CN114008787A - 显示基板及其制造方法和显示装置 - Google Patents
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- CN114008787A CN114008787A CN202080001128.3A CN202080001128A CN114008787A CN 114008787 A CN114008787 A CN 114008787A CN 202080001128 A CN202080001128 A CN 202080001128A CN 114008787 A CN114008787 A CN 114008787A
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- 239000000758 substrate Substances 0.000 title claims abstract description 474
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 230000000903 blocking effect Effects 0.000 claims abstract description 228
- 239000011368 organic material Substances 0.000 claims abstract description 101
- 230000004888 barrier function Effects 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims description 714
- 238000005520 cutting process Methods 0.000 claims description 105
- 239000011229 interlayer Substances 0.000 claims description 44
- 229910010272 inorganic material Inorganic materials 0.000 claims description 40
- 239000011147 inorganic material Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 40
- 238000002161 passivation Methods 0.000 claims description 31
- 239000004642 Polyimide Substances 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 7
- 238000003698 laser cutting Methods 0.000 claims description 7
- -1 polyethylene Polymers 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 123
- 238000000059 patterning Methods 0.000 description 12
- 239000010409 thin film Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 239000011810 insulating material Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 238000010884 ion-beam technique Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
提供一种显示基板及其制造方法和显示装置。所述显示基板包括：衬底基板，所述衬底基板至少包括像素区域和开孔区域；设置在所述衬底基板上的多个子像素，所述多个子像素位于所述像素区域；开孔，所述开孔位于所述开孔区域；第一阻挡坝，所述第一阻挡坝设置在所述子像素与所述开孔之间，并且至少部分包围所述开孔；有机材料层，所述有机材料层在所述衬底基板上的正投影落入所述像素区域，所述有机材料层包括至少一个膜层；和填充结构，所述填充结构的至少一部分设置在所述开孔与所述第一阻挡坝之间，其中，所述填充结构和所述有机材料层的至少一个膜层位于相同的层，并且所述填充结构和所述有机材料层的至少一个膜层包括的材料相同。
Description
PCT国内申请，说明书已公开。
Claims (39)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2020104633704 | 2020-05-27 | ||
| CN202010463370.4A CN113745269B (zh) | 2020-05-27 | 2020-05-27 | 显示基板及其制备方法、显示面板、显示装置 |
| PCT/CN2020/099169 WO2021237867A1 (zh) | 2020-05-27 | 2020-06-30 | 显示基板及其制造方法和显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114008787A true CN114008787A (zh) | 2022-02-01 |
Family
ID=78722996
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010463370.4A Active CN113745269B (zh) | 2020-05-27 | 2020-05-27 | 显示基板及其制备方法、显示面板、显示装置 |
| CN202080001128.3A Pending CN114008787A (zh) | 2020-05-27 | 2020-06-30 | 显示基板及其制造方法和显示装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010463370.4A Active CN113745269B (zh) | 2020-05-27 | 2020-05-27 | 显示基板及其制备方法、显示面板、显示装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US12004367B2 (zh) |
| EP (1) | EP4160690A4 (zh) |
| CN (2) | CN113745269B (zh) |
| GB (1) | GB2610325A (zh) |
| WO (2) | WO2021237867A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117677251A (zh) * | 2023-11-15 | 2024-03-08 | 惠科股份有限公司 | 显示面板的制作方法、显示面板以及显示装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112164762B (zh) * | 2020-09-29 | 2023-10-17 | 京东方科技集团股份有限公司 | 显示面板及其制作方法、显示装置 |
| CN114824128B (zh) * | 2022-04-07 | 2023-07-04 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
| CN117461398A (zh) * | 2022-05-20 | 2024-01-26 | 京东方科技集团股份有限公司 | 显示基板及显示装置 |
| EP4451824A1 (en) * | 2022-08-29 | 2024-10-23 | Boe Technology Group Co., Ltd. | Display substrate and touch-control display apparatus |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102465377B1 (ko) * | 2016-02-12 | 2022-11-10 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| CN105914224A (zh) * | 2016-05-04 | 2016-08-31 | 京东方科技集团股份有限公司 | 一种有机发光二极管显示基板及其制作方法、显示装置 |
| JP7002908B2 (ja) | 2017-10-13 | 2022-01-20 | 株式会社ジャパンディスプレイ | 表示装置 |
| CN107768413B (zh) * | 2017-10-26 | 2020-12-01 | 京东方科技集团股份有限公司 | 一种柔性显示基板、显示装置及其制作方法 |
| KR102583898B1 (ko) * | 2018-04-30 | 2023-10-04 | 삼성디스플레이 주식회사 | 표시 패널 및 이의 제조 방법 |
| US10541380B1 (en) | 2018-08-30 | 2020-01-21 | Samsung Display Co., Ltd. | Display device with substrate comprising an opening and adjacent grooves |
| CN209071332U (zh) * | 2018-10-31 | 2019-07-05 | 云谷（固安）科技有限公司 | 显示面板、显示屏和显示终端 |
| KR102612769B1 (ko) * | 2018-11-09 | 2023-12-11 | 엘지디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
| CN109616506A (zh) | 2018-12-18 | 2019-04-12 | 武汉华星光电半导体显示技术有限公司 | 全屏显示面板及其制作方法 |
| CN109671864B (zh) * | 2018-12-20 | 2020-06-30 | 武汉华星光电技术有限公司 | Oled显示面板 |
| CN110212113B (zh) * | 2019-05-31 | 2021-11-09 | 京东方科技集团股份有限公司 | 电致发光显示基板及其制备方法、电致发光显示装置 |
| CN110265583B (zh) * | 2019-07-26 | 2022-08-12 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
| CN110491913B (zh) * | 2019-07-31 | 2021-11-02 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
| CN110600511A (zh) * | 2019-08-26 | 2019-12-20 | 武汉华星光电半导体显示技术有限公司 | 有机发光显示面板及其制备方法 |
| CN110518147B (zh) * | 2019-08-30 | 2023-07-21 | 京东方科技集团股份有限公司 | 显示面板及其制造方法、显示装置 |
| CN210535696U (zh) * | 2019-11-29 | 2020-05-15 | 京东方科技集团股份有限公司 | 一种电致发光显示基板和包含其的电致发光显示装置 |
| CN111180496B (zh) * | 2020-01-06 | 2023-07-04 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示面板及显示装置 |
-
2020
- 2020-05-27 CN CN202010463370.4A patent/CN113745269B/zh active Active
- 2020-06-30 CN CN202080001128.3A patent/CN114008787A/zh active Pending
- 2020-06-30 WO PCT/CN2020/099169 patent/WO2021237867A1/zh unknown
- 2020-06-30 US US17/271,490 patent/US12004367B2/en active Active
- 2020-06-30 EP EP20904254.8A patent/EP4160690A4/en active Pending
-
2021
- 2021-05-25 WO PCT/CN2021/095836 patent/WO2021238926A1/zh active Application Filing
- 2021-05-25 GB GB2215764.8A patent/GB2610325A/en active Pending
- 2021-05-25 US US17/914,938 patent/US20230110854A1/en active Pending
-
2024
- 2024-04-25 US US18/645,891 patent/US20240276760A1/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117677251A (zh) * | 2023-11-15 | 2024-03-08 | 惠科股份有限公司 | 显示面板的制作方法、显示面板以及显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240276760A1 (en) | 2024-08-15 |
| WO2021238926A1 (zh) | 2021-12-02 |
| CN113745269B (zh) | 2024-10-18 |
| GB2610325A (en) | 2023-03-01 |
| EP4160690A4 (en) | 2024-06-19 |
| US12004367B2 (en) | 2024-06-04 |
| US20230110854A1 (en) | 2023-04-13 |
| GB202215764D0 (en) | 2022-12-07 |
| EP4160690A1 (en) | 2023-04-05 |
| US20220199943A1 (en) | 2022-06-23 |
| WO2021237867A1 (zh) | 2021-12-02 |
| CN113745269A (zh) | 2021-12-03 |
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