CN114032410B - 一种高硬度高导热铁铜材料及其制备方法 - Google Patents
一种高硬度高导热铁铜材料及其制备方法 Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 23
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000000498 ball milling Methods 0.000 claims abstract description 28
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000005272 metallurgy Methods 0.000 claims abstract description 9
- 239000011812 mixed powder Substances 0.000 claims abstract description 8
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- 238000003892 spreading Methods 0.000 claims abstract description 4
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 238000009689 gas atomisation Methods 0.000 claims description 5
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 abstract description 6
- 231100000956 nontoxicity Toxicity 0.000 abstract description 2
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- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 229910052790 beryllium Inorganic materials 0.000 description 5
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- 230000009286 beneficial effect Effects 0.000 description 2
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- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical group [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
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- 239000011159 matrix material Substances 0.000 description 2
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- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 102000004506 Blood Proteins Human genes 0.000 description 1
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- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 150000001573 beryllium compounds Chemical class 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- PWOSZCQLSAMRQW-UHFFFAOYSA-N beryllium(2+) Chemical compound [Be+2] PWOSZCQLSAMRQW-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B33Y40/10—Pre-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/043—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by ball milling
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Abstract
本发明公开一种高硬度高导热铁铜材料及其制备方法，属于新材料领域。本发明将气雾化工艺制备的粒径为10~60微米的纯铜粉和粒径为50~100微米的Fe‑(0.3‑0.5)C‑(1.8~4.6)B粉末混合，进行球磨，然后将球磨后获得的混合粉末置于选区激光熔化增材制备设备中，在铺粉厚度100~150微米、激光功率280~370W、扫描速度600~900毫米/秒、扫描间距0.1~0.15微米条件下进行激光选区熔化微冶金增材，凝固冷却后获得新型高硬度高导热铁铜材料并实现增材制备成形。本发明获得的高硬度高导热铁铜材料硬度超过HRC35，导热率超过95W/(m.k)，与铍铜相当，具有无毒无污染、安全性高、成本低、应用广等特点。
Description
技术领域
本发明涉及一种高硬度高导热铁铜材料及其制备方法，属于新材料领域。
背景技术
铍铜是以铍为主要添加元素的青铜，又称为铍青铜。铍铜硬度高，导热率高，弹性好，抗火花、耐磨损、抗应力松弛，加工性能好，广泛用于注塑模具、防爆工具、和电子元器件中的载流簧片、接插件、触点、紧固弹簧等。但是，铍及其氧化物和盐类化合物以粉尘、烟雾、蒸气形式经呼吸道吸收后会对肺严重伤害，经破损皮肤吸收后，会引起局部病变。铍进入人体后，难溶的氧化铍主要储存在肺部，引起肺炎。可溶性的铍化合物主要储存在骨骼、肝脏、肾脏和淋巴结等处，它们可与血浆蛋白作用，生成蛋白复合物，引起脏器或组织的病变而致癌。
铜和铁可以形成互溶体系，过饱和的铁固溶到铜中，可以强化铜基体，提高硬度和强度。但是，固溶的铁会导致铜的导热性能急剧下降。此外，合金化电阻熔炼或感应熔炼方法，难以实现铁的过饱和溶解，铁的强化作用难以体现。激光选区熔化微冶金增材以聚焦激光束为热源，按照成形件三维模型的离散切片数据扫描粉床上的球形粉末，以极快速度熔化粉末，凝固后获得成形件，这为实现铜基体中铁的过饱和可控固溶、实现强度硬度和导热性的可靠调控，提供了条件。
发明内容
本发明不使用有毒的铍，以成分简单的纯铜和Fe-C-B合金为组元，通过选区激光熔化粉床微冶金快速凝固方法，解决了铜-铁难混熔合金的制备和成形问题。
本发明的目的在于提供一种高硬度高导热铁铜材料及其的制备方法，制备的高硬度高导热铁铜材料硬度超过HRC35，导热率超过95W/(m.k)，与铍铜相当，具有无毒无污染、安全性高、成本低、应用广等突出优点，包括以下步骤：
(1)将气雾化工艺制备的粒径为10～60微米的纯铜粉和粒径为50～100微米的Fe-C-B合金粉末按照重量比4：(0.2～1)混合。
(2)将混合粉末进行行星球磨，将球磨后获得的混合粉末置于选区激光熔化增材制备设备中，激光选区熔化微冶金增材，凝固冷却后获得新型高硬度高导热铁铜材料并实现增材制备成形。
优选的，本发明步骤(2)中行星球磨的条件为：在150～300转转速下分5阶段球磨，其中每阶段球磨5分钟后暂停25分钟再进行下一阶段球磨。
优选的，本发明所述激光选区熔化的条件为：在铺粉厚度100～150微米、激光功率280～370W、扫描速度600～900毫米/秒、扫描间距0.1～0.15微米条件下进行
本发明步骤(1)中所述用于高硬度高导热铁铜材料的原材料为气雾化纯铜球形粉末和Fe-C-B铁基球形粉末，其中Fe、C、B的摩尔比为1：(0.3-0.5)：
(1.8～4.6)；其添加量和成分，可以根据工况条件的需要进行改变，实现性能的有效调节。
本发明的另一目的在于提供所述的方法制备得到的高硬度高导热铁铜材料。
本发明的有益效果：
(1)高硬度高导热铁铜材料但不使用有毒的铍元素，克服了铍铜生产过程中对人体的危害，无毒无污染。
(2)以成分简单的纯铜和Fe-C-B合金为组元，充分发挥激光选区熔化增材制备粉床微冶金过程中快速凝固的特点，解决了铜-铁难混熔合金的制备和成形问题；制备的高硬度高导热铁铜材料硬度超过HRC35，导热率超过95W/(m.k)，与铍铜相当。
(3)球磨方法提高铜粉的激光吸收率和Fe-C-B粉的均匀分布，有利于实现成形件致密化和组织均匀性。
具体实施方式
下面结合具体实施例对本发明作进一步详细说明，但本发明的保护范围并不限于所述内容。
实施例1
(1)将气雾化工艺制备的粒径为10～30微米的纯铜粉和粒径为50～80微米的Fe-0.30C-1.8B粉末按照重量比4：0.2混合。
(2)使用行星球磨机在150转转速下分5阶段球磨25分钟，其中每阶段球磨5分钟后暂停25分钟再进行下一阶段球磨。
(3)将球磨后获得的混合粉末置于选区激光熔化增材制备设备中，在铺粉厚度100微米、激光功率280W、扫描速度600毫米/秒、扫描间距0.1微米条件下进行激光选区熔化微冶金增材。
(4)凝固冷却后获得实现了增材制备成形的高硬度高导热铁铜材料，硬度为36HRC，导热率为126W/(m.k)。
实施例2
(1)将气雾化工艺制备的粒径为30～60微米的纯铜粉和粒径为80～100微米的Fe-0.49C-4.5B粉末按照重量比4：1混合。
(2)使用行星球磨机在240转转速下分5阶段球磨25分钟，其中每阶段球磨5分钟后暂停25分钟再进行下一阶段球磨。
(3)将球磨后获得的混合粉末置于选区激光熔化增材制备设备中，在铺粉厚度150微米、激光功率370W、扫描速度900毫米/秒、扫描间距0.15微米条件下进行激光选区熔化微冶金增材。
(4)凝固冷却后获得实现了增材制备成形的新型高硬度高导热铁铜材料，硬度为45HRC，导热率为96W/(m.k)。
实施例3
(1)将气雾化工艺制备的粒径为20～40微米的纯铜粉和粒径为70～90微米的Fe-0.42C-3.0B粉末按照重量比4：0.8混合。
(2)使用行星球磨机在300转转速下分5阶段球磨25分钟，其中每阶段球磨5分钟后暂停25分钟再进行下一阶段球磨。
(3)将球磨后获得的混合粉末置于选区激光熔化增材制备设备中，在铺粉厚度120微米、激光功率350W、扫描速度900毫米/秒、扫描间距0.12微米条件下进行激光选区熔化微冶金增材。
(4)凝固冷却后获得实现了增材制备成形的新型高硬度高导热铁铜材料，硬度为41HRC，导热率为102W/(m.k)。
Claims (3)
1.一种高硬度高导热铁铜材料的制备方法，其特征在于，具体包括以下步骤：
(1)将气雾化工艺制备的粒径为10～60微米的纯铜粉和粒径为50～100微米的Fe-C-B合金粉末按照重量比4：(0.2～1)混合，Fe-C-B合金粉末中Fe、C、B的摩尔比为1：(0.3-0.5)：(1.8～4.6)；
(2)将混合粉末进行行星球磨，球磨的条件为：在150～300转转速下分5阶段球磨，其中每阶段球磨5分钟后暂停25分钟再进行下一阶段球磨；
将球磨后获得的混合粉末置于选区激光熔化增材制备设备中，激光选区熔化微冶金增材，凝固冷却后获得高硬度高导热铁铜材料并实现增材制备成形。
2.根据权利要求1所述高硬度高导热铁铜材料的制备方法，其特征在于：激光选区熔化的条件为：在铺粉厚度100～150微米、激光功率280～370W、扫描速度600～900毫米/秒、扫描间距0.1～0.15微米条件下进行。
3.权利要求1～2任意一项所述的方法制备得到的高硬度高导热铁铜材料。
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