CN114088716B - Component mounting device and component warpage detection method - Google Patents
Component mounting device and component warpage detection methodInfo
- Publication number
- CN114088716B CN114088716B CN202110639781.9A CN202110639781A CN114088716B CN 114088716 B CN114088716 B CN 114088716B CN 202110639781 A CN202110639781 A CN 202110639781A CN 114088716 B CN114088716 B CN 114088716B
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- Prior art keywords
- component
- ball
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- unit
- balls
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention can improve the robustness of ball height measurement and component warping measurement of a ball component, thereby more accurately judging whether the ball component is a defective component. The component mounting device is provided with an imaging unit that images a plurality of balls provided on the lower surface of a component held by a mounting head from a plurality of different directions, a defective ball determination unit that determines whether each of the plurality of balls is a defective ball based on each of a plurality of imaging images imaged from the plurality of different directions by the imaging unit, a ball height measurement unit that measures the height of each ball that is not determined to be a defective ball by the defective ball determination unit, and a component warp detection unit that detects the warp of the component based on the height of each ball measured by the ball height measurement unit.
Description
Technical Field
The present invention relates to a component mounting apparatus and a component warp detection method.
Background
Patent document 1 discloses a component recognition method in which hemispherical terminals provided on electronic components mounted on a printed wiring board are photographed from a plurality of directions, and the heights of the hemispherical terminals are detected based on a plurality of images having different photographing directions obtained by the photographing. In the component recognition method, after photographing the hemispherical terminal from the oblique direction, the electronic component is rotated by a predetermined angle about an axis orthogonal to the mounting surface, and then photographing the hemispherical terminal from the oblique direction, and the height of the hemispherical terminal is detected using the image before rotation and the image after rotation.
Prior art literature
Patent literature
Patent document 1 Japanese patent application laid-open No. 2005-340648
However, in patent document 1, since the heights of the electronic components are detected based on the heights of all hemispherical terminals including the hemispherical terminals having defects provided in the electronic components using the image before rotation and the image after rotation, there is a possibility that warpage of the electronic components cannot be accurately measured. In addition, in patent document 1, when the hemispherical terminal is defective, the hemispherical terminal is different in shape between the image before rotation and the image after rotation, and therefore, an accurate ball height cannot be measured, and there is a possibility that an electronic component having no warpage is erroneously detected as a defective product having warpage.
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made in view of the above-described conventional circumstances, and an object thereof is to provide a component mounting apparatus and a component warp detection method that can more accurately determine whether a ball component is a defective component by improving the robustness (robustness) of ball height measurement and component warp measurement of the ball component.
Means for solving the problems
A component mounting apparatus includes an imaging unit that images a plurality of balls provided on a lower surface of a component held by a mounting head from a plurality of different directions, a defective ball determination unit that determines whether the plurality of balls are defective balls based on each of a plurality of imaging images imaged from the plurality of different directions by the imaging unit, a ball height measurement unit that measures a height of each ball that is not determined to be the defective ball by the defective ball determination unit, and a component warp detection unit that detects warp of the component based on the height of each ball measured by the ball height measurement unit.
The present invention also provides a component warp measurement method, wherein a plurality of balls provided on a lower surface of a component held by a mounting head are imaged from a plurality of different directions, whether the balls are defective balls or not is determined based on each of a plurality of imaged images imaged from the plurality of different directions, heights of balls not determined to be defective balls are measured, and warp of the component is detected based on the measured heights of the balls.
Effects of the invention
According to the present invention, the robustness of ball height measurement and component warp measurement of the ball component can be improved, and whether the ball component is a defective component can be determined more accurately.
Drawings
Fig. 1 is a view of a component mounting apparatus according to an embodiment as viewed from above.
Fig. 2 is a side view showing an example of the mechanical structure of the component mounting apparatus shown in fig. 1.
Fig. 3 is a perspective view showing a component mounting step of suction-to-mounting of components by the mounting head.
Fig. 4 is a perspective view showing an example of the internal structure of the component recognition camera.
Fig. 5 is a diagram illustrating a positional relationship between the component recognition camera and the ball component.
Fig. 6 is a block diagram illustrating a functional configuration of a control section of the component mounting apparatus.
Fig. 7 is a view showing an example of the lower surface of the ball member.
Fig. 8 is a flowchart illustrating an example of a component warp detection step in the component mounting apparatus according to the embodiment.
Fig. 9 is a diagram illustrating an example of a component warp detection step of the component mounting apparatus according to the embodiment.
Description of the reference numerals
1. Component mounting apparatus
26. Mounting head
28. Component recognition camera
28A right camera
28B left camera
40. Control unit
41. Storage unit
42. Mechanism driving part
43. Image pickup processing unit
43B defective ball judging section
43C ball height measuring part
43D component warp detection part
43E defective component determination unit
BP, BP1, BP2 ball parts
B1, B2, B3, B4, B5, B6 solder balls
F1, F2 images
P component
UP, UP1, UP2 lower surface
A W substrate.
Detailed Description
Hereinafter, embodiments of a component mounting apparatus and a component warp detection method according to the present invention will be described in detail with reference to the accompanying drawings. However, a detailed description thereof may be omitted. For example, a detailed description of well-known matters and a repeated description of substantially the same structure may be omitted. This is to avoid that the following description becomes too lengthy and will be easily understood by those skilled in the art. The drawings and the following description are provided to enable those skilled in the art to fully understand the present invention, and are not intended to limit the subject matter described in the claims.
For example, the "part" or "device" in the embodiment is not limited to a physical structure mechanically realized by hardware, but includes a structure realizing a function of the structure by software such as a program. The functions of one structure may be realized by two or more physical structures, or the functions of two or more structures may be realized by one physical structure, for example.
The structure of the component mounting apparatus 1 will be described with reference to fig. 1. Fig. 1 is a view of a component mounting apparatus 1 according to an embodiment as viewed from above. Fig. 2 is a side view showing an example of the mechanical structure of the component mounting apparatus 1 shown in fig. 1. In fig. 1 and 2, the front side of the component mounting device 1 (the lower side in the drawing of fig. 1 and the left side in the drawing of fig. 2) is also referred to as the front side, and the rear side of the component mounting device 1 (the upper side in the drawing of fig. 1 and the right side in the drawing of fig. 2) is referred to as the rear side.
The component mounting apparatus 1 is an apparatus that is disposed in a component mounting line (not shown) for manufacturing a mounting board, and mounts one or more components P (for example, electronic components such as ICs (INTEGRATED CIRCUIT, integrated circuits), transistors, capacitors, and BGA components) and the like on a carried-in board W. The component mounting apparatus 1 is accommodated in the base 12 (see below) and is provided with a control unit 40 for controlling each unit of the component mounting apparatus 1.
In the component mounting apparatus 1 of the present embodiment, the pair of component supply mechanisms 15 are provided on both sides (Y direction, -Y direction) of the pair of substrate conveyance mechanisms 13 that convey the substrates W, respectively, but may be provided on only one side. Further, although the component mounting apparatus 1 of the embodiment has been shown as an example having a structure of a one-way lane (SINGLE LANE) capable of conveying one substrate, a structure of a double lane (dual lane) capable of simultaneously conveying two substrates, respectively, may be also used.
In the component mounting apparatus 1 according to the embodiment shown in fig. 1 and 2, an example in which the tape feeder 18 accommodating the component P is used as a method of supplying the component P for mounting on the substrate W is described. However, the method of supplying the components is not limited to the tape feeder 18, and for example, a tray in which the components are stored may be used, and the tape feeder 18 and the tray may be used together. In the component mounting apparatus 1, the tape feeder 18 is included in the component feeding mechanism 15, and the tray feeder is included in the component feeding mechanism 15.
A substrate conveying mechanism 13 is disposed in the center of the base 12 of the mounting machine body 11 along the X direction (the conveying direction of the substrate W) shown in fig. 1. The substrate conveying mechanism 13 includes a pair of conveyor units 14 extending in the X direction, and conveys the substrates W placed on the pair of conveyor units 14 and positions and holds the substrates W at a predetermined mounting operation position.
The pair of front and rear component supply mechanisms 15 are disposed opposite each other on the front and rear sides (upper and lower sides in the drawing sheet of fig. 1 and left and right sides in the drawing sheet of fig. 2) of the substrate conveying mechanism 13. The pair of component feeding mechanisms 15 each have a feeder base 16 provided with a slot 17, and a plurality of tape feeders 18, which are part feeders and receive components P, are mounted in parallel in the slot 17.
In addition, the component mounting apparatus 1 also has a feeder wagon 19. The feeder wagon 19 includes a carriage unit 20 having a plurality of wheels disposed on a lower side thereof, and a plurality of reel storage units (not shown) disposed on an upper side of the carriage unit 20. The reels 21 are respectively accommodated in the plurality of reel storage units. The carrier tape 22 containing the components P is pulled out from the reels 21 and fed to the tape feeder 18 of the component feeding mechanism 15, thereby feeding the components P to the take-out position where take-out (pickup) is performed. Thereby, the tape feeder 18 of the component feeding mechanism 15 pitch feeds the carrier tape 22 in the tape feeding direction, thereby feeding it to a component taking-out position where taking-out (pickup) of the component P is performed by the mounting head 26 of the component mounting mechanism 23 described below.
The component mounting mechanism 23 is disposed above the base 12 and is configured to be movable in a range between a component take-out position where the component supply mechanism 15 is provided and a substrate transport position where the substrate W is transported. Specifically, the component mounting mechanism 23 is linearly movable in the X direction and the Y direction on a plane substantially parallel to the surface of the substrate W by the X-axis table mechanism 25 and the Y-axis table mechanism 24 disposed perpendicularly to each other.
The Y-axis table mechanism 24 is disposed on the upper surface of the base 12 in the Y-direction. The front and rear pair of X-axis table mechanisms 25 are disposed along the X-direction and are slidably attached to the Y-axis table mechanisms 24, respectively. The mounting head 26 is slidably mounted on the front end portions of the front and rear pair of X-axis table mechanisms 25. That is, in the embodiment, the mounting head 26 is mounted on the component mounting mechanism 23, and the mounting head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. Thus, the mounting head 26 can be positioned arbitrarily on a plane substantially parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). The X-axis table mechanism 25 and the Y-axis table mechanism 24 are each constituted by a linear guide driving mechanism.
A component recognition camera 28 (an example of an imaging unit) is disposed between the front and rear pair of component supply mechanisms 15 and the substrate conveyance mechanism 13. In a state where the component P is taken out and held from the component supply mechanism 15, a component holding suction nozzle 27 (see below) attached to the mounting head 26 moves and passes over the component recognition camera 28. At this time, the component recognition camera 28 photographs the component P sucked and held by the passing component holding nozzle 27 at a predetermined timing.
The component recognition camera 28 is composed of cameras (specifically, a right camera 28A, a left camera 28B, and a lower camera 28C) arranged at a plurality of different angles. In the case where the component P is a Ball component (for example, BGA (Ball GRID ARRAY), CSP (Chip Size Package), interposer, or the like) having a solder Ball (an example of a Ball) on the lower surface, the component recognition camera 28 captures images of the Ball component from different angles by the right camera 28A and the left camera 28B based on a control signal input from the control unit 40.
Further, a nozzle holder 38 and a discard box 37 are disposed between the front and rear pair of component supply mechanisms 15 and the substrate conveyance mechanism 13. The nozzle holder 38 accommodates the plurality of component holding nozzles 27 of the mounting head 26 so as to correspond to the component P to be held. A component holding nozzle 27 (described below) adapted to hold a subject is mounted on the mounting head 26 by bringing the mounting head 26 into contact with the nozzle holder 38 and performing a predetermined nozzle replacement operation. The discard box 37 is formed in a box shape and has an internal space, and discards the component P or the like, which is determined to be defective as a result of the recognition of the imaging result by the component recognition camera 28, into the internal space.
Next, the structure of the mounting head 26 and the operation thereof will be described with reference to fig. 3. Fig. 3 is a perspective view showing a component mounting step of suction-to-mounting of the component P by the mounting head 26. The mounting head 26 shown in fig. 3 is shown as having one component holding nozzle 27 for simplicity of description, but may be a multi-head (not shown) in which a plurality of component holding nozzles are mounted. A reflecting plate (not shown) for reflecting the illumination light emitted from the transmission illumination portion (not shown) is fixedly provided to the mounting head 26. The reflecting plate is disposed above the held member P.
The component holding nozzle 27 vacuum-sucks and holds the component P from the tape feeder 18 fed to the component take-out position of the component supply mechanism 15 by, for example, air pressure, and lifts and lowers the component P. The mounting head 26 further includes a Z-axis lifting mechanism (not shown) for lifting and lowering the component holding nozzle 27, and a θ -axis rotation mechanism (not shown) for individually rotating the component holding nozzle 27 about the nozzle axis. The mounting head 26 is arbitrarily positioned on the horizontal plane (XY plane) by being driven by the Y-axis table mechanism 24 and the X-axis table mechanism 25. By this movement, the mounting head 26 suctions and takes out the component P from the take-out position of the tape feeder 18 of the component supply mechanism 15 by the component holding suction nozzle 27.
The mounting head 26 is fixedly provided with a substrate recognition camera 36 (see fig. 1) which is disposed on the lower surface side of the X-axis table mechanism 25 and moves integrally with the mounting head 26. The mounting head 26 moves, and the substrate recognition camera 36 thereby picks up an image of the substrate W by being transported to the substrate transport position by the substrate transport mechanism 13 and being positioned above the substrate W. The control unit 40 performs recognition processing on the imaging result (imaging information) in the same manner, and detects the transport position and posture of the substrate W.
As a result of the detection of the transport position and the posture of the substrate W, the mounting head 26 mounts the component P at a predetermined component mounting position in a predetermined posture by the component holding nozzle 27 based on a control command of the control unit 40. Thus, the component P is held and moved by the component holding suction nozzles 27 of the mounting head 26 between the component taking-out position and the component mounting position, and then mounted on the substrate W.
The component mounting apparatus 1 repeatedly performs a series of operations of taking out, mounting, and returning movement to the component taking-out position of the plurality of components P by the component holding nozzles 27 of the mounting head 26 until the mounting of the components to the plurality of mounting positions on the substrate W is completed. By repeating this operation, a plurality of components P are sequentially mounted on each of the substrates W sequentially conveyed, and the substrates W on which all the components P to be mounted by the component mounting apparatus 1 are mounted are conveyed to the next process (downstream process). In this way, the mounting machine body 11 and the component mounting mechanism 23 operate in coordination, and the coordinated operation is performed by an instruction from the control unit 40.
Next, the structure of the component recognition camera 28 will be described with reference to fig. 4. Fig. 4 is a perspective view showing an example of the internal structure of the component recognition camera 28.
As shown in fig. 4, the component recognition camera 28 includes a plurality of right cameras 28A, a plurality of left cameras 28B, and a lower camera 28C. One right camera 28A and one left camera 28B facing each other with the mirror 281C of the lower camera 28C interposed therebetween function as a group of stereoscopic cameras. In the component recognition camera 28 of the present embodiment, two right cameras 28A and two left cameras 28B are provided to obtain a wider angle of view, but the component recognition camera may be provided with one right camera 28A and one left camera 28B, or may be provided with three right cameras 28A and three left cameras 28B.
The right camera 28A includes a lens 281A and an image sensor 282A, which are incorporated in the mirror 283A.
The left camera 28B includes lenses (not shown) each incorporated in the mirror 283B, and an image sensor 282B for the left camera.
The lower camera 28C includes lenses (not shown) incorporated in the mirror 281C, image sensors 282C and 283C for the lower camera, and a prism 281P, respectively.
The image sensors 282A, 282B, 282C, 283C are constituted by CCD (Charge Coupled Device), CMOS (Complementary Metal Oxide Semiconductor), or the like, for example.
The right camera 28A, the left camera 28B, and the lower camera 28C are arranged such that the optical axes thereof are in the vertical direction (Z direction), and can capture the part P moving above the part recognition camera 28. The right camera 28A, the left camera 28B, and the lower camera 28C have a shutter function, and are configured to be able to take an image at a predetermined timing in accordance with a control instruction of an image-taking processing unit 43 (see below) of the control unit 40. The right camera 28A, the left camera 28B, and the lower camera 28C transmit the captured results (captured images) to the control unit 40.
Next, the positional relationship when the component recognition camera 28 captures the ball component BP will be described with reference to fig. 5. Fig. 5 is a diagram illustrating the positional relationship between the component recognition camera 28 and the ball component BP.
The right camera 28A and the left camera 28B, which are stereo cameras provided in the component recognition camera 28, photograph the lower surfaces of the ball components BP conveyed on the component recognition camera 28 in a state of being suctioned and held by the component holding suction nozzles 27 mounted on the mounting head 26 from different angles. The two right cameras 28A and the two left cameras 28B each transmit the captured image to the imaging processing unit 43.
The imaging processing unit 43 determines whether or not each solder ball provided in the ball component BP is a defective ball having a defect, based on a plurality of imaging images transmitted from the two right cameras 28A and the two left cameras 28B, respectively. The imaging processing unit 43 sets a plane passing through a point on the optical axis of each lens provided in each of the right camera and the left camera, the point being equidistant from each lens surface by the distance H1, as a reference plane H0. Here, the distance H1 for setting the reference plane H0 is set to a value of, for example, 4 mm. The imaging processing unit 43 measures, as the ball height, a distance H2 from the surface to the reference plane H0 of a solder ball (hereinafter referred to as a "normal ball") determined to be not a defective ball among the plurality of solder balls provided in the ball member BP, based on each of the plurality of imaging images captured by the two right cameras 28A and the two left cameras 28B, respectively.
Next, the function of the control unit 40 of the component mounting device 1 according to the embodiment will be described with reference to fig. 6. Fig. 6 is a block diagram illustrating a functional configuration of the control section 40 of the component mounting apparatus 1.
The control unit 40 of the component mounting apparatus 1 is configured using CPU (Central Processing Unit) or an FPGA (Field Programmable GATE ARRAY), for example, and performs various processes and controls in cooperation with the storage unit 41. Specifically, the control unit 40 refers to the program and data stored in the storage unit 41, and executes the program to realize the functions of each unit. The respective units here are, for example, a mechanism driving unit 42, an imaging processing unit 43, and the like. The control unit 40 performs a function of determining whether or not each solder ball included in the ball component BP is a defective ball, a function of detecting warpage of the ball component BP based on a ball height of each normal ball of the ball component BP, a function of determining whether or not the ball component BP is a defective component based on warpage of the ball component BP, and the like by the above-described respective units.
When the component taken out by the mounting head 26 is a ball component BP having a solder ball, the control unit 40 photographs the ball component BP using the right camera 28A and the left camera 28B of the component recognition camera 28. On the other hand, when the component taken out by the mounting head 26 is a component having no solder ball (i.e., not the ball component BP), the control unit 40 photographs the component with the lower camera 28C or by combining the lower camera 28C with the right camera 28A or the left camera 28B.
The storage unit 41 includes, for example, RAM (Random Access Memory) as a work memory used when executing each process of the control unit 40, and ROM (Read Only Memory) for storing programs and data defining the operation of the control unit 40. The RAM temporarily stores data or information generated or acquired by the control unit 40. A program for defining the operation of the control unit 40 is written in the ROM. The storage section 41 stores mounting data 41A, component data 41B, ball height information 41C, and component warp data 41D.
The mounting data 41A is information related to the substrate W and the plurality of components mounted on the substrate W, and includes height information (i.e., thickness information) of the substrate W, information of components supplied from the respective carrier tapes 22 disposed in the plurality of slots 17, information of component mounting positions of the respective components, and the like.
The component data 41B is information related to the component, and includes, for example, information such as a component name, a size of the component, a thickness (height in the Z direction) of the component, the number of electrodes provided to the component, and a position. In addition, when the component is the ball component BP, the component data 41B stores information indicating that the component is the ball component, the number of solder balls provided in the component, positional information of each solder ball, and the like.
The ball height information 41C is stored in association with the component data 41B of each ball component BP, and includes information such as the height (height in the Z direction) of the solder ball provided in the ball component BP.
The component warp data 41D is stored in association with the component data 41B of each of the plurality of components, and includes information for determining whether the component is a threshold value of the component warp of the defective component based on the component warp detected by the component warp detecting section 43D.
The mechanism driving section 42 drives the substrate conveying mechanism 13, the component mounting mechanism 23, and the tape feeding mechanism 29, respectively, based on the control instruction output from the control section 40. The tape feeding mechanism 29 is a mechanism for feeding the carrier tape 22 accommodating the respective components mounted on the substrate W and supplying the components to the component take-out position.
The mechanism driving section 42 drives the substrate conveying mechanism 13 to convey the substrate W to the substrate conveying position. When the information of the corrected substrate transport position and the component mounting position of each of the plurality of components P is input from the control unit 40, the mechanism driving unit 42 drives the tape feeding mechanism 29 to feed each of the plurality of components mounted on the substrate W to the component take-out position. The mechanism driving unit 42 drives the component mounting mechanism 23 to suck and hold the component at the component extraction position, extract the component, and convey the component so as to pass through the component recognition camera 28.
The imaging processing unit 43 performs image processing on the captured image captured by the component recognition camera 28, measures the ball height of each solder ball included in the ball component BP, and determines whether or not the ball component BP is a defective component. The image pickup processing unit 43 detects the position and posture of the substrate W conveyed to the substrate conveying position based on the image picked up by the substrate recognition camera 36. The imaging processing unit 43 includes a camera control unit 43A, a defective ball determination unit 43B, a ball height measurement unit 43C, a component warp detection unit 43D, and a defective component determination unit 43E.
The camera control section 43A controls the component recognition camera 28 based on the control instruction output from the control section 40. Specifically, when the component suctioned and held by the mounting head 26 is the ball component BP, the camera control unit 43A causes the plurality of right cameras 28A and the plurality of left cameras 28B to capture the ball component BP at a timing when the ball component BP passes above the component recognition camera 28. On the other hand, when the component suctioned and held by the mounting head 26 is not the ball component BP, the imaging processing unit 43 causes the lower camera 28C to image the component at a timing when the component passes over the component recognition camera 28. The plurality of right cameras 28A, the plurality of left cameras 28B, or the lower camera 28C transmit the captured image to the capture processing unit 43.
The defective ball determination unit 43B determines the roundness of the shape of any one of the plurality of solder balls provided in the ball member BP based on each of the plurality of captured images captured by the plurality of right cameras 28A and the plurality of left cameras 28B. The defective ball determination unit 43B determines that a solder ball having a roundness of not more than a predetermined value (i.e., a solder ball having an elliptical shape) is defective, and determines that a solder ball having a roundness of more than a predetermined value is normal ball having no defect.
The ball height measuring unit 43C measures the ball height of a normal ball determined by the defective ball determining unit 43B as not being a defective ball. The ball height measuring unit 43C stores information (for example, position information) capable of identifying the normal ball in association with the measured ball height, and outputs the information to the storage unit 41. The storage unit 41 stores, for each ball component BP, information (for example, position information) of a normal ball output from the ball height measurement unit 43C and the measured ball height as ball height information 41C.
The imaging processing unit 43 repeatedly executes the determination processing by the defective ball determination unit 43B and the measurement processing by the ball height measurement unit 43C for all the solder balls included in the ball component BP.
After the ball heights of all the normal balls provided in the ball component BP are measured by the ball height measuring unit 43C, the component warp detecting unit 43D measures (detects) the warp of the ball component BP based on the measured ball heights. The component warp detection unit 43D stores the warp of the component detected by the measurement (detection), and outputs the warp to the storage unit 41. The storage section 41 stores the information related to the component warp output from the component warp detection section 43D as the component warp data 41D for each ball component BP.
The defective component determination unit 43E determines whether or not the ball component BP is a defective component based on the warp of the ball component BP measured (detected) by the component warp detection unit 43D. When the ball component BP is determined to be a defective component, the defective component determination unit 43E generates a signal for notifying that the ball component BP is defective, and outputs the signal to the control unit 40. The control unit 40 generates a control command for the waste component P based on the signal output from the defective component determination unit 43E, and outputs the control command to the mechanism driving unit 42. Note that, when the number of normal balls out of the plurality of solder balls provided in the ball component BP is one or less, the component warp detection unit 43D may generate a signal for notifying that the ball component BP is a defective component, and output the signal to the defective component determination unit 43E or the control unit 40.
Here, the lower surfaces UP1 and UP2 of the ball members BP1 and BP2 will be described with reference to fig. 7. Fig. 7 is a view showing an example of the lower surfaces UP1 and UP2 of the ball members BP1 and BP 2. It is needless to say that the shape and size of each of the ball members BP1 and BP2 as members shown in fig. 7, the number and arrangement of solder balls, and the like are examples, and are not limited thereto.
The ball member BP1 as a member includes a plurality of solder balls BA on the lower surface UP 1. When the ball members BP1 are mounted (placed) on a predetermined position on the substrate W by the mounting heads 26, the solder balls BA are in contact with the substrate W, respectively. In the same manner, the ball member BP2 formed in a rectangular shape includes a plurality of solder balls BB on the lower surface UP 2. When the ball members BP2 are mounted (placed) on a predetermined position on the substrate W by the mounting head 26, the solder balls BB are brought into contact with the substrate W.
Next, a component warp detection process performed by the component mounting apparatus 1 will be described with reference to fig. 8 and 9. Fig. 8 is a flowchart illustrating an example of a component warp detection step in the component mounting apparatus 1 according to the embodiment. Fig. 9 is a diagram illustrating an example of a component warp detection step of the component mounting apparatus 1 according to the embodiment. In fig. 8 and 9, an example in which the mounting head 26 sucks and mounts the ball member BP having six solder balls B1, B2, B3, B4, B5, and B6 as members onto the substrate W is described.
The component mounting apparatus 1 suctions and holds the ball component BP conveyed to the component take-out position by the component holding nozzle 27 mounted on the mounting head 26 (St 1), and moves the mounting head 26 upward of the component recognition camera 28 (St 2).
The component mounting apparatus 1 photographs the lower surface of the ball component BP (i.e., the ball portion) with the right camera 28A and the left camera 28B at a timing when the ball component BP sucked and held by the mounting head 26 moves to a position above the component recognition camera 28, that is, a position at which the lower surface of the ball component BP can be photographed by the component recognition camera 28 (St 3). Here, captured images F1 and F2 shown in fig. 9 will be described. The captured image F1 is a captured image of the lower surface UP of the ball part BP captured by the right camera 28A. The captured image F2 is a captured image of the lower surface UP of the ball part BP captured by the left camera 28B. Each of six solder balls B1 to B6 photographed from different angles is mapped to each of the plurality of photographed images F1, F2.
The component mounting apparatus 1 determines whether any one of the solder balls B1 to B6 (for example, the solder ball B1) is a defective ball based on the captured image F1 captured by the right camera 28A and the captured image F2 captured by the left camera 28B (St 4).
Specifically, the component mounting apparatus 1 detects six solder balls B1 to B6 respectively imaged in the plurality of imaged images F1, F2 by a difference in brightness from other portions or the like. When the roundness of one or both of the solder balls respectively imaged in the plurality of imaged images F1, F2 is equal to or lower than a predetermined value, the component mounting apparatus 1 determines the solder ball as a defective ball. When the roundness of both of the solder balls respectively imaged in the plurality of imaged images F1 and F2 is greater than a predetermined value, the component mounting apparatus 1 determines that the solder ball is a normal ball. For example, in a partial side view of the ball member BP shown in fig. 9, the solder ball B3 has a defective DF1 and a dirt defective DF2. When the roundness of the solder ball is determined and the shape of the solder ball is detected for the solder ball having such a defective portion, the solder ball is detected as a non-circular shape such as an elliptical shape or a semicircular shape.
As described above, the component mounting apparatus 1 determines whether the solder ball is a defective ball. In the example shown in fig. 9, the component mounting device 1 determines the solder balls B1, B3, B6 as defective balls and the solder balls B2, B4, B5 as normal balls.
When it is determined that the solder ball B1 is not a defective ball by the processing of step St4 (no in St 4), the component mounting apparatus 1 measures and stores the ball height (the ball height H2 shown in fig. 5, and the distance from the reference plane H0 to the solder ball) of the solder ball B1 (St 5).
When it is determined that the solder ball B1 is a defective ball by the process of step St4 (yes of St 4), or after the process of step St5 is performed, the component mounting apparatus 1 determines whether or not there is a solder ball whose ball height is not measured (St 6).
When it is determined that there are solder balls whose ball height is not measured by the processing of step St6 (yes of St 6), the component mounting apparatus 1 proceeds to the processing of step St 4.
On the other hand, after repeating the processing of step St4 to step St6, if it is determined by the processing of step St6 that there are no solder balls whose ball height is not measured, that is, if the processing of step St4 to step St5 has been performed on all the solder balls included in the ball component BP (no in step St 6), the component mounting apparatus 1 detects the component warpage of the ball component BP based on the measured ball heights of all the normal balls (St 7). In the example shown in fig. 9, the component mounting device 1 detects (measures) the component warpage of the ball component BP based on the ball heights of the plurality of solder balls B2, B4, and B5.
The component mounting apparatus 1 determines whether or not the ball component BP is a defective component based on the detected (measured) component warpage (St 8). For example, the component mounting apparatus 1 determines whether or not the value of the detected (measured) component warp is equal to or greater than a predetermined value.
When it is determined that the ball BP is not a defective component by the processing of step St8 (no in St 8), the component mounting apparatus 1 mounts the ball BP sucked and held by the mounting head 26 at a predetermined position on the substrate W (St 9).
On the other hand, when it is determined that the ball component BP is a defective component by the processing of step St8 (yes of St 8), the component mounting apparatus 1 omits the mounting processing of the ball component BP sucked and held by the mounting head 26 on the substrate W, and discards the ball component BP to the discard box 37, for example.
The component mounting device 1 according to the embodiment includes the right camera 28A and the left camera 28B that capture the solder balls provided on the lower surface UP of the ball component BP held by the mounting head 26 from different directions, the defective ball determining unit 43B that determines whether or not the solder balls are defective balls based on each of the captured images F1 and F2 captured from different directions by the right camera 28A and the left camera 28B, the ball height measuring unit 43C that measures the heights of the solder balls that are not determined to be defective balls by the defective ball determining unit 43B, and the component warp detecting unit 43D that detects the warp of the ball component based on the ball heights of the solder balls measured by the ball height measuring unit 43C.
As a result, the component mounting device 1 according to the embodiment performs ball height measurement and component warp measurement of the ball component BP based on the solder ball determined to be a normal ball, and therefore, can improve the robustness of the ball height measurement and component warp measurement, thereby more accurately determining whether the ball component BP is a defective component.
The defective ball determining unit 43B of the component mounting device 1 according to the embodiment calculates the roundness of each solder ball mapped to each of the plurality of captured images F1 and F2, and determines the solder ball whose calculated roundness is equal to or lower than a predetermined value as a defective ball. As a result, the component mounting apparatus 1 according to the embodiment can detect, as defective balls, solder balls having dirt attached thereto or solder balls having defects such as flaws or defects on the surface, by using the calculated roundness. Accordingly, the component mounting apparatus 1 performs ball height measurement and component warp measurement of the ball component BP using the ball heights of the normal balls other than the defective balls, and thus can improve the robustness of the ball height measurement and component warp measurement, thereby more accurately determining whether the ball component BP is a defective component.
The component mounting device 1 according to the embodiment further includes a defective component determination unit 43E, and the defective component determination unit 43E determines whether or not the ball component BP is defective based on the warpage of the ball component BP detected by the component warpage detection unit 43D. As a result, the component mounting apparatus 1 according to the embodiment can effectively determine the ball component BP having a predetermined component warpage, which is a factor of a contact failure with the substrate W or the like.
The various embodiments have been described above with reference to the drawings, but the present invention is not limited to the above examples. It is needless to say that various modifications, substitutions, additions, deletions, and the like can be made by those skilled in the art within the scope of the description of the claims, and it is to be understood that these matters also fall within the technical scope of the present invention. The components of the above-described various embodiments may be arbitrarily combined within a range not departing from the gist of the present invention.
Industrial applicability
The present invention is useful as a component mounting device and a component warp measuring method capable of improving the robustness of ball height measurement and component warp measurement of a ball component and thereby more accurately determining whether the ball component is a defective component.
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2020099532A JP7417864B2 (en) | 2020-06-08 | 2020-06-08 | Component mounting equipment and component warpage detection method |
| JP2020-099532 | 2020-06-08 |
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| CN119334293B (en) * | 2024-09-03 | 2025-10-28 | 彩虹（合肥）液晶玻璃有限公司 | A liquid crystal glass quality detection system based on warping deformation |
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| JPH10209227A (en) * | 1997-01-20 | 1998-08-07 | Sony Corp | Semiconductor integrated circuit inspection system, semiconductor integrated circuit inspection apparatus, and semiconductor integrated circuit inspection method |
| JP4090557B2 (en) * | 1998-03-17 | 2008-05-28 | Ｊｕｋｉ株式会社 | Electronic component recognition method and apparatus |
| JP3073485B2 (en) | 1999-01-14 | 2000-08-07 | 北陽電機株式会社 | Height measuring device and semiconductor package inspection device using the same |
| JP4557471B2 (en) * | 2001-08-24 | 2010-10-06 | 株式会社リコー | Method and apparatus for testing flatness of semiconductor device package |
| JP2005340648A (en) | 2004-05-28 | 2005-12-08 | Yamaha Motor Co Ltd | Component recognition method, component recognition device, surface mounter, and component inspection device |
| JP4527203B2 (en) * | 2008-11-17 | 2010-08-18 | パナソニック株式会社 | Ranging device |
| DE102018111134A1 (en) * | 2018-05-09 | 2019-11-14 | Mtu Friedrichshafen Gmbh | Calibration procedure for an X-ray inspection, X-ray inspection procedure |
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| KR20010037417A (en) * | 1999-10-16 | 2001-05-07 | 김주환 | Inspection system of Semiconductor device package with 3 dimension type and the inspection method thereof |
| CN102446785A (en) * | 2010-10-04 | 2012-05-09 | 瑞萨电子株式会社 | Method of inspecting semiconductor device |
| CN202841837U (en) * | 2011-08-22 | 2013-03-27 | 松下电器产业株式会社 | Installation parts inspection device, parts installation system |
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| JP2021193706A (en) | 2021-12-23 |
| JP7417864B2 (en) | 2024-01-19 |
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