CN114062797A - Dynamic test board for needle-shaped terminal full-bridge type power module - Google Patents
Dynamic test board for needle-shaped terminal full-bridge type power module Download PDFInfo
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- CN114062797A CN114062797A CN202010781883.XA CN202010781883A CN114062797A CN 114062797 A CN114062797 A CN 114062797A CN 202010781883 A CN202010781883 A CN 202010781883A CN 114062797 A CN114062797 A CN 114062797A
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- 238000012360 testing method Methods 0.000 title claims abstract description 168
- 239000003990 capacitor Substances 0.000 claims abstract description 32
- 230000000694 effects Effects 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000002355 dual-layer Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/30—Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/327—Testing of circuit interrupters, switches or circuit-breakers
Abstract
The invention discloses a dynamic test board for a needle terminal full-bridge type power module, which belongs to the field of power module test, wherein a plurality of needle terminals are arranged on a power module, and the test board comprises: the direct current bus interface, the connecting module, the driving module, the decoupling module, the inductance access module and the testing module are arranged on the double-layer circuit board; the connecting module is arranged at the outlet side of the double-layer circuit board and comprises a plurality of connecting holes which are in one-to-one correspondence with the needle-shaped terminals; the decoupling module is formed by connecting a plurality of decoupling branches in parallel, each decoupling branch is formed by connecting a plurality of surface-mounted decoupling capacitors in series, and two ends of each surface-mounted decoupling capacitor are connected with surface-mounted resistors in parallel; the decoupling module is connected with the power module inserted on the connecting module, and the distance between the decoupling module and the power module is smaller than a preset threshold; the direct current bus interface, the driving module, the inductance access module and the testing module are respectively connected with the corresponding connecting holes. The dynamic test board has small area, low cost, flexible regulation, high pressure resistance and raised test effect.
Description
Technical Field
The invention belongs to the field of power module testing, and particularly relates to a dynamic test board for a needle-shaped terminal full-bridge type power module.
Background
In recent years, with the development of power electronics technology, power modules using pin terminals have been developed. The terminal position of the power module can be flexibly adjusted, and great convenience is brought to module design. Dynamic testing is an important component in testing a full-bridge power module, and a double-pulse testing method is generally adopted to test the switching performance parameters of each switching tube in a certain half bridge.
For the full-bridge power module with the needle-shaped terminals, which comprises two half-bridge branches, the positions of the terminals are flexible and changeable, so that the full-bridge power module has higher flexible layout requirements on a dynamic test board. In addition, traditional dynamic test board contains electrolytic capacitor, film capacitor of large capacity for dynamic test board's area is great, and the cost is higher, when changing power module structure or changing test module, needs to change dynamic test board, and electrolytic capacitor, film capacitor on the dynamic test board all can't reuse, cause very big waste, have increased the cost. Some full-bridge power modules have higher voltage, such as the full-bridge power module of the british flying, the voltage level of which can reach 1200V or even 1700V, which has higher requirements for the test board.
Disclosure of Invention
Aiming at the defects and the improvement requirements of the prior art, the invention provides a dynamic test board for a needle-shaped terminal full-bridge type power module, aiming at reducing the area of the test board, reducing the cost, improving the setting flexibility and the high-voltage resistance, providing a smaller current conversion loop for the power module and improving the test effect.
In order to achieve the above object, according to an aspect of the present invention, there is provided a dynamic test board for a full-bridge power module with needle terminals, the full-bridge power module having a plurality of needle terminals thereon, the dynamic test board including a dc bus interface, a connection module, a driving module, a decoupling module, an inductor access module, and a test module, the dc bus interface, the connection module, the driving module, the decoupling module, the inductor access module, and the test module being disposed on a double-layer circuit board; the connecting module is arranged on the outlet side of the double-layer circuit board and comprises a plurality of connecting holes, and the connecting holes correspond to the needle-shaped terminals one to one; the decoupling module comprises a plurality of decoupling branches connected in parallel, each decoupling branch comprises a plurality of decoupling sub-modules connected in series, each decoupling sub-module is formed by connecting one or more surface-mounted decoupling capacitors and one surface-mounted resistor in parallel, two ends of the decoupling module are respectively connected with connecting holes corresponding to a main power positive terminal and a main power negative terminal, and the distance between the decoupling module and the connecting holes connected with the decoupling module is smaller than a preset threshold value; the direct current bus interface, the driving module, the inductance access module and the testing module are electrically connected with the corresponding connecting holes of the needle-shaped terminals respectively.
Furthermore, the direct current bus interface is positioned at the inlet of the double-layer circuit board and is connected to a direct current bus provided with an electrolytic capacitor, and the capacitance value of the electrolytic capacitor is greater than a first preset value.
Furthermore, the surface-mounted decoupling capacitor and the surface-mounted resistor are located in the middle area of the double-layer circuit board, the resistance values of the surface-mounted resistors in the same decoupling branch are equal, and the resistance value of the surface-mounted resistor is larger than a second preset value.
Still further, the test board further comprises: the shunt is arranged in the middle area of the double-layer circuit board, one end of the shunt is connected to the decoupling module, and the other end of the shunt is connected to the connecting hole corresponding to the main power positive terminal or the main power negative terminal.
Still further, the splitter is a coaxial splitter.
Furthermore, the driving module comprises a driving submodule which is arranged on one side of the connecting hole corresponding to the driving terminal of any half bridge in the full-bridge type power module.
Furthermore, the driving module comprises two driving submodules, and the two driving submodules are respectively arranged at one side of the connecting holes corresponding to the driving terminals of the two half-bridges in the full-bridge power module.
Further, a spring seat matched with the needle-shaped terminal is arranged in the connecting hole.
Generally, by the above technical solution conceived by the present invention, the following beneficial effects can be obtained:
(1) the connecting module is arranged in the outlet side area of the circuit board, and the driving module, the inductance access module and the testing module are arranged around the connecting module, so that the structure of the testing board can be flexibly adjusted according to the terminals of the power module;
(2) each decoupling branch in the decoupling module is formed by connecting a plurality of surface-mounted decoupling capacitors in series, and a surface-mounted resistor is arranged for each surface-mounted decoupling capacitor in parallel, so that the high-voltage resistance of the test board is improved, and the decoupling module can be used for testing a high-voltage power layer module and improving the application range of the high-voltage power layer module;
(3) the dynamic test board is connected to the direct current bus provided with the large-capacitance electrolytic capacitor instead of adding the large-capacitance bus electrolytic capacitor and the thin-film capacitor by adopting a plurality of surface-mounted decoupling capacitors connected in parallel, so that the area of the dynamic test board can be reduced, the cost is reduced, the dynamic test boards corresponding to different power modules can share the same direct current bus, and the cost is further reduced;
(4) the distance between the decoupling module and a bus voltage input terminal of the full-bridge power module is set to be a small value, so that the decoupling capacitor provides a small commutation loop for the power module, parasitic parameters of the commutation loop are reduced, and the test effect is improved;
(5) the connecting module is provided with a plurality of connecting holes with spring seats, so that the needle-shaped terminal full-bridge type power module can be conveniently inserted into the connecting holes to carry out dynamic test, and the test convenience is improved.
Drawings
FIG. 1 is a schematic diagram of a top layout structure of a dynamic test board for a full-bridge power module with pin terminals according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a bottom layout structure of a dynamic test board for a full-bridge power module with pin terminals according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating an external structure of a full-bridge power module according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating the distribution of the upper copper layer of the dual-layer circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic view illustrating the distribution of the lower copper layer of the dual-layer circuit board according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a testing circuit of a dynamic testing board for a full-bridge power module with pin terminals according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a top layout structure of a dynamic test board for a pin-terminal full-bridge power module according to another embodiment of the present invention;
FIG. 8 is a schematic diagram of a bottom layout structure of a dynamic test board for a pin-terminal full-bridge power module according to another embodiment of the present invention;
fig. 9 is a schematic diagram of a testing circuit of a dynamic testing board for a pin-terminal full-bridge power module according to another embodiment of the invention.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:
1 is a double-layer circuit board, 11 is a positive electrode copper layer, 12 is a negative electrode copper layer, 13 is a through hole array, 14 is an upper tube driving connecting lead, 15 is a lower tube driving connecting lead, 16 is a power module side negative electrode copper layer, 17 is a power module output electrode copper layer, 18 is a connecting copper layer, 2 is a direct current bus interface, 21 is a direct current bus interface positive electrode, 22 is a direct current bus interface negative electrode, 3 is a connecting module, 31 is a connecting hole, 4 is a driving module, 41 is a driving submodule, 41a is a first half-bridge upper tube driving interface, 41b is a first half-bridge lower tube driving interface, 41c is a second half-bridge upper tube driving interface, 41d is a second half-bridge lower tube driving interface, 5 is a decoupling module, 51 is a decoupling branch, 511 is a decoupling submodule, 511a is a surface-mounted decoupling capacitor, 511b is a surface-mounted resistor, 6 is an inductance access module, 61 is a positive electrode inductance interface, 62 is a negative electrode inductance interface, 63 is a first output electrode inductance interface, 64 is a second output electrode inductance interface, 7 is a test module, 71a is a main power positive electrode test point, 71b is a main power negative electrode test point, 71c is a first main power output electrode test point, 71d is a second main power output electrode test point, 72a is a first half-bridge upper tube drive voltage test point, 72b is a first half-bridge lower tube drive voltage test point, 72c is a second half-bridge upper tube drive voltage test point, 72d is a second half-bridge lower tube drive voltage test point, 8 is a shunt, 9 is a full-bridge type power module, 91 is a main power positive terminal, 92 is a main power negative terminal, 93 is a main power first output terminal, 94 is a main power second output terminal, 95 is a first half-bridge upper tube drive terminal, 96 is a first half-bridge lower tube drive terminal, 97 is a second half-bridge upper tube drive terminal, reference numeral 98 denotes a second half-bridge down-tube drive terminal, and 99 denotes a thermistor terminal.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the present application, the terms "first," "second," and the like (if any) in the description and the drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
The full-bridge power module is a full-bridge power electronic circuit and consists of two half-bridge branches. Each half-bridge branch circuit is composed of an upper switch tube and a lower switch tube, each switch tube is reversely connected with a diode in parallel, and each switch tube is switched on or off under the control of a driving signal so as to complete electric energy conversion. The direct current positive electrodes and the direct current negative electrodes of the two half-bridge branches are respectively connected together, and output electrodes are respectively led out. Referring to fig. 3, the needle terminals disposed on the full-bridge power module 9 include a main power positive terminal 91, a main power negative terminal 92, a main power first output terminal 93, a main power second output terminal 94, a first half-bridge upper tube driving terminal 95, a first half-bridge lower tube driving terminal 96, a second half-bridge upper tube driving terminal 97, a second half-bridge lower tube driving terminal 98, and a thermistor terminal 99. Each pin terminal is connected to a corresponding circuit element in the full-bridge power module, such as a first half-bridge upper transistor drive terminal 95 connected to the gate and source of the first half-bridge upper transistor of the power module, as shown in fig. 6, for inputting an external drive voltage to the first half-bridge upper transistor.
Fig. 1 is a schematic top layout structure of a dynamic test board for a pin-terminal full-bridge power module according to an embodiment of the invention. Referring to fig. 1, the dynamic test board in the present embodiment is described in detail with reference to fig. 2 to 6.
When two half-bridge branches of the full-bridge power module are symmetrical, the switching tube on one half-bridge branch is generally only required to be tested, at the moment, the full-bridge power module is tested by using the dynamic test board in FIG. 1, and the test cost is reduced on the basis of ensuring the test integrity and accuracy. In this embodiment, the dynamic test board is only used for testing the first half bridge branch of the full-bridge power module 9.
Referring to fig. 1, the dynamic test board for the full-bridge power module with the needle-shaped terminals includes a dc bus interface 2, a connection module 3, a driving module 4, a decoupling module 5, an inductor access module 6, a test module 7, and a shunt 8, which are disposed on a double-layer circuit board 1. The double-layer wiring board 1 is a printed circuit board having two copper layers.
The connecting module 3 comprises a plurality of connecting holes 31 arranged in the double-layer circuit board 1, the connecting holes 31 correspond to the needle-shaped terminals of the full-bridge power module 9 one by one, and the full-bridge power module 9 to be tested can be conveniently connected into the dynamic test board through the insertion connection between the needle-shaped terminals and the connecting holes 31. Specifically, referring to fig. 1, the connection module 3 includes a plurality of connection holes 31 respectively corresponding to the main power positive terminal 91, the main power negative terminal 92, the main power first output terminal 93, the main power second output terminal 94, the first half-bridge upper tube driving terminal 95, the first half-bridge lower tube driving terminal 96, the second half-bridge upper tube driving terminal 97, the second half-bridge lower tube driving terminal 98, and the thermistor terminal 99. In this embodiment, the connection module 3 is disposed in the outlet side region of the double-layer circuit board 1, and the drive module 4, the inductance access module 6, and the test module 7 are disposed around the connection module 3.
In the embodiment of the present invention, a spring seat is provided in each connection hole 31 to be engaged with the pin terminal. The spring seat is welded in the connecting hole 31, and each needle-shaped terminal of the full-bridge power module is inserted in the spring seat corresponding to the connecting hole 31, so that the elastic connection between the full-bridge power module and the dynamic test board can be realized, and the full-bridge power module can be conveniently plugged and unplugged. Furthermore, each needle-shaped terminal of the full-bridge power module can be welded in the corresponding connecting hole 31, so as to realize the fixed connection between the full-bridge power module and the dynamic test board.
The direct current bus interface 2 is located at the inlet of the double-layer circuit board 1, and comprises a direct current bus interface positive electrode 21 and a direct current bus interface negative electrode 22, and is used for being connected with a direct current bus so as to provide bus voltage for the dynamic test board. The dc bus bar interface 2 is electrically connected to the connection hole 31 corresponding to the corresponding needle terminal. Specifically, the dc bus interface positive electrode 21 is electrically connected to the connection hole 31 corresponding to the main power positive terminal 91, and the dc bus interface negative electrode 22 is electrically connected to the connection hole 31 corresponding to the main power negative terminal 92.
In the embodiment of the invention, the direct current bus interface 2 is connected with a direct current bus provided with an electrolytic capacitor, and the capacitance value of the electrolytic capacitor is greater than a first preset value so as to ensure the stability of the voltage of the direct current bus. The first preset value may be set according to a specific application scenario of the full-bridge power module.
In this embodiment, the driver module 4 includes a driver submodule 41 for testing a half-bridge branch of the full-bridge power module 9. Still taking the example that the dynamic test board is only used for testing the first half-bridge branch, the driving sub-module 41 includes two driving interfaces disposed on the dual-layer circuit board 1, which are a first half-bridge upper driving interface 41a and a first half-bridge lower driving interface 41b, respectively. First half-bridge pipe drive interface 41a corresponds connecting hole 31 with first half-bridge pipe drive terminal 95 and is connected to be located the next door that first half-bridge pipe drive terminal 95 corresponds connecting hole 31 one side, be convenient for be connected with first half-bridge pipe drive terminal 95, with external pipe drive voltage input to the switch tube on the first half-bridge. The first half-bridge lower tube driving interface 41b is electrically connected to the corresponding connecting hole 31 of the first half-bridge lower tube driving terminal 96, and is located beside the side of the corresponding connecting hole 31 of the first half-bridge lower tube driving terminal 96, so as to be conveniently connected to the first half-bridge lower tube driving terminal 96, and input the external lower tube driving voltage to the first half-bridge lower switch tube.
The decoupling module 5 comprises a plurality of decoupling branches 51 connected in parallel, each decoupling branch 51 comprises a plurality of decoupling sub-modules 511 connected in series, and each decoupling sub-module 511 is formed by connecting one or more surface-mounted decoupling capacitors and one surface-mounted resistor in parallel. As shown in fig. 1, each decoupling submodule 511 is formed by connecting four surface-mount decoupling capacitors 511a in parallel and then connecting one surface-mount resistor 511b in parallel, so that the decoupling submodule 511 has a larger capacitance value, thereby ensuring the decoupling effect and the test effect. For the high-voltage power module, for example, two decoupling sub-modules 511 are connected in series to form a decoupling branch 51 for voltage division, so that the voltage withstanding capability of the test board is improved, and the test board is ensured to meet the voltage withstanding requirement; for example, the two decoupling branches 51 are connected in parallel to form the decoupling module 5 shown in fig. 1. The dynamic test board only uses the surface-mounted decoupling capacitor, and the bus electrolytic capacitors with large capacitance values are connected in an external connection mode, so that the area of the test board is reduced, and the cost is reduced.
The surface-mounted decoupling capacitor and the surface-mounted resistor in the decoupling module 5 are located in the middle area of the double-layer circuit board 1, as shown in fig. 2. The surface-mounted resistors in the same decoupling branch 51 have the same resistance, that is, the surface-mounted resistors connected in series have the same resistance, so as to ensure that the voltages divided by the decoupling sub-modules 511 connected in series are the same. The resistance value of each surface-mounted resistor is larger than the second preset value, so that the power consumption of the surface-mounted resistor is limited to a smaller value. The second preset value may be set according to a specific application scenario of the full-bridge power module.
Two ends of the decoupling module 5 are respectively connected to the direct current bus interface positive electrode 21 and the direct current bus interface negative electrode 22. The two ends of the decoupling capacitor 5 are respectively and electrically connected with the connecting holes 31 corresponding to the main power positive terminal 91 and the main power negative terminal 92, and the distance between the decoupling capacitor 5 and the connecting holes 31 corresponding to the main power positive terminal 91 and the main power negative terminal 92 is smaller than a preset threshold value, so that the decoupling capacitor 5 is ensured to be close to the full-bridge power module on the dynamic test board, a smaller commutation loop is provided for the full-bridge power module, the parasitic parameters of the commutation loop are reduced, and the test effect is improved. The preset threshold value can be set according to a specific application scene and the size parameter of the dynamic test plate.
The inductance access module 6 comprises a plurality of inductance interfaces arranged on the double-layer circuit board 1. Still taking the example that the dynamic test board is only used for testing the first half bridge branch as an example, the inductor access module 6 includes a positive electrode inductor interface 61, a negative electrode inductor interface 62 and a first output electrode inductor interface 63, the positive electrode inductor interface 61 is connected to the connection hole 31 corresponding to the positive main power terminal 91, the negative electrode inductor interface 62 is connected to the connection hole 31 corresponding to the negative main power terminal 92, and the first output electrode inductor interface 63 is connected to the connection hole 31 corresponding to the first main power output terminal 93, so as to access the test inductor into the first half bridge branch.
The test module 7 includes a plurality of test points electrically connected to the connection holes 31 corresponding to the respective pin terminals. Specifically, the test module 7 includes a main power test point and a driving voltage test point.
Still taking the example that the dynamic test board is only used for testing the first half bridge branch, the main power test point includes a main power positive electrode test point 71a, a main power negative electrode test point 71b and a first main power output electrode test point 71 c. The main power positive electrode test point 71a is electrically connected with the connection hole 31 corresponding to the main power positive terminal 91; the main power negative electrode test point 71b is electrically connected with the connecting hole 31 corresponding to the main power negative terminal 92; the first main power output electrode test point 71c is electrically connected to the connection hole 31 corresponding to the main power first output terminal 93. Measuring the voltage of the switching tube on the first half-bridge through the main power positive electrode test point 71a and the first main power output electrode test point 71 c; the voltage of the first under-half bridge switching tube is measured through the main power negative electrode test point 71b and the first main power output electrode test point 71 c.
The drive voltage test points include a first half-bridge upper tube drive voltage test point 72a and a first half-bridge lower tube drive voltage test point 72 b. The first half-bridge upper tube driving voltage test point 72a is electrically connected with the connecting hole 31 corresponding to the first half-bridge upper tube driving terminal 95, and is positioned at one side of the connecting hole 31 and close to the connecting hole 31; the first under-bridge driving voltage test point 72b is electrically connected to the connection hole 31 corresponding to the first under-bridge driving terminal 96, and is located at one side of the connection hole 31 and close to the connection hole 31. Measuring the driving voltage of the switching tube on the first half-bridge through the tube driving voltage test point 72a on the first half-bridge; the drive voltage of the first half-bridge lower switching tube is measured through the first half-bridge lower tube drive voltage test point 72 b.
The shunt 8 is arranged in the middle area of the double-layer circuit board 1 and is arranged side by side with the decoupling module 5. One end of the shunt 8 is connected to the decoupling module 5, and the other end of the shunt 8 is connected to the connection hole 31 corresponding to the main power positive terminal 91 or the main power negative terminal 92. Specifically, one end of the shunt 8 is connected to one end of the decoupling module 5 connected to the dc bus interface negative electrode 22, for example, and the other end of the shunt 8 is connected to the connection hole 31 corresponding to the main power negative terminal 92; alternatively, one end of the shunt 8 is connected to one end of the decoupling module 5 connected to the dc bus bar interface positive electrode 21, for example, and the other end of the shunt 8 is connected to the connection hole 31 corresponding to the main power positive terminal 91. The shunt 8 is a coaxial shunt, which is convenient for an external oscilloscope to measure the current of the full-bridge power module.
Referring to fig. 4 and 5, the black shaded portion indicates the copper layer on the double-layer wiring board 1. The dc bus bar interface positive electrode 21 is connected to the positive electrode inductor interface 61 through the positive electrode copper layer 11 shown in fig. 4, the via array 13, and the positive electrode copper layer 11 shown in fig. 5, and is connected to the main power positive terminal 91. The direct current bus interface negative electrode 22 is connected with the bottom electrode of the shunt 8 through the negative electrode copper layer 12; the top electrode of the shunt 8 is connected to the main power negative terminal 92 through the power module side negative electrode copper layer 16. The top drive connection lead 14 connects together a first half-bridge top drive voltage test point 72a, a first half-bridge top drive interface 41a and a first half-bridge top drive terminal 95. A lower tube drive connection lead 15 connects together the first under-bridge drive voltage test point 72b, the first under-bridge drive interface 41b and the first under-bridge drive terminal 96. The power module output electrode copper layer 17 connects the main power first output terminal 93 and the first output electrode inductive interface 63 together. The surface-mounted decoupling capacitors in the decoupling sub-modules 511 connected in series are connected in series through the connecting copper layer 18, and are respectively connected in parallel with the surface-mounted resistors. The decoupling module 5 is connected across the positive electrode copper layer 11 and the negative electrode copper layer 12.
Referring to FIG. 6, a testing process of the dynamic test board of the present embodiment will be described. The needle terminals of the full bridge type power module to be tested are inserted into the connection holes 31 to mount the full bridge type power module on the dynamic test board. When testing the parameters of the lower switch tube of the first half-bridge, a test inductor is connected between the positive electrode inductor interface 61 and the first output electrode inductor interface 63, a lower tube driving voltage is connected in the first half-bridge lower tube driving interface 41b to provide two times of switching signals for the first half-bridge lower switch tube, when providing the first switching signal, the first half-bridge lower switch tube is conducted, the bus voltage is applied on the test inductor, the test inductor current rises, the current flowing on the first half-bridge lower switch tube when the first signal is finished is controlled by controlling the time of the first switching signal, when the first switching signal is finished, the test inductor current is transferred from the first half-bridge lower switch tube to the anti-parallel diode of the first half-bridge upper switch tube, the voltage between the main power negative electrode test point 71b and the first main power output electrode test point 71c is measured, the current is measured from the shunt 8, measuring the voltage of the first half-bridge lower tube driving voltage test point 72b to obtain a parameter when the first half-bridge lower switch tube is turned off under a certain current; then, the test inductance current flows through the anti-parallel diode of the switch tube on the first half bridge, the current is almost unchanged, when a second switching signal is provided, the switch tube under the first half bridge is conducted, the test inductance current is transferred from the anti-parallel diode of the switch tube on the first half bridge to the switch tube under the first half bridge, the current of the switch tube under the first half bridge rises from 0 to the current value when the first switching signal is finished, the voltage between the main power negative electrode test point 71b and the first main power output electrode test point 71c is measured, the current is measured from the shunt 8, the voltage of the first half bridge lower tube driving voltage test point 72b is measured, and the parameter of the switch tube under the first half bridge when the switch tube is switched on under a certain current is obtained. When testing the parameters of the upper switch tube of the full-bridge power module, a test inductor is connected between the negative electrode inductor interface 62 and the first output electrode inductor interface 63, a first half-bridge upper tube driving voltage is connected to the first half-bridge upper tube driving interface 41a, a voltage between the main power positive electrode test point 71a and the first main power output electrode test point 71c is measured, a current is measured from the shunt 8, a voltage of the first half-bridge upper tube driving voltage test point 72a is measured, parameters when the switch tube of the first half-bridge is turned off and parameters when the switch tube of the first half-bridge is turned on under a certain current are obtained, the specific test process and principle are similar to those of the switch tube of the first half-bridge, and the description is omitted here.
Fig. 7 is a schematic top layout structure of a dynamic test board for a pin-terminal full-bridge power module according to another embodiment of the invention. Referring to FIG. 7, the dynamic test board in the present embodiment is described in detail with reference to FIGS. 8-9.
When two half-bridge branches of the full-bridge power module are extremely asymmetric, the switching tubes on the two half-bridge branches need to be tested, and at the moment, the full-bridge power module is tested by using the dynamic test board in fig. 7 so as to guarantee the test accuracy and integrity.
Referring to fig. 7-8, unlike the dynamic test board shown in fig. 1, the driving module 4 of the dynamic test board in this embodiment includes two driving sub-modules 41. One of the driving sub-modules 41 includes a first half-bridge upper tube driving interface 41a and a first half-bridge lower tube driving interface 41b for driving the upper and lower switching tubes of the first half-bridge. The other driver sub-module 41 includes a second half-bridge upper tube driving interface 41c and a second half-bridge lower tube driving interface 41d for driving the upper and lower switching tubes of the second half-bridge. Second half-bridge upper tube drive interface 41c is connected to connection hole 31 corresponding to second half-bridge upper tube drive terminal 97, and second half-bridge lower tube drive interface 41d is connected to connection hole 31 corresponding to second half-bridge lower tube drive terminal 98, as shown in fig. 9. The inductor access module 6 further comprises a second output electrode inductor interface 64 for connecting the test inductor of the second half-bridge branch.
Unlike the dynamic test board shown in fig. 1, in this embodiment, the main power test point further includes a second main power output electrode test point 71d for testing the voltages of the upper and lower tubes of the second half-bridge; the driving voltage test points further include a second half-bridge upper tube driving voltage test point 72c and a second half-bridge lower tube driving voltage test point 72d for testing the driving voltage of the second half-bridge upper and lower tubes. Second main power output electrode test point 71d is connected to connection hole 31 corresponding to main power second output terminal 94, second half-bridge upper tube driving voltage test point 72c is connected to connection hole 31 corresponding to second half-bridge upper tube driving terminal 97, and second half-bridge lower tube driving voltage test point 72d is connected to connection hole 31 corresponding to second half-bridge lower tube driving terminal 98, as shown in fig. 9.
Other structures in the dynamic test board in this embodiment are the same as the corresponding structures in the embodiment shown in fig. 1, and the testing process of the upper and lower switching tubes of each half-bridge branch is the same as the testing process of the upper and lower switching tubes of the first half-bridge branch in the embodiment shown in fig. 1, which is not described herein again.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (8)
1. A dynamic test board for a needle-shaped terminal full-bridge type power module is characterized in that the dynamic test board comprises a direct current bus interface (2), a connecting module (3), a driving module (4), a decoupling module (5), an inductance access module (6) and a test module (7), wherein the direct current bus interface, the connecting module, the driving module, the decoupling module and the inductance access module are arranged on a double-layer circuit board (1);
the connecting module (3) is arranged on the outlet side of the double-layer circuit board (1) and comprises a plurality of connecting holes (31), and the connecting holes (31) correspond to the needle-shaped terminals one by one;
the decoupling module (5) comprises a plurality of decoupling branches (51) connected in parallel, each decoupling branch (51) comprises a plurality of decoupling sub-modules (511) connected in series, each decoupling sub-module (511) is formed by connecting one or more surface-mounted decoupling capacitors and one surface-mounted resistor in parallel, two ends of the decoupling module (5) are respectively connected with connecting holes (31) corresponding to a main power positive terminal (91) and a main power negative terminal (92), and the distance between the decoupling module (5) and the connecting holes (31) connected with the decoupling module is smaller than a preset threshold;
the direct current bus interface (2), the driving module (4), the inductance access module (6) and the testing module (7) are electrically connected with the corresponding connecting holes (31) of the needle-shaped terminals respectively.
2. The dynamic test board for the full-bridge power module with needle terminals according to claim 1, characterized in that said dc bus bar interface (2) is located at the inlet of said double-layer circuit board (1) and is connected to a dc bus bar provided with an electrolytic capacitor having a capacitance value greater than a first preset value.
3. The dynamic test board for the full-bridge power module with the needle-shaped terminals according to claim 1, wherein the surface-mounted decoupling capacitors and the surface-mounted resistors are located in a middle area of the double-layer circuit board (1), the resistance values of the surface-mounted resistors in the same decoupling branch (51) are equal, and the resistance value of the surface-mounted resistor is greater than a second preset value.
4. The dynamic test board for a pin terminal full-bridge type power module according to claim 1, wherein said test board further comprises:
the shunt (8) is arranged in the middle area of the double-layer circuit board (1), one end of the shunt (8) is connected to the decoupling module (5), and the other end of the shunt (8) is connected to a connecting hole (31) corresponding to the main power positive terminal (91) or the main power negative terminal (92).
5. The dynamic test board for full-bridge power modules with pin terminals according to claim 4, characterized in that said shunt (8) is a coaxial shunt.
6. The dynamic test board for needle terminal full-bridge power modules according to claim 1, wherein the driving module (4) comprises a driving submodule (41), and the driving submodule (41) is arranged on one side of the connecting hole (31) corresponding to the driving terminal of any half bridge in the full-bridge power module (9).
7. The dynamic test board for needle terminal full-bridge power modules according to claim 1, characterized in that the driving module (4) comprises two driving submodules (41), the two driving submodules (41) are respectively arranged at one side of the connecting holes (31) corresponding to the driving terminals of the two half-bridges in the full-bridge power module (9).
8. The dynamic test board for full-bridge power modules with pin terminals according to claims 1-7, characterized in that the connection holes (31) are provided with spring seats cooperating with the pin terminals.
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