CN114055006B - 无铅焊柱及其制造方法 - Google Patents

无铅焊柱及其制造方法 Download PDF

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CN114055006B
CN114055006B CN202110741461.4A CN202110741461A CN114055006B CN 114055006 B CN114055006 B CN 114055006B CN 202110741461 A CN202110741461 A CN 202110741461A CN 114055006 B CN114055006 B CN 114055006B
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solder
post
inner core
outer sleeve
welding
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CN114055006A (zh
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马丁·B·哈特
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Topline Corp
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Topline Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Abstract

本文公开了无铅(无Pb)或含铅焊柱器件的实施例，所述器件可包括内芯、围绕所述内芯的一部分的外套管、沿所述外套管的长度的至少一个空间以及第二层，所述第二层包括在所述至少一个空间内与所述内芯的一部分结合的焊料。所述内芯可以被配置为支撑焊柱，以防止焊柱在温度高于所述外套管的焊料和所述第二层的焊料的液相线温度时坍塌。该柱用作散热器以将过多的热量从发热的半导体芯片传导走。此外，柔性焊柱吸收由将半导体芯片连接到印刷电路板(PCB)的热膨胀系数(CTE)差异引起的应变和机械应力。

Description

无铅焊柱及其制造方法
技术领域
本公开的实施例一般地涉及新颖的焊柱结构，包括新颖的无铅焊柱结构，及其制造方法。
背景技术
通常，金属间连接形成在多个焊柱和平面网格阵列(land grid array，LGA)基板上的导电垫之间。最初，施加一层焊膏以覆盖所述LGA上的导电垫阵列。加热后，焊膏在导电垫上回流，产生焊柱和LGA上的导电垫之间的金属间连接。LGA基板材料可由陶瓷、塑料或硅材料组成。回流过程完成后，带有焊柱的LGA在本领域中被称为柱栅阵列(column gridarray，CGA)或陶瓷柱栅阵列(ceramic column grid array，CCGA)。通常，随着电子设备和集成电路封装的密度不断增加，CGA器件上的焊柱的数量可在4到10000个或更多的范围内。
CGA柱栅阵列器件的替代方案是球栅阵列(ball grid array，BGA)器件。BGA器件包含焊球(球)阵列，以在BGA基板上的导电垫和印刷电路板(PCB)之间提供电连接。在本领域中，由陶瓷材料(例如氧化铝或Al2O3)构成的BGA基板被称为陶瓷球栅阵列(ceramic ballgrid array，CBGA)。在恶劣的环境中或存在过多的热量和功率时，通常需要陶瓷基板。
然而，BGA器件的一个潜在问题是在BGA基板和PCB之间会存在热膨胀系数(CTE)的显著差异。当大尺寸BGA基板附接到由塑料玻璃纤维材料如FR-4或其他层压材料(在本领域中称为有机基板或有机PCB)制成的PCB时，CTE差异的潜在问题通常会变得更成问题。热膨胀系数的这种差异会导致将BGA器件和PCB互连的焊球变形。随着时间的推移，由于CTE失配问题，焊球和金属基板垫之间的电连接会在大尺寸有机BGA基板和塑料玻璃纤维的PCB之间断开。
发明内容
作为减小半导体封装的尺寸和质量的一种方式，应将注意力放在开发解决方案上，该解决方案可以通过导热柱从发热的半导体芯片的下侧传递热量，而无需在此类CGA封装的顶部增加体积和重量。
因此，需要更好的焊柱设计来克服这些缺点和限制中的每一个。特别是，需要一种更稳健可靠的方法和结构来保持焊柱的柱状形状和结构完整性，同时满足RoHS指令对使用无铅(无Pb)材料的要求。此外，需要一种柔性柱结构用于吸收由CTE失配引起的机械应力，以最小的失真传导电信号，并使用无铅(无Pb)材料将热量从CGA基板的下侧通过柱芯热传导到印刷电路板的接地层中。本发明实施例针对上述需求提供了解决方案。下面将更详细地描述这些实施例的细节。
在此公开了焊柱结构以及制造这种结构的方法的实施例，该焊柱结构可被配置为避免柱栅阵列(CGA)在回流期间的灾难性坍塌。本文公开的任何焊柱实施例可以具有金属芯，该金属芯可以将更多热量从CGA基板的下侧通过柱传导至印刷电路板的接地层。
本文公开了焊柱器件的实施例，所述焊柱器件可以包括：具有外表面的内芯；围绕所述内芯的外表面的一部分并包括焊料的外套管；沿所述外套管的长度的至少一个空间，其中所述内芯的外表面未被所述外套管覆盖；以及第二层，包括在所述至少一个空间内与所述内芯的外表面的一部分结合的焊料。在一些实施例中，所述内芯可被配置为至少在所述焊柱的轴向方向上支撑所述焊柱，以防止所述焊柱在温度高于所述外套管的焊料和所述第二层的焊料的液相线温度时坍塌。此外，在一些实施例中，所述内芯可以包括导电金属材料。
本文公开的焊柱器件的任何实施例在另外的实施例中与本文公开的任何其他实施例的任何其他特征、组件和/或细节的任何组合可以包括一个或多个以下特征、组件和/或细节：其中焊柱是无铅的；其中大直径为约0.10mm(0.004英寸)至约0.50mm(0.020英寸)；其中小直径为约0.05mm(0.002英寸)至约0.25mm(0.010英寸)；其中焊柱可以被配置成使得当套管结构材料处于塑性熔融状态时，焊柱材料将与LGA/CGA和/或印刷电路板的导电垫形成粘结，而所述焊柱不坍塌；和/或其中焊柱的第一端被配置为当焊膏的温度超过所述焊膏的液相线温度时利用所述焊膏与LGA/CGA和/或印刷电路板的导电垫形成粘结。
内核：
本文公开的焊柱器件的任何实施例在另外的实施例中与本文公开的任何其他实施例的任何其他特征、组件和/或细节的任何组合可以包括一个或多个以下特征、组件和/或细节：其中内芯的熔点高于外套管的焊料和第二层的焊料的液相线温度；其中内芯可被配置为在温度高于外套管的焊料和第二层的焊料的液相线温度时不坍塌；其中内芯包括铜；其中内芯具有大致圆柱形的形状；其中内芯由线材(wire material)制成；其中外套管和第二层中的每一个都具有小于内芯的直径的径向厚度；其中内芯包括无铅材料；其中焊柱的大直径等于或大于内芯的直径的两倍；其中内芯具有约0.05mm(0.002英寸)至约0.25mm(0.010英寸)的直径；其中焊柱的小直径大于或约等于内芯的直径；其中焊柱可被配置成使得内芯的外表面至少相当地被外套管和第二层完全覆盖；其中焊柱可被配置成使得内芯的外表面完全被外套管和第二层覆盖；其中内芯还被配置为改善通过焊柱的热传导；和/或其中内芯包括铜、金、银、锡、铂、钯或铍铜中的至少一种。
空间：
此外，本文公开的焊柱器件的任何实施例在另外的实施例中与本文公开的任何其他实施例的任何其他特征、组件和/或细节的任何组合可以包括一个或多个以下特征、组件和/或细节：其中至少一个空间沿着内芯的整个长度延伸；其中至少一个空间沿着内芯的整个长度围绕内芯的外表面螺旋地延伸；其中至少一空间在焊柱的轴向方向上具有的高度小于内芯的直径；其中外套管中至少一个空间具有约0.05mm(0.002英寸)至约0.25mm(0.010英寸)的高度；其中至少一个空间包括沿外套管的长度的多个空间；其中至少一个空间可被配置为向焊柱提供附加的柔性以提高焊柱吸收应力的能力，该应力由通过焊柱互连的基板之间热膨胀系数的失配引起；和/或其中内芯在回流期间不坍塌。
外套管和第二层：
此外，本文公开的焊柱器件的任何实施例在另外的实施例中与本文公开的任何其他实施例的任何其他特征、组件和/或细节的任何组合可以包括一个或多个以下特征、组件和/或细节：其中外套管围绕内芯的外表面的大部分；其中外套管以一定间距围绕内芯的外表面螺旋状地延伸，该间距提供沿着外套管的长度的至少一个空间；其中外套管的径向厚度为约0.025mm(0.001英寸)至约0.125mm(0.005英寸)；其中外套管和第二层中的至少一个包括无铅合金材料或含铅合金材料；其中外套管和第二层中的至少一个包括以下中的至少一种：无铅合金SCN305、无铅合金Sn96.5/Cu3.0/Ni0.5、无铅合金Sn96.5/Cu3.5、无铅合金Sn平衡/Cu1.0-5.0/Ni0.1-2.0、含铅合金Pb80/Sn20、含铅合金Pb85/Sn15、含铅合金Pb90/Sn10、含铅合金Pb平衡/Sn5-20、以及含铅合金Pb93.5/Sn5/Ag1.5；其中所述第二层还覆盖外套管的外表面的至少一部分；其中第二层还完全覆盖外套管的外表面；和/或其中第二层包括以下中的至少一种：Sn96.5/Ag3.0/Cu0.5、Sn平衡/Cu0.6-0.8/Ag0.5-0.7/Bi1.8-2.0、Sn平衡/Cu0.6-0.8/Ag2.8-2.9/Bi2.5-2.9/Sb0.5-0.7/Ni0.04-0.06、Sn平衡/Ag3.5/Bi0.5/In8.0、Sn平衡/Ag3.5/Bi0.5/In4.0、Sn平衡/Cu0.7/Ni0.05/Ge<0.010、Sn100C的无铅合金、或Sn63/Pb37或Sn62/Pb36/Ag2的含铅合金。
本文还公开了用于将电子元件安装至印刷电路板的焊柱的实施例，包括：内芯，包括具有第一液相线温度的第一材料；外套管，包围所述内芯的外表面的至少大部分，所述外套管包括具有第二液相线温度的第二材料；以及在所述外套管的段之间沿着所述内芯的至少一侧的长度的多个空间。在一些实施例中，所述焊柱可被配置成使得所述内芯将支撑所述外套管并防止所述外套管在温度高于所述外套管的液相线温度时坍塌。此外，在一些实施例中，这些空间可被配置为向所述焊柱提供附加的柔性，以提高所述焊柱吸收应力的能力，所述应力由与所述焊柱的第一端结合的第一基板和与所述焊柱的第二端结合的第二基板之间的热膨胀系数的失配引起。
本文公开的焊柱器件的任何实施例在另外的实施例中与本文公开的任何其他实施例的任何其他特征、组件和/或细节的任何组合可以包括一个或多个以下特征、组件和/或细节：还包括第二层，该第二层包括在多个空间内与内芯的外表面的结合的焊料；其中焊柱的最大直径至少等于或大于内芯的直径的两倍；焊柱的最小直径不小于内芯的直径；其中套管结构中多个空间中的每一个具有小于或约等于或不大于内芯的直径的两倍的高度；其中外套管的径向厚度小于内芯的直径；和/或其中外套管沿着内芯的长度的至少相当一部分螺旋地延伸。
一些实施例包括改进的柱栅阵列(CGA)焊柱，其包括由柔性无铅焊料合金外套管结构包裹的导电金属内芯(例如铜)。该内芯可以被配置成使得其将支撑焊料合金外套管以防止焊柱在温度超过将焊柱连接至半导体芯片基板及PCB的焊膏的液相线温度时坍塌。可选地，多个相邻的铜芯焊柱排列成阵列，作为散热片将多余的热量从与焊柱相连的发热半导体芯片传导走，同时将这些热量传递到印刷电路板(PCB)的接地层。此外，柔性焊料合金套管结构提供柔性以吸收由发热半导体芯片和印刷电路板之间的不兼容材料的热膨胀系数(CTE)的差异引起的应变和机械应力。
本文公开的改进的焊柱的一些实施例被配置为提供机械柔性、导电和导热的结构，以在将半导体模块连接至印刷电路板时用作互连。在任何实施例中，内芯(在任何实施例中可以是金属的)可以被柔性套管包围，该套管可以包括通过用可湿性无铅(无Pb)焊料合金涂覆整个结构而结合在一起的无铅(无Pb)焊料合金材料。有利地，在正常焊接温度下的回流期间，柱的端部可以液化而焊柱不坍塌。这可以有利地与润湿在模块的金属垫以及其次与印刷电路板上的金属垫上的焊膏形成扩散的金属间连接。本文公开的任何焊柱实施例还可由含铅材料制成或包括含铅材料。本文公开的焊柱还可以在使用或不使用焊膏的情况下，可选地仅使用焊点预成型件与粘性助焊剂(Tacky Flux)一起，将焊柱附接至LGA/CGA封装和印刷电路板。
本文还公开了焊柱器件的实施例，其可以包括改进的焊柱，该焊柱包括由诸如铜、金、银、锡、铂和/或钯或铍铜合金材料的导电金属制成的圆柱形内芯以及围绕导电金属芯的外表面的至少大部分的外部焊料合金套管结构，其中外部焊料合金套管被配置成使得内部金属芯将支撑该外部焊料合金套管以抑制(例如防止)整个焊柱在温度超过润湿在模块的金属垫以及其次印刷电路板上的金属垫上的焊膏的液相线温度时坍塌。
本文公开的焊柱器件的任何实施例在另外的实施例中与本文公开的任何其他实施例的任何其他特征、组件和/或细节的任何组合可以包括一个或多个以下特征、组件和/或细节：其中金属芯的直径不超过整个焊柱的总直径的60％；其中金属芯的直径不小于整个焊柱的总直径的30％；其中焊柱的整体形状近似为圆柱或柱状；其中柱的总长度至少为柱的总直径的2.5倍，且柱的长度不超过柱的总直径的9.0倍；其中内部金属芯具有约0.050mm(0.002英寸)至约0.250mm(0.010英寸)的直径；其中焊料合金套管的径向厚度为约0.025mm(0.001英寸)至约0.200mm(0.008英寸)；其中焊柱被配置成使得当焊膏处于熔融状态时，柱材料将与LGA/CGA和/或印刷电路板的导电垫形成粘结，而柱不坍塌；其中金属芯还被配置为改善通过焊柱的热传导；其中焊柱被配置成使得当温度超过焊膏或焊点的液相线温度时，来自外焊料套管的焊料将与施加到LGA/CGA和/或印刷电路板的导电垫的焊膏或焊点预成型件形成粘结；其中金属芯的至少一部分与外部焊料套管形成金属间粘结；其中金属芯包括铜、金、银、锡、铂、钯或铍铜合金中的至少一种；其中焊柱具有矩形或圆形的横截面；其中外焊料套管大约围绕焊料芯的整个长度；其中外焊料套管上的多个空间部分或全部充满焊料；其中柱的外套管的径向边界可变化为与柱的大直径一样大或可与柱的小直径一样小；和/或其中套管中的螺旋空间、狭缝或狭槽被配置为向焊柱提供附加的柔性，以提高焊柱吸收应力的能力，所述应力由通过焊柱连接互连的基板之间热膨胀系数的失配引起的。
本文还公开了一种电子系统的实施例，其包括一个或多个印刷电路板，该印刷电路板具有多个焊柱，该焊柱具有本文公开的任何焊柱实施例的任何特征、部件和/或细节。本文还公开了一种电子系统的实施例，其包括具有多个焊柱的印刷电路板，该焊柱与印刷电路板结合并具有本文公开的任何焊柱实施例的任何特征、部件和/或细节。本文还公开了包括多个焊柱的平面网格阵列的实施例，该焊柱具有本文公开的任何焊柱实施例的任何特征、部件和/或细节。本文还公开了包括多个焊柱的陶瓷柱栅阵列的实施例，该焊柱具有本文公开的任何焊柱实施例的任何特征、部件和/或细节。本文还公开了包括多个焊柱的有机基板柱栅阵列的实施例，该焊柱具有本文公开的任何焊柱实施例的任何特征、部件和/或细节。
附图说明
图1A是焊柱的实施例的透视图，该焊柱包括在内芯和外套管已浸入液化焊料之后被外套管包围的内芯。
图1B是焊柱的实施例的透视图，该焊柱包括在内芯和外套管已浸入液化焊料之前被外套管包围的内芯。
图2A是图1A所示焊柱实施例的侧视图。
图2B是图1A的焊柱实施例的俯视图。
图2C是图2B的焊柱实施例的放大俯视图。
图3是图1A的焊柱实施例沿图2C的线3-3截取的截面透视图。
图4是图3的截面图的一部分的放大图。
图5A是图1B所示的内芯的实施例的透视图。
图5B是图5A所示的内芯通过内芯的轴向中心线截取的截面图。
图6A是图1A所示的焊柱在将该柱的一端回流至LGA/CGA基板的导电垫后的透视图。
图6B是图6A所示的焊柱实施例在将该柱的另一端也回流至PCB印刷电路板上的导电垫之后的透视图。
图7A是图6B所示的焊柱实施例附接至LGA/CGA基板和PCB的正面截面图。
图7B是图6B中所示的焊柱实施例的截面的透视截面图。
图8示出了可用于本文公开的任何焊柱实施例中和/或用于焊膏以可选地将此类焊柱实施例回流至LGA/CCGA基板上的导电垫和/或印刷电路板上的导电垫的可选材料表。
图9示出了本文公开的任何焊柱实施例的不同尺寸以及与焊柱实施例组合使用的LGA/CGA和/或印刷电路板上的导电垫的一些实施例的可选尺寸的示例。
具体实施方式
CTE失配问题已通过使用圆柱形焊柱代替焊球作为模块基板和PCB之间的电气互连得到解决。传统上，带有锡铅(Sn-Pb)芯的圆柱形焊柱倾向于应用于军事、航空航天和国防领域且通常具有约0.50mm(0.020英寸)的直径和约2.2mm(0.087英寸)的高度。然而，用于包括大功率计算机服务器、人工智能(Ai)、5G无线通信和微电子在内的商业(非国防)应用领域的焊柱一般直径可能小至0.10mm(0.004英寸)或直径超过0.50mm(0.020英寸)。此外，商业应用中使用的焊柱长度可能短至0.25mm(0.010英寸)或长至4.5mm(0.177英寸)或更多。此外，商业(非国防)相关应用领域需要使用无铅(无Pb)材料，以满足源自欧盟和世界其他立法机构的有害物质限制指令(RoHS)。
在将多个焊柱附接至LGA基板之前，LGA基板上的导电垫通常被覆盖有受控厚度的焊膏。在某些情况下，由诸如Sn63/Pb37的锡铅合金组成的焊膏可更适合航空航天、军事和国防工业领域的应用。然而，在商业领域，无铅(无Pb)焊膏合金，如SAC305(Sn96.5/Ag3.0/Cu0.5)、或其他含有锡(Sn)、银(Ag)、铜(Cu)、镍(Ni)、锗(Ge)、铋(Bi)、铟(In)和其他掺杂剂或添加剂的合金，可用于需要无铅(无Pb)材料的应用。
焊柱通常垂直地垂直定位在LGA基板上的相应导电垫阵列上。然后通常将基板连同高温焊柱和一层低温焊膏一起加热，使焊膏回流焊以在焊柱和LGA导电垫之间形成金属间填角连接，而不熔化或损坏焊柱。附接有焊柱的完整封装在本领域中被称为柱栅阵列(CGA)或陶瓷柱栅阵列(CCGA)封装。
通常需要二次程序将CGA封装安装至PCB上。CGA封装与PCB连接的过程需要CGA再次回流，而焊柱不熔化或坍塌。可以将低温熔化焊膏的受控层施加到PCB上相应的多个接触垫。CGA封装可以放置在PCB上覆盖焊膏的垫上。PCB连同一个或多个CGA封装(以及其他组件)然后可以被加热和回流，这可以产生将CGA焊柱保持至PCB的金属间填角。
传统工艺已经将重点放在通过选择与焊膏的熔化开始相比具有更高熔点的柱材料以避免在回流过程中垂直定位的柱的坍塌，该焊膏润湿柱并将柱连接至CGA封装和PCB的金属垫。在传统设计中，通常将重且体积大的散热器安装在CGA封装的顶部，作为将热量从CGA传导走的补救措施。
本文公开了改进的焊柱(可以是无铅的)和用于制造改进的焊柱的方法的实施例。本文公开的改进的焊柱或焊柱结构可以吸收由在计算机服务器中使用的柱栅阵列(CGA)集成电路模块之间传递电信号和传导热量的配合或邻接材料或部件的热膨胀系数(CTE)的差异引起的机械应力。当将微电子封装接合至印刷电路板上的相应金属垫时，本文公开的改进的焊柱或焊柱结构还可以在陶瓷、有机或硅基板上以阵列图案提供互连。本文公开的任何实施例可以被配置成使得焊柱可以在回流期间用焊膏结合至LGA和印刷电路板上的金属垫。
焊柱的第一次附接通常是到LGA部件外壳基板、模块、硅芯片或硅晶片上的导电(金属化)垫，在本领域中通常称为“第一级”(或级别1)附接。在第一级附接完成之后，在一些实施例中，数天、数周、数月甚至数年之后，将CGA电子部件外壳基板(连同先前安装的焊柱)附接至PCB。这在本领域中被称为“第二级”(或级别2)附接。在第二级附接期间，柱内和柱周围的焊料再次暂时液化(回流)。冷却固化后，将柱的一端焊接至LGA/CGA基板，将柱的另一端焊接至PCB。以上描述了典型的附接柱的两步焊接过程。
如将更详细地描述的，本文公开的任何焊柱10实施例可以具有改进的内芯22(在本文中也称为芯)和/或外套管32，其能够被配置为增加焊柱的强度和完整性，使得在柱回流到LGA的期间以及其次当CGA基板回流至印刷电路板时，焊柱可以保持足够的机械、电和热完整性，而不坍塌。此外，本文公开的柱结构可以可选地被配置为吸收由热膨胀系数(CTE)失配引起的机械应力，以最小的失真传导电信号，并通过内芯从CGA基板的下侧将热量热传导至PCB印刷电路板的接地层。如上所述，此类部件可由含铅或无铅材料制成。
本文公开的一些焊柱10实施例包括与内芯22集成的外焊料合金套管32结构，该内芯22被配置为避免在回流期间LGA/CGA的灾难性坍塌。本文公开的焊柱10实施例中的至少一些被配置为实现在回流期间很少或没有坍塌。如图1B所示，外套管32可以在柱10的第一端10a和柱10的第二端10b之间延伸。在其他实施例中，外套管32可以仅部分地在柱10的第一端10a和柱10的第二端10b之间延伸，例如但不限于仅延伸柱10的长度的90％(或约90％)或柱10的长度的80％(或约80％或小于80％)至95％(或大约95％或超过95％)。
本文公开的任何实施例的外套管32可以被配置为允许柱包括易于获取的合金，这些合金可以回流以通过柱结构将LGA/CGA粘结至印刷电路板，而不导致柱在温度超过浸入LGA基板和/或PCB上的焊膏材料的液相线温度时坍塌的后果。例如但不限于，在本文公开的任何实施例中，外套管32可包括任何无铅材料或由任何无铅材料制成，所述无铅材料例如缩写为SCN305的Sn96.5/Cu3.0/Ni0.5。替代地，外套管32的任何实施例可包括重量约80％以上的铅(Pb)和剩余重量的锡(Sn)(例如，Pb90/Sn10、Pb85/Sn15、Pb80/Sn20、Pb93.5/Sn5/Ag1.5等)或图8中所示的任何材料的任何非限制性组合的含铅焊料合金。
不可坍塌的柱体避免了当LGA基板和印刷电路板之间的间距改变时通常遇到的阻抗和工作频率变化(失谐)问题。另外，本文公开的一些实施例涉及：用于构造外套管结构的方法和装置，该外套管结构连接到内芯(可以是但不是必须是金属的)的表面中，减小套管和内芯之间由氧化和污染所引起的电阻累积；以及用于构造具有外套管的焊柱的方法，该外套管在回流期间使用焊膏将CGA电连接和粘结至PCB，且在LGA/CGA和印刷电路板之间具有最大的导电性和最小的电阻。
任何实施例的柱10可具有图9的表中所示的任何值或近似任何值的大直径D10(至焊柱10的外表面10c)，如图2A所示。
图9是本文公开的焊柱10的任何实施例的尺寸表，包括本文公开的焊柱10的任何实施例的大直径D10、本文公开的焊柱10的任何实施例的小直径D42、本文公开的焊柱10的任何实施例的内芯22的直径D22、本文公开的焊柱10的任何实施例的外套管32的径向厚度T32、以及CGA基板80的导电垫70的直径和PCB 81的导电垫71的直径。
大直径D10是在柱10已经浸入焊浴中之后柱10的外表面的直径并且焊柱10具有焊料的外层44(也称为外焊层)。因此，在一些实施例中，柱10的大直径D10可以等于芯22的直径加上外套管32的径向厚度T32(如图4所示)的两倍加上外焊层44的径向厚度T44(如图4所示)的两倍。在一些实施例中，外焊层44的径向厚度T44可根据诸如熔融焊浴中焊柱的角度和焊柱在熔融焊浴中的时间之类的因素而变化，甚至可按焊柱上的位置而变化。例如但不限于，焊柱10的一些实施例可以具有约0.005mm(或在一些实施例中更小)至约0.025mm(或在一些实施例中更大)的径向厚度T44。
例如但不限于，在一些实施例中，柱10可具有0.10mm(或约0.10mm或小于0.10mm)至0.50mm(或约0.50mm或大于0.50mm)的大直径D10，或其间的任何值或值范围的大直径D10，或适用于使用焊柱10的应用的任何值的大直径D10。在一些实施例中，柱10的大直径D10可以受到CGA封装上导电垫70的螺距(间距)以及PCB上导电垫71的直径的限制，如图6A、6B、7A和7B所示。图6A是图2A所示的焊柱实施例的透视图，该焊柱具有附接至所示的LGA/CGA基板的金属垫70的焊填角60。图6B是图6A中的焊柱实施例的透视图，该焊柱具有附接至PCB的金属垫71的焊填角61。图7A是图1A所示的焊柱10实施例在将柱10的一端回流并连接至LGA/CGA基板80上的导电垫70之后的截面图，该焊柱具有填角60。可通过将受控厚度的焊膏施加到导电垫70上，然后在高于垫70上的焊膏的液相线温度回流柱结构来形成填角60。在一些实施例中，在实际实践中，当焊料加热并回流到柱10的端部周围时，来自填角60的焊料可能不均匀地流动。此外，填角60中的焊料可以沿柱的端部向上或向下蠕变。焊料60的一些可能流入或流过焊料填充物42和/或可能在一侧比另一侧流动得更多。换言之，当焊料已经冷却和固化时，焊料42、44、60和61可能不像图中所示那样对称。图7A所示的焊柱10实施例的另一端可以回流到印刷电路板81上的导电垫71，并具有将柱状结构接合到印刷电路板上的导电垫71的填角61。通过将受控厚度的焊膏施加到导电垫71上，然后在高于垫71上焊膏的液相线温度回流柱状结构，可以形成填角61。图7B(为清楚起见，无LGA/CGA基板80且无印刷电路板81)是图7A的透视截面图。
如上所述，参照图1B，本文公开的焊柱10的任何实施例可包括由外套管32围绕的内芯22。芯22可具有第一端22a和第二端22b，并且在一些实施例中可具有圆柱形或大体上圆柱形，如图5A至图5B所示，它们分别是芯22的实施例的透视图和截面图。
本文公开的任何实施例的内芯22可具有沿着内芯22的表面和/或在内芯22表面上的接合处，将芯22连接至焊料外套管32，以便使柱10的实施例更坚固。换言之，焊柱10的一些实施例可被配置成使得熔融焊料可流入外套管32与内芯22的外表面22c之间的空间以将外套管32粘结或结合至内芯22。在一些实施例中，可以在内芯22的外表面22c和外套管32的内表面之一或两者中形成通道或凹槽，以允许熔融焊料将外套管32的部分粘结或结合至内芯22。这种配置的一些实施例可以通过柱10的内芯22将更多的热量从CGA基板80的下侧传导至印刷电路板81的与垫71连接的接地层。将更多热量从CGA基板80传导走的好处可以包括但不限于通过在与环境相比较低的温差下操作来延长容纳在CGA中的硅芯片系统的寿命。一般地，过热可导致硅芯片的寿命缩短。从CGA封装80的底侧通过柱10的内芯22传导热量可以潜在地减小传统安装在常规CGA封装的顶侧上的重型散热器的尺寸、质量和重量。
在本文公开的任何实施例中，内芯22可以是金属的。此外，在本文公开的任何实施例中，内芯22可以是圆柱形的。在一些实施例中，内芯22可由线材形成。在本文公开的任何实施例中，芯22可由圆柱形金属线形成或包括圆柱形金属线。在本文公开的任何实施例中，芯22可由铜、金、银、锡、铂、钯、铍-铜和/或重量小于约1％的可选的其他添加剂或掺杂剂的任何组合、或任何其他合适的材料或其组合或合金制成。
图3是图2A的截面图，示出了焊柱10的第一端面10a和焊柱10的第二端面10b之间的内部圆柱形金属芯22。如图3所示，芯22可具有截面尺寸或直径D22。芯22的任何实施例的直径D22的非限制性示例在图9的表中示出。此外，并非限制地，本文公开的芯22的任何实施例可具有焊柱的直径D10的约30％至焊柱的直径D10的约60％或任何前述范围内的任何值或任何值范围的直径D22。
参考图1B，外套管32可具有螺旋形状或大体螺旋形状并且可具有足以导致在外套管32的相邻段之间形成空间40的螺距或角度。在任何实施例中，外套管32可具有图9的表中所示的任何值或近似图9的表中所示的任何值的高度H32。此外，并非限制地，外套管32的一些实施例可具有大于焊柱10的总高度H10的5％(或约5％)至焊柱10的总高度H10的40％(或约40％，或小于40％)、或在任何前述范围内的任何值或任何值范围的高度H32。
在一些实施例中，外套管32可包括沿内芯22的长度定位的多个环形圈，以便沿内芯22的长度形成空间40。在一些实施例中，外套管32可以具有中空圆柱形状，其尺寸和构造适于围绕内芯22，并且可以具有形成在其中的多个空间40，这些空间完全穿过外套管32的壁延伸，从而当外套管32位于内芯22上时暴露内芯22的外表面。
此外，在任何实施例中，外套管32可具有图9的表中所示的任何值或近似图9的表中所示的任何值的厚度T32。此外，但不限于，外套管32的一些实施例可具有大于外套管32的高度H32的约20％或小于外套管32的高度H32的约50％、或任何前述范围内的任何值或任何值范围的厚度T32。并非限制地，外套管32的一些实施例可具有大于焊柱的直径D10的约20％至小于焊柱的直径D10的约40％、或任何前述范围内的任何值或任何值范围的厚度T32。
在本文公开的任何实施例中，外套管32可包括图8中的表中所示的任何焊料合金材料或由图8中的表中所示的任何焊料合金材料制成。在其他实施例中，可以使用其他材料、焊料或其他材料制造外套管32。
在本文公开的任何实施例中，空间40中的每一个可被最佳地确定尺寸以提供上述益处。在一些实施例中，空间40的尺寸可以被设计成使得焊料填充物42完全地或相当完全地覆盖芯22的外表面22c(即，使得外表面22c的任何部分均不可见或均被焊料填充物42覆盖)。在本文公开的任何实施例中，本文公开的任何实施例的空间40可具有如图1B所示的高度H40，范围为但不限于大于约0.025mm(0.001英寸)至约0.250mm(0.010英寸)。
此外，在任何实施例中，外套管32可形成为使得空间40具有图9的表中所示的任何值或近似图9的表中所示的任何值的高度H40。此外，在任何实施例中，在外套管32的相邻段之间形成的空间40可具有大于焊柱10的总高度H10的约3％至小于焊柱10的总高度H10的约40％、或任何前述范围内的任何值或任何值范围的高度H40。此外，例如但不限于，在任何实施例中，在外套管32的相邻段之间形成的空间40可以具有小于外套管32的高度H32的约85％至大于外套管32的高度H32的20％、或在任何前述范围内的任何值或任何值范围的高度H4。在一些实施例中，外套管32可具有圆角(即角半径)、尖角(如图1B所示)、斜角或其他角。
图1A示出了在芯22和外套管32(例如，图1B中所示的芯22和外套管32)浸入焊浴中之后本公开的焊柱10的实施例。如图1A所示，来自焊浴浸渍的焊料可以用焊料填充物42填充空间40，并且还形成可以覆盖外套管32的焊料的外焊层44，使得焊柱的外表面10c可以大致完全并且被连续地覆盖来自焊浴的焊料涂层。形成空间40和外焊层44的焊料填充物42的焊料浸渍浴的焊料涂层可以包括图8的表中所示的任何材料或可以由图8的表中所示的任何材料制成，除了或甚至与任何其他合适的材料或元素组合。
在一些实施例中，焊料填充物42可以填充空间40并且可以形成为具有凹入或弯曲形状的外表面42a，焊料填充物42的外表面42a限定柱10的小直径D42(如图3所示)。如图3中所示，柱的小直径D42被确定为柱10中焊料填充物42的最内点之间的距离。在本文公开的任何实施例中，小直径D42和/或大直径D10可以被最佳地确定尺寸以提供上述优点，而不允许内芯22可见或被填充焊料42不完全覆盖。可选地，本文公开的任何实施例的小直径D42的范围可以为约0.05mm(0.002英寸)至约大于0.250mm(0.010英寸)。
在任何实施例中，焊料填充物42可以形成为使得焊柱10具有图9的表中所示的任何值或近似图9的表中所示的任何值的小直径D42。并非限制性地，焊柱10的一些实施例可形成为使得小直径D42大于焊柱大直径D10的30％(或约30％)，或小于焊柱的直径D10的60％(或约60％)，或为任何前述范围内的任何值或任何值范围。
本文公开的具有内芯22和第一端面10a和第二端面10b并包括图8中所示的任何材料或其他合适的材料的焊柱10的实施例与具有由焊料合金构成的芯的实施例相比具有显著的优点。具有焊料合金芯的实施例可具有显著的缺点。例如，用焊料合金制成的芯具有明显更高的电阻量(例如，较低的导电性)和较低的导热性(例如，较高的热阻)。然而，内芯22具有显著更低的电阻和更好的导热性以承载自柱10的第一端10a(例如，连接至CGA基板80的柱10的端，如图7A中所示)至柱10的第二端10b(其可以与柱10的第一端10a相对并且可以连接至PCB 81中的铜迹线和铜接地层，如图7A所示)的热传导。例如，包括退火铜的芯22具有每厘米1.72微欧的电阻率额定值；而由SAC305构成的焊料合金芯具有约每厘米16.6微欧的电阻率额定值。
在本文公开的任何实施例中，焊柱可具有芯22，该芯具有常规焊柱的芯材料的电阻率额定值的10％(或约10％)至常规焊柱的芯材料的电阻率额定值的30％(或约30％)的电阻率额定值。
更高的焊柱通常可以更具柔性以更好地吸收CGA基板80和PCB 81之间的CTE差热膨胀率。因此，由于本文公开的一些实施例的增强的坚固性，与球栅阵列(BGA)部件上常见的传统焊球相比，任何实施例可以具有增加的高度。本文公开的焊柱10的任何实施例可以具有任何合适的或期望的高度。可以将柱配置为在结构上更加坚固，以支撑重型、大型CGA基板的负载重量。在本文公开的任何实施例中，焊柱10的第一端10a和第二端10b之间或芯20的第一端20a和第二端20b之间的柱10的长度可以大于大直径D10的2.5倍(或约2.5倍)至小于大直径D10的9倍(或约9倍)。在本文公开的任何实施例中，焊柱的高度H10可以为0.25mm(0.010英寸)(或约0.25mm)至4.5mm(0.177英寸)(或约4.5mm)。
如上所述，芯22和外套管32可以浸入液化焊料的熔浴中。当芯22和外套管32浸入液化焊料的熔浴中时，可以在外套管32的内壁32a(如图3所示)和芯22的外表面22c之间形成全连接的电气和机械连接。在一些实施例中，当芯22和外套管32浸入液化焊料的熔浴中时，可以在外套管32的内壁32a和芯22的外表面22c之间形成金属间连接。
在浸入热的熔融焊浴期间，开放空间40(图1B中最清楚地示出)可以部分或完全填充有测量的或期望的体积的焊料42(在本文中也称为焊料填充物42)。焊料可以是图8的表中所示的任何材料或任何其他合适的材料或上述材料的任何组合。此外，浸入液化焊料的熔池中可形成焊料的外层44，外层44部分或完全覆盖外套管32并可形成柱10的外表面10c。
当热焊浴包括重量约96.5％的锡(Sn)和约0.8％的铜(Cu)和重量约0.7％的银(Ag)和重量2.0％的铋(Bi)的合金时，无铅焊料的铅熔融焊浴可以在约208℃和约220℃之间的温度范围内液化。可替代地，含铅熔融焊浴最佳可以包括共晶Sn63/Pb37或Sn62/Pb36/Ag2，且其熔融温度在约183℃到约220℃之间。
如上文和/或下文所述，本文公开的焊柱结构可以使用改进的材料和合金实现改进的性能。在此公开的任何焊柱结构或其部件可以使用无铅或含铅材料制成，包括但不限于图8的表中所示的任何合金或材料。图8是可用于制造本文公开的焊柱10的任何实施例的内芯22、外套管32、焊料填充物42、焊层44以及焊填角60和焊填角61的材料表。
图8中所示的任何材料均可以单独使用或与图8的表的其他材料结合使用。此外，本文公开的无铅焊柱或部件的任何实施例可以与本领域中已知为SAC305(Sn96.5/Ag3.0/Cu0.5)或SN100C(Sn99.2/Cu0.7/Ni0.05/Ge0.009)和/或上述的任意组合的无铅焊料结合回流至LGA/CGA基板和/或PCB。附加地或可替代地，本文公开的无铅焊柱可以利用其他可用的无铅焊膏合金回流至LGA/CGA基板和/或PCB上的导电垫，所述其他可用的无铅焊膏合金包括如下任何组合或由如下任何组合构成：重量约超过96％的锡(Sn)、重量小于约5％的银(Ag)、重量小于约3％的铜(Cu)、以及诸如镍(Ni)、锗(Ge)、镓(Ga)、铋(Bi)、铟(In)、锑(Sb)或钯(Pd)的可替代地其他添加剂或掺杂剂。
此外，本文公开的任何含铅焊柱实施例可以利用图8所示的铅(Pb)和锡(Sn)的合金的任何可用组合可选地回流至LGA/CGA基板和/或PCB上的导电垫，其中铅可以可选地为重量小于40％，锡可以可选地包括材料的剩余(平衡)重量。非限制性示例包括Sn63/Pb37或具有约2％银(Ag)的Sn62/Pb36/Ag2以及其他类似材料或合金。
本文公开的任何实施例可包括前述方法、设备、部件、材料和前述实施例或实施例的方面的任何其他细节的任何组合。
虽然已经描述了本发明的某些布置，但是这些实施例仅通过示例的方式呈现，并不旨在限制本公开的范围。实际上，本文描述的新方法和系统可以以多种其他形式体现。此外，在不脱离本公开的精神的情况下，可以对本文描述的系统和方法进行各种省略、替换和改变。要求保护的内容及其等同物旨在覆盖落入本公开的范围和精神内的此类形式或修改。
结合特定方面、实施例或示例描述的特征、材料、特性或组应理解为适用于本节或本说明书其他地方描述的任何其他方面、实施例或示例，除非与其不相容。本说明书(包括任何要求保护的内容、摘要和附图)中公开的所有特征和/或如此公开的任何方法或过程的所有步骤可以以任何组合方式组合，除非组合中至少一些这样的特征和/或步骤是相互排斥的。保护不限于任何前述实施例的细节。保护扩展到本说明书中公开的特征中的任何新特征或其任何新组合(包括任何要求保护的内容、摘要和附图)或如此公开的任何方法或过程的任何新颖的步骤或其任何新颖的组合。
此外，本公开中在单独实现的上下文中描述的某些特征也可以在单个实现中组合实现。相反，在单个实现的上下文中描述的各种特征也可以单独地或以任何合适的子组合在多个实现中实现。此外，尽管特征可能在上文中被描述为在某些组合中起作用，但是在某些情况下，可以从组合中去除来自要求保护的组合的一个或多个特征，并且该组合可以被要求保护为子组合或子组合的变体。
此外，虽然可以以特定顺序在附图中描绘或在说明书中描述操作，但这些操作不需要以所示的特定顺序或按先后顺序执行或者执行所有操作，以实现期望的结果。未描绘或描述的其他操作可以并入示例方法和过程中。例如，可以在任何所描述的操作之前、之后、同时或之间执行一个或多个附加操作。此外，在其他实现方式中可以重新排列或重新排序操作。本领域技术人员将理解，在一些实施例中，所示和/或公开的过程中采取的实际步骤可能与图中所示的步骤不同。根据实施例，可以去除上述某些步骤，可以添加其他步骤。此外，以上公开的具体实施例的特征和属性可以以不同方式组合以形成额外的实施例，所有这些均落入本公开的范围内。另外，上述实施方式中各个系统部件的分离不应理解为在所有实施方式中均需要这样的分离，应当理解，所描述的部件和系统一般可以集成在单个产品中或打包成多个产品。
出于本公开的目的，本文描述了某些方面、优点和新颖特征。根据任何特定实施例，可以不一定实现所有这些优点。因此，例如，本领域技术人员将认识到，本公开可以以实现如本文所教导的一个或一组优点而不必实现如本文所教导或建议的其他优点的方式来体现或实施。
除非另外具体说明，或者在所使用的上下文中以其他方式理解，诸如“能够”、“能”、“可能”、“可以”的条件语言通常意在传达某些实施例包括同时其他实施例不包括某些特征、元件和/或步骤。因此，这种条件语言通常不旨在暗示一个或多个实施例以任何方式要求特征、元素和/或步骤或者一个或多个实施例必须包括用于在有或没有用户输入或提示的情况下做如下决定的逻辑：是否在任何特定实施例中包括或将执行这些特征、元素和/或步骤。
诸如短语“X、Y和Z中的至少一个”的连词，除非另外特别说明，否则与上下文一起理解为通常用于传达项目、术语等可以是X、Y或Z。因此，这样的连词一般不旨在暗示某些实施例需要存在X中的至少一个、Y中的至少一个和Z中的至少一个。
本文使用的程度语言，例如本文使用的术语“大约”、“约”、“一般”和“相当地”表示接近于规定值、量或特征的值、量或特征，其仍然执行所需的功能或达到所需的结果。例如，术语“大约”、“约”、“一般”和“相当地”可以指小于规定量的10％内、小于规定量的5％内、小于规定量的1％内、小于规定量的0.1％内以及小于规定量的0.01％内的量。作为另一示例，在某些实施例中，术语“大体平行”和“相当平行”是指偏离完全平行小于或等于15度、10度、5度、3度、1度或0.1度的值、量或特性。
本公开的范围并不旨在受本节或本说明书中其他地方的优选实施例的具体公开内容的限制，并且可以由本节中或本说明书中的其他地方或如将来所提出的内容来定义。本公开的语言应基于本公开中使用的语言进行广义解释，而不限于本说明书中或在申请的审查过程中描述的示例，这些示例将被解释为非排他性的。

Claims (43)

1.一种焊柱，包括：
内芯，包括导电金属材料并具有外表面；
外套管，围绕所述内芯的外表面的一部分并包括焊料；
沿着所述外套管的长度的至少一个空间，其中所述内芯的外表面未被所述外套管覆盖；和
第二层，包括在所述至少一个空间内与所述内芯的外表面的一部分结合的焊料；
其中所述内芯被配置为至少在所述焊柱的轴向方向上支撑所述焊柱，以防止所述焊柱在温度高于所述外套管的焊料和所述第二层的焊料的液相线温度时坍塌。
2.根据权利要求1所述的焊柱，其中所述内芯的熔点高于所述外套管的焊料和所述第二层的焊料的液相线温度。
3.根据权利要求1或2所述的焊柱，其中所述内芯被配置为在温度高于所述外套管的焊料和所述第二层的焊料的液相线温度时不坍塌。
4.根据权利要求1或2所述的焊柱，其中所述内芯包括铜。
5.根据权利要求1或2所述的焊柱，其中所述内芯具有大致圆柱形的形状。
6.根据权利要求1或2所述的焊柱，其中所述内芯由线材制成。
7.根据权利要求1或2所述的焊柱，其中所述外套管和所述第二层中的每一个具有小于所述内芯的直径的径向厚度。
8.根据权利要求1或2所述的焊柱，其中所述内芯包括无铅材料。
9.根据权利要求1或2所述的焊柱，其中所述焊柱的大直径等于或大于所述内芯的直径的两倍。
10.根据权利要求1或2所述的焊柱，其中所述内芯具有0.05mm至0.25mm的直径。
11.根据权利要求1或2所述的焊柱，其中所述焊柱的小直径大于所述内芯的直径。
12.根据权利要求1或2所述的焊柱，其中所述焊柱被配置成使得所述内芯的外表面被所述外套管和所述第二层覆盖。
13.根据权利要求1或2所述的焊柱，其中所述焊柱被配置成使得所述内芯的外表面完全被所述外套管和所述第二层覆盖。
14.根据权利要求1或2所述的焊柱，其中所述内芯还被配置为改善通过所述焊柱的热传导。
15.根据权利要求1或2所述的焊柱，其中所述内芯包括金、银、锡、铂、钯或铍铜中的至少一种。
16.根据权利要求1或2所述的焊柱，其中所述至少一个空间沿所述内芯的整个长度延伸。
17.根据权利要求16所述的焊柱，其中所述至少一个空间沿着所述内芯的整个长度围绕所述内芯的外表面螺旋地延伸。
18.根据权利要求1或2所述的焊柱，其中所述至少一个空间在所述焊柱的轴向方向上具有的高度小于所述内芯的直径。
19.根据权利要求1或2所述的焊柱，其中所述外套管中所述至少一个空间具有0.05mm至0.25mm的高度。
20.根据权利要求1或2所述的焊柱，其中所述至少一个空间包括沿着所述外套管的长度的多个空间。
21.根据权利要求1或2所述的焊柱，其中所述至少一个空间被配置为向所述焊柱提供附加的柔性，以提高所述焊柱吸收应力的能力，所述应力由通过所述焊柱互连的基板之间热膨胀系数的失配引起。
22.根据权利要求1或2所述的焊柱，其中所述内芯在回流期间不坍塌。
23.根据权利要求1或2所述的焊柱，其中所述外套管围绕所述内芯的外表面的大部分。
24.根据权利要求1或2所述的焊柱，其中所述外套管以一定间距围绕所述内芯的外表面螺旋状地延伸，所述间距提供沿着所述外套管的长度的至少一个空间。
25.根据权利要求1或2所述的焊柱，其中所述外套管的径向厚度为0.025mm至0.125mm。
26.根据权利要求1或2所述的焊柱，其中所述外套管和所述第二层中的至少一个包括无铅合金材料。
27.根据权利要求1或2所述的焊柱，其中所述外套管和所述第二层中的至少一个包括含铅合金材料。
28.根据权利要求1或2所述的焊柱，其中所述外套管包括以下中的至少一种：无铅合金SCN305、无铅合金Sn96.5/Cu3.0/Ni0.5、无铅合金Sn96.5/Cu3.5、无铅合金Sn平衡/Cu1.0-5.0/Ni0.1-2.0、含铅合金Pb80/Sn20、含铅合金Pb85/Sn15、含铅合金Pb90/Sn10、含铅合金Pb平衡/Sn5-20、以及含铅合金Pb93.5/Sn5/Ag1.5。
29.根据权利要求1或2所述的焊柱，其中所述第二层还覆盖所述外套管的外表面的至少一部分。
30.根据权利要求29所述的焊柱，其中所述第二层还完全覆盖所述外套管的外表面。
31.根据权利要求1或2所述的焊柱，其中所述第二层包括以下中的至少一种：Sn96.5/Ag3.0/Cu0.5、Sn平衡/Cu0.6-0.8/Ag0.5-0.7/Bi1.8-2.0、Sn平衡/Cu0.6-0.8/Ag2.8-2.9/Bi2.5-2.9/Sb0.5-0.7/Ni0.04-0.06、Sn平衡/Ag3.5/Bi0.5/In8.0、Sn平衡/Ag3.5/Bi0.5/In4.0、Sn平衡/Cu0.7/Ni0.05/Ge<0.010、Sn100C的无铅合金，或Sn63/Pb37、Sn62/Pb36/Ag2、或Pb平衡/Sn5-20的含铅合金。
32.根据权利要求1所述的焊柱，其中所述焊柱是无铅的。
33.根据权利要求1至2和32中任一项所述的焊柱，其中所述焊柱的大直径为0.10mm至0.50mm。
34.根据权利要求1至2和32中任一项所述的焊柱，其中所述焊柱的小直径为0.05mm至0.25mm。
35.根据权利要求1至2和32中任一项所述的焊柱，其中所述焊柱被配置成使得当套管结构材料处于塑性熔融状态时，焊柱材料将与LGA/CGA和/或印刷电路板的导电垫形成粘结，而所述焊柱不坍塌。
36.根据权利要求1至2和32中任一项所述的焊柱，其中所述焊柱的第一端被配置为当焊膏的温度超过所述焊膏的液相线温度时利用所述焊膏与LGA/CGA和/或印刷电路板的导电垫形成粘结。
37.一种用于将电子元件安装至印刷电路板的焊柱，包括：
内芯，包括具有第一液相线温度的第一材料；
外套管，围绕所述内芯的外表面的至少大部分，所述外套管包括具有第二液相线温度的第二材料；和
在所述外套管的段之间沿着所述内芯的至少一侧的长度的多个空间；
其中所述焊柱被配置成使得所述内芯将支撑所述外套管并防止所述外套管在温度高于所述外套管的液相线温度时坍塌；和
所述空间被配置为向所述焊柱提供附加的柔性，以提高所述焊柱吸收应力的能力，所述应力由与所述焊柱的第一端结合的第一基板和与所述焊柱的第二端结合的第二基板之间的热膨胀系数的失配引起。
38.根据权利要求37所述的焊柱，还包括第二层，所述第二层包括在所述多个空间内与所述内芯的外表面的一部分结合的焊料。
39.根据权利要求37或38所述的焊柱，其中所述焊柱的最大直径至少等于或大于所述内芯的直径的两倍。
40.根据权利要求37或38所述的焊柱，其中所述焊柱的最小直径不小于所述内芯的直径。
41.根据权利要求37或38所述的焊柱，其中至少一个空间在所述焊柱的轴向方向上具有的高度小于所述内芯的直径。
42.根据权利要求37或38所述的焊柱，其中所述外套管的径向厚度小于所述内芯的直径。
43.根据权利要求37或38所述的焊柱，其中所述外套管沿着所述内芯的长度的至少一部分螺旋地延伸。
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