CN114088716A

CN114088716A - Component mounting device and component warpage detection method

Info

Publication number: CN114088716A
Application number: CN202110639781.9A
Authority: CN
Inventors: 坪田一总; 韩猛; 秦纯一; 村田浩; 加藤秀明; 松田鹰则; 松尾诚一; 星野龙也; 福田尚三
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2020-06-08
Filing date: 2021-06-08
Publication date: 2022-02-25
Anticipated expiration: 2041-06-08
Also published as: CN114088716B; JP2021193706A; JP7417864B2

Abstract

The present invention can improve the robustness of ball height measurement and component warpage measurement of a ball component, thereby more accurately determining whether the ball component is a defective component. The component mounting device is provided with: an imaging unit that images, from a plurality of different directions, a plurality of balls provided on the lower surface of the component held by the mounting head; a defective ball determination unit that determines whether each of the plurality of balls is a defective ball based on each of a plurality of captured images captured from a plurality of different directions by the imaging unit; a ball height measuring unit that measures the height of each ball that is not determined as a defective ball by the defective ball determining unit; and a component warpage detection unit that detects warpage of the component based on the height of each ball measured by the ball height measurement unit.

Description

Component mounting device and component warpage detection method

Technical Field

The invention relates to a component mounting apparatus and a component warpage detection method.

Background

Patent document 1 discloses a component recognition method in which hemispherical terminals provided on an electronic component mounted on a printed wiring board are photographed from a plurality of directions, and the heights of the hemispherical terminals are detected based on a plurality of images obtained by the photographing in different photographing directions. In the component recognition method, after the hemispherical terminals are photographed from an oblique direction, the electronic component is rotated by a predetermined angle about an axis perpendicular to the mounting surface, then the hemispherical terminals are photographed from the oblique direction, and the heights of the hemispherical terminals are detected using an image before rotation and an image after rotation.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2005-340648

However, in patent document 1, the height of the electronic component is detected based on the heights of all hemispherical terminals including a defective hemispherical terminal provided in the electronic component using the image before rotation and the image after rotation, and therefore there is a possibility that the warpage of the electronic component cannot be accurately measured. In addition, in patent document 1, when the hemispherical terminal is broken, the shapes of the hemispherical terminals reflected on the image before rotation and the image after rotation are different from each other, and therefore, the accurate ball height cannot be measured, and there is a possibility that the electronic component without warpage is erroneously detected as a defective product with warpage.

Disclosure of Invention

Problems to be solved by the invention

The present invention has been made in view of the above-described conventional circumstances, and an object thereof is to provide a component mounting apparatus and a component warpage detection method that can improve robustness (robustness) of ball height measurement and component warpage measurement of a ball component and thereby more accurately determine whether the ball component is a defective component.

Means for solving the problems

The present invention provides a component mounting device, which comprises: an imaging unit that images, from a plurality of different directions, a plurality of balls provided on the lower surface of the component held by the mounting head; a defective ball determination unit that determines whether each of the plurality of balls is a defective ball based on each of the plurality of captured images captured from the plurality of different directions by the imaging unit; a ball height measuring unit that measures the height of each ball that is not determined as the defective ball by the defective ball determining unit; and a component warpage detection unit that detects warpage of the component based on the height of each of the balls measured by the ball height measurement unit.

The present invention also provides a component warpage measuring method, wherein a plurality of balls provided on a lower surface of a component held by a mounting head are picked up from a plurality of different directions, whether or not each of the plurality of balls is a defective ball is determined based on each of a plurality of picked-up images picked up from the plurality of different directions, heights of the respective balls that are not determined as the defective ball are measured, and warpage of the component is detected based on the heights of the respective balls measured by the height measuring device.

Effects of the invention

According to the present invention, the robustness of the ball height measurement and the component warpage measurement of the ball component can be improved, and whether the ball component is a defective component can be determined more accurately.

Drawings

Fig. 1 is a view of the component mounting apparatus according to the embodiment as viewed from above.

Fig. 2 is a side view showing a mechanical configuration example of the component mounting apparatus shown in fig. 1.

Fig. 3 is a perspective view showing a component mounting step of suction-to-mounting of a component by a mounting head.

Fig. 4 is a perspective view showing an example of the internal configuration of the component recognition camera.

Fig. 5 is a diagram illustrating a positional relationship between the component recognition camera and the ball component.

Fig. 6 is a block diagram illustrating a functional configuration of a control section of the component mounting apparatus.

Fig. 7 is a view showing an example of the lower surface of the ball member.

Fig. 8 is a flowchart illustrating an example of a component warp detection procedure of the component mounting device according to the embodiment.

Fig. 9 is a diagram illustrating an example of a component warp detection procedure of the component mounting device according to the embodiment.

Description of the reference numerals

1 parts mounting device

26 mounting head

28 parts recognition camera

28A Right Camera

28B left camera

40 control part

41 storage part

42 mechanism driving part

43 shooting processing part

43B defective ball determination section

43C ball height measuring unit

43D part warpage detection unit

43E defective component determination unit

BP, BP1, BP2 ball parts

B1, B2, B3, B4, B5 and B6 solder balls

F1 and F2 captured images

P part

UP, UP1, UP2 lower surface

And (5) a W substrate.

Detailed Description

Hereinafter, embodiments specifically disclosing the component mounting apparatus and the component warpage detection method of the present invention will be described in detail with reference to the drawings as appropriate. However, an excessively detailed description may be omitted. For example, detailed descriptions of already known matters and repetitive descriptions of substantially the same configuration may be omitted. This is to avoid the following description being too lengthy and to make it readily understandable by a person skilled in the art. It should be noted that the drawings and the following description are provided to fully understand the present invention by those skilled in the art, and the subject matter described in the technical solutions is not limited by these.

For example, the "unit" or "device" according to the embodiments is not limited to a physical configuration mechanically realized by hardware, and includes a configuration in which a function included in the configuration is realized by software such as a program. Further, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by one physical configuration, for example.

The structure of the component mounting apparatus 1 will be described with reference to fig. 1. Fig. 1 is a view of the component mounting apparatus 1 according to the embodiment as viewed from above. Fig. 2 is a side view showing a mechanical configuration example of the component mounting apparatus 1 shown in fig. 1. In fig. 1 and 2, the front side (lower side in the paper of fig. 1 and left side in the paper of fig. 2) of the component mounting device 1 is referred to as the front side, and the back side (upper side in the paper of fig. 1 and right side in the paper of fig. 2) of the component mounting device 1 is referred to as the back side.

The component mounting apparatus 1 is an apparatus which is disposed in a component mounting line (not shown) for manufacturing a mounting substrate and mounts one or more components P (for example, an electronic component such as an IC (Integrated Circuit), a transistor, a capacitor, or a BGA component) or the like on a loaded substrate W. The component mounting apparatus 1 is housed in a base 12 (see below) and includes a control unit 40 that controls each unit of the component mounting apparatus 1.

In the component mounting apparatus 1 of the present embodiment, the pair of component supply mechanisms 15 are provided on both sides (Y direction and Y direction) of the pair of substrate conveyance mechanisms 13 that convey the substrate W, respectively, but may be provided only on one side. Further, the component mounting apparatus 1 of the embodiment has an example of a configuration having a single lane (single lane) capable of conveying one substrate, but may have a configuration having a double lane (dual lane) capable of simultaneously conveying two substrates.

In the component mounting apparatus 1 of the embodiment shown in fig. 1 and 2, an example in which the tape feeder 18 in which the component P is accommodated is used as a method for supplying the component P for mounting on the substrate mounted on the substrate W will be described. However, the method of supplying components is not limited to the tape feeder 18, and for example, a tray in which components are stored may be used, or the tape feeder 18 and the tray may be used in combination. Note that, with the component mounting device 1, in the case of using the tape feeder 18, a structure including the tape feeder in the component supply mechanism 15 is made, and in the case of using the tray, a structure including the tray feeder in the component supply mechanism 15 is made.

A substrate conveying mechanism 13 is disposed in the center of the base 12 of the mounting machine body 11 along the X direction (conveying direction of the substrate W) shown in fig. 1. The substrate conveying mechanism 13 includes a pair of conveyor portions 14 extending in the X direction, and conveys the substrate W placed on the pair of conveyor portions 14 and positions and holds the substrate W at a predetermined mounting work position.

The pair of front and rear component supply mechanisms 15 are disposed on both front and rear sides (upper and lower sides in the paper plane of fig. 1, and left and right sides in the paper plane of fig. 2) of the substrate conveyance mechanism 13 so as to face each other. The pair of component supply mechanisms 15 each have a feeder base 16 provided with a slot 17, and a plurality of tape feeders 18 each housing a component P as a parts feeder are mounted in parallel in the slot 17.

In addition, the component mounting device 1 also has a feeder cart 19. The feeder cart 19 includes a cart unit 20 having a plurality of wheels arranged on the lower side thereof, and a plurality of reel storage units (not shown) arranged on the upper side of the cart unit 20. Reels 21 are stored in the plurality of reel storage portions, respectively. The carrier tape 22 in which the components P are stored is pulled out from each reel 21 and fed to the tape feeder 18 of the component supply mechanism 15, thereby supplying the components P to a take-out position where take-out (pickup) is performed. Thereby, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feeding direction to supply it to a component pickup position where pickup (pickup) of the component P is performed by a mounting head 26 of a component mounting mechanism 23 described below.

The component mounting mechanism 23 is disposed above the base 12, and is configured to be movable in a range between a component pickup position where the component supply mechanism 15 is provided and a substrate conveyance position where the substrate W is conveyed. Specifically, the component mounting mechanism 23 is linearly movable in the X direction and the Y direction on a plane substantially parallel to the surface of the substrate W by an X-axis table mechanism 25 and a Y-axis table mechanism 24 arranged perpendicularly to each other.

The Y-axis table mechanism 24 is disposed on the upper surface of the base 12 in the Y direction. Further, a pair of front and rear X-axis table mechanisms 25 are disposed in the X direction and are mounted on the Y-axis table mechanisms 24 so as to be slidable in the Y direction. The mounting head 26 is mounted to the front end of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable in the X direction. That is, in the embodiment, the mounting head 26 is mounted on the component mounting mechanism 23, and the mounting head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. Thereby, the mounting head 26 can be arbitrarily positioned on a plane substantially parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). The X-axis table mechanism 25 and the Y-axis table mechanism 24 are each constituted by a linear guide driving mechanism.

A component recognition camera 28 (an example of an imaging unit) is disposed between the front and rear pair of component supply mechanisms 15 and the substrate conveyance mechanism 13. In a state where the component P is taken out from the component supply mechanism 15 and held, a component holding nozzle 27 (see below) attached to the mounting head 26 moves and passes above the component recognition camera 28. At this time, the component recognition camera 28 photographs the component P sucked and held by the passed component holding nozzle 27 at a predetermined timing.

The component recognition camera 28 is configured by cameras (specifically, a right camera 28A, a left camera 28B, and a lower camera 28C, respectively) arranged at a plurality of different angles. When the component P is a ball component (for example, bga (ball Grid array), csp (chip Size package), interposer, or the like) having solder balls (an example of balls) on a lower surface thereof, the component recognition camera 28 images the ball component from different angles by the right camera 28A and the left camera 28B based on a control signal input from the control unit 40.

Further, a nozzle holder 38 and a waste box 37 are disposed between the front and rear pair of component supply mechanisms 15 and the substrate transport mechanism 13. The nozzle holder 38 accommodates the plural types of component holding nozzles 27 of the mounting head 26 so as to correspond to the component P to be held. By bringing the mounting head 26 into contact with the nozzle holder 38 and executing a predetermined nozzle replacement operation, the component holding nozzles 27 (described below) suitable for holding the object are mounted on the mounting head 26. The discard box 37 is formed in a box shape and has an internal space, and discards the component P or the like identified as defective as a result of the recognition of the imaging result by the component recognition camera 28 in the internal space.

Next, the structure of the mounting head 26 and the operation thereof will be described with reference to fig. 3. Fig. 3 is a perspective view showing a component mounting step of suction-to-mounting of the component P by the mounting head 26. The mounting head 26 shown in fig. 3 is provided with one component holding nozzle 27 for the sake of simplicity of description, but may be a multiple head (not shown) in which a plurality of component holding nozzles are mounted. A reflector (not shown) for reflecting the illumination light emitted from the transmission illumination unit (not shown) is fixed to the mounting head 26. The reflection plate is disposed above the held member P.

The component holding suction nozzle 27 vacuum-adsorbs and holds the component P from the tape feeder 18 fed to the component take-out position of the component supply mechanism 15 by, for example, air pressure, and performs lifting and lowering. The mounting head 26 further includes a Z-axis lifting mechanism (not shown) for lifting and lowering the component holding nozzles 27, and a θ -axis rotating mechanism (not shown) for rotating the component holding nozzles 27 around the nozzle axes individually. The mounting head 26 is arbitrarily positioned on the horizontal plane (XY plane) by being driven by the Y-axis table mechanism 24 and the X-axis table mechanism 25. By this movement, the mounting head 26 sucks and takes out the component P from the take-out position of the tape feeder 18 of the component supply mechanism 15 by the component holding suction nozzle 27.

A substrate recognition camera 36 (see fig. 1) that is disposed on the lower surface side of the X-axis table mechanism 25 and moves integrally with the mounting head 26 is fixed to the mounting head 26. The mounting head 26 moves, and thereby the substrate recognition camera 36 photographs the substrate W by being conveyed to the substrate conveying position by the substrate conveying mechanism 13 and being positioned above the substrate W. The imaging result (imaging information) is also subjected to recognition processing by the control unit 40, and the conveyance position and posture of the substrate W are detected.

As a result of the detection of the transport position and posture of the substrate W, the mounting head 26 mounts the component P at a predetermined posture at a predetermined component mounting position by the component holding nozzle 27 based on a control command of the control unit 40. By so doing, the component P is held and moved by the component holding suction nozzle 27 of the mounting head 26 between the component pickup position to the component mounting position, and then mounted on the substrate W.

The component mounting device 1 repeatedly executes a series of operations of taking out and mounting the plurality of components P and returning the components P to the component taking-out position by the component holding nozzles 27 of the mounting head 26 until the mounting of the components P to the plurality of mounting positions on the substrate W is completed. By repeating this operation, a plurality of components P are sequentially mounted on each of the substrates W sequentially conveyed, and the substrate W on which all the components P to be mounted by the component mounting apparatus 1 are mounted is conveyed to the next step (downstream step). In this way, the mounting machine body 11 and the component mounting mechanism 23 operate in coordination, and the coordination is executed by an instruction of the control unit 40.

Next, the structure of the component recognition camera 28 will be described with reference to fig. 4. Fig. 4 is a perspective view showing an example of the internal configuration of the component recognition camera 28.

As shown in fig. 4, the component recognition camera 28 is provided with a plurality of right cameras 28A, a plurality of left cameras 28B, and a lower camera 28C. One right camera 28A and one left camera 28B that face each other with the scope 281C of the lower camera 28C interposed therebetween function as a set of stereo cameras. Note that, although the component recognition camera 28 of the present embodiment has been described as including two right cameras 28A and two left cameras 28B to obtain a wider angle of view, the component recognition camera may be configured to include one right camera 28A and one left camera 28B, or may be configured to include three right cameras 28A and three left cameras 28B.

The right camera 28A includes a lens 281A built in the mirror 283A and an image sensor 282A for the right camera.

The left camera 28B includes a lens (not shown) incorporated in the scope 283B and an image sensor 282B for the left camera.

The lower camera 28C includes a lens (not shown) incorporated in the mirror body 281C,

image sensors

282C and 283C for a lower camera, and a prism 281P.

The

image sensors

282A, 282B, 282C, 283C are formed of, for example, a ccd (charge Coupled device) or a cmos (complementary Metal Oxide semiconductor).

The right camera 28A, the left camera 28B, and the lower camera 28C are arranged such that the optical axes thereof are oriented in the vertical direction (Z direction), and can capture an image of the component P moving above the component recognition camera 28. The right camera 28A, the left camera 28B, and the lower camera 28C have a shutter function, and are configured to be capable of shooting at predetermined timing in accordance with a control command from a shooting processing unit 43 (see below) of the control unit 40. The right camera 28A, the left camera 28B, and the lower camera 28C transmit the captured results (captured images) to the control unit 40.

Next, a positional relationship when the component recognition camera 28 captures the ball component BP will be described with reference to fig. 5. Fig. 5 is a diagram illustrating a positional relationship between the component recognition camera 28 and the ball component BP.

The right camera 28A and the left camera 28B, which are stereo cameras provided in the component recognition camera 28, take images of the lower surface of the ball component BP conveyed on the component recognition camera 28 in a state of being sucked and held by the component holding suction nozzle 27 attached to the mounting head 26 from different angles. The two right cameras 28A and the two left cameras 28B transmit the captured images to the image capture processing unit 43.

The imaging processing unit 43 determines whether or not each of the solder balls included in the ball member BP is a defective ball having a defect, based on a plurality of imaging images transmitted from the two right cameras 28A and the two left cameras 28B, respectively. The imaging processing unit 43 sets a plane passing through a point on the optical axis of each lens provided in each of the right and left cameras and at an equal distance H1 from the surface of each lens as a reference plane H0. Here, the distance H1 for setting the reference surface H0 is set to a value of, for example, 4 mm. The imaging processing unit 43 measures, as the ball height, a distance H2 from the surface to the reference surface H0 of a solder ball (hereinafter referred to as a "normal ball") determined not to be a defective ball among a plurality of solder balls included in the ball component BP, based on each of a plurality of captured images captured by the two right cameras 28A and the two left cameras 28B.

Next, the function of the control unit 40 of the component mounting apparatus 1 according to the embodiment will be described with reference to fig. 6. Fig. 6 is a block diagram illustrating a functional configuration of the control section 40 of the component mounting apparatus 1.

The control unit 40 of the component mounting apparatus 1 is configured using, for example, a cpu (central Processing unit) or an fpga (field Programmable Gate array), and performs various processes and controls in cooperation with the storage unit 41. Specifically, the control unit 40 refers to the program and data stored in the storage unit 41, and executes the program to realize the functions of each unit. The units described here include, for example, the mechanism driving unit 42 and the imaging processing unit 43. The control unit 40 performs, by the above-described respective units, a function of determining whether each of the solder balls included in the ball member BP is a defective ball, a function of detecting warpage of the ball member BP based on the ball height of each of the normal balls of the ball member BP, a function of determining whether the ball member BP is a defective member based on the warpage of the ball member BP, and the like.

When the component taken out by the mounting head 26 is a ball component BP having solder balls, the control unit 40 images the ball component BP by the right camera 28A and the left camera 28B of the component recognition camera 28. On the other hand, when the component taken out by the mounting head 26 is a component without solder balls (that is, not the ball component BP), the control unit 40 images the component by the lower camera 28C or by combining the lower camera 28C and the right camera 28A or the left camera 28B.

The storage unit 41 includes, for example, a ram (random Access memory) as a work memory used when each process of the control unit 40 is executed, and a rom (read Only memory) that stores a program and data that define the operation of the control unit 40. The RAM temporarily stores data or information generated or acquired by the control unit 40. A program for specifying the operation of the control unit 40 is written in the ROM. The storage section 41 stores mounting data 41A, component data 41B, ball height information 41C, and component warp data 41D.

The mounting data 41A is information on each of the substrate W and the plurality of components mounted on the substrate W, and includes height information (i.e., thickness information) of the substrate W, information on components supplied from the carrier tapes 22 respectively arranged in the plurality of slots 17, information on component mounting positions of the respective components, and the like.

The component data 41B is information relating to the component, and includes information such as a component name, a size of the component, a thickness (height in the Z direction) of the component, the number and position of electrodes provided to the component, and the like, for example. In addition, when the component is the ball component BP, the component data 41B stores information indicating that the component is the ball component, the number of solder balls included in the component, position information of each solder ball, and the like.

The ball height information 41C is stored in association with the component data 41B of each of the ball components BP, and includes information such as the height (height in the Z direction) of the solder balls included in the ball components BP.

The component warp data 41D is stored in association with the component data 41B of each of the plurality of components, and includes information of a threshold value of component warp for determining whether or not the component is a defective component based on the component warp detected by the component warp detecting unit 43D.

The mechanism driving unit 42 drives the substrate conveying mechanism 13, the component mounting mechanism 23, and the tape feed mechanism 29, respectively, based on the control command output from the control unit 40. The tape feed mechanism 29 is a mechanism for feeding the carrier tape 22 containing the components mounted on the substrate W with a tape and supplying the components to the component pickup position.

The mechanism driving unit 42 drives the substrate transfer mechanism 13 to transfer the substrate W to the substrate transfer position. When the information on the corrected substrate conveying position and the component mounting positions of the plurality of components P is input from the control unit 40, the mechanism driving unit 42 drives the belt feeding mechanism 29 to send out the plurality of components mounted on the substrate W to the component pickup positions, respectively. The mechanism driving unit 42 drives the component mounting mechanism 23 to suction and hold the component at each component pickup position, pick up the component, and convey the component so as to pass over the component recognition camera 28.

The imaging processing unit 43 performs image processing on the captured image captured by the component recognition camera 28, measures the ball height of each solder ball included in the ball component BP, and determines whether or not the ball component BP is a defective component. The imaging processing unit 43 detects the position and posture of the substrate W conveyed to the substrate conveying position based on the captured image captured by the substrate recognition camera 36. The imaging processing unit 43 includes a camera control unit 43A, a defective ball determination unit 43B, a ball height measurement unit 43C, a component warp detection unit 43D, and a defective component determination unit 43E.

The camera control section 43A controls the component recognition camera 28 based on a control instruction output from the control section 40. Specifically, when the component sucked and held by the mounting head 26 is the ball component BP, the camera control unit 43A causes the plurality of right cameras 28A and the plurality of left cameras 28B to take an image of the ball component BP at a timing when the ball component BP passes above the component recognition camera 28. On the other hand, when the component sucked and held by the mounting head 26 is not the ball component BP, the imaging processing unit 43 causes the lower camera 28C to take an image of the component at a timing when the component passes above the component recognition camera 28. The plurality of right cameras 28A, the plurality of left cameras 28B, or the lower camera 28C transmits the captured images to the image capture processing unit 43.

The defective ball determination unit 43B determines the roundness of the shape of any one of the plurality of solder balls included in the ball member BP, based on each of the plurality of captured images captured by the plurality of right cameras 28A and the plurality of left cameras 28B. The defective ball determination unit 43B determines the solder ball determined to have a roundness of a predetermined value or less (i.e., an elliptical solder ball) as a defective ball having a defect, and determines the solder ball having a roundness of greater than the predetermined value as a normal ball having no defect.

The ball height measuring unit 43C measures the ball height of a normal ball determined by the defective ball determining unit 43B as not being a defective ball. The ball height measuring unit 43C stores information (for example, positional information) that enables recognition of the normal ball in association with the measured ball height, and outputs the information to the storage unit 41. The storage unit 41 stores, as the ball height information 41C, information (for example, positional information) of a normal ball output from the ball height measurement unit 43C and the measured ball height for each ball member BP.

The imaging processing unit 43 repeatedly executes the determination process by the defective ball determination unit 43B and the measurement process by the ball height measurement unit 43C for all the solder balls included in the ball member BP.

After the ball height measurement unit 43C measures the ball heights of all the normal balls included in the ball part BP, the part warp detection unit 43D measures (detects) the warp of the ball part BP based on each of the measured ball heights. The component warp detection unit 43D stores the measured (detected) warp of the component, and outputs the same to the storage unit 41. The storage section 41 stores information relating to the part warp output from the part warp detection section 43D as part warp data 41D for each ball part BP.

The defective component determination unit 43E determines whether or not the ball component BP is a defective component based on the warpage of the ball component BP measured (detected) by the component warpage detection unit 43D. When determining that the ball member BP is a defective member, the defective member determination unit 43E generates a signal for notifying that the ball member BP is defective, and outputs the signal to the control unit 40. The control unit 40 generates a control command for the waste component P based on the signal output from the defective component determination unit 43E, and outputs the control command to the mechanism drive unit 42. When one or less normal balls are included among the plurality of solder balls included in the ball component BP, the component warp detection unit 43D may generate a signal notifying that the ball component BP is a defective component, and output the signal to the defective component determination unit 43E or the control unit 40.

Now, the lower surfaces UP1 and UP2 of the ball members BP1 and BP2 will be described with reference to fig. 7. Fig. 7 is a view showing an example of the lower surfaces UP1 and UP2 of the ball members BP1 and BP 2. It should be noted that the shape and size of each of the ball members BP1 and BP2 as components shown in fig. 7, the number and arrangement of the solder balls, and the like are examples, and are not limited to these.

The ball member BP1 as a component is provided with a plurality of solder balls BA on the lower surface UP 1. When the ball components BP1 are mounted (mounted) at predetermined positions on the substrate W by the mounting head 26, the solder balls BA are in contact with the substrate W, respectively. Similarly, the ball member BP2 formed in a rectangular shape includes a plurality of solder balls BB on the lower surface UP 2. When the ball components BP2 are mounted (mounted) at predetermined positions on the substrate W by the mounting head 26, the solder balls BB are in contact with the substrate W, respectively.

Next, the component warp detection process executed by the component mounting apparatus 1 will be described with reference to fig. 8 and 9. Fig. 8 is a flowchart illustrating an example of the component warp detection procedure of the component mounting device 1 according to the embodiment. Fig. 9 is a diagram illustrating an example of a component warp detection procedure of the component mounting device 1 according to the embodiment. In fig. 8 and 9, an example will be described in which the mounting head 26 sucks and mounts the ball component BP, which is a component and includes six solder balls B1, B2, B3, B4, B5, and B6, onto the substrate W.

The component mounting device 1 suctions and holds the ball component BP conveyed to the component pickup position by the component holding suction nozzle 27 attached to the mounting head 26 (St1), and moves the mounting head 26 upward of the component recognition camera 28 (St 2).

The component mounting device 1 images the lower surface (i.e., the ball portion) of the ball component BP by the right camera 28A and the left camera 28B at a timing at which the ball component BP sucked and held by the mounting head 26 moves to a position above the component recognition camera 28, that is, a position at which the lower surface of the ball component BP can be imaged by the component recognition camera 28 (St 3). Here, the captured images F1 and F2 shown in fig. 9 will be described. The captured image F1 is a captured image of the lower surface UP of the ball member BP captured by the right camera 28A. The captured image F2 is a captured image of the lower surface UP of the ball member BP captured by the left camera 28B. Each of the six solder balls B1 to B6 photographed from different angles is mapped on the plurality of photographed images F1 and F2.

The component mounting apparatus 1 determines whether any one of the solder balls B1 to B6 (for example, the solder ball B1) is a defective ball based on the captured image F1 captured by the right camera 28A and the captured image F2 captured by the left camera 28B (St 4).

Specifically, the component mounting apparatus 1 detects the six solder balls B1 to B6 respectively reflected in the plurality of captured images F1 and F2 by a difference in luminance from other portions or the like. When the roundness of one or both of the solder balls reflected in the plurality of captured images F1 and F2 is equal to or less than a predetermined value, the component mounting apparatus 1 determines that the solder ball is a defective ball. When the circularities of both of the solder balls reflected in the captured images F1 and F2 are larger than a predetermined value, the component mounting apparatus 1 determines that the solder ball is a normal ball. For example, in the partial side view of the ball component BP shown in fig. 9, the solder ball B3 has a defect DF1 and a contamination defect DF 2. When the roundness of the solder ball is determined and the shape of the solder ball is detected for the solder ball having such a defective portion, the solder ball is detected as a non-perfect circle shape such as an elliptical shape or a semicircular shape.

As described above, the component mounting apparatus 1 determines whether the solder ball is a defective ball. In the example shown in fig. 9, the component mounting device 1 judges the solder balls B1, B3, B6 as defective balls, and judges the solder balls B2, B4, B5 as normal balls.

When it is determined that the solder ball B1 is not a defective ball by the processing of step St4 (St4, no), the component mounting apparatus 1 measures and stores the ball height of the solder ball B1 (the ball height H2 shown in fig. 5, and the distance from the reference surface H0 to the solder ball) (St 5).

When it is determined that the solder ball B1 is a defective ball by the process of step St4 (yes in St4), or after the process of step St5 is executed, the component mounting apparatus 1 determines whether or not a solder ball whose ball height is not measured exists (St 6).

When it is determined that there is a solder ball whose ball height has not been measured by the process of step St6 (St6, yes), the component mounting apparatus 1 proceeds to the process of step St 4.

On the other hand, after repeatedly executing the processing of step St4 to step St6, when it is determined by the processing of step St6 that there is no solder ball whose ball height is not measured, that is, when the processing of step St4 to step St5 has been executed for all the solder balls included in the ball part BP (St6, no), the component mounting device 1 detects the component warpage of the ball part BP based on the measured ball heights of all the normal balls (St 7). In the example shown in fig. 9, the component mounting apparatus 1 detects (measures) the component warpage of the ball component BP based on the respective ball heights of the plurality of solder balls B2, B4, and B5.

The component mounting apparatus 1 determines whether or not the ball member BP is a defective member based on the detected (measured) warpage of the component (St 8). For example, the component mounting apparatus 1 determines whether or not the value of the detected (measured) warpage of the component is a predetermined value or more.

When it is determined that the ball component BP is not a defective component by the processing of step St8 (St8, no), the component mounting device 1 mounts the ball component BP sucked and held by the mounting head 26 at a predetermined position on the substrate W (St 9).

On the other hand, when the ball component BP is determined to be a defective component by the processing of step St8 (yes in St8), the component mounting device 1 omits the mounting processing of the ball component BP sucked and held by the mounting head 26 on the substrate W, and discards the ball component BP in the discard box 37, for example.

As described above, the component mounting apparatus 1 according to the embodiment includes: a right camera 28A and a left camera 28B that respectively take images of a plurality of solder balls provided on the lower surface UP of the ball component BP held by the mounting head 26 from a plurality of different directions; a defective ball determination unit 43B that determines whether or not the plurality of solder balls are defective balls based on each of a plurality of captured images F1, F2 captured from a plurality of different directions by the right camera 28A and the left camera 28B; a ball height measuring section 43C for measuring the height of each solder ball that is not determined as a defective ball by the defective ball determining section 43B; and a component warp detection unit 43D for detecting the warp of the ball component based on the ball height of each solder ball measured by the ball height measurement unit 43C.

Thus, the component mounting apparatus 1 of the embodiment performs the ball height measurement and the component warpage measurement of the ball component BP based on the solder ball determined as a normal ball, and therefore can improve the robustness of the ball height measurement and the component warpage measurement, and more accurately determine whether the ball component BP is a defective component.

The defective ball determining unit 43B of the component mounting apparatus 1 according to the embodiment calculates the roundness of each solder ball reflected in each of the plurality of captured images F1 and F2, and determines a solder ball having the calculated roundness equal to or less than a predetermined value as a defective ball. Thus, the component mounting apparatus 1 according to the embodiment can detect a solder ball having dirt attached thereto or a solder ball having a defect such as a flaw or a flaw on the surface thereof as a defective ball by using the calculated roundness. Therefore, the component mounting apparatus 1 performs the ball height measurement and the component warp measurement of the ball component BP by using the respective ball heights of the normal balls other than the defective balls, and therefore can improve the robustness of the ball height measurement and the component warp measurement, and more accurately determine whether or not the ball component BP is a defective component.

The component mounting device 1 of the embodiment further includes a defective component determination unit 43E, and the defective component determination unit 43E determines whether or not the ball member BP is defective based on the warpage of the ball member BP detected by the component warpage detection unit 43D. Thus, the component mounting apparatus 1 according to the embodiment can effectively determine the ball component BP having a predetermined component warpage and causing a contact failure with the substrate W or the like.

While various embodiments have been described above with reference to the drawings, the present invention is not limited to the above examples. It is obvious that various modifications, replacements, additions, deletions, and equivalents will occur to those skilled in the art within the scope of the claims, and it is to be understood that these also fall within the technical scope of the present invention. In addition, the respective components in the above-described embodiments may be arbitrarily combined without departing from the scope of the invention.

Industrial applicability

The present invention is useful as a component mounting apparatus and a component warp measuring method that can improve the robustness of ball height measurement and component warp measurement of a ball component and thereby more accurately determine whether the ball component is a defective component.

Claims

1. A component mounting apparatus, wherein,

the component mounting device includes:

an imaging unit that images, from a plurality of different directions, a plurality of balls provided on the lower surface of the component held by the mounting head;

a defective ball determination unit that determines whether each of the plurality of balls is a defective ball based on each of the plurality of captured images captured from the plurality of different directions by the imaging unit;

a ball height measuring unit that measures the height of each ball that is not determined as the defective ball by the defective ball determining unit; and

and a component warpage detection unit that detects warpage of the component based on the height of each of the balls measured by the ball height measurement unit.

2. The component mounting apparatus according to claim 1,

the defective ball determining unit calculates a roundness of each of the balls reflected in the plurality of captured images, and determines a ball having the calculated roundness of a predetermined value or less as the defective ball.

3. The component mounting apparatus according to claim 1,

the component mounting apparatus further includes a defective component determination unit that determines whether or not the component is defective based on the warpage of the component detected by the component warpage detection unit.

4. A component warp measuring method, wherein,

a plurality of balls provided on the lower surface of the component held by the mounting head are picked up from a plurality of different directions,

determining whether the plurality of balls are respectively defective balls based on each of a plurality of captured images captured from the plurality of different directions,

measuring the height of each ball which is not determined as the defective ball,

detecting warpage of the component based on the measured height of each of the balls.