CN114076863A - Dynamic testing device for lower converter circuit of half-bridge module of Vienna rectifier - Google Patents
Dynamic testing device for lower converter circuit of half-bridge module of Vienna rectifier Download PDFInfo
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- CN114076863A CN114076863A CN202010850555.0A CN202010850555A CN114076863A CN 114076863 A CN114076863 A CN 114076863A CN 202010850555 A CN202010850555 A CN 202010850555A CN 114076863 A CN114076863 A CN 114076863A
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Abstract
The invention discloses a dynamic testing device for a lower commutation loop of a half-bridge module of a Vienna rectifier, which comprises: the circuit board comprises a double-layer PCB circuit board, and a shunt, a capacitance decoupling module, a driving interface and a module interface which are arranged on the double-layer PCB circuit board; the shunt is arranged in the center of the double-layer PCB circuit board and used for measuring the current flowing through the switch tube in the tested module; the driving interface is used for receiving an external driving signal; the module interface is used for providing a connection interface for the tested module; the decoupling unit is arranged on the lower surface of the double-layer PCB circuit board and used for absorbing voltage spikes caused by the inductance of the test loop in the switching process. The invention does not contain a large-volume direct current bus capacitor, only uses a surface-mounted capacitor as a last-stage decoupling capacitor, realizes multi-stage decoupling by externally connecting a large-capacitance bus capacitor plate, and reduces the area of a test board; meanwhile, due to the use of the external bus capacitor plate, the plate manufacturing and device cost of dynamic testing of different modules is reduced.
Description
Technical Field
The invention belongs to the technical field of power module testing, and particularly relates to a dynamic testing device for a lower converter circuit of a half-bridge module of a Vienna rectifier.
Background
In recent years, as power electronic converters have made higher and higher demands on power density, power module packaging technology has been developed rapidly. Pin-type power modules are preferred in power module design due to their flexible terminal placement. The dynamic test of the power modules is an important way to obtain the performance parameters of the module switches, and the dynamic performance of the power modules is generally tested by adopting a double-pulse test.
The Vienna rectifier half-bridge structure comprises four power ports and three half-bridge branches, wherein each power port comprises an alternating current input port, a direct current midpoint output port, a direct current positive electrode output port and a direct current negative electrode output port, each half-bridge branch comprises a rectifier bridge arm upper branch, a rectifier bridge arm lower branch and a bidirectional switch branch, and each bidirectional switch branch is formed by connecting two power switch tube common sources in series. The dynamic test of the half-bridge module of the pin-type vienna rectifier is greatly different from the traditional half-bridge module test method; when testing two switch tube switching parameters, required circuit connection difference is great, and the design complete dynamic testing device needs bigger test panel area respectively, also can have the waste of devices such as electric capacity simultaneously.
Therefore, it is necessary to design a dynamic testing device structure for the pin type vienna rectifier half-bridge module.
Disclosure of Invention
The invention provides a dynamic testing device for a lower commutation loop of a Vienna rectifier half-bridge module, aiming at solving the problems of complex design of a testing board and waste of devices such as capacitors and the like in the dynamic testing of the Vienna rectifier half-bridge module.
The invention provides a dynamic testing device for a lower converter circuit of a half-bridge module of a Vienna rectifier, which is characterized by comprising the following components: the circuit board comprises a double-layer PCB circuit board, and a shunt, a capacitance decoupling module, a driving interface and a module interface which are arranged on the double-layer PCB circuit board; the shunt is arranged in the center of the double-layer PCB circuit board and used for measuring the current flowing through the switch tube in the tested module; the driving interface is used for receiving an external driving signal; the module interface is used for providing a connection interface for the tested module; the decoupling unit is arranged on the lower surface of the double-layer PCB circuit board and used for absorbing voltage spikes caused by the inductance of the test loop in the switching process. The invention has better testing capability and reduces the testing cost.
The capacitance decoupling module comprises two groups of decoupling sub-modules which are connected in series, and the two groups of decoupling sub-modules are respectively arranged at two ends of the shunt.
The decoupling submodule provided by the embodiment of the invention comprises: the capacitor comprises a plurality of surface-mounted capacitors connected in parallel and one or more surface-mounted resistors connected in parallel with the surface-mounted capacitors.
The surface-mounted resistor and the surface-mounted capacitor are welded on the lower surface of the PCB.
In the embodiment of the invention, the inlet side of the PCB is provided with the positive direct current bus interface and the negative direct current bus interface, and the positive direct current bus interface and the negative direct current bus interface are connected to the corresponding interfaces of the direct current bus capacitor plate in a screw crimping mode.
The invention does not contain a large-volume direct current bus capacitor, only uses a surface-mounted capacitor as a last-stage decoupling capacitor, realizes multi-stage decoupling by externally connecting a large-capacitance bus capacitor plate, and reduces the area of a test board; meanwhile, due to the use of the external bus capacitor plate, the plate manufacturing and device cost of dynamic testing of different modules is reduced.
In an embodiment of the present invention, the driving interface includes: the first driving interface and the second driving interface are arranged on the outlet side of the double-layer PCB circuit board; for connecting external driving signals.
And a first grid test point, a common source drive test point and a second grid test point are arranged near the first drive interface and the second drive interface.
As an embodiment of the invention, the splitter may be a coaxial splitter.
In the embodiment of the invention, the module interface is a plug-in structure and is used for providing a direct plug-in connection interface for the module to be tested.
In general, the dynamic test function of the converter circuit under the vienna rectifier half bridge is realized through the technical scheme, and the dynamic test device has the following technical advantages:
(1) according to the dynamic test device, the corresponding dynamic test device of the lower current conversion loop is designed aiming at the dynamic test of the contact pin type Vienna rectifier half-bridge module, so that the design difficulty is reduced, and the test effect is improved.
(2) The dynamic testing device provided by the invention comprises the surface-mounted decoupling capacitor and the power and drive connection and testing interface of the module, and is externally connected with a public bus capacitor plate with a large capacitance value during testing, so that the plate manufacturing cost and the capacitor cost of a testing plate are reduced.
(3) The invention adopts a direct plug-in module and drive connection mode, can ensure the connection performance, is convenient to replace the module and the drive circuit during testing, is very flexible and brings great convenience to batch testing.
(4) According to the invention, through reasonable layout, the tested module is taken as a center, the shunt, the decoupling capacitor, the power connection and test part and the drive connection and test part are distributed around the module interface, and the distance between the shunt, the decoupling capacitor, the power connection and test part and the module interface is less than the preset second threshold, so that the area of a current conversion loop is reduced, parasitic parameters are reduced, the influence of a main circuit on a drive circuit is reduced, and better test performance is obtained.
Drawings
Fig. 1 is a schematic diagram of an external structure of a module under test to which a dynamic testing apparatus structure of a pin-type vienna rectifier half-bridge module according to an embodiment of the present invention is applied;
fig. 2 is a schematic diagram of a top layout structure of a dynamic testing apparatus for testing a lower commutation loop in a dynamic testing apparatus structure provided in an embodiment of the present invention;
fig. 3 is a schematic diagram of a bottom layout structure of a dynamic testing apparatus for testing a lower commutation loop in a dynamic testing apparatus structure according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating an upper copper layer distribution structure of a dynamic test PCB for testing a lower commutation loop in a dynamic test apparatus structure according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a distribution structure of a lower copper layer of a dynamic test PCB for testing a lower commutation loop in a dynamic test apparatus structure according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a lower commutation loop test circuit in a dynamic test apparatus structure according to an embodiment of the present invention.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein: 1 is a direct current positive electrode output end, 2 is a direct current negative electrode output end, 3 is a direct current midpoint output end, 4 is an alternating current input end, 5 is a common source drive end, 6 is a first grid, 7 is a second grid, 8 is a thermistor end, 9 is a double-layer PCB circuit board, 10a is a positive direct current bus interface, 10b is a negative direct current bus interface, 11 is a shunt, 12 is a module interface, 13 is a direct current negative electrode inductance interface, 14 is an alternating current input inductance interface, 15a is a direct current negative electrode test point, 15b is an alternating current input test point, 15c is a direct current midpoint test point, 16 is a first drive interface, 17 is a second drive interface, 18a is a first grid test point, 18b is a common source drive test point, 18c is a second grid test point, 19 is a surface-mounted capacitor, 20 is a surface-mounted resistor, 21 is a direct current bus positive electrode, 22 is a direct current negative electrode output copper layer, 23 is a first gate lead, 24 is a second gate lead, 25 is a common source drive lead, 26 is a stitch hole, 27 is a dc bus negative electrode copper layer, 28 is a series decoupling capacitor midpoint copper layer, 29 is a dc bus positive electrode copper layer, and 30 is an ac input copper layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention provides a dynamic testing device for a lower converter circuit of a half-bridge module of a Vienna rectifier, which comprises: the double-layer PCB circuit board is used for dynamically testing the lower commutation loop, and the shunt, the surface-mounted resistor, the surface-mounted capacitor, the first driving interface, the second driving interface and the module interface are connected on the lower commutation loop dynamically testing PCB circuit board; an inlet at one side of the PCB circuit board for the dynamic test of the lower converter circuit is provided with an interface of a positive direct current bus and an interface of a negative direct current bus, and the interfaces are connected to a direct current bus capacitor plate in a screw compression joint mode; the shunt is positioned in the center of the test board and used for measuring the current flowing through the switch tube; the surface-mounted resistors and the surface-mounted capacitors are welded on the lower surface of the PCB, a plurality of surface-mounted capacitors are connected with one or more surface-mounted resistors in parallel to form decoupling sub-modules, and then are connected with another group of decoupling sub-modules in series to form capacitor decoupling modules, and two groups of capacitor decoupling modules are distributed at two ends of the shunt and are close to the module interfaces; the module interface suitable for the needle-shaped terminal is positioned in the middle of the test board, is close to the capacitance decoupling module and the shunt, the distance is less than a preset threshold value, a test point of a direct current midpoint output end is reserved, and each connector corresponds to the terminal of the tested module one by one; an alternating current input end inductance interface and a direct current negative electrode output end inductance interface are respectively reserved on two sides of the test board, are used for connecting a double-pulse test inductance, and are reserved with corresponding test points; and a first driving interface and a second driving interface are arranged on the outlet side of the test board and used for externally connecting driving signals, and corresponding test points are reserved.
For the dynamic test of the vienna rectifier half-bridge module, the connection modes of the double-pulse test circuits adopted by the upper converter circuit and the lower converter circuit are greatly different, and although two test circuits can be arranged on the same PCB, the area of the test circuit board is increased, and the layout difficulty and the test board complexity are increased. Preferably, for the dynamic test of the lower conversion current loop, a corresponding dynamic test device is manufactured, so that the design difficulty is reduced, the area of a single dynamic test device is reduced, the influence caused by parasitic parameters is reduced, and the test effect is improved.
For a high-voltage module of 1700V or 1200V, in order to meet the requirement of voltage stress, a plurality of 600V surface-mounted capacitors are connected in series to improve the voltage resistance of the decoupling capacitor; preferably, the series-parallel surface-mounted decoupling capacitors are divided into two groups and are evenly distributed on two sides of the shunt side by side, the resistors are connected in parallel to meet the voltage sharing requirement, and the resistance value is selected according to the fact that the resistance loss is smaller than 500 mW.
As an embodiment of the invention, the shunt adopts a coaxial shunt, which is convenient for an oscilloscope to measure, can reduce the volume occupied by the shunt, reduce the area of a current conversion loop and improve the test effect.
As an embodiment of the invention, the tested module can be reliably connected with the PCB board through the spring seat welded on the PCB board, so that the tested module can be conveniently plugged and replaced.
As an embodiment of the invention, the invention adopts a surface-mounted capacitor as the last-stage decoupling for absorbing the voltage peak caused by the inductance of the test loop; during testing, the dynamic testing device is connected with a direct current bus capacitor plate, and the total capacitance value reaches thousands of microfarads because the direct current bus capacitor is usually the series-parallel connection of an electrolytic capacitor and a thin film capacitor; the use of the dynamic device can flexibly adapt to different tests and reuse the bus capacitor plate, thus reducing the cost of the test plate, the electrolytic capacitor and the film capacitor and being very economical and convenient.
In order to further illustrate the dynamic testing apparatus for the lower commutation loop of the vienna rectifier half-bridge module according to the embodiment of the present invention, the dynamic testing apparatus for the pin type vienna rectifier half-bridge module is described below. It should be noted that the words indicating orientation or positional relationship, such as "upper", "lower", "left", "right", "middle", etc., are based on the orientation or positional relationship shown in the drawings, and are used for describing the invention only and not for limiting the invention; the following is now detailed in conjunction with specific examples and with reference to the accompanying drawings:
fig. 1 is a schematic diagram showing an external structure of a module under test to which a dynamic testing apparatus structure of a pin-type vienna rectifier half-bridge module according to an embodiment of the present invention is applied, where the module includes the following types of terminals: the direct current positive electrode output end 1, the direct current negative electrode output end 2, the direct current midpoint output end 3, the alternating current input end 4, the common source drive end 5, the first grid 6, the second grid 7 and the thermistor end 8. Wherein: the DC positive electrode output end 1, the DC negative electrode output end 2, the DC midpoint output end 3 and the AC input end 4 are power ends; the common source driving end 5, the first grid electrode 6 and the second grid electrode 7 are driving ends; the Vienna rectifier half bridge comprises a rectifier bridge arm upper branch, a rectifier bridge arm lower branch and a bidirectional switch branch; a rectifying bridge arm upper branch is arranged between the direct current positive electrode output end 1 and the alternating current input end 4, a rectifying bridge arm lower branch is arranged between the direct current negative electrode output end 2 and the alternating current input end 4, and a bidirectional switch branch is arranged between the direct current midpoint output end 3 and the alternating current input end 4; the bidirectional switch branch is formed by connecting two power switch tubes in series with common sources.
Fig. 2 is a top layout diagram of a dynamic testing apparatus for testing a lower commutation loop in a dynamic testing apparatus structure provided in an embodiment of the present invention, and fig. 3 is a bottom layout diagram of a dynamic testing apparatus for testing a lower commutation loop in a dynamic testing apparatus structure provided in an embodiment of the present invention; the dynamic testing device for the lower converter circuit comprises: the circuit comprises a double-layer PCB (printed circuit board) 9, a shunt 11 connected to the double-layer PCB 9, a direct current negative electrode inductance interface 13, an alternating current input inductance interface 14, a first driving interface 16, a second driving interface 17, a surface-mounted capacitor 19 and a surface-mounted resistor 20. A positive direct current bus interface 10a and a negative direct current bus interface 10b are reserved above the double-layer PCB 9 and are used for being connected with a direct current bus capacitor plate with a capacitance value of thousands of microfarads; the shunt 11 is positioned in the middle of the PCB and used for measuring the current flowing through the switching tube of the module to be measured; the surface-mounted capacitor 19 and the surface-mounted decoupling resistor are located on the lower surface of the double-layer PCB circuit board 9 and used for achieving a decoupling function.
In the embodiment of the invention, the capacitance decoupling modules are divided into two symmetrical groups and are positioned at two sides of the shunt; meanwhile, in order to achieve a good capacitor voltage-sharing effect, each decoupling capacitor submodule is connected with two groups of surface-mounted resistors 20 in parallel, and in order to limit power consumption, the resistance value of each decoupling capacitor submodule is smaller than a preset threshold value; the module interface 12 is as close as possible to the voltage dividing resistor and the decoupling capacitor, and the distance should be as small as possible on the premise of not influencing each other, so that a smaller commutation loop is obtained, the influence of parasitic parameters on the measurement result is reduced, and a better test effect is obtained.
A module interface 12 is arranged at the lower part of the double-layer PCB 9 and is used for connecting a contact pin type Vienna rectifier half-bridge module, and a direct current negative electrode inductance interface 13, an alternating current input inductance interface 14, a direct current negative electrode test point 15a, an alternating current input test point 15b, a direct current midpoint test point 15c, a first drive interface 16, a second drive interface 17, a first grid test point 18a, a common source drive test point 18b and a second grid test point 18c are arranged around the module interface; seen from the top of the test board, the direct-current negative electrode inductance interface 13 and the alternating-current input inductance interface 14 are respectively positioned on the right side and the left side of the module interface 12 and used for connecting a double-pulse test inductance; a direct current negative electrode test point 15a corresponding to the direct current negative electrode output end 2, a direct current midpoint test point 15b corresponding to the alternating current input end 4 and an alternating current input test point 15c corresponding to the direct current midpoint output end 3 are power test points and are used for measuring the voltage of a switch tube to be tested in the module; the lowest side of the double-layer PCB circuit board 9 is provided with a first driving interface 16 and a second driving interface 17, and the first driving interface, the second driving interface and the second driving interface are respectively provided with a first grid test point 18a, a common source driving test point 18b and a second grid test point 18c which are used for externally connecting and measuring driving signals.
Fig. 4 is a diagram of an upper copper layer distribution of a dynamic test PCB for testing a lower commutation loop in a dynamic test apparatus structure according to an embodiment of the present invention; fig. 5 is a diagram of a lower copper layer of a dynamic test PCB for testing a lower commutation loop in a dynamic test apparatus structure according to an embodiment of the present invention. The direct current bus positive electrode copper layer 21 is an upper layer copper, is connected with the direct current bus interface positive electrode 10a and is connected with a direct current bus positive electrode copper layer 29 on the lower layer through a sewing hole 26, and the direct current bus positive electrode copper layer 29 is connected with the module direct current midpoint output end 3; the direct current bus negative electrode copper layer 27 is lower copper, is connected with the direct current bus negative electrode 10b and is connected with the bottom electrode of the shunt 11; the direct current negative electrode output copper layer 22 is upper copper and is connected with the module direct current negative electrode output end 2 and the upper electrode of the shunt 11; the surface-mounted capacitor 19 and the surface-mounted resistor 20 which are connected in series are bridged between a direct current bus negative electrode copper layer 27 and a direct current bus positive electrode copper layer 29 through a series decoupling capacitor midpoint copper layer 28; the AC input copper layer 30 is connected with the AC input port 4; the direct current negative electrode inductance interface 13 is positioned on the direct current bus negative electrode copper layer 22, and the alternating current input inductance interface 14 is positioned on the alternating current input copper layer 30; the first grid electrode 6, two pins of the first driving interface 16 and the first grid electrode driving test point 18a are connected through a first grid electrode lead 23; the second grid 7, two pins of the second driving interface 17 and the second grid driving test point 18c are connected through a second grid lead 24; the other two legs of the first drive interface 16 are connected to the other two legs of the second drive interface 17 and to the common source drive terminal 5 and the common source drive test point 18b by common source drive leads 26.
Fig. 6 is a schematic diagram of a lower commutation loop test circuit corresponding to the dynamic test apparatus structure according to the embodiment of the present invention; when the dynamic performance of the lower commutation loop of the module to be tested is measured, an inductor used for double-pulse testing is connected between the direct-current negative electrode inductor interface 13 and the alternating-current input inductor interface 14, a double-pulse driving signal is connected on the second driving interface 17, a long-pass driving signal is connected on the first driving interface 16, and the voltage, the current and the driving test result of the second switch tube to be tested of the module are respectively obtained from the alternating-current input test point 15b, the direct-current midpoint test point 15c, the shunt 11, the second grid test point 18c and the common source driving test point 18 b.
The dynamic testing device provided by the invention only adopts the surface-mounted capacitor as the last-stage decoupling capacitor and is externally connected with a direct-current bus capacitor plate with a capacitance value reaching thousands of microfarads, so that the waste of electrolytic capacitors and film capacitors when different measuring circuits are adopted is avoided, the area of a single testing plate is reduced, and the testing cost is reduced; on the dynamic testing device, the decoupling capacitor is close to the tested module, so that the area of a current conversion loop is reduced, the influence of parasitic parameters on the test is further reduced, and the test precision is improved.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (9)
1. A dynamic testing device for a lower commutation loop of a half-bridge module of a Vienna rectifier is characterized by comprising the following components: the circuit board comprises a double-layer PCB circuit board, and a shunt, a capacitance decoupling module, a driving interface and a module interface which are arranged on the double-layer PCB circuit board;
the shunt is arranged in the center of the double-layer PCB circuit board and used for measuring the current flowing through the switch tube in the module to be measured;
the driving interface is used for receiving an external driving signal;
the module interface is used for providing a connection interface for a module to be tested;
the decoupling unit is arranged on the lower surface of the double-layer PCB circuit board and used for absorbing voltage spikes caused by the inductance of the test loop in the switching process.
2. The dynamic testing device for the lower commutation loop of claim 1, wherein the capacitive decoupling module comprises two sets of decoupling sub-modules connected in series, and the two sets of decoupling sub-modules are respectively arranged at two ends of the shunt.
3. The dynamic testing apparatus of the lower commutation loop of claim 2, wherein the decoupling submodule comprises: the capacitor comprises a plurality of surface-mounted capacitors connected in parallel and one or more surface-mounted resistors connected in parallel with the surface-mounted capacitors.
4. The dynamic testing device for the lower commutation loop of claim 3, wherein the surface-mounted resistor and the surface-mounted capacitor are welded on the lower surface of the PCB.
5. The dynamic testing device for the down-conversion circuit according to any one of claims 1 to 4, wherein a positive DC bus interface and a negative DC bus interface are arranged on the inlet side of the PCB, and the positive DC bus interface and the negative DC bus interface are connected to corresponding interfaces of a DC bus capacitor plate by means of screw crimping.
6. The dynamic testing apparatus of any one of claims 1 to 5, wherein the driving interface comprises: the first driving interface and the second driving interface are arranged on the outlet side of the double-layer PCB circuit board; for connecting external driving signals.
7. The dynamic test apparatus of claim 6, wherein a first gate test point, a common source drive test point, and a second gate test point are disposed adjacent to the first drive interface and the second drive interface.
8. The dynamic testing apparatus of any one of claims 1 to 7, wherein the splitter is a coaxial splitter.
9. The dynamic testing device for the lower commutation loop according to any one of claims 1 to 8, wherein the module interface has a plug-in structure and is configured to provide a direct plug-in connection interface for a module under test.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010850555.0A CN114076863A (en) | 2020-08-21 | 2020-08-21 | Dynamic testing device for lower converter circuit of half-bridge module of Vienna rectifier |
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| CN202010850555.0A CN114076863A (en) | 2020-08-21 | 2020-08-21 | Dynamic testing device for lower converter circuit of half-bridge module of Vienna rectifier |
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| US20200185302A1 (en) * | 2018-12-10 | 2020-06-11 | Gan Systems Inc. | Power modules for ultra-fast wide-bandgap power switching devices |
| CN114062797A (en) * | 2020-08-05 | 2022-02-18 | 华中科技大学 | Dynamic test board for needle-shaped terminal full-bridge type power module |
| CN114088986A (en) * | 2020-08-05 | 2022-02-25 | 华中科技大学 | Dynamic test board for needle-shaped terminal half-bridge type power module |
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2020
- 2020-08-21 CN CN202010850555.0A patent/CN114076863A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202093137U (en) * | 2011-03-28 | 2011-12-28 | 天津瑞能电气有限公司 | Parameter test platform for intelligent power module group |
| WO2016034232A1 (en) * | 2014-09-04 | 2016-03-10 | Siemens Aktiengesellschaft | Test circuit for a modular multi-cell converter |
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| CN114088986A (en) * | 2020-08-05 | 2022-02-25 | 华中科技大学 | Dynamic test board for needle-shaped terminal half-bridge type power module |
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Application publication date: 20220222 |