture au niveau de la carte et dispositif électronique

Also Published As

Publication number Publication date
WO2023093680A1 (fr) 2023-06-01

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