CN114072444A - 固化性组合物、固化物、外涂膜以及柔性配线板和其制造方法 - Google Patents

固化性组合物、固化物、外涂膜以及柔性配线板和其制造方法 Download PDF

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Publication number
CN114072444A
CN114072444A CN202080049496.5A CN202080049496A CN114072444A CN 114072444 A CN114072444 A CN 114072444A CN 202080049496 A CN202080049496 A CN 202080049496A CN 114072444 A CN114072444 A CN 114072444A
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CN
China
Prior art keywords
component
curable composition
group
polymer
wiring board
Prior art date
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CN202080049496.5A
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English (en)
Chinese (zh)
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CN114072444B (zh
Inventor
大贺一彦
石桥圭孝
山本龙之介
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Japan Poly Co
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Japan Poly Co
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515Three-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
CN202080049496.5A 2019-07-08 2020-05-29 固化性组合物、固化物、外涂膜以及柔性配线板和其制造方法 Active CN114072444B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-126907 2019-07-08
JP2019126907 2019-07-08
PCT/JP2020/021411 WO2021005913A1 (ja) 2019-07-08 2020-05-29 硬化性組成物、硬化物、オーバーコート膜、並びにフレキシブル配線板及びその製造方法

Publications (2)

Publication Number Publication Date
CN114072444A true CN114072444A (zh) 2022-02-18
CN114072444B CN114072444B (zh) 2024-07-09

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CN202080049496.5A Active CN114072444B (zh) 2019-07-08 2020-05-29 固化性组合物、固化物、外涂膜以及柔性配线板和其制造方法

Country Status (5)

Country Link
JP (1) JP7521814B2 (ko)
KR (1) KR20220033490A (ko)
CN (1) CN114072444B (ko)
TW (1) TWI753456B (ko)
WO (1) WO2021005913A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007131833A (ja) * 2005-10-13 2007-05-31 Hitachi Chem Co Ltd 変性エポキシ樹脂及びその製造方法、並びに、感光性樹脂組成物及びこれを用いた感光性エレメント
CN102741351A (zh) * 2010-02-03 2012-10-17 昭和电工株式会社 热固性组合物
TW201807062A (zh) * 2016-03-30 2018-03-01 東洋油墨Sc控股股份有限公司 樹脂組成物及電子元件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000171973A (ja) 1998-12-08 2000-06-23 Ngk Spark Plug Co Ltd 感光性樹脂組成物及びソルダーレジスト用感光性樹脂組成物
AU2003221053A1 (en) 2002-03-29 2003-10-27 Taiyo Ink Manufacturing Co., Ltd. Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof
JP5537566B2 (ja) * 2009-12-14 2014-07-02 太陽ホールディングス株式会社 ソルダーレジストインキ組成物及びその硬化物
CN108368336B (zh) * 2015-12-25 2021-09-10 日保丽公司 固化性组合物、固化物、外涂膜、覆盖柔性配线板及其制造方法
KR102265094B1 (ko) 2016-03-23 2021-06-15 한국공항공사 로드 블럭 및 이를 포함하는 차량 차단 시스템

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007131833A (ja) * 2005-10-13 2007-05-31 Hitachi Chem Co Ltd 変性エポキシ樹脂及びその製造方法、並びに、感光性樹脂組成物及びこれを用いた感光性エレメント
CN102741351A (zh) * 2010-02-03 2012-10-17 昭和电工株式会社 热固性组合物
TW201807062A (zh) * 2016-03-30 2018-03-01 東洋油墨Sc控股股份有限公司 樹脂組成物及電子元件

Also Published As

Publication number Publication date
TWI753456B (zh) 2022-01-21
TW202106740A (zh) 2021-02-16
CN114072444B (zh) 2024-07-09
JPWO2021005913A1 (ko) 2021-01-14
KR20220033490A (ko) 2022-03-16
JP7521814B2 (ja) 2024-07-24
WO2021005913A1 (ja) 2021-01-14

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